JP6506614B2 - 固体撮像装置およびカメラ - Google Patents
固体撮像装置およびカメラ Download PDFInfo
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- JP6506614B2 JP6506614B2 JP2015099511A JP2015099511A JP6506614B2 JP 6506614 B2 JP6506614 B2 JP 6506614B2 JP 2015099511 A JP2015099511 A JP 2015099511A JP 2015099511 A JP2015099511 A JP 2015099511A JP 6506614 B2 JP6506614 B2 JP 6506614B2
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- 101100443272 Arabidopsis thaliana DIR2 gene Proteins 0.000 description 21
- 102100038804 FK506-binding protein-like Human genes 0.000 description 21
- 101001031402 Homo sapiens FK506-binding protein-like Proteins 0.000 description 21
- 238000006243 chemical reaction Methods 0.000 description 6
- 230000000052 comparative effect Effects 0.000 description 4
- 238000001444 catalytic combustion detection Methods 0.000 description 3
- 230000002093 peripheral effect Effects 0.000 description 3
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B3/00—Simple or compound lenses
- G02B3/0006—Arrays
- G02B3/0037—Arrays characterized by the distribution or form of lenses
- G02B3/0043—Inhomogeneous or irregular arrays, e.g. varying shape, size, height
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
- H04N23/54—Mounting of pick-up tubes, electronic image sensors, deviation or focusing coils
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B3/00—Simple or compound lenses
- G02B3/0006—Arrays
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B3/00—Simple or compound lenses
- G02B3/0006—Arrays
- G02B3/0037—Arrays characterized by the distribution or form of lenses
- G02B3/0056—Arrays characterized by the distribution or form of lenses arranged along two different directions in a plane, e.g. honeycomb arrangement of lenses
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B5/00—Optical elements other than lenses
- G02B5/02—Diffusing elements; Afocal elements
- G02B5/0205—Diffusing elements; Afocal elements characterised by the diffusing properties
- G02B5/021—Diffusing elements; Afocal elements characterised by the diffusing properties the diffusion taking place at the element's surface, e.g. by means of surface roughening or microprismatic structures
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14601—Structural or functional details thereof
- H01L27/14625—Optical elements or arrangements associated with the device
- H01L27/14627—Microlenses
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14683—Processes or apparatus peculiar to the manufacture or treatment of these devices or parts thereof
- H01L27/14685—Process for coatings or optical elements
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
- H04N23/55—Optical parts specially adapted for electronic image sensors; Mounting thereof
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N25/00—Circuitry of solid-state image sensors [SSIS]; Control thereof
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N25/00—Circuitry of solid-state image sensors [SSIS]; Control thereof
- H04N25/70—SSIS architectures; Circuits associated therewith
- H04N25/71—Charge-coupled device [CCD] sensors; Charge-transfer registers specially adapted for CCD sensors
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N25/00—Circuitry of solid-state image sensors [SSIS]; Control thereof
- H04N25/70—SSIS architectures; Circuits associated therewith
- H04N25/71—Charge-coupled device [CCD] sensors; Charge-transfer registers specially adapted for CCD sensors
- H04N25/75—Circuitry for providing, modifying or processing image signals from the pixel array
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N25/00—Circuitry of solid-state image sensors [SSIS]; Control thereof
- H04N25/70—SSIS architectures; Circuits associated therewith
- H04N25/76—Addressed sensors, e.g. MOS or CMOS sensors
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B3/00—Simple or compound lenses
- G02B2003/0093—Simple or compound lenses characterised by the shape
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- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- General Physics & Mathematics (AREA)
- Multimedia (AREA)
- Signal Processing (AREA)
- Electromagnetism (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Optics & Photonics (AREA)
- Solid State Image Pick-Up Elements (AREA)
- Transforming Light Signals Into Electric Signals (AREA)
Description
Claims (8)
- 複数の行および複数の列を構成するように複数のマイクロレンズが配列されたマイクロレンズアレイを備える固体撮像装置であって、
前記複数の行に平行で、前記マイクロレンズアレイの中心であるアレイ中心を通る第1軸と、前記複数の列に平行で前記アレイ中心を通る第2軸とを定義したときに、前記複数のマイクロレンズのうち前記アレイ中心を中心とする仮想円の上に位置するマイクロレンズは、前記第1軸または前記第2軸の上に位置する第1マイクロレンズと、前記第1軸および第2軸のいずれの上にも位置しない第2マイクロレンズとを含み、
前記第1マイクロレンズおよび前記第2マイクロレンズは、非円形の底面形状を有し、
前記第2マイクロレンズと前記アレイ中心とを通る第2方向における前記第2マイクロレンズの幅は、前記第1マイクロレンズと前記アレイ中心とを通る第1方向における前記第1マイクロレンズの幅より大きく、
前記第1マイクロレンズは、前記第1方向に平行な直線を対称軸とする線対称な形状を有し、前記第2マイクロレンズは、前記第2方向に平行な直線を対称軸とする線対称な形状を有する、
ことを特徴とする固体撮像装置。 - 前記第1マイクロレンズの頂点位置は、前記第1方向における前記第1マイクロレンズの幅の中心から前記アレイ中心の側にシフトした位置にあり、前記第2マイクロレンズの頂点位置は、前記第2方向における前記第2マイクロレンズの幅の中心から前記アレイ中心の側にシフトした位置にある、
ことを特徴とする請求項1に記載の固体撮像装置。 - 前記第2方向に平行な直線に沿って切断された前記第2マイクロレンズの断面形状は、前記第1方向に平行な直線に沿って切断された前記第1マイクロレンズの断面形状の少なくとも一部を拡大した形状を含む、
ことを特徴とする請求項1又は2に記載の固体撮像装置。 - 前記第2方向に平行な直線に沿って切断された前記第2マイクロレンズの断面形状は、前記第1方向に平行な直線に沿って切断された前記第1マイクロレンズの断面形状と相似である、
ことを特徴とする請求項1又は2に記載の固体撮像装置。 - 前記第1マイクロレンズの底面の外縁は、前記第1方向に平行な部分、および、前記第1方向に垂直な部分を含み、
前記第2マイクロレンズの底面の外縁は、前記第2方向に平行な部分、および、前記第2方向に垂直な部分を含む、
ことを特徴とする請求項1乃至4のいずれか1項に記載の固体撮像装置。 - 前記第1軸と前記第2方向とのなす角をθとしたときに、0°<θ≦45°、90°<θ≦135°、180°<θ≦225°、270°<θ≦315°の範囲で、前記第2方向における前記第2マイクロレンズの幅は、θの増加に応じて増加し、45°≦θ<90°、135°<θ≦180°225°<θ≦270°、315°<θ≦360°の範囲で、前記第2方向における前記第2マイクロレンズの幅は、θの増加に応じて減少する、
ことを特徴とする請求項1乃至5のいずれか1項に記載の固体撮像装置。 - 前記複数のマイクロレンズは、前記アレイ中心と前記第1マイクロレンズとの間に配置された第3マイクロレンズと、前記アレイ中心と前記第2マイクロレンズとの間に配置された第4マイクロレンズとを含み、前記第3マイクロレンズおよび前記第4マイクロレンズが円形の底面形状を有する、
ことを特徴とする請求項1乃至6のいずれか1項に記載の固体撮像装置。 - 請求項1乃至7のいずれか1項に記載の固体撮像装置と、
前記固体撮像装置から出力される信号を処理する処理部と、
を備えることを特徴とするカメラ。
Priority Applications (9)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2015099511A JP6506614B2 (ja) | 2015-05-14 | 2015-05-14 | 固体撮像装置およびカメラ |
EP16165488.4A EP3093887B1 (en) | 2015-05-14 | 2016-04-15 | Solid-state image sensor and camera |
US15/136,017 US10114151B2 (en) | 2015-05-14 | 2016-04-22 | Solid-state image sensor and camera |
BR102016009246A BR102016009246A2 (pt) | 2015-05-14 | 2016-04-26 | sensor de imagem de estado sólido e câmera |
KR1020160056116A KR20160134502A (ko) | 2015-05-14 | 2016-05-09 | 고체 촬상 센서 및 카메라 |
SG10201603687RA SG10201603687RA (en) | 2015-05-14 | 2016-05-10 | Solid-state image sensor and camera |
PH12016000181A PH12016000181A1 (en) | 2015-05-14 | 2016-05-11 | Solid-state image sensor and camera |
RU2016118405A RU2650729C2 (ru) | 2015-05-14 | 2016-05-12 | Твердотельный датчик изображений и камера |
CN201610317738.XA CN106161891B (zh) | 2015-05-14 | 2016-05-13 | 固态图像传感器和照相机 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
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JP2015099511A JP6506614B2 (ja) | 2015-05-14 | 2015-05-14 | 固体撮像装置およびカメラ |
Publications (3)
Publication Number | Publication Date |
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JP2016219469A JP2016219469A (ja) | 2016-12-22 |
JP2016219469A5 JP2016219469A5 (ja) | 2018-06-21 |
JP6506614B2 true JP6506614B2 (ja) | 2019-04-24 |
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JP2015099511A Active JP6506614B2 (ja) | 2015-05-14 | 2015-05-14 | 固体撮像装置およびカメラ |
Country Status (9)
Country | Link |
---|---|
US (1) | US10114151B2 (ja) |
EP (1) | EP3093887B1 (ja) |
JP (1) | JP6506614B2 (ja) |
KR (1) | KR20160134502A (ja) |
CN (1) | CN106161891B (ja) |
BR (1) | BR102016009246A2 (ja) |
PH (1) | PH12016000181A1 (ja) |
RU (1) | RU2650729C2 (ja) |
SG (1) | SG10201603687RA (ja) |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US10205894B2 (en) | 2015-09-11 | 2019-02-12 | Canon Kabushiki Kaisha | Imaging device and imaging system |
JP6688165B2 (ja) | 2016-06-10 | 2020-04-28 | キヤノン株式会社 | 撮像装置及び撮像システム |
JP6727938B2 (ja) | 2016-06-10 | 2020-07-22 | キヤノン株式会社 | 撮像装置、撮像装置の制御方法、及び撮像システム |
JP6776011B2 (ja) | 2016-06-10 | 2020-10-28 | キヤノン株式会社 | 撮像装置及び撮像システム |
JP7013119B2 (ja) | 2016-07-21 | 2022-01-31 | キヤノン株式会社 | 固体撮像素子、固体撮像素子の製造方法、及び撮像システム |
US10212576B2 (en) | 2016-09-08 | 2019-02-19 | Samsung Electronics Co., Ltd. | Near field communication device |
CN109842766B (zh) * | 2018-12-28 | 2021-05-18 | 上海集成电路研发中心有限公司 | 一种极坐标图像传感器及其进行图像处理的方法 |
Family Cites Families (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5662401A (en) * | 1995-12-13 | 1997-09-02 | Philips Electronics North America Corporation | Integrating lens array and image forming method for improved optical efficiency |
US7375892B2 (en) * | 2003-10-09 | 2008-05-20 | Micron Technology, Inc. | Ellipsoidal gapless microlens array and method of fabrication |
JP2007335723A (ja) | 2006-06-16 | 2007-12-27 | Fujifilm Corp | 固体撮像素子用マイクロレンズ及びその製造方法 |
US20080011936A1 (en) | 2006-07-14 | 2008-01-17 | Visera Technologies Company Ltd, Roc | Imaging sensor having microlenses of different radii of curvature |
JP4941233B2 (ja) | 2007-10-31 | 2012-05-30 | 大日本印刷株式会社 | 固体撮像素子およびそれを用いた撮像装置 |
US7687757B1 (en) * | 2009-01-29 | 2010-03-30 | Visera Technologies Company Limited | Design of microlens on pixel array |
WO2011061998A1 (ja) | 2009-11-20 | 2011-05-26 | 富士フイルム株式会社 | 固体撮像装置 |
GB2498972A (en) * | 2012-02-01 | 2013-08-07 | St Microelectronics Ltd | Pixel and microlens array |
JP5791664B2 (ja) | 2013-06-28 | 2015-10-07 | キヤノン株式会社 | 光学素子アレイ、及び固体撮像装置 |
JP2015109314A (ja) | 2013-12-03 | 2015-06-11 | 株式会社東芝 | 固体撮像装置 |
JP2016058538A (ja) | 2014-09-09 | 2016-04-21 | キヤノン株式会社 | 固体撮像装置およびカメラ |
-
2015
- 2015-05-14 JP JP2015099511A patent/JP6506614B2/ja active Active
-
2016
- 2016-04-15 EP EP16165488.4A patent/EP3093887B1/en active Active
- 2016-04-22 US US15/136,017 patent/US10114151B2/en active Active
- 2016-04-26 BR BR102016009246A patent/BR102016009246A2/pt not_active Application Discontinuation
- 2016-05-09 KR KR1020160056116A patent/KR20160134502A/ko not_active Application Discontinuation
- 2016-05-10 SG SG10201603687RA patent/SG10201603687RA/en unknown
- 2016-05-11 PH PH12016000181A patent/PH12016000181A1/en unknown
- 2016-05-12 RU RU2016118405A patent/RU2650729C2/ru active
- 2016-05-13 CN CN201610317738.XA patent/CN106161891B/zh active Active
Also Published As
Publication number | Publication date |
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JP2016219469A (ja) | 2016-12-22 |
US20160334550A1 (en) | 2016-11-17 |
CN106161891B (zh) | 2019-07-30 |
US10114151B2 (en) | 2018-10-30 |
CN106161891A (zh) | 2016-11-23 |
RU2016118405A (ru) | 2017-11-16 |
KR20160134502A (ko) | 2016-11-23 |
EP3093887B1 (en) | 2018-01-24 |
RU2650729C2 (ru) | 2018-04-17 |
EP3093887A1 (en) | 2016-11-16 |
BR102016009246A2 (pt) | 2016-11-16 |
PH12016000181A1 (en) | 2018-01-22 |
SG10201603687RA (en) | 2016-12-29 |
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