JP6534540B2 - Thermosetting sheet composition - Google Patents
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- JP6534540B2 JP6534540B2 JP2015044651A JP2015044651A JP6534540B2 JP 6534540 B2 JP6534540 B2 JP 6534540B2 JP 2015044651 A JP2015044651 A JP 2015044651A JP 2015044651 A JP2015044651 A JP 2015044651A JP 6534540 B2 JP6534540 B2 JP 6534540B2
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- 239000000203 mixture Substances 0.000 title claims description 46
- 229920001187 thermosetting polymer Polymers 0.000 title claims description 26
- -1 silane compound Chemical class 0.000 claims description 19
- 239000003822 epoxy resin Substances 0.000 claims description 16
- 229920000647 polyepoxide Polymers 0.000 claims description 16
- 239000004593 Epoxy Substances 0.000 claims description 13
- 125000003118 aryl group Chemical group 0.000 claims description 12
- 125000003055 glycidyl group Chemical group C(C1CO1)* 0.000 claims description 12
- 125000000524 functional group Chemical group 0.000 claims description 10
- 239000003505 polymerization initiator Substances 0.000 claims description 10
- 238000010538 cationic polymerization reaction Methods 0.000 claims description 9
- 229910000077 silane Inorganic materials 0.000 claims description 9
- 229920006132 styrene block copolymer Polymers 0.000 claims description 9
- UHKPXKGJFOKCGG-UHFFFAOYSA-N 2-methylprop-1-ene;styrene Chemical compound CC(C)=C.C=CC1=CC=CC=C1.C=CC1=CC=CC=C1 UHKPXKGJFOKCGG-UHFFFAOYSA-N 0.000 claims description 7
- ZFSLODLOARCGLH-UHFFFAOYSA-N isocyanuric acid Chemical group OC1=NC(O)=NC(O)=N1 ZFSLODLOARCGLH-UHFFFAOYSA-N 0.000 claims description 6
- 238000007789 sealing Methods 0.000 claims description 6
- 125000002091 cationic group Chemical group 0.000 claims description 4
- QGZKDVFQNNGYKY-UHFFFAOYSA-O Ammonium Chemical compound [NH4+] QGZKDVFQNNGYKY-UHFFFAOYSA-O 0.000 claims description 3
- 238000013329 compounding Methods 0.000 claims description 3
- 239000012954 diazonium Substances 0.000 claims description 3
- IJGRMHOSHXDMSA-UHFFFAOYSA-O diazynium Chemical compound [NH+]#N IJGRMHOSHXDMSA-UHFFFAOYSA-O 0.000 claims description 3
- MGFYSGNNHQQTJW-UHFFFAOYSA-N iodonium Chemical compound [IH2+] MGFYSGNNHQQTJW-UHFFFAOYSA-N 0.000 claims description 3
- RWSOTUBLDIXVET-UHFFFAOYSA-O sulfonium Chemical compound [SH3+] RWSOTUBLDIXVET-UHFFFAOYSA-O 0.000 claims description 3
- 150000001875 compounds Chemical class 0.000 claims description 2
- 125000003700 epoxy group Chemical group 0.000 claims description 2
- 239000003999 initiator Substances 0.000 claims description 2
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 claims 1
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 12
- 230000035699 permeability Effects 0.000 description 12
- 229920002799 BoPET Polymers 0.000 description 10
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 9
- 230000000052 comparative effect Effects 0.000 description 9
- 239000000126 substance Substances 0.000 description 9
- 230000015572 biosynthetic process Effects 0.000 description 8
- 229920006287 phenoxy resin Polymers 0.000 description 7
- 239000013034 phenoxy resin Substances 0.000 description 7
- XEKOWRVHYACXOJ-UHFFFAOYSA-N Ethyl acetate Chemical compound CCOC(C)=O XEKOWRVHYACXOJ-UHFFFAOYSA-N 0.000 description 6
- 238000002156 mixing Methods 0.000 description 6
- 230000000694 effects Effects 0.000 description 5
- 238000002834 transmittance Methods 0.000 description 5
- 239000007983 Tris buffer Substances 0.000 description 4
- 238000001723 curing Methods 0.000 description 4
- 238000011156 evaluation Methods 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- 239000011342 resin composition Substances 0.000 description 4
- 239000004841 bisphenol A epoxy resin Substances 0.000 description 3
- 239000003795 chemical substances by application Substances 0.000 description 3
- LTYMSROWYAPPGB-UHFFFAOYSA-N diphenyl sulfide Chemical compound C=1C=CC=CC=1SC1=CC=CC=C1 LTYMSROWYAPPGB-UHFFFAOYSA-N 0.000 description 3
- 239000005357 flat glass Substances 0.000 description 3
- 230000001771 impaired effect Effects 0.000 description 3
- 230000003647 oxidation Effects 0.000 description 3
- 238000007254 oxidation reaction Methods 0.000 description 3
- 229920000642 polymer Polymers 0.000 description 3
- 229920005989 resin Polymers 0.000 description 3
- 239000011347 resin Substances 0.000 description 3
- BPSIOYPQMFLKFR-UHFFFAOYSA-N trimethoxy-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CO[Si](OC)(OC)CCCOCC1CO1 BPSIOYPQMFLKFR-UHFFFAOYSA-N 0.000 description 3
- LWNGJAHMBMVCJR-UHFFFAOYSA-N (2,3,4,5,6-pentafluorophenoxy)boronic acid Chemical compound OB(O)OC1=C(F)C(F)=C(F)C(F)=C1F LWNGJAHMBMVCJR-UHFFFAOYSA-N 0.000 description 2
- HECLRDQVFMWTQS-RGOKHQFPSA-N 1755-01-7 Chemical compound C1[C@H]2[C@@H]3CC=C[C@@H]3[C@@H]1C=C2 HECLRDQVFMWTQS-RGOKHQFPSA-N 0.000 description 2
- DKPFZGUDAPQIHT-UHFFFAOYSA-N Butyl acetate Natural products CCCCOC(C)=O DKPFZGUDAPQIHT-UHFFFAOYSA-N 0.000 description 2
- 229910000831 Steel Inorganic materials 0.000 description 2
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical class C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 2
- 239000004842 bisphenol F epoxy resin Substances 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 2
- 238000007872 degassing Methods 0.000 description 2
- ZUOUZKKEUPVFJK-UHFFFAOYSA-N diphenyl Chemical compound C1=CC=CC=C1C1=CC=CC=C1 ZUOUZKKEUPVFJK-UHFFFAOYSA-N 0.000 description 2
- 239000000945 filler Substances 0.000 description 2
- 230000005484 gravity Effects 0.000 description 2
- FUZZWVXGSFPDMH-UHFFFAOYSA-N hexanoic acid Chemical compound CCCCCC(O)=O FUZZWVXGSFPDMH-UHFFFAOYSA-N 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- NFHFRUOZVGFOOS-UHFFFAOYSA-N palladium;triphenylphosphane Chemical compound [Pd].C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1.C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1.C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1.C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1 NFHFRUOZVGFOOS-UHFFFAOYSA-N 0.000 description 2
- 239000008188 pellet Substances 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- 239000010959 steel Substances 0.000 description 2
- 229910052623 talc Inorganic materials 0.000 description 2
- 238000010998 test method Methods 0.000 description 2
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 description 1
- AWQFNUMHFNEWGS-UHFFFAOYSA-N 2-methylprop-1-ene;styrene Chemical compound CC(C)=C.C=CC1=CC=CC=C1 AWQFNUMHFNEWGS-UHFFFAOYSA-N 0.000 description 1
- FVCSARBUZVPSQF-UHFFFAOYSA-N 5-(2,4-dioxooxolan-3-yl)-7-methyl-3a,4,5,7a-tetrahydro-2-benzofuran-1,3-dione Chemical compound C1C(C(OC2=O)=O)C2C(C)=CC1C1C(=O)COC1=O FVCSARBUZVPSQF-UHFFFAOYSA-N 0.000 description 1
- 229920001634 Copolyester Polymers 0.000 description 1
- VVQNEPGJFQJSBK-UHFFFAOYSA-N Methyl methacrylate Chemical compound COC(=O)C(C)=C VVQNEPGJFQJSBK-UHFFFAOYSA-N 0.000 description 1
- 229910018286 SbF 6 Inorganic materials 0.000 description 1
- 239000006087 Silane Coupling Agent Substances 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 229920006397 acrylic thermoplastic Polymers 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 150000001450 anions Chemical group 0.000 description 1
- 239000004305 biphenyl Substances 0.000 description 1
- 235000010290 biphenyl Nutrition 0.000 description 1
- PXKLMJQFEQBVLD-UHFFFAOYSA-N bisphenol F Chemical class C1=CC(O)=CC=C1CC1=CC=C(O)C=C1 PXKLMJQFEQBVLD-UHFFFAOYSA-N 0.000 description 1
- 229920001400 block copolymer Polymers 0.000 description 1
- CQEYYJKEWSMYFG-UHFFFAOYSA-N butyl acrylate Chemical compound CCCCOC(=O)C=C CQEYYJKEWSMYFG-UHFFFAOYSA-N 0.000 description 1
- 238000005266 casting Methods 0.000 description 1
- 239000003054 catalyst Substances 0.000 description 1
- 150000001768 cations Chemical class 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000010227 cup method (microbiological evaluation) Methods 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 238000004925 denaturation Methods 0.000 description 1
- 230000036425 denaturation Effects 0.000 description 1
- OTARVPUIYXHRRB-UHFFFAOYSA-N diethoxy-methyl-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CCO[Si](C)(OCC)CCCOCC1CO1 OTARVPUIYXHRRB-UHFFFAOYSA-N 0.000 description 1
- 239000003085 diluting agent Substances 0.000 description 1
- 229920001971 elastomer Polymers 0.000 description 1
- 239000000806 elastomer Substances 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- BXOUVIIITJXIKB-UHFFFAOYSA-N ethene;styrene Chemical group C=C.C=CC1=CC=CC=C1 BXOUVIIITJXIKB-UHFFFAOYSA-N 0.000 description 1
- 238000001125 extrusion Methods 0.000 description 1
- 239000003063 flame retardant Substances 0.000 description 1
- 230000009969 flowable effect Effects 0.000 description 1
- DWYMPOCYEZONEA-UHFFFAOYSA-L fluoridophosphate Chemical compound [O-]P([O-])(F)=O DWYMPOCYEZONEA-UHFFFAOYSA-L 0.000 description 1
- 238000009472 formulation Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000013007 heat curing Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 230000007062 hydrolysis Effects 0.000 description 1
- 238000006460 hydrolysis reaction Methods 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 239000011259 mixed solution Substances 0.000 description 1
- DRRZZMBHJXLZRS-UHFFFAOYSA-N n-[3-[dimethoxy(methyl)silyl]propyl]cyclohexanamine Chemical compound CO[Si](C)(OC)CCCNC1CCCCC1 DRRZZMBHJXLZRS-UHFFFAOYSA-N 0.000 description 1
- 239000004843 novolac epoxy resin Substances 0.000 description 1
- 125000005440 p-toluyl group Chemical group [H]C1=C([H])C(=C([H])C([H])=C1C(*)=O)C([H])([H])[H] 0.000 description 1
- 239000005022 packaging material Substances 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 1
- 229920001225 polyester resin Polymers 0.000 description 1
- 239000004645 polyester resin Substances 0.000 description 1
- 150000003839 salts Chemical class 0.000 description 1
- 229920006395 saturated elastomer Polymers 0.000 description 1
- 230000001568 sexual effect Effects 0.000 description 1
- 150000004756 silanes Chemical class 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
- 239000000454 talc Substances 0.000 description 1
- 229920001169 thermoplastic Polymers 0.000 description 1
- 239000004416 thermosoftening plastic Substances 0.000 description 1
- UDUKMRHNZZLJRB-UHFFFAOYSA-N triethoxy-[2-(7-oxabicyclo[4.1.0]heptan-4-yl)ethyl]silane Chemical compound C1C(CC[Si](OCC)(OCC)OCC)CCC2OC21 UDUKMRHNZZLJRB-UHFFFAOYSA-N 0.000 description 1
- JXUKBNICSRJFAP-UHFFFAOYSA-N triethoxy-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CCO[Si](OCC)(OCC)CCCOCC1CO1 JXUKBNICSRJFAP-UHFFFAOYSA-N 0.000 description 1
- DQZNLOXENNXVAD-UHFFFAOYSA-N trimethoxy-[2-(7-oxabicyclo[4.1.0]heptan-4-yl)ethyl]silane Chemical compound C1C(CC[Si](OC)(OC)OC)CCC2OC21 DQZNLOXENNXVAD-UHFFFAOYSA-N 0.000 description 1
- WLOQLWBIJZDHET-UHFFFAOYSA-N triphenylsulfonium Chemical compound C1=CC=CC=C1[S+](C=1C=CC=CC=1)C1=CC=CC=C1 WLOQLWBIJZDHET-UHFFFAOYSA-N 0.000 description 1
- 239000012953 triphenylsulfonium Substances 0.000 description 1
Landscapes
- Electroluminescent Light Sources (AREA)
- Manufacture Of Macromolecular Shaped Articles (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Epoxy Resins (AREA)
Description
本発明は、有機エレクトロルミネッセンス素子の封止に使用する熱硬化性シート組成物に関し、特には透明度が高く、かつ透湿性が低い熱硬化性シート組成物に関する。 The present invention relates to a thermosetting sheet composition used for sealing an organic electroluminescent device, and more particularly to a thermosetting sheet composition having high transparency and low moisture permeability.
従来、有機エレクトロルミネッセンス素子（以下「有機ＥＬ素子」、という）に悪影響を及ぼすことなく封止を行うことにより、ダークスポットの発生・成長を確実に抑制して、さらに高い光透過率を保持させることにより長期間にわたって安定な発光特性を維持することができる有機ＥＬ素子封止用の光硬化性樹脂組成物が提案されている（特許文献１）。 Conventionally, by sealing without adversely affecting an organic electroluminescent element (hereinafter referred to as "organic EL element"), generation and growth of dark spots are reliably suppressed, and a higher light transmittance is maintained. Thus, a photocurable resin composition for sealing an organic EL element capable of maintaining stable light emission characteristics over a long period of time has been proposed (Patent Document 1).
特許文献１に示される光硬化性樹脂組成物は、（Ａ）１分子中に少なくとも２個以上のグリシジル基を有し、分子量が２００〜７０００のエポキシ樹脂と、（Ｂ）１分子中に少なくとも１個以上のグリシジル基を有し、分子量が２００００〜１０００００のエポキシ樹脂と、（Ｃ）エネルギー線照射により活性化し、酸を発生する潜在性の光酸触媒と、（Ｄ）分子中にグリシジル基を含有するシランカップリング剤を含む組成物であって、前記（Ａ）成分１００重量部に対して前記（Ｂ）成分が３０〜１５０重量部であり、なおかつ前記（Ａ）成分及び（Ｂ）成分の合計１００重量部に対して前記（Ｃ）成分が０．１〜１０重量部、前記（Ｄ）成分が０．１〜１０重量部であり、なおかつ前記組成物は２５℃では非流動性を示し、かつ、５０〜１００℃の範囲で流動性を発現することを特徴とする有機ＥＬ素子封止用光硬化性樹脂組成物である。 The photocurable resin composition disclosed in Patent Document 1 has (A) an epoxy resin having at least two or more glycidyl groups in one molecule, and having a molecular weight of 200 to 7,000, and (B) at least in one molecule. An epoxy resin having one or more glycidyl groups and having a molecular weight of 20,000 to 100,000, (C) a latent photoacid catalyst which is activated by energy ray irradiation to generate an acid, and (D) a glycidyl group in a molecule A composition containing a silane coupling agent, wherein the component (B) is 30 to 150 parts by weight with respect to 100 parts by weight of the component (A), and the component (A) and the component (B) The component (C) is 0.1 to 10 parts by weight, the component (D) is 0.1 to 10 parts by weight, and the composition is non-flowable at 25 ° C., based on 100 parts by weight of the components in total. And 50 An organic EL element encapsulation photocurable resin composition characterized by expressing a fluidity in the range of 100 ° C..
しかしながら、該有機ＥＬ素子封止用光硬化性樹脂組成物は、透湿性がやや高い傾向にあるため、有機ＥＬ素子内に空気中の水分が浸入して、電極の酸化や有機物の変性等が生じる場合があり、有機ＥＬ素子の発光特性が低下する場合があるという課題があった。 However, since the photocurable resin composition for sealing an organic EL element tends to have a somewhat high moisture permeability, moisture in the air infiltrates into the organic EL element to cause oxidation of the electrode, modification of the organic substance, and the like. In some cases, the light emission characteristics of the organic EL element may be degraded.
本発明が解決しようとする課題は、透湿性が低いため有機ＥＬ素子内に空気中の水分等が浸入することが少なく、有機ＥＬ素子に係る電極の酸化や有機物の変性等が生じにくく、また透明性が高く接着性が良好な熱硬化性シート組成物を提供することにある。 The problem to be solved by the present invention is that moisture permeability and the like in the air are less likely to infiltrate into the organic EL element because the moisture permeability is low, oxidation of the electrode related to the organic EL element and denaturation of organic substances are less likely to occur. It is an object of the present invention to provide a thermosetting sheet composition having high transparency and good adhesion.
請求項１記載の発明は、１分子中に２以上のグリシジル基を有するエポキシ当量が１００〜３００のエポキシ樹脂と、スチレン−イソブチレン−スチレンブロック共重合体ポリマーと、熱カチオン重合開始剤と、反応性官能基含有加水分解性シラン化合物とを、含み、エポキシ樹脂の組成物全体１００重量部に対する配合量は２０〜６０重量部であり、反応性官能基含有加水分解性シラン化合物の反応性官能基はグリシジル基、エポキシ基、イソシアヌレート基のいずれか、であることを特徴とする熱硬化性シート組成物を提供する。
The invention according to claim 1 is characterized in that an epoxy resin having an epoxy equivalent of 100 to 300 having two or more glycidyl groups in one molecule, a styrene-isobutylene-styrene block copolymer, a thermal cationic polymerization initiator, and a reaction. and sexual functional group-containing hydrolyzable silane compound, seen including, amount to the total 100 parts by weight composition of the epoxy resin is 20 to 60 parts by weight, reactive functionality of the reactive functional group-containing hydrolyzable silane compound The present invention provides a thermosetting sheet composition characterized in that the group is any one of glycidyl group, epoxy group and isocyanurate group .
また、請求項２記載の発明は、熱カチオン重合開始剤はカチオン部分が、芳香族スルホニウム、芳香族ヨードニウム、芳香族ジアゾニウム、芳香族アンモニウムから選択されることを特徴とする請求項１記載の熱硬化性シート組成物を提供する。 In the invention according to claim 2, the cationic thermal initiator is selected from the group consisting of aromatic sulfonium, aromatic iodonium, aromatic diazonium and aromatic ammonium as the cationic moiety. Provided is a curable sheet composition.
また、請求項３記載の発明は、有機ＥＬ素子封止用であることを特徴とする請求項１又は２記載の熱硬化性シート組成物を提供する。 The invention according to claim 3 provides the thermosetting sheet composition according to claim 1 or 2, which is for sealing an organic EL element .
本発明に係る熱硬化性シート組成物は、透湿性が低いため、有機ＥＬ素子内に空気中の水分等が浸入することが少なく、有機ＥＬ素子に係る電極の酸化や有機物の変性等が生じにくいという効果がある。また透明性が高いため、長期間にわたって安定な発光特性を維持することが出来る効果がある。さらにはガラス板やＰＥＴフィルムに高い接着性を有する効果がある。 Since the thermosetting sheet composition according to the present invention has low moisture permeability, moisture and the like in the air hardly infiltrate into the organic EL element, causing oxidation of the electrode of the organic EL element, modification of the organic substance, and the like. It has the effect of being difficult. In addition, since the transparency is high, there is an effect that stable light emission characteristics can be maintained for a long period of time. Furthermore, there is an effect that the glass plate and the PET film have high adhesiveness.
以下本発明について詳細に説明する。 The present invention will be described in detail below.
本発明の熱硬化性シート組成物は、１分子中に２以上のグリシジル基を有するエポキシ当量が１００〜３００のエポキシ樹脂と、スチレン−イソブチレン−スチレンブロック共重合体ポリマーと、熱カチオン重合開始剤と、反応性官能基含有加水分解性シラン化合物とを、含むことを特徴とする熱硬化性シート組成物であり、本組成物の性能を損なわない範囲で、必要により、吸湿剤、消泡剤、レベリング剤、チクソ付与剤、希釈剤、接着付与剤、難燃剤、充填材等を配合することが出来る。 The thermosetting sheet composition of the present invention comprises an epoxy resin having an epoxy equivalent of 100 to 300 and an epoxy equivalent of 100 to 300 having two or more glycidyl groups in one molecule, a styrene-isobutylene-styrene block copolymer, and a thermal cationic polymerization initiator. And a hydrolyzable silane compound containing a reactive functional group, as long as the performance of the present composition is not impaired. A leveling agent, a thixo agent, a diluent, an adhesion agent, a flame retardant, a filler, etc. can be blended.
１分子中に２以上のグリシジル基を有するエポキシ当量が１００〜３００のエポキシ樹脂
本発明に使用される１分子中に２以上のグリシジル基を有するエポキシ当量が１００〜３００のエポキシ樹脂は、熱カチオン重合開始剤によって硬化する熱硬化性樹脂であり、組成物に接着性、低透湿性を付与するために配合される。エポキシ当量は１００〜３００が好ましく、より好ましくは１５０〜３００であり、エポキシ当量が１００未満では接着力低下が起こり、エポキシ当量が３００超では低透湿性が損なわれる。組成物全体１００重量部中の配合量は、２０〜６０重量部であり、２０重量部未満では接着不良となり、６０重量部超ではハンドリング性不良となる。具体的には、ビスフェノールＡ型エポキシ樹脂、ビスフェノールＦ型エポキシ樹脂、水素化ビスフェノールＡ型エポキシ樹脂、水素化ビスフェノールＦ型エポキシ樹脂、ジシクロペンタジエン型エポキシ樹脂、ノボラック型エポキシ樹脂、ビフェニル型エポキシ樹脂等を使用することが出来るが、該エポキシ樹脂のほか、溶剤に溶解して流延塗工法や溶融押し出し成形法等により容易にシートを成形することができるフェノキシ樹脂をさらに加えることが出来る。フェノキシ樹脂は、熱カチオン重合開始剤によって架橋するため熱硬化樹脂としても機能し、フェノキシ樹脂を配合する場合、組成物全体１００重量部中のフェノキシ樹脂の配合量は、０〜２０重量部が好ましく、２０重量部超では接着不良となる。またフェノキシ樹脂の重量平均分子量は２００００〜１０００００が好ましく、２００００未満では成膜不良となり、１０００００超ではシート形成前の各材料との混合が困難と成る。
Epoxy resin having an epoxy equivalent of 100 to 300 having two or more glycidyl groups in one molecule The epoxy resin having an epoxy equivalent of 100 to 300 having two or more glycidyl groups in one molecule used in the present invention is a thermal cation It is a thermosetting resin cured by a polymerization initiator, and is blended to impart adhesiveness and low moisture permeability to the composition. The epoxy equivalent is preferably 100 to 300, more preferably 150 to 300. If the epoxy equivalent is less than 100, the adhesive strength decreases, and if the epoxy equivalent is more than 300, the low moisture permeability is impaired. The compounding amount in 100 parts by weight of the whole composition is 20 to 60 parts by weight. If less than 20 parts by weight, adhesion becomes poor, and if more than 60 parts by weight, handling becomes poor. Specifically, bisphenol A epoxy resin, bisphenol F epoxy resin, hydrogenated bisphenol A epoxy resin, hydrogenated bisphenol F epoxy resin, dicyclopentadiene epoxy resin, novolac epoxy resin, biphenyl epoxy resin, etc. In addition to the epoxy resin, it is possible to further add a phenoxy resin which can be dissolved in a solvent and which can be easily molded into a sheet by a casting coating method, a melt extrusion molding method or the like. The phenoxy resin functions as a thermosetting resin because it is crosslinked by a thermal cationic polymerization initiator, and when the phenoxy resin is blended, the blending amount of the phenoxy resin in 100 parts by weight of the whole composition is preferably 0 to 20 parts by weight If the amount is more than 20 parts by weight, adhesion failure occurs. The weight average molecular weight of the phenoxy resin is preferably 20000 to 100000. If the weight average molecular weight is less than 20000, the film formation becomes defective. If it exceeds 100000, mixing with each material before sheet formation becomes difficult.
スチレン−イソブチレン−スチレンブロック共重合体ポリマー
本発明に使用されるスチレン−イソブチレン−スチレンブロック共重合体ポリマーは、上記１分子中に２以上のグリシジル基を有するエポキシ当量が１００〜３００のエポキシ樹脂と、同時に配合されることにより組成物に接着性を付与すると共に、硬化後の組成物に低い透湿性能を与える。スチレン成分の含有量は１５〜３５重量％が好ましく。１５重量％未満では低透湿性と皮膜性が損なわれ、３５重量％超ではシート形成前の各材料との混合が困難となる。また重量平均分子量は１００００〜４０００００が好ましく、１００００未満では成膜化困難となり、４０００００超ではシート形成前の各材料との混合が困難となる。スチレン−イソブチレン−スチレンブロック共重合体ポリマーの組成物全体１００重量部に対する配合量は２０〜８０重量部であり、２０重量部未満では成膜不良となり、８０重量部超では接着不良となる。
Styrene-isobutylene-styrene block copolymer polymer The styrene-isobutylene-styrene block copolymer polymer used in the present invention is an epoxy resin having an epoxy equivalent of 100 to 300 and having two or more glycidyl groups in one molecule. In addition to imparting adhesiveness to the composition by being compounded simultaneously, the composition after curing is provided with low moisture permeation performance. The content of the styrene component is preferably 15 to 35% by weight. If the amount is less than 15% by weight, the low moisture permeability and the film properties are impaired, and if it exceeds 35% by weight, mixing with each material before sheet formation becomes difficult. The weight average molecular weight is preferably 10000 to 400000. If the weight average molecular weight is less than 10000, film formation becomes difficult, and if it exceeds 400000, mixing with each material before sheet formation becomes difficult. The blending amount of the styrene-isobutylene-styrene block copolymer with respect to 100 parts by weight of the whole composition is 20 to 80 parts by weight, less than 20 parts by weight results in film formation failure, and more than 80 parts by weight results in adhesion failure.
熱カチオン重合開始剤
本発明に使用される熱カチオン重合開始剤は、熱によってカチオンイオンを発生し、例えば、カチオン部分が、芳香族スルホニウム、芳香族ヨードニウム、芳香族ジアゾニウム、芳香族アンモニウム等であり、アニオン部分が、ＢＦ４ -、ＰＦ６ -、ＳｂＦ６ −、Ｂ（Ｃ６Ｆ５）４ −、等で構成されるオニウム塩を単独又は２種以上使用することが出来る。
Thermal cationic polymerization initiator The thermal cationic polymerization initiator used in the present invention generates cationic ions by heat, and for example, the cationic moiety is aromatic sulfonium, aromatic iodonium, aromatic diazonium, aromatic ammonium, etc. And the like. It is possible to use one or more of onium salts whose anion moiety is composed of BF 4 − , PF 6 − , SbF 6 − , B (C 6 F 5 ) 4 − , and the like.
芳香族スルホニウム塩としては、例えば、トリフェニルスルホニウムヘキサフルオロホスフェート、トリフェニルスルホニウムヘキサフルオロアンチモネート、トリフェニルスルホニウムテトラキス（ペンタフルオロフェニル）ボレート、４,４´−ビス（ジフェニルスルホニオ）ジフェニルスルフィドビスヘキサフルオロホスフェート、４，４´−ビス[ジ（β−ヒドロキシエトキシ）フェニルスルホニオ]ジフェニルスルフィドビスヘキサフルオロアンチモネート、４，４´−ビス[（ジ（β−ヒドロキシエトキシ）フェニルスルホニオ]ジフェニルスルフィドビスヘキサフルオロホスフェート、７−[ジ（ｐ−トルイル）スルホニオ]−２−イソプロピルチオキサントンヘキサフルオロアンチモネート、７−[（ジ（ｐ−トルイル）スルホニオ]−２−イソプロピルチオキサントンテトラキス（ペンタフルオロフェニル）ボレート、４−フェニルカルボニル−４´−ジフェニルスルホニオ−ジフェニルスルフィドハキサフルオロホスフェート、などを使用することが出来る。 As the aromatic sulfonium salt, for example, triphenylsulfonium hexafluorophosphate, triphenylsulfonium hexafluoroantimonate, triphenylsulfonium tetrakis (pentafluorophenyl) borate, 4,4'-bis (diphenylsulfonio) diphenyl sulfide bishexa Fluorophosphate, 4,4′-bis [di (β-hydroxyethoxy) phenylsulfonio] diphenyl sulfide bishexafluoroantimonate, 4,4′-bis [(di (β-hydroxyethoxy) phenyl sulfonio] diphenyl sulfide Bishexafluorophosphate, 7- [di (p-toluyl) sulfonio] -2-isopropylthioxanthone hexafluoroantimonate, 7-[(di (p-toluyl) sulfonio] -2- Isopropyl thioxanthone tetrakis (pentafluorophenyl) borate, 4-phenylcarbonyl-4'-diphenylsulfonio-diphenyl sulfide haxafluorophosphate, and the like can be used.
熱カチオン重合開始剤は、上記エポキシ樹脂１００重量部に対して、０．５〜１０重量部が好ましく、より好ましくは１〜５重量部である。０．５重量部未満では硬化不十分となり、１０重量部超では組成物としての保存安定性が不良となる。１重量部未満では硬化不十分となる傾向があり、５重量部超では組成物としての保存安定性と不良になる傾向がある。市販の芳香族スルホニウム塩の熱カチオン重合開始剤としては、サンエイドＳＩ−８０（商品名、三新化学工業株式会社製、化学名：２−メチルベンジルメチルp−ヒドロキシフェニルスルホニウムヘキサフルオロアンチモナート）がある。 The amount of the thermal cationic polymerization initiator is preferably 0.5 to 10 parts by weight, and more preferably 1 to 5 parts by weight with respect to 100 parts by weight of the epoxy resin. Less than 0.5 parts by weight results in insufficient curing, and more than 10 parts by weight results in poor storage stability as a composition. When the amount is less than 1 part by weight, curing tends to be insufficient, and when the amount is more than 5 parts by weight, the composition tends to have storage stability and defects. As a thermal cationic polymerization initiator of a commercially available aromatic sulfonium salt, SunAid SI-80 (trade name, manufactured by Sanshin Chemical Industry Co., Ltd., chemical name: 2-methylbenzylmethyl p-hydroxyphenyl sulfonium hexafluoroantimonate) is used. is there.
反応性官能基含有加水分解性シラン化合物
本発明に使用される反応性官能基含有加水分解性シラン化合物は、良好な接着性を得るために配合され、反応性官能基とは、加水分解性を有するアルコキシシリル基以外の反応性官能基を言い、例えば３−グリシドキシプロピルトリメトキシシラン、３−グリシドキシプロピルトリエトキシシラン、３−グリシドキシプロピルメチルジエトキシシラン、３−グリシドキシプロピルメチルジメトキシシラン、２−（３，４−エポキシシクロヘキシル）エチルトリメトキシシラン、２−（３，４−エポキシシクロヘキシル）エチルトリエトキシシラン、トリス（トリアルコキシシリルプロピル）イソシアヌレート等を単独または併用して使用することが出来る。特に、トリス（トリアルコキシシリルプロピル）イソシアヌレートを配合することにより熱硬化性シート組成物の接着性を著しく向上させることが出来る効果があり、上記例示した他の反応性官能基含有加水分解性シラン化合物と比較してトリス（トリアルコキシシリルプロピル）イソシアヌレートは接着性向上に顕著な効果を有する。該反応性官能基含有加水分解性シラン化合物の熱硬化性シート組成物全体１００重量部に対する配合量は、０．１〜１０重量部が好ましく、０．１重量部未満では接着不良となり、１０重量部超では硬化不良となる。
Reactive Functional Group-Containing Hydrolyzable Silane Compound The reactive functional group-containing hydrolyzable silane compound used in the present invention is compounded to obtain good adhesion, and the reactive functional group means hydrolysis. For example, 3-glycidoxypropyltrimethoxysilane, 3-glycidoxypropyltriethoxysilane, 3-glycidoxypropylmethyldiethoxysilane, 3-glycidoxy. Propylmethyldimethoxysilane, 2- (3,4-epoxycyclohexyl) ethyltrimethoxysilane, 2- (3,4-epoxycyclohexyl) ethyltriethoxysilane, tris (trialkoxysilylpropyl) isocyanurate, etc. alone or in combination Can be used. In particular, by blending tris (trialkoxysilylpropyl) isocyanurate, there is an effect that the adhesion of the thermosetting sheet composition can be remarkably improved, and the other reactive functional group-containing hydrolyzable silanes exemplified above Compared to the compounds, tris (trialkoxysilylpropyl) isocyanurate has a remarkable effect on adhesion improvement. The compounding amount of the reactive functional group-containing hydrolyzable silane compound relative to 100 parts by weight of the thermosetting sheet composition is preferably 0.1 to 10 parts by weight, and less than 0.1 parts by weight causes adhesion failure, and 10 parts by weight If it is more than 10 parts, curing will be poor.
以下、実施例及び比較例にて本出願に係る熱硬化性シート組成物について具体的に説明する。 Hereinafter, the thermosetting sheet composition concerning the present application is concretely explained with an example and a comparative example.
実施例１乃至実施例１２
１分子中に２以上のグリシジル基を有するエポキシ当量が１００〜３００のエポキシ樹脂として、エピクロン ＨＰ−７２００（商品名、ジシクロペンンタジエン型エポキシ樹脂、エポキシ当量：２５４−２６４、ＤＩＣ社製）及びｊＥＲ ＹＸ−８０００（商品名、水素化ビスフェノールＡエポキシ樹脂、エポキシ当量：２０５、三菱化学社製）を使用し、スチレン−イソブチレン−スチレンブロック共重合体ポリマーとして、ＳＩＢＳＴＡＲ ０６２Ｔ（商品名、スチレン含有量：２３％、Ｍｎ：６００００）、ＳＩＢＳＴＡＲ ０７２Ｔ（商品名、スチレン含有量：２３％、Ｍｎ：７００００）、ＳＩＢＳＴＡＲ １０２Ｔ（商品名、スチレン含有量：１５％、Ｍｎ：１０００００）を使用し、反応性官能基含有加水分解性シラン化合物として、ＤＹＮＡＳＩＬＡＮ ＧＬＹＭＯ（商品名、化学名：３−グリシドキシプロピルトリメトキシシラン、ＥＶＯＮＩＣ社製）及びトリス（トリアルコキシシリルプロピル）イソシアヌレートを使用し、熱カチオン重合開始剤として、低中温（１１０℃〜１８０℃）加熱用のサンエイドＳＩ−８０（商品名、化学名：２−メチルベンジルメチルp−ヒドロキシフェニルスルホニウムヘキサフルオロアンチモナート、三新化学工業社製）を使用し、その他にフェノキシ樹脂として、フェノトートＹＰ−７０（商品名、ペレット状固体、重量平均分子量：５００００〜６００００、新日鐵住金化学社製）を使用し、充填材としてタルクＳＧ−９５（商品名、平均粒径Ｄ５０：２．５μｍ、日本タルク社製）を使用し、表１に示す配合に加え、それぞれトルエン１４６重量部、酢酸ブチル３７重量部を加えて均一に攪拌混合し、シート形成前混合液を得る。該混合液を離型用ＰＥＴフィルムＮＰ３８ＳＡ（商品名、パナック社製）上にフィルムアプリケーター（Ｓｈｅｅｎ社製、ＳＡ−２０４）で、４０〜５０μｍに均一に塗布し、その後７０℃オーブンで５分間乾燥し、トルエン及び酢酸エチルを全て塗布塗膜中より揮発させる。フィルム厚み測定器ＤＩＧＩＭＩＣＲＯ（ＮＩＫＯＮ社製）にて、ＰＥＴフィルム上に形成された熱硬化性シート組成物の厚みが２０〜２５μｍとなっていることを確認し実施例１乃至実施例１２の熱硬化性シート組成物を得た。
Example 1 to Example 12
Epiclon HP-7200 (trade name, dicyclopentadiene type epoxy resin, epoxy equivalent: 254-264, manufactured by DIC) as an epoxy resin having an epoxy equivalent of 100 to 300 having two or more glycidyl groups in one molecule And jER YX-8000 (trade name, hydrogenated bisphenol A epoxy resin, epoxy equivalent: 205, manufactured by Mitsubishi Chemical Corporation), and as a styrene-isobutylene-styrene block copolymer polymer, SIBSTAR 062T (trade name, styrene-containing) Amount: 23%, Mn: 60000), SIBSTAR 072T (trade name, styrene content: 23%, Mn: 70000), SIBSTAR 102T (trade name, styrene content: 15%, Mn: 100000) and reaction Functional hydrolyzable silane compound Using DYNASILAN GLYMO (trade name, chemical name: 3-glycidoxypropyltrimethoxysilane, manufactured by EVONIC) and tris (trialkoxysilylpropyl) isocyanurate, as a thermal cationic polymerization initiator, at a low temperature (110 ° C.) ~ 180 ° C) Using SANAID SI-80 for heating (trade name, chemical name: 2-methylbenzylmethyl p-hydroxyphenylsulfonium hexafluoroantimonate, manufactured by Sanshin Chemical Industry Co., Ltd.), and additionally as a phenoxy resin, Pheno tote YP-70 (trade name, pellet-like solid, weight average molecular weight: 50000 to 60000, manufactured by Nippon Steel Sumikin Chemical Co., Ltd.) is used, and talc SG-95 (trade name, average particle diameter D 50 : as filler) 2.5 μm, manufactured by Nippon Talc Co., Ltd.), and in addition to the formulations shown in Table 1, 146 parts by weight of toluene and 37 parts by weight of butyl acetate are added and uniformly mixed by stirring to obtain a mixture before sheet formation. The mixture is uniformly applied to a thickness of 40 to 50 μm on a release PET film NP38SA (trade name, manufactured by Panac) using a film applicator (SA-204, manufactured by Sheen), and then dried in an oven at 70 ° C. for 5 minutes And all toluene and ethyl acetate are volatilized from the coated film. It was confirmed that the thickness of the thermosetting sheet composition formed on the PET film was 20 to 25 μm with a film thickness measuring instrument DIGIMICRO (manufactured by NIKON), and the heat curing of Example 1 to Example 12 Sex sheet composition was obtained.
比較例１乃至比較例７
実施例１乃至実施例１２で使用した材料のほか、フェノキシ樹脂としてフェノトートＹＰ−５０（商品名、ペレット状固体、重量平均分子量６００００〜８００００、新日鐵住金化学社製）を使用し、スチレン−イソブチレン−スチレンブロック共重合体ポリマーに代えて、スチレン−エチレン／プロピレン−スチレンブロック共重合体であるセプトン２００２（商品名、スチレン含有量：３０重量％、Ｍｗ：不明（情報未開示）、クラレ社製）、アクリル系熱可塑性エラストマーであるクラリティＬＡ２１４０ｅ（商品名、メチルメタアクリル酸とアクリル酸ブチルとのブロック共重合体、Ｍｗ：不明（情報未開示））、非晶性共重合ポリエステル樹脂であるバイロン２００（商品名、ペレット状、数平均分子量：１７０００、比重：１．２６、Ｔｇ：６７℃、東洋紡社製）、熱可塑性飽和共重合ポリエステル樹脂であるエリーテルＵＥ３２１０（商品名、重量平均分子量：２００００、比重：１．２５、ユニチカ社製）を使用し、表１に示す配合に加え、それぞれトルエン１４６重量部、酢酸ブチル３７重量部を加えて均一に攪拌混合し、シート形成前混合液を得る。該混合液をＰＥＴフィルムＮＰ３８ＳＡ（商品名、パナック社製）上にフィルムアプリケーター（Ｓｈｅｅｎ社製、ＳＡ−２０４）で、４０〜５０μｍに均一に塗布し、その後７０℃オーブンで５分間乾燥し、トルエン及び酢酸エチルを全て塗布塗膜中より揮発させる。フィルム厚み測定器ＤＩＧＩＭＩＣＲＯ（ＮＩＫＯＮ社製）にて、ＰＥＴフィルム上に形成された熱硬化性シート組成物の厚みが２０〜２５μｍとなっていることを確認し比較例１乃至比較例７の熱硬化性シート組成物を得た。
Comparative Examples 1 to 7
In addition to the materials used in Examples 1 to 12, Phenotote YP-50 (trade name, solid in pellet form, weight average molecular weight 60000 to 80000, manufactured by Nippon Steel Sumikin Chemical Co., Ltd.) is used as a phenoxy resin, styrene -Septone 2002 (trade name, styrene content: 30% by weight, Mw: unknown (information not disclosed), Kuraray) which is a styrene-ethylene / propylene-styrene block copolymer instead of isobutylene-styrene block copolymer Made in Japan, Clarity LA2140e (trade name, block copolymer of methyl methacrylate and butyl acrylate, Mw: unknown (undisclosed information)), which is an acrylic thermoplastic elastomer, non-crystalline copolyester resin A certain Byron 200 (trade name, pellet, number average molecular weight: 17,000, specific gravity: 1. 6, Tg: 67 ° C., manufactured by Toyobo Co., Ltd. Erietel UE 3210 (trade name, weight average molecular weight: 20000, specific gravity: 1.25, manufactured by Unitika Co., Ltd.) which is a thermoplastic saturated copolymerized polyester resin is used. In addition to the composition shown, 146 parts by weight of toluene and 37 parts by weight of butyl acetate are added, respectively, and the mixture is uniformly stirred and mixed to obtain a mixture before sheet formation. The mixed solution is uniformly coated to 40 to 50 μm on a PET film NP38SA (trade name, manufactured by PANAK) using a film applicator (SA-204, manufactured by Sheen), and then dried in an oven at 70 ° C. for 5 minutes. And all ethyl acetate is volatilized from the coated film. It was confirmed that the thickness of the thermosetting sheet composition formed on the PET film was 20 to 25 μm with a film thickness measuring instrument DIGIMICRO (manufactured by NIKON), and the thermosetting of Comparative Example 1 to Comparative Example 7 Sex sheet composition was obtained.
評価項目及び評価方法Evaluation item and evaluation method
接着性
実施例１乃至実施例１２又は比較例１乃至比較例７の熱硬化性シート組成物を離型用ＰＥＴフィルムが付着した状態で２０×５０ｍｍに調整し、組成物側を２０×５０×２ｍｍ厚みの青板ガラス板の全面に重なるように貼り付け、真空ラミネーター（日清紡メカトロニクス社製）にて４０℃にて２分間脱泡しながら貼り付ける。その後離型用ＰＥＴフィルムを剥離し、あらためて２０×１２０ｍｍ（厚さ２５μｍｍ）にカットした剥離試験用ＰＥＴフィルム ルミラー（商品名、東レ社製）を貼り付けて同様に真空ラミネーター（日清紡メカトロニクス社製）にて４０℃にて２分間脱泡しながら貼り付ける。この状態で１００℃に昇温して１時間該温度を保ち、熱硬化性シート組成物を硬化させることにより、実施例１乃至実施例５又は比較例１乃至比較例７の熱硬化性シート組成物のそれぞれの剥離試験用試験片を作製した。その後２３℃に徐冷し、引張試験機ＴＧＩ−１ｋＮ（ミネベア社製）にて試験片の剥離試験用ＰＥＴフィルムを青板ガラス板に対して９０度方向に３００ｍｍ／ｍｉｎで引張り、２０ｍｍ幅に剥離強度（Ｎ）を測定した。また剥離部分の破壊状態を目視にて観察した。
Adhesiveness The thermosetting sheet composition of Examples 1 to 12 or Comparative Examples 1 to 7 is adjusted to 20 × 50 mm with the release PET film adhered, and the composition side is 20 × 50 × It sticks so that it may overlap on the whole surface of a 2 mm thick blue sheet glass plate, and it sticks, degassing for 2 minutes at 40 degreeC with a vacuum laminator (made by Nisshinbo Mechatronics company make). After that, the PET film for mold release is peeled off, and the PET film for peel test (trade name, manufactured by Toray Industries, Inc.), which has been cut again to 20 × 120 mm (thickness 25 μm), is attached and a vacuum laminator (manufactured by Nisshinbo Mechatronics) While degassing at 40 ° C for 2 minutes. In this state, the thermosetting sheet composition of Example 1 to Example 5 or Comparative Example 1 to Comparative Example 7 is obtained by raising the temperature to 100 ° C. and maintaining the temperature for 1 hour to cure the thermosetting sheet composition. Test pieces for peeling test of each of the objects were prepared. After that, it was gradually cooled to 23 ° C, and the PET film for peel test of the test piece was pulled with a tensile tester TGI-1kN (made by Minebea) at 300 mm / min in the 90 ° direction against the blue sheet glass plate to peel 20 mm wide. The strength (N) was measured. Further, the broken state of the peeled portion was visually observed.
透湿度
実施例１乃至実施例１２又は比較例１乃至比較例７の熱硬化性シート組成物を１００℃のオーブンに１時間放置し、熱硬化性シート組成物を硬化させる。その後、ＪＩＳ Ｚ ０２０８（防湿包装材料の透湿度試験方法（カップ法））に準拠し、条件Ｂ（４０±０．５℃、相対湿度９０±２％）の温湿度条件で、透湿度（ｇ／ｍ２・２４ｈ）を求めた。
Moisture Permeability The thermosetting sheet compositions of Examples 1 to 12 or Comparative Examples 1 to 7 are left to stand in an oven at 100 ° C. for 1 hour to cure the thermosetting sheet composition. Then, according to JIS Z 0208 (moisture permeability test method for moisture-proof packaging material (cup method)), moisture permeability (g in g) under the condition B (40 ± 0.5 ° C., relative humidity 90 ± 2%) under the temperature and humidity / M 2 · 24h) was obtained.
全光線透過率
実施例１乃至実施例１２又は比較例１乃至比較例７の熱硬化性シート組成物を１００℃のオーブンに１時間放置し、熱硬化性シート組成物を硬化させる。その後、ＪＩＳ Ｋ ７３６１−１（プラスチック−透明材料の全光線透過率の試験方法―第１部；シングルビーム法）に準拠し、厚さ２０μｍ部分の全光線透過率（％）を測定した。
Total Light Transmittance The thermosetting sheet compositions of Examples 1 to 12 or Comparative Examples 1 to 7 are left in an oven at 100 ° C. for 1 hour to cure the thermosetting sheet composition. Thereafter, the total light transmittance (%) of a 20 μm thick portion was measured in accordance with JIS K 7361-1 (Test method for total light transmittance of plastic-transparent material-part 1; single beam method).
評価結果
評価結果を表２に示す。
Evaluation Results Evaluation results are shown in Table 2.
まとめ
実施例１乃至実施例１２は青板ガラス及びＰＥＴフィルム対する接着性は良好であり、透湿度は４５ｇ／ｍ２・２４ｈ以下であり、全光線透過率は８８％以上であった。
Summary In Examples 1 to 12, the adhesion to blue sheet glass and PET film was good, the moisture permeability was 45 g / m 2 · 24 h or less, and the total light transmittance was 88% or more.
Claims (3)
エポキシ樹脂の組成物全体１００重量部に対する配合量は２０〜６０重量部であり、
反応性官能基含有加水分解性シラン化合物の反応性官能基はグリシジル基、エポキシ基、イソシアヌレート基のいずれか、であることを特徴とする熱硬化性シート組成物。 Epoxy resin having an epoxy equivalent of 100 to 300 having two or more glycidyl groups in one molecule, a styrene-isobutylene-styrene block copolymer, a thermal cationic polymerization initiator, and a reactive functional group-containing hydrolyzable silane Containing compounds and
The compounding amount is 20 to 60 parts by weight with respect to 100 parts by weight of the total composition of the epoxy resin,
A thermosetting sheet composition characterized in that the reactive functional group of the reactive functional group-containing hydrolyzable silane compound is any one of a glycidyl group, an epoxy group and an isocyanurate group.
The thermosetting sheet composition according to claim 1 or 2, which is for sealing an organic EL element.
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