JP6500504B2 - 電子デバイス、及び、電子デバイスの製造方法 - Google Patents
電子デバイス、及び、電子デバイスの製造方法 Download PDFInfo
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- JP6500504B2 JP6500504B2 JP2015043353A JP2015043353A JP6500504B2 JP 6500504 B2 JP6500504 B2 JP 6500504B2 JP 2015043353 A JP2015043353 A JP 2015043353A JP 2015043353 A JP2015043353 A JP 2015043353A JP 6500504 B2 JP6500504 B2 JP 6500504B2
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Description
前記第1の基板に前記第1の感光性接着剤を形成する第1の工程と、
前記第1の感光性接着剤に重ねて当該第1の感光性接着剤よりも硬化度が低い第2の感光性接着剤を設ける第2の工程と、
前記第1の基板と前記第2の基板との間に前記第1の感光性接着剤及び前記第2の感光性接着剤を挟んだ状態で、加熱により前記第2の感光性接着剤を硬化させて、前記第1の基板と前記第2の基板とを接合する接合工程と、を含むことを特徴とする。
前記第2の基板に前記第2の感光性接着剤よりも硬化度が高い前記第3の感光性接着剤を形成する第3の工程を含み、
前記接合工程は、前記第2の感光性接着剤と前記第3の感光性接着剤とを密着させた状態で、加熱により前記第2の感光性接着剤を硬化させることが望ましい。
前記第2の基板に前記第2の感光性接着剤よりも硬化度が高い前記第3の感光性接着剤を形成する第3の工程と、
前記第3の感光性接着剤に重ねて第2の感光性接着剤を設ける第4の工程と、を含み、
前記接合工程は、前記第1の基板に設けられた第2の感光性接着剤と前記第2の基板に設けられた第2の感光性接着剤とを密着させた状態で、加熱により両方の第2の感光性接着剤を硬化させることが望ましい。
当該第1の基板に形成された第1の感光性接着剤と、
当該第1の感光性接着剤に重ねて設けられた第2の感光性接着剤と、
前記第1の感光性接着剤及び前記第2の感光性接着剤を介在させた状態で前記第1の基板に接合された第2の基板と、を備え、
前記第2の感光性接着剤は、前記第1の基板と前記第2の基板との間において、少なくとも一部が前記第1の感光性接着剤よりも外側に膨らんで形成されたことを特徴とする。
また、上記目的を達成するために提案される本発明の電子デバイスの製造方法は、以下の工程を備えたものであってもよい。
すなわち、第1の基板と、第1の感光性接着剤及び第2の感光性接着剤を介在させた状態で前記第1の基板に接合された第2の基板と、を備えた電子デバイスの製造方法であって、
前記第1の基板に前記第1の感光性接着剤を形成する第1の工程と、
前記第1の感光性接着剤に重ねて当該第1の感光性接着剤よりも硬化度が低い第2の感光性接着剤を設ける第2の工程と、
前記第2の基板に前記第2の感光性接着剤よりも硬化度が高い前記第3の感光性接着剤を形成する第3の工程と、
前記第1の基板と前記第2の基板との間に前記第1の感光性接着剤、前記第2の感光性接着剤、及び前記第3の感光性接着剤を挟み、前記第2の感光性接着剤と前記第3の感光性接着剤とを密着させた状態で、加熱により前記第2の感光性接着剤を硬化させて、前記第1の基板と前記第2の基板とを接合する接合工程と、を含むことを特徴とする。
本発明によれば、第1の感光性接着剤上に当該第1の感光性接着剤よりも硬化度が低い第2の感光性接着剤を形成するため、第2の感光性接着剤により第1の基板と第2の基板との接合強度を向上させることができる。すなわち、接着剤のパターニング精度を向上させるべく第1の感光性接着剤の硬化反応を進めたとしても、第2の感光性接着剤により接着力を確保することができる。その結果、感光性接着剤のパターニング精度の向上と、接合強度の向上と、を両立できる。
また、第2の基板上に直接第3の感光性接着剤を塗布するため、第2の基板と第3の感光性接着剤との接合強度を確実に確保できる。さらに、第2の感光性接着剤と第3の感光性接着剤との接着、すなわち接着剤同士の接着により第1の基板と第2の基板とが接合されるため、第1の基板と第2の基板との接合強度をより向上させることができる。
また、本発明の電子デバイスの製造方法は、以下の工程を備えたものであってもよい。
すなわち、第1の基板と、第1の感光性接着剤及び第2の感光性接着剤を介在させた状態で前記第1の基板に接合された第2の基板と、を備えた電子デバイスの製造方法であって、
前記第1の基板に前記第1の感光性接着剤を形成する第1の工程と、
前記第1の感光性接着剤に重ねて当該第1の感光性接着剤よりも硬化度が低い第2の感光性接着剤を設ける第2の工程と、
前記第2の基板に前記第2の感光性接着剤よりも硬化度が高い前記第3の感光性接着剤を形成する第3の工程と、
前記第3の感光性接着剤に重ねて第2の感光性接着剤を設ける第4の工程と、
前記第1の基板と前記第2の基板との間に前記第1の感光性接着剤、前記第2の感光性接着剤、及び前記第3の感光接着剤を挟み、前記第1の基板に設けられた前記第2の感光性接着剤と前記第2の基板に設けられた前記第2の感光性接着剤とを密着させた状態で、加熱により各第2の感光性接着剤を硬化させて、前記第1の基板と前記第2の基板とを接合する接合工程と、を含むことを特徴とする。
本発明によれば、第1の感光性接着剤上に当該第1の感光性接着剤よりも硬化度が低い第2の感光性接着剤を形成するため、第2の感光性接着剤により第1の基板と第2の基板との接合強度を向上させることができる。すなわち、接着剤のパターニング精度を向上させるべく第1の感光性接着剤の硬化反応を進めたとしても、第2の感光性接着剤により接着力を確保することができる。その結果、感光性接着剤のパターニング精度の向上と、接合強度の向上と、を両立できる。
また、第2の基板上に直接第3の感光性接着剤を塗布するため、第2の基板と第3の感光性接着剤との接合強度を確実に確保できる。さらに、第2の感光性接着剤同士の接着により第1の基板と第2の基板とが接合されるため、第1の基板と第2の基板との接合強度を一層向上させることができる。
Claims (2)
- 第1の基板と、第1の感光性接着剤及び第2の感光性接着剤を介在させた状態で前記第1の基板に接合された第2の基板と、を備えた電子デバイスの製造方法であって、
前記第1の基板に前記第1の感光性接着剤を形成する第1の工程と、
前記第1の感光性接着剤に重ねて当該第1の感光性接着剤よりも硬化度が低い第2の感光性接着剤を設ける第2の工程と、
前記第2の基板に前記第2の感光性接着剤よりも硬化度が高い前記第3の感光性接着剤を形成する第3の工程と、
前記第1の基板と前記第2の基板との間に前記第1の感光性接着剤、前記第2の感光性接着剤、及び前記第3の感光性接着剤を挟み、前記第2の感光性接着剤と前記第3の感光性接着剤とを密着させた状態で、加熱により前記第2の感光性接着剤を硬化させて、前記第1の基板と前記第2の基板とを接合する接合工程と、を含むことを特徴とする電子デバイスの製造方法。 - 第1の基板と、第1の感光性接着剤及び第2の感光性接着剤を介在させた状態で前記第1の基板に接合された第2の基板と、を備えた電子デバイスの製造方法であって、
前記第1の基板に前記第1の感光性接着剤を形成する第1の工程と、
前記第1の感光性接着剤に重ねて当該第1の感光性接着剤よりも硬化度が低い第2の感光性接着剤を設ける第2の工程と、
前記第2の基板に前記第2の感光性接着剤よりも硬化度が高い前記第3の感光性接着剤を形成する第3の工程と、
前記第3の感光性接着剤に重ねて第2の感光性接着剤を設ける第4の工程と、
前記第1の基板と前記第2の基板との間に前記第1の感光性接着剤、前記第2の感光性接着剤、及び前記第3の感光接着剤を挟み、前記第1の基板に設けられた前記第2の感光性接着剤と前記第2の基板に設けられた前記第2の感光性接着剤とを密着させた状態で、加熱により各第2の感光性接着剤を硬化させて、前記第1の基板と前記第2の基板とを接合する接合工程と、を含むことを特徴とする電子デバイスの製造方法。
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