JP6489896B2 - 電子モジュール - Google Patents
電子モジュール Download PDFInfo
- Publication number
- JP6489896B2 JP6489896B2 JP2015066582A JP2015066582A JP6489896B2 JP 6489896 B2 JP6489896 B2 JP 6489896B2 JP 2015066582 A JP2015066582 A JP 2015066582A JP 2015066582 A JP2015066582 A JP 2015066582A JP 6489896 B2 JP6489896 B2 JP 6489896B2
- Authority
- JP
- Japan
- Prior art keywords
- hole
- coil
- core
- wiring
- insertion hole
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 238000003780 insertion Methods 0.000 claims description 38
- 230000037431 insertion Effects 0.000 claims description 38
- 239000000758 substrate Substances 0.000 claims description 15
- 239000000696 magnetic material Substances 0.000 claims description 3
- 239000010410 layer Substances 0.000 description 37
- 239000013067 intermediate product Substances 0.000 description 8
- 230000002093 peripheral effect Effects 0.000 description 5
- 230000015572 biosynthetic process Effects 0.000 description 4
- 239000004020 conductor Substances 0.000 description 4
- 239000012212 insulator Substances 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 239000004642 Polyimide Substances 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 238000005553 drilling Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 239000011229 interlayer Substances 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 230000035515 penetration Effects 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 238000005549 size reduction Methods 0.000 description 1
- 230000009466 transformation Effects 0.000 description 1
- 238000004804 winding Methods 0.000 description 1
- 229910000859 α-Fe Inorganic materials 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/28—Coils; Windings; Conductive connections
- H01F27/2804—Printed windings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/28—Coils; Windings; Conductive connections
- H01F27/30—Fastening or clamping coils, windings, or parts thereof together; Fastening or mounting coils or windings on core, casing, or other support
- H01F27/306—Fastening or mounting coils or windings on core, casing or other support
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/28—Coils; Windings; Conductive connections
- H01F27/2804—Printed windings
- H01F2027/2809—Printed windings on stacked layers
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Coils Or Transformers For Communication (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
- Parts Printed On Printed Circuit Boards (AREA)
Description
4 回路基板
6 電子部品
8 コアコイル領域
12 コア
20 中心軸
22、24 側壁
26 中心軸用挿通孔
32 コイル配線パターン
38 第1退避辺
40 第2退避辺
42 第1コイル配線
48 第1接続部
52 第2コイル配線
60 第2接続部
62 第3接続部
64 第3コイル配線
70 第4接続部
77 凹部
78 端面スルーホール
Claims (1)
- コア挿通孔が形成され、多数の配線層が積層されてなる多層基板と、
磁性材料で形成され、前記コア挿通孔に挿通されるコアと、を備え、
前記多層基板は、前記配線層のそれぞれにおける前記コア挿通孔を囲む位置に形成された複数のコイル配線パターンと、前記コア挿通孔の内壁面に形成され、前記複数のコイル配線パターンを電気的に接続してコイルを形成する端面スルーホールと、を含み、
前記コア挿通孔は、平面視が多角形形状をなし、その多角形形状の角と角との間の直線的な辺に相当する部分の内壁面に凹部が設けられており、前記凹部に前記端面スルーホールが形成されている、電子モジュール。
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2015066582A JP6489896B2 (ja) | 2015-03-27 | 2015-03-27 | 電子モジュール |
US15/080,283 US10276292B2 (en) | 2015-03-27 | 2016-03-24 | Electronic module with polygonal core insertion hole |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2015066582A JP6489896B2 (ja) | 2015-03-27 | 2015-03-27 | 電子モジュール |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2016186999A JP2016186999A (ja) | 2016-10-27 |
JP6489896B2 true JP6489896B2 (ja) | 2019-03-27 |
Family
ID=56976274
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2015066582A Active JP6489896B2 (ja) | 2015-03-27 | 2015-03-27 | 電子モジュール |
Country Status (2)
Country | Link |
---|---|
US (1) | US10276292B2 (ja) |
JP (1) | JP6489896B2 (ja) |
Family Cites Families (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3148356A (en) * | 1959-09-14 | 1964-09-08 | Jr George A Hedden | Printed circuit connector |
JPS62134213U (ja) * | 1986-02-17 | 1987-08-24 | ||
JPH069121U (ja) * | 1992-06-30 | 1994-02-04 | 日立フェライト株式会社 | コモンモードチョークコイル |
US7145787B2 (en) * | 1994-04-26 | 2006-12-05 | Comarco Wireless Technologies, Inc. | Programmable power supply |
JPH1032129A (ja) * | 1996-07-15 | 1998-02-03 | Tdk Corp | 薄型コイル部品とその製造方法 |
US6073339A (en) * | 1996-09-20 | 2000-06-13 | Tdk Corporation Of America | Method of making low profile pin-less planar magnetic devices |
US7180397B1 (en) * | 2004-02-20 | 2007-02-20 | Tyco Electronics Power Systems, Inc. | Printed wiring board having edge plating interconnects |
JP4802615B2 (ja) * | 2005-08-26 | 2011-10-26 | パナソニック電工株式会社 | Lc複合部品 |
US8502632B2 (en) * | 2008-04-24 | 2013-08-06 | Panasonic Corporation | Transformer, power converter, lighting device, lighting device for vehicle, and vehicle using the same |
US7987581B2 (en) * | 2008-05-28 | 2011-08-02 | Flextronics Ap, Llc | High power manufacturing friendly transformer |
TWM357691U (en) * | 2008-11-07 | 2009-05-21 | Delta Electronics Inc | Transformer |
JP2012134291A (ja) * | 2010-12-21 | 2012-07-12 | Sanken Electric Co Ltd | 電子回路装置 |
KR101323690B1 (ko) * | 2011-06-10 | 2013-10-30 | (주) 네톰 | 엣지형 다이폴 안테나 구조 및 이를 구비한 피씨비 |
US9633772B2 (en) * | 2013-03-14 | 2017-04-25 | Gentex Corporation | Solderable planar magnetic components |
KR102203090B1 (ko) * | 2013-12-20 | 2021-01-14 | 주식회사 솔루엠 | 변압기 및 어댑터 |
US9620278B2 (en) * | 2014-02-19 | 2017-04-11 | General Electric Company | System and method for reducing partial discharge in high voltage planar transformers |
-
2015
- 2015-03-27 JP JP2015066582A patent/JP6489896B2/ja active Active
-
2016
- 2016-03-24 US US15/080,283 patent/US10276292B2/en active Active
Also Published As
Publication number | Publication date |
---|---|
US10276292B2 (en) | 2019-04-30 |
JP2016186999A (ja) | 2016-10-27 |
US20160284464A1 (en) | 2016-09-29 |
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