JP6486571B1 - 電子部品用接着剤 - Google Patents
電子部品用接着剤 Download PDFInfo
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- JP6486571B1 JP6486571B1 JP2018548156A JP2018548156A JP6486571B1 JP 6486571 B1 JP6486571 B1 JP 6486571B1 JP 2018548156 A JP2018548156 A JP 2018548156A JP 2018548156 A JP2018548156 A JP 2018548156A JP 6486571 B1 JP6486571 B1 JP 6486571B1
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- JP
- Japan
- Prior art keywords
- adhesive
- liquid crystal
- compound
- group
- photocurable composition
- Prior art date
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- 239000000853 adhesive Substances 0.000 title claims abstract description 36
- 230000001070 adhesive effect Effects 0.000 title claims abstract description 34
- 150000001875 compounds Chemical class 0.000 claims abstract description 94
- 239000004973 liquid crystal related substance Substances 0.000 claims abstract description 70
- 239000000565 sealant Substances 0.000 claims abstract description 38
- YRHRIQCWCFGUEQ-UHFFFAOYSA-N thioxanthen-9-one Chemical group C1=CC=C2C(=O)C3=CC=CC=C3SC2=C1 YRHRIQCWCFGUEQ-UHFFFAOYSA-N 0.000 claims abstract description 11
- -1 acrylic compound Chemical class 0.000 claims description 56
- 239000004593 Epoxy Substances 0.000 claims description 30
- 239000010419 fine particle Substances 0.000 claims description 26
- 239000003795 chemical substances by application Substances 0.000 claims description 19
- 239000012766 organic filler Substances 0.000 claims description 15
- 239000011256 inorganic filler Substances 0.000 claims description 13
- 229910003475 inorganic filler Inorganic materials 0.000 claims description 13
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 claims description 12
- 229920001187 thermosetting polymer Polymers 0.000 claims description 10
- 239000006087 Silane Coupling Agent Substances 0.000 claims description 9
- 150000007524 organic acids Chemical group 0.000 claims description 9
- 229920001296 polysiloxane Polymers 0.000 claims description 9
- 238000007789 sealing Methods 0.000 claims description 8
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 claims description 7
- JOYRKODLDBILNP-UHFFFAOYSA-N Ethyl urethane Chemical compound CCOC(N)=O JOYRKODLDBILNP-UHFFFAOYSA-N 0.000 claims description 4
- 239000000463 material Substances 0.000 claims description 4
- JRZJOMJEPLMPRA-UHFFFAOYSA-N olefin Natural products CCCCCCCC=C JRZJOMJEPLMPRA-UHFFFAOYSA-N 0.000 claims description 4
- 230000004956 cell adhesive effect Effects 0.000 claims description 2
- 239000000203 mixture Substances 0.000 abstract description 83
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 description 36
- 239000000758 substrate Substances 0.000 description 18
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 16
- 238000001723 curing Methods 0.000 description 15
- ZFSLODLOARCGLH-UHFFFAOYSA-N isocyanuric acid Chemical compound OC1=NC(O)=NC(O)=N1 ZFSLODLOARCGLH-UHFFFAOYSA-N 0.000 description 15
- 210000004027 cell Anatomy 0.000 description 14
- 239000003822 epoxy resin Substances 0.000 description 14
- 238000000034 method Methods 0.000 description 14
- 229920000647 polyepoxide Polymers 0.000 description 14
- 239000007983 Tris buffer Substances 0.000 description 13
- 238000006243 chemical reaction Methods 0.000 description 13
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 10
- PXKLMJQFEQBVLD-UHFFFAOYSA-N bisphenol F Chemical compound C1=CC(O)=CC=C1CC1=CC=C(O)C=C1 PXKLMJQFEQBVLD-UHFFFAOYSA-N 0.000 description 10
- 239000007870 radical polymerization initiator Substances 0.000 description 10
- 239000003999 initiator Substances 0.000 description 9
- 239000000047 product Substances 0.000 description 9
- 229920003986 novolac Polymers 0.000 description 8
- 238000010526 radical polymerization reaction Methods 0.000 description 8
- 239000007787 solid Substances 0.000 description 8
- 125000004209 (C1-C8) alkyl group Chemical group 0.000 description 7
- 230000015572 biosynthetic process Effects 0.000 description 7
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 7
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 6
- 238000010521 absorption reaction Methods 0.000 description 6
- 230000001588 bifunctional effect Effects 0.000 description 6
- 230000000052 comparative effect Effects 0.000 description 6
- 238000011109 contamination Methods 0.000 description 6
- 239000011521 glass Substances 0.000 description 6
- 239000003112 inhibitor Substances 0.000 description 6
- 125000005647 linker group Chemical group 0.000 description 6
- 229910052757 nitrogen Inorganic materials 0.000 description 6
- 239000002245 particle Substances 0.000 description 6
- 125000001424 substituent group Chemical group 0.000 description 6
- 238000003786 synthesis reaction Methods 0.000 description 6
- 238000002835 absorbance Methods 0.000 description 5
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 5
- 239000000843 powder Substances 0.000 description 5
- 150000003254 radicals Chemical class 0.000 description 5
- 239000002904 solvent Substances 0.000 description 5
- AZQWKYJCGOJGHM-UHFFFAOYSA-N 1,4-benzoquinone Chemical compound O=C1C=CC(=O)C=C1 AZQWKYJCGOJGHM-UHFFFAOYSA-N 0.000 description 4
- AGXAFZNONAXBOS-UHFFFAOYSA-N 2-[[3-(oxiran-2-ylmethyl)phenyl]methyl]oxirane Chemical compound C=1C=CC(CC2OC2)=CC=1CC1CO1 AGXAFZNONAXBOS-UHFFFAOYSA-N 0.000 description 4
- IAZDPXIOMUYVGZ-WFGJKAKNSA-N Dimethyl sulfoxide Chemical compound [2H]C([2H])([2H])S(=O)C([2H])([2H])[2H] IAZDPXIOMUYVGZ-WFGJKAKNSA-N 0.000 description 4
- QIGBRXMKCJKVMJ-UHFFFAOYSA-N Hydroquinone Chemical compound OC1=CC=C(O)C=C1 QIGBRXMKCJKVMJ-UHFFFAOYSA-N 0.000 description 4
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 4
- NQRYJNQNLNOLGT-UHFFFAOYSA-N Piperidine Chemical compound C1CCNCC1 NQRYJNQNLNOLGT-UHFFFAOYSA-N 0.000 description 4
- 125000003545 alkoxy group Chemical group 0.000 description 4
- 125000002947 alkylene group Chemical group 0.000 description 4
- 125000003118 aryl group Chemical group 0.000 description 4
- TZCXTZWJZNENPQ-UHFFFAOYSA-L barium sulfate Chemical compound [Ba+2].[O-]S([O-])(=O)=O TZCXTZWJZNENPQ-UHFFFAOYSA-L 0.000 description 4
- LLEMOWNGBBNAJR-UHFFFAOYSA-N biphenyl-2-ol Chemical compound OC1=CC=CC=C1C1=CC=CC=C1 LLEMOWNGBBNAJR-UHFFFAOYSA-N 0.000 description 4
- OSGAYBCDTDRGGQ-UHFFFAOYSA-L calcium sulfate Chemical compound [Ca+2].[O-]S([O-])(=O)=O OSGAYBCDTDRGGQ-UHFFFAOYSA-L 0.000 description 4
- 150000001732 carboxylic acid derivatives Chemical class 0.000 description 4
- YCIMNLLNPGFGHC-UHFFFAOYSA-N catechol Chemical compound OC1=CC=CC=C1O YCIMNLLNPGFGHC-UHFFFAOYSA-N 0.000 description 4
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 4
- 239000003365 glass fiber Substances 0.000 description 4
- CSFWPUWCSPOLJW-UHFFFAOYSA-N lawsone Chemical compound C1=CC=C2C(=O)C(O)=CC(=O)C2=C1 CSFWPUWCSPOLJW-UHFFFAOYSA-N 0.000 description 4
- 230000009257 reactivity Effects 0.000 description 4
- GHMLBKRAJCXXBS-UHFFFAOYSA-N resorcinol Chemical compound OC1=CC=CC(O)=C1 GHMLBKRAJCXXBS-UHFFFAOYSA-N 0.000 description 4
- 229920002379 silicone rubber Polymers 0.000 description 4
- 239000004945 silicone rubber Substances 0.000 description 4
- XMQULJHUJRTETE-UHFFFAOYSA-N 2-acetylthioxanthen-9-one Chemical compound C1=CC=C2C(=O)C3=CC(C(=O)C)=CC=C3SC2=C1 XMQULJHUJRTETE-UHFFFAOYSA-N 0.000 description 3
- QCBSYPYHCJMQGB-UHFFFAOYSA-N 2-ethyl-1,3,5-triazine Chemical compound CCC1=NC=NC=N1 QCBSYPYHCJMQGB-UHFFFAOYSA-N 0.000 description 3
- WFDIJRYMOXRFFG-UHFFFAOYSA-N Acetic anhydride Chemical compound CC(=O)OC(C)=O WFDIJRYMOXRFFG-UHFFFAOYSA-N 0.000 description 3
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 3
- ZMXDDKWLCZADIW-UHFFFAOYSA-N N,N-Dimethylformamide Chemical compound CN(C)C=O ZMXDDKWLCZADIW-UHFFFAOYSA-N 0.000 description 3
- 229930192627 Naphthoquinone Natural products 0.000 description 3
- ZMANZCXQSJIPKH-UHFFFAOYSA-N Triethylamine Chemical compound CCN(CC)CC ZMANZCXQSJIPKH-UHFFFAOYSA-N 0.000 description 3
- 125000003647 acryloyl group Chemical group O=C([*])C([H])=C([H])[H] 0.000 description 3
- 125000001931 aliphatic group Chemical group 0.000 description 3
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 3
- 229910052799 carbon Inorganic materials 0.000 description 3
- 125000004122 cyclic group Chemical group 0.000 description 3
- 239000004205 dimethyl polysiloxane Substances 0.000 description 3
- 235000013870 dimethyl polysiloxane Nutrition 0.000 description 3
- 238000001914 filtration Methods 0.000 description 3
- 125000001072 heteroaryl group Chemical group 0.000 description 3
- 229910052739 hydrogen Inorganic materials 0.000 description 3
- 239000011159 matrix material Substances 0.000 description 3
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 3
- 150000002791 naphthoquinones Chemical class 0.000 description 3
- 150000002989 phenols Chemical class 0.000 description 3
- 229920000435 poly(dimethylsiloxane) Polymers 0.000 description 3
- 238000006116 polymerization reaction Methods 0.000 description 3
- 230000035945 sensitivity Effects 0.000 description 3
- 239000000377 silicon dioxide Substances 0.000 description 3
- 125000006850 spacer group Chemical group 0.000 description 3
- 239000000454 talc Substances 0.000 description 3
- 229910052623 talc Inorganic materials 0.000 description 3
- 150000003512 tertiary amines Chemical class 0.000 description 3
- ZNGSVRYVWHOWLX-KHFUBBAMSA-N (1r,2s)-2-(methylamino)-1-phenylpropan-1-ol;hydrate Chemical compound O.CN[C@@H](C)[C@H](O)C1=CC=CC=C1.CN[C@@H](C)[C@H](O)C1=CC=CC=C1 ZNGSVRYVWHOWLX-KHFUBBAMSA-N 0.000 description 2
- MFEWNFVBWPABCX-UHFFFAOYSA-N 1,1,2,2-tetraphenylethane-1,2-diol Chemical compound C=1C=CC=CC=1C(C(O)(C=1C=CC=CC=1)C=1C=CC=CC=1)(O)C1=CC=CC=C1 MFEWNFVBWPABCX-UHFFFAOYSA-N 0.000 description 2
- 238000005160 1H NMR spectroscopy Methods 0.000 description 2
- OVJHMJJVXOJMBB-UHFFFAOYSA-N 2-(1,3-dioxo-3a,4,5,6,7,7a-hexahydroisoindol-2-yl)ethyl prop-2-enoate Chemical compound C1CCCC2C(=O)N(CCOC(=O)C=C)C(=O)C21 OVJHMJJVXOJMBB-UHFFFAOYSA-N 0.000 description 2
- TXBCBTDQIULDIA-UHFFFAOYSA-N 2-[[3-hydroxy-2,2-bis(hydroxymethyl)propoxy]methyl]-2-(hydroxymethyl)propane-1,3-diol Chemical compound OCC(CO)(CO)COCC(CO)(CO)CO TXBCBTDQIULDIA-UHFFFAOYSA-N 0.000 description 2
- PTJWCLYPVFJWMP-UHFFFAOYSA-N 2-[[3-hydroxy-2-[[3-hydroxy-2,2-bis(hydroxymethyl)propoxy]methyl]-2-(hydroxymethyl)propoxy]methyl]-2-(hydroxymethyl)propane-1,3-diol Chemical compound OCC(CO)(CO)COCC(CO)(CO)COCC(CO)(CO)CO PTJWCLYPVFJWMP-UHFFFAOYSA-N 0.000 description 2
- OBGBGHKYJAOXRR-UHFFFAOYSA-N 2-methoxy-1,4-naphthoquinone Chemical compound C1=CC=C2C(=O)C(OC)=CC(=O)C2=C1 OBGBGHKYJAOXRR-UHFFFAOYSA-N 0.000 description 2
- LAQYHRQFABOIFD-UHFFFAOYSA-N 2-methoxyhydroquinone Chemical compound COC1=CC(O)=CC=C1O LAQYHRQFABOIFD-UHFFFAOYSA-N 0.000 description 2
- QTWJRLJHJPIABL-UHFFFAOYSA-N 2-methylphenol;3-methylphenol;4-methylphenol Chemical compound CC1=CC=C(O)C=C1.CC1=CC=CC(O)=C1.CC1=CC=CC=C1O QTWJRLJHJPIABL-UHFFFAOYSA-N 0.000 description 2
- RDFQSFOGKVZWKF-UHFFFAOYSA-N 3-hydroxy-2,2-dimethylpropanoic acid Chemical compound OCC(C)(C)C(O)=O RDFQSFOGKVZWKF-UHFFFAOYSA-N 0.000 description 2
- VPWNQTHUCYMVMZ-UHFFFAOYSA-N 4,4'-sulfonyldiphenol Chemical compound C1=CC(O)=CC=C1S(=O)(=O)C1=CC=C(O)C=C1 VPWNQTHUCYMVMZ-UHFFFAOYSA-N 0.000 description 2
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 2
- 229910052582 BN Inorganic materials 0.000 description 2
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 description 2
- 125000004648 C2-C8 alkenyl group Chemical group 0.000 description 2
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 description 2
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 2
- IAZDPXIOMUYVGZ-UHFFFAOYSA-N Dimethylsulphoxide Chemical compound CS(C)=O IAZDPXIOMUYVGZ-UHFFFAOYSA-N 0.000 description 2
- GUUVPOWQJOLRAS-UHFFFAOYSA-N Diphenyl disulfide Chemical compound C=1C=CC=CC=1SSC1=CC=CC=C1 GUUVPOWQJOLRAS-UHFFFAOYSA-N 0.000 description 2
- WTDHULULXKLSOZ-UHFFFAOYSA-N Hydroxylamine hydrochloride Chemical compound Cl.ON WTDHULULXKLSOZ-UHFFFAOYSA-N 0.000 description 2
- MJVAVZPDRWSRRC-UHFFFAOYSA-N Menadione Chemical compound C1=CC=C2C(=O)C(C)=CC(=O)C2=C1 MJVAVZPDRWSRRC-UHFFFAOYSA-N 0.000 description 2
- NTIZESTWPVYFNL-UHFFFAOYSA-N Methyl isobutyl ketone Chemical compound CC(C)CC(C)=O NTIZESTWPVYFNL-UHFFFAOYSA-N 0.000 description 2
- UIHCLUNTQKBZGK-UHFFFAOYSA-N Methyl isobutyl ketone Natural products CCC(C)C(C)=O UIHCLUNTQKBZGK-UHFFFAOYSA-N 0.000 description 2
- VVQNEPGJFQJSBK-UHFFFAOYSA-N Methyl methacrylate Chemical group COC(=O)C(C)=C VVQNEPGJFQJSBK-UHFFFAOYSA-N 0.000 description 2
- NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical compound OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 description 2
- 229910052581 Si3N4 Inorganic materials 0.000 description 2
- KKEYFWRCBNTPAC-UHFFFAOYSA-N Terephthalic acid Chemical compound OC(=O)C1=CC=C(C(O)=O)C=C1 KKEYFWRCBNTPAC-UHFFFAOYSA-N 0.000 description 2
- WYURNTSHIVDZCO-UHFFFAOYSA-N Tetrahydrofuran Chemical compound C1CCOC1 WYURNTSHIVDZCO-UHFFFAOYSA-N 0.000 description 2
- ZJCCRDAZUWHFQH-UHFFFAOYSA-N Trimethylolpropane Chemical compound CCC(CO)(CO)CO ZJCCRDAZUWHFQH-UHFFFAOYSA-N 0.000 description 2
- YKTSYUJCYHOUJP-UHFFFAOYSA-N [O--].[Al+3].[Al+3].[O-][Si]([O-])([O-])[O-] Chemical compound [O--].[Al+3].[Al+3].[O-][Si]([O-])([O-])[O-] YKTSYUJCYHOUJP-UHFFFAOYSA-N 0.000 description 2
- 125000000738 acetamido group Chemical group [H]C([H])([H])C(=O)N([H])[*] 0.000 description 2
- 229920000800 acrylic rubber Polymers 0.000 description 2
- WNLRTRBMVRJNCN-UHFFFAOYSA-N adipic acid Chemical compound OC(=O)CCCCC(O)=O WNLRTRBMVRJNCN-UHFFFAOYSA-N 0.000 description 2
- IBVAQQYNSHJXBV-UHFFFAOYSA-N adipic acid dihydrazide Chemical compound NNC(=O)CCCCC(=O)NN IBVAQQYNSHJXBV-UHFFFAOYSA-N 0.000 description 2
- 125000002723 alicyclic group Chemical group 0.000 description 2
- 125000000217 alkyl group Chemical group 0.000 description 2
- 125000001118 alkylidene group Chemical group 0.000 description 2
- WNROFYMDJYEPJX-UHFFFAOYSA-K aluminium hydroxide Chemical compound [OH-].[OH-].[OH-].[Al+3] WNROFYMDJYEPJX-UHFFFAOYSA-K 0.000 description 2
- 125000004397 aminosulfonyl group Chemical group NS(=O)(=O)* 0.000 description 2
- 239000011324 bead Substances 0.000 description 2
- UTTHLMXOSUFZCQ-UHFFFAOYSA-N benzene-1,3-dicarbohydrazide Chemical compound NNC(=O)C1=CC=CC(C(=O)NN)=C1 UTTHLMXOSUFZCQ-UHFFFAOYSA-N 0.000 description 2
- PASDCCFISLVPSO-UHFFFAOYSA-N benzoyl chloride Chemical compound ClC(=O)C1=CC=CC=C1 PASDCCFISLVPSO-UHFFFAOYSA-N 0.000 description 2
- WERYXYBDKMZEQL-UHFFFAOYSA-N butane-1,4-diol Chemical compound OCCCCO WERYXYBDKMZEQL-UHFFFAOYSA-N 0.000 description 2
- CQEYYJKEWSMYFG-UHFFFAOYSA-N butyl acrylate Chemical compound CCCCOC(=O)C=C CQEYYJKEWSMYFG-UHFFFAOYSA-N 0.000 description 2
- 239000000378 calcium silicate Substances 0.000 description 2
- 229910052918 calcium silicate Inorganic materials 0.000 description 2
- OYACROKNLOSFPA-UHFFFAOYSA-N calcium;dioxido(oxo)silane Chemical compound [Ca+2].[O-][Si]([O-])=O OYACROKNLOSFPA-UHFFFAOYSA-N 0.000 description 2
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 description 2
- 229910052804 chromium Inorganic materials 0.000 description 2
- 239000011651 chromium Substances 0.000 description 2
- 239000004927 clay Substances 0.000 description 2
- 229910052570 clay Inorganic materials 0.000 description 2
- 239000002131 composite material Substances 0.000 description 2
- 238000001816 cooling Methods 0.000 description 2
- 239000012792 core layer Substances 0.000 description 2
- 239000011258 core-shell material Substances 0.000 description 2
- 229930003836 cresol Natural products 0.000 description 2
- 210000002858 crystal cell Anatomy 0.000 description 2
- 125000004093 cyano group Chemical group *C#N 0.000 description 2
- 230000007423 decrease Effects 0.000 description 2
- 230000007547 defect Effects 0.000 description 2
- VFHVQBAGLAREND-UHFFFAOYSA-N diphenylphosphoryl-(2,4,6-trimethylphenyl)methanone Chemical compound CC1=CC(C)=CC(C)=C1C(=O)P(=O)(C=1C=CC=CC=1)C1=CC=CC=C1 VFHVQBAGLAREND-UHFFFAOYSA-N 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- 150000004820 halides Chemical class 0.000 description 2
- 125000005843 halogen group Chemical group 0.000 description 2
- WJRBRSLFGCUECM-UHFFFAOYSA-N hydantoin Chemical compound O=C1CNC(=O)N1 WJRBRSLFGCUECM-UHFFFAOYSA-N 0.000 description 2
- 229940091173 hydantoin Drugs 0.000 description 2
- 125000004435 hydrogen atom Chemical group [H]* 0.000 description 2
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 2
- 150000002460 imidazoles Chemical class 0.000 description 2
- QQVIHTHCMHWDBS-UHFFFAOYSA-N isophthalic acid Chemical compound OC(=O)C1=CC=CC(C(O)=O)=C1 QQVIHTHCMHWDBS-UHFFFAOYSA-N 0.000 description 2
- 125000001449 isopropyl group Chemical group [H]C([H])([H])C([H])(*)C([H])([H])[H] 0.000 description 2
- 239000010410 layer Substances 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 125000000956 methoxy group Chemical group [H]C([H])([H])O* 0.000 description 2
- 239000010445 mica Substances 0.000 description 2
- 229910052618 mica group Inorganic materials 0.000 description 2
- 238000002156 mixing Methods 0.000 description 2
- 125000004123 n-propyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])* 0.000 description 2
- SLCVBVWXLSEKPL-UHFFFAOYSA-N neopentyl glycol Chemical compound OCC(C)(C)CO SLCVBVWXLSEKPL-UHFFFAOYSA-N 0.000 description 2
- 125000000449 nitro group Chemical group [O-][N+](*)=O 0.000 description 2
- 125000000018 nitroso group Chemical group N(=O)* 0.000 description 2
- 238000010943 off-gassing Methods 0.000 description 2
- 150000001451 organic peroxides Chemical class 0.000 description 2
- 235000010292 orthophenyl phenol Nutrition 0.000 description 2
- AFEQENGXSMURHA-UHFFFAOYSA-N oxiran-2-ylmethanamine Chemical compound NCC1CO1 AFEQENGXSMURHA-UHFFFAOYSA-N 0.000 description 2
- NWVVVBRKAWDGAB-UHFFFAOYSA-N p-methoxyphenol Chemical compound COC1=CC=C(O)C=C1 NWVVVBRKAWDGAB-UHFFFAOYSA-N 0.000 description 2
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 2
- XNGIFLGASWRNHJ-UHFFFAOYSA-N phthalic acid Chemical compound OC(=O)C1=CC=CC=C1C(O)=O XNGIFLGASWRNHJ-UHFFFAOYSA-N 0.000 description 2
- 229920000058 polyacrylate Polymers 0.000 description 2
- 229920002742 polystyrene-block-poly(ethylene/propylene) -block-polystyrene Polymers 0.000 description 2
- CYIDZMCFTVVTJO-UHFFFAOYSA-N pyromellitic acid Chemical compound OC(=O)C1=CC(C(O)=O)=C(C(O)=O)C=C1C(O)=O CYIDZMCFTVVTJO-UHFFFAOYSA-N 0.000 description 2
- 229960001755 resorcinol Drugs 0.000 description 2
- CXMXRPHRNRROMY-UHFFFAOYSA-N sebacic acid Chemical compound OC(=O)CCCCCCCCC(O)=O CXMXRPHRNRROMY-UHFFFAOYSA-N 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 235000012239 silicon dioxide Nutrition 0.000 description 2
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 2
- 229920002050 silicone resin Polymers 0.000 description 2
- 238000003860 storage Methods 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 125000000020 sulfo group Chemical group O=S(=O)([*])O[H] 0.000 description 2
- ARCGXLSVLAOJQL-UHFFFAOYSA-N trimellitic acid Chemical compound OC(=O)C1=CC=C(C(O)=O)C(C(O)=O)=C1 ARCGXLSVLAOJQL-UHFFFAOYSA-N 0.000 description 2
- 238000009281 ultraviolet germicidal irradiation Methods 0.000 description 2
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- 229940009714 erythritol Drugs 0.000 description 1
- 235000019414 erythritol Nutrition 0.000 description 1
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- 229910052760 oxygen Inorganic materials 0.000 description 1
- RVTZCBVAJQQJTK-UHFFFAOYSA-N oxygen(2-);zirconium(4+) Chemical compound [O-2].[O-2].[Zr+4] RVTZCBVAJQQJTK-UHFFFAOYSA-N 0.000 description 1
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- FZUGPQWGEGAKET-UHFFFAOYSA-N parbenate Chemical compound CCOC(=O)C1=CC=C(N(C)C)C=C1 FZUGPQWGEGAKET-UHFFFAOYSA-N 0.000 description 1
- LGYJSPMYALQHBL-UHFFFAOYSA-N pentanedihydrazide Chemical compound NNC(=O)CCCC(=O)NN LGYJSPMYALQHBL-UHFFFAOYSA-N 0.000 description 1
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- 230000000379 polymerizing effect Effects 0.000 description 1
- 230000002265 prevention Effects 0.000 description 1
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- DDOVHJODVHQLCS-UHFFFAOYSA-N pyridine-2,6-dicarbohydrazide Chemical compound NNC(=O)C1=CC=CC(C(=O)NN)=N1 DDOVHJODVHQLCS-UHFFFAOYSA-N 0.000 description 1
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- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 1
- 229910010271 silicon carbide Inorganic materials 0.000 description 1
- 239000012321 sodium triacetoxyborohydride Substances 0.000 description 1
- 150000005846 sugar alcohols Polymers 0.000 description 1
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- 125000004213 tert-butoxy group Chemical group [H]C([H])([H])C(O*)(C([H])([H])[H])C([H])([H])[H] 0.000 description 1
- 125000000999 tert-butyl group Chemical group [H]C([H])([H])C(*)(C([H])([H])[H])C([H])([H])[H] 0.000 description 1
- YLQBMQCUIZJEEH-UHFFFAOYSA-N tetrahydrofuran Natural products C=1C=COC=1 YLQBMQCUIZJEEH-UHFFFAOYSA-N 0.000 description 1
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- JREYOWJEWZVAOR-UHFFFAOYSA-N triazanium;[3-methylbut-3-enoxy(oxido)phosphoryl] phosphate Chemical compound [NH4+].[NH4+].[NH4+].CC(=C)CCOP([O-])(=O)OP([O-])([O-])=O JREYOWJEWZVAOR-UHFFFAOYSA-N 0.000 description 1
- BPSIOYPQMFLKFR-UHFFFAOYSA-N trimethoxy-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CO[Si](OC)(OC)CCCOCC1CO1 BPSIOYPQMFLKFR-UHFFFAOYSA-N 0.000 description 1
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- 229910052720 vanadium Inorganic materials 0.000 description 1
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 1
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- GFQYVLUOOAAOGM-UHFFFAOYSA-N zirconium(iv) silicate Chemical compound [Zr+4].[O-][Si]([O-])([O-])[O-] GFQYVLUOOAAOGM-UHFFFAOYSA-N 0.000 description 1
- PAPBSGBWRJIAAV-UHFFFAOYSA-N ε-Caprolactone Chemical compound O=C1CCCCCO1 PAPBSGBWRJIAAV-UHFFFAOYSA-N 0.000 description 1
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- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F2/00—Processes of polymerisation
- C08F2/46—Polymerisation initiated by wave energy or particle radiation
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- C08K5/00—Use of organic ingredients
- C08K5/16—Nitrogen-containing compounds
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- C08K5/541—Silicon-containing compounds containing oxygen
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- C08L33/00—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides or nitriles thereof; Compositions of derivatives of such polymers
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Abstract
Description
なお、本明細書中、「(メタ)アクリル」とは「アクリル及び/又はメタクリル」を意味し、「(メタ)アクリレート」とは「アクリレート及び/又はメタクリレート」を意味し、「(メタ)アクリロイル」とは「アクリロイル及び/又はメタクリロイル」を意味する。
[2] 硬化性化合物を含有する[1]に記載の光硬化性組成物。
[3] 前記硬化性化合物が(メタ)アクリル化合物である[2]に記載の光硬化性組成物。
[4] 前記硬化性化合物が、(メタ)アクリル化合物とエポキシ化合物との混合物である[2]に記載の光硬化性組成物。
[5] 有機フィラーを含有する[1]〜[4]のいずれか一項に記載の光硬化性組成物。
[6] 前記有機フィラーが、ウレタン微粒子、アクリル微粒子、スチレン微粒子、スチレンオレフィン微粒子、及びシリコーン微粒子からなる群より選択される少なくとも1種の有機フィラーである[5]に記載の光硬化性組成物。
[7] 無機フィラーを含有する[1]〜[6]のいずれか一項に記載の光硬化性組成物。
[8] シランカップリング剤を含有する[1]〜[7]のいずれか一項に記載の光硬化性組成物。
[9] 熱硬化剤を含有する[1]〜[8]のいずれか一項に記載の光硬化性組成物。
[10] 前記熱硬化剤が有機酸ヒドラジド化合物である[9]に記載の光硬化性組成物。
[11] [1]〜[10]のいずれか一項に記載の光硬化性組成物を用いた電子部品用接着剤。
[12] [11]に記載の電子部品用接着剤を硬化して得られる硬化物で接着された電子部品。
[13] [1]〜[10]のいずれか一項に記載の光硬化性組成物を用いた液晶表示セル用接着剤。
[14] [1]〜[10]のいずれか一項に記載の光硬化性組成物を用いた液晶シール剤。
[15] [13]に記載の液晶表示セル用接着剤又は[14]に記載の液晶シール剤を用いて接着された液晶表示セル。
[分子内にオキシムエステル構造及びチオキサントン構造を併せ持つ化合物]
本実施形態に係る光硬化性組成物は、分子内にオキシムエステル構造及びチオキサントン構造を併せ持つ化合物(以下、「特定化合物」ともいう。)を含有する。この特定化合物は、低エネルギー光に対する感度が非常に高い光重合開始剤として機能する。特定化合物は、1種を単独で使用してもよく、2種以上を併用してもよい。
本実施形態に係る光硬化性組成物は、上記の特定化合物以外に、他の光重合開始剤を含有していてもよい。他の光重合開始剤としては、紫外光線や可視光線の照射によってラジカル、酸、塩基等を発生し、連鎖重合反応を開始させる化合物であれば特に限定されない。
本実施形態に係る光硬化性組成物は、硬化性をさらに高めるため、三級アミン類等の光開始助剤を含有していてもよい。三級アミン類としては、特に限定されないが、p−ジメチルアミノ安息香酸エチル、p−ジメチルアミノ安息香酸イソアミル、N,N−ジメチルベンジルアミン等が挙げられる。また、一分子内に複数の三級アミン類を多価アルコール等で分岐させた高分子量化合物も適宜使用することができる。
本実施形態に係る光硬化性組成物は、硬化性化合物を含有することが好ましい。硬化性化合物としては、光、熱等によって硬化する化合物であれば特に限定されないが、(メタ)アクリルエステル化合物、エポキシ(メタ)アクリレート化合物等の(メタ)アクリル化合物が好ましい。(メタ)アクリル化合物は、1種を単独で使用してもよく、2種以上を併用してもよい。
また、本実施形態に係る光硬化性組成物がエポキシ化合物を含有する場合、その含有率は、光硬化性組成物の総量中、通常5〜50質量%であり、好ましくは5〜30質量%である。
本実施形態に係る光硬化性組成物は、有機フィラーを含有していてもよい。有機フィラーは、1種を単独で使用してもよく、2種以上を併用してもよい。
本実施形態に係る光硬化性組成物は、無機フィラーを含有していてもよい。無機フィラーは、1種を単独で使用してもよく、2種以上を併用してもよい。
本実施形態に係る光硬化性組成物は、接着強度や耐湿性の向上を図るため、シランカップリング剤を含有していてもよい。シランカップリング剤は、1種を単独で使用してもよく、2種以上を併用してもよい。
本実施形態に係る光硬化性組成物は、熱硬化剤を含有していてもよい。熱硬化剤は、1種を単独で使用してもよく、2種以上を併用してもよい。
本実施形態に係る光硬化性組成物は、硬化速度及び硬化性を向上するため、熱ラジカル重合開始剤を含有していてもよい。熱ラジカル重合開始剤は、1種を単独で使用してもよく、2種以上を併用してもよい。
本実施形態に係る光硬化性組成物は、必要に応じて、硬化促進剤、ラジカル重合防止剤、顔料、レベリング剤、消泡剤、溶剤などの添加剤を含有していてもよい。
硬化促進剤としては、有機酸、イミダゾール等が挙げられる。
有機酸としては、有機カルボン酸、有機リン酸等が挙げられ、有機カルボン酸が好ましい。具体的には、フタル酸、イソフタル酸、テレフタル酸、トリメリット酸、ベンゾフェノンテトラカルボン酸、フランジカルボン酸、コハク酸、アジピン酸、ドデカン二酸、セバシン酸、チオジプロピオン酸、シクロヘキサンジカルボン酸、トリス(2−カルボキシメチル)イソシアヌレート、トリス(2−カルボキシエチル)イソシアヌレート、トリス(2−カルボキシプロピル)イソシアヌレート、ビス(2−カルボキシエチル)イソシアヌレート等が挙げられる。
イミダゾール化合物としては、2−メチルイミダゾール、2−フェニルイミダゾール、2−ウンデシルイミダゾール、2−ヘプタデシルイミダゾール、2−フェニル−4−メチルイミダゾール、1−ベンジル−2−フェニルイミダゾール、1−ベンジル−2−メチルイミダゾール、1−シアノエチル−2−メチルイミダゾール、1−シアノエチル−2−フェニルイミダゾール、1−シアノエチル−2−ウンデシルイミダゾール、2,4−ジアミノ−6(2’−メチルイミダゾール(1’))エチル−s−トリアジン、2,4−ジアミノ−6(2’−ウンデシルイミダゾール(1’))エチル−s−トリアジン、2,4−ジアミノ−6(2’−エチル−4−メチルイミダゾール(1’))エチル−s−トリアジン、2,4−ジアミノ−6(2’−メチルイミダゾール(1’))エチル−s−トリアジン・イソシアヌル酸付加物、2−メチルイミダゾールイソシアヌル酸の2:3付加物、2−フェニルイミダゾールイソシアヌル酸付加物、2−フェニル−3,5−ジヒドロキシメチルイミダゾール、2−フェニル−4−ヒドロキシメチル−5−メチルイミダゾール、1−シアノエチル−2−フェニル−3,5−ジシアノエトキシメチルイミダゾール等が挙げられる。
ラジカル重合防止剤としては、光ラジカル重合開始剤や熱ラジカル重合開始剤等から発生するラジカルと反応して重合を防止する化合物であれば特に限定されるものではなく、キノン系、ピペリジン系、ヒンダードフェノール系、ニトロソ系等のラジカル重合防止剤が挙げられる。具体的には、ナフトキノン、2−ヒドロキシナフトキノン、2−メチルナフトキノン、2−メトキシナフトキノン、2,2,6,6−テトラメチルピペリジン−1−オキシル、2,2,6,6−テトラメチル−4−ヒドロキシピペリジン−1−オキシル、2,2,6,6,−テトラメチル−4−メトキシピペリジン−1−オキシル、2,2,6,6−テトラメチル−4−フェノキシピペリジン−1−オキシル、ハイドロキノン、2−メチルハイドロキノン、2−メトキシハイドロキノン、パラベンゾキノン、ブチル化ヒドロキシアニソール、2,6−ジ−t−ブチル−4−エチルフェノール、2,6−ジ−t−ブチルクレゾール、ステアリルβ−(3,5−ジ−t−ブチル−4−ヒドロキシフェニル)プロピオネート、2,2’−メチレンビス(4−エチル−6−t−ブチルフェノール)、4,4’−チオビス(3−メチル−6−t−ブチルフェノール)、4,4’−ブチリデンビス(3−メチル−6−t−ブチルフェノール)、3,9−ビス[1,1−ジメチル−2−[β―(3−t−ブチル−4−ヒドロキシ−5−メチルフェニル)プロピオニルオキシ]エチル]、2,4,8,10−テトラオキサスピロ[5,5]ウンデカン、テトラキス−[メチレン−3−(3’,5’−ジ−t−ブチル−4’−ヒドロキシフェニルプロピオネート)]メタン、1,3,5−トリス(3’,5’−ジ−t−ブチル−4’−ヒドロキシベンジル)−sec−トリアジン−2,4,6−(1H,3H,5H)トリオン、パラメトキシフェノール、4−メトキシ−1−ナフトール、チオジフェニルアミン、N−ニトロソフェニルヒドロキシアミンのアルミニウム塩、商品名アデカスタブLA−81、商品名アデカスタブLA−82(いずれも株式会社アデカ製)等が挙げられる。これらの中でも、ナフトキノン系、ハイドロキノン系、ニトロソ系、ピペリジン系のラジカル重合防止剤が好ましく、ナフトキノン、2−ヒドロキシナフトキノン、ハイドロキノン、2,6−ジ−tert−ブチル−p−クレゾール、ポリストップ7300P(伯東株式会社製)がより好ましく、ポリストップ7300P(伯東株式会社製)がさらに好ましい。
本実施形態に係る光硬化性組成物の25℃における粘度は、150〜500Pa・sが好ましく、200〜500Pa・sがより好ましい。特に、本実施形態に係る光硬化性組成物を液晶シール剤として用いる場合、光硬化性組成物の25℃における粘度は、250〜400Pa・sが好ましく、280〜320Pa・sがより好ましい。粘度を250Pa・s以上とすることで、液晶の差し込みの発生が抑えられ、セル化が容易になる傾向にある。粘度を400Pa・s以下とすることで、液晶シール剤の塗布が容易になる傾向にある。
本実施形態に係る光硬化性組成物の調製方法の一例としては、次に示す方法が挙げられる。まず、硬化性化合物に、上記特定化合物を加熱溶解する。次いで、室温まで冷却した後、必要に応じて、有機フィラー、無機フィラー、シランカップリング剤、熱硬化剤、熱ラジカル重合開始剤、消泡剤、レベリング剤、溶剤等を添加する。そして、3本ロール、サンドミル、ボールミル等の公知の混合装置により均一に混合し、金属メッシュにて濾過することにより、本実施形態に係る光硬化性組成物を調製することができる。
本実施形態に係る光硬化性組成物は、電子部品用封止剤又は電子部品用接着剤として非常に有用である。電子部品用封止剤又は電子部品用接着剤としては、フレキシブルプリント配線板用接着剤、TAB用接着剤、半導体用接着剤、各種ディスプレイ用接着剤等が挙げられるが、これらに限定されるものではない。
まず、液晶シール剤にスペーサ(間隙制御材)を添加する。スペーサとしては、グラスファイバー、シリカビーズ、ポリマービーズ等が挙げられる。スペーサの直径は目的に応じ異なるが、通常2〜8μm、好ましくは4〜7μmである。その使用量は、液晶シール剤100質量部に対し、通常0.1〜4質量部であり、好ましくは0.5〜2質量部であり、より好ましくは0.9〜1.5質量部程度である。
[2−アセチルチオキサントンの合成]
1H―NMR(400MHz,DMSO―d6);δ(ppm)2.30(s,3H),2.51(s,3H),7.53(ddd,1H)7.59−7.6(m,2H),7.64−7.68(m,1H),8.25(dd,1H),8.60−8.66(m,1H),8.85(d,1H)
1H−NMR(400MHz,DMSO−d6);δ(ppm)2.65(s,3H),7.58−7.67(m,3H),7.72−7.85(m,2H)7.89−8.28(m,5H),8.51(d,1H),8.85(s,1H)
下記表1に示す硬化性化合物(B−1、B−2、B−3)を混合し、下記表1に示す特定化合物(A−1)を90℃で加熱溶解させた後、室温まで冷却した。次いで、下記表1の残りの成分を添加して撹拌した後、3本ロールミルにて分散させた。その後、金属メッシュ(635メッシュ)で濾過することにより、実施例1及び2の光硬化性組成物を調製した。なお、表1中の各成分の数値は質量部を表す。
特定化合物(A−1)の代わりに下記表1に示すその他の成分(O−2、O−3)を用いたほかは実施例1及び2と同様にして、比較例1及び2の光硬化性組成物を調製した。
[遮光部硬化幅(紫外線照射)]
実施例1及び2、比較例1及び2の各光硬化性組成物に4μmのグラスファイバー(日本電気硝子株式会社製)を1質量%添加し、液晶シール剤を調製した。クロムをエッチングすることによって100μmのライン及びスペースを設けたガラス基板に液晶シール剤を塗布し、対向基板としてブラックマトリクス基板を貼り合わせた。次いで、ライン/スペースを設けた基板側から波長365nmの紫外光を3000mJ/cm2(100mW/cm2で30秒)の照射量で照射し、顕微鏡にて硬化幅を測定した。結果を下記表1に示す。
実施例1及び2、比較例1及び2の各光硬化性組成物に4μmのグラスファイバー(日本電気硝子株式会社製)を1質量%添加し、液晶シール剤を調製した。クロムをエッチングすることによって100μmのライン及びスペースを設けたガラス基板に液晶シール剤を塗布し、対向基板としてブラックマトリクス基板を貼り合わせた。次いで、ライン/スペースを設けた基板側から波長405nmの可視光を3000mJ/cm2(100mW/cm2で30秒)の照射量で照射し、顕微鏡にて硬化幅を測定した。結果を下記表1に示す。
E型粘度計(R115型粘度計(東機産業株式会社製))により実施例1及び2、比較例1及び2の各光硬化性組成物の25℃における粘度(Pa・s)を測定した。結果を下記表1に示す。
Claims (12)
- 分子内にオキシムエステル構造及びチオキサントン構造を併せ持つ化合物と、(メタ)アクリル化合物と、を含有する電子部品用接着剤。
- エポキシ化合物を含有する請求項1に記載の電子部品用接着剤。
- 有機フィラーを含有する請求項1又は2に記載の電子部品用接着剤。
- 前記有機フィラーが、ウレタン微粒子、アクリル微粒子、スチレン微粒子、スチレンオレフィン微粒子、及びシリコーン微粒子からなる群より選択される少なくとも1種の有機フィラーである請求項3に記載の電子部品用接着剤。
- 無機フィラーを含有する請求項1〜4のいずれか一項に記載の電子部品用接着剤。
- シランカップリング剤を含有する請求項1〜5のいずれか一項に記載の電子部品用接着剤。
- 熱硬化剤を含有する請求項1〜6のいずれか一項に記載の電子部品用接着剤。
- 前記熱硬化剤が有機酸ヒドラジド化合物である請求項7に記載の電子部品用接着剤。
- 請求項1〜8のいずれか一項に記載の電子部品用接着剤を硬化して得られる硬化物で接着された電子部品。
- 請求項1〜8のいずれか一項に記載の電子部品用接着剤を用いた液晶表示セル用接着剤。
- 請求項1〜8のいずれか一項に記載の電子部品用接着剤を用いた液晶シール剤。
- 請求項10に記載の液晶表示セル用接着剤又は請求項11に記載の液晶シール剤を用いて接着された液晶表示セル。
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Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2001233842A (ja) * | 1999-12-15 | 2001-08-28 | Ciba Specialty Chem Holding Inc | オキシムエステルの光開始剤 |
JP2005154494A (ja) * | 2003-11-21 | 2005-06-16 | Toyo Ink Mfg Co Ltd | 光ラジカル重合開始剤及びそれを用いた光ラジカル重合性組成物 |
JP2007199135A (ja) * | 2006-01-24 | 2007-08-09 | Mitsubishi Chemicals Corp | 感光性組成物、及び青紫色レーザー用感光性組成物並びにそれを用いた画像形成材料、画像形成材、及び画像形成方法 |
JP2009116112A (ja) * | 2007-11-07 | 2009-05-28 | Taiyo Ink Mfg Ltd | 光硬化性樹脂組成物及びその硬化物パターン、並びに該硬化物パターンを具備するプリント配線板 |
JP2010527339A (ja) * | 2007-05-11 | 2010-08-12 | ビーエーエスエフ ソシエタス・ヨーロピア | オキシムエステル光重合開始剤 |
JP2012122045A (ja) * | 2010-05-19 | 2012-06-28 | Fujifilm Corp | 重合性組成物 |
JP2014141583A (ja) * | 2013-01-24 | 2014-08-07 | Nippon Kagaku Kogyosho:Kk | 新規な光重合開始剤及びその使用方法 |
CN106569388A (zh) * | 2015-09-30 | 2017-04-19 | 奇美实业股份有限公司 | 黑色矩阵用的感光性树脂组成物及其应用 |
Family Cites Families (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2004126211A (ja) | 2002-10-02 | 2004-04-22 | Mitsui Chemicals Inc | 液晶封止用樹脂組成物および液晶表示パネルの製造方法 |
KR101299026B1 (ko) | 2006-05-26 | 2013-08-27 | 니폰 가야꾸 가부시끼가이샤 | 액정 실링제 및 이를 사용한 액정 표시 셀 |
JP5268235B2 (ja) | 2006-07-05 | 2013-08-21 | 日本化薬株式会社 | 液晶シール剤およびそれを用いた液晶表示セル |
JP5079310B2 (ja) * | 2006-11-15 | 2012-11-21 | 太陽ホールディングス株式会社 | ソルダーレジスト露光用フォトツール及びそれを用いて露光処理されるソルダーレジストパターンの形成方法 |
JP5139735B2 (ja) | 2007-06-26 | 2013-02-06 | 積水化学工業株式会社 | 液晶滴下工法用シール剤、上下導通材料及び液晶表示素子 |
JP5388091B2 (ja) | 2007-11-16 | 2014-01-15 | 日本化薬株式会社 | 液晶シール剤およびそれを用いた液晶表示セル |
CN101565472B (zh) * | 2009-05-19 | 2011-05-04 | 常州强力电子新材料有限公司 | 酮肟酯类光引发剂 |
WO2012011220A1 (ja) * | 2010-07-20 | 2012-01-26 | 日本化薬株式会社 | 液晶シール剤及びそれを用いた液晶表示セル |
EP2625166B1 (en) * | 2010-10-05 | 2014-09-24 | Basf Se | Oxime ester derivatives of benzocarbazole compounds and their use as photoinitiators in photopolymerizable compositions |
KR101860356B1 (ko) * | 2011-11-25 | 2018-05-24 | 금호석유화학 주식회사 | 액정 오염성을 개선한 표시소자용 실란트 조성물 및 그를 경화하여 형성된 실란트 |
CN102516916B (zh) * | 2011-12-12 | 2013-08-14 | 东莞市派乐玛新材料技术开发有限公司 | 一种液晶密封剂组合物 |
KR101479813B1 (ko) * | 2012-04-10 | 2015-01-06 | (주)엘지하우시스 | 반경화 감압 점착필름 |
CN104704426A (zh) * | 2012-08-01 | 2015-06-10 | 株式会社Lg化学 | 具有光固化性能和热固化性能的树脂组合物及阻焊干膜 |
CN104380196B (zh) * | 2013-06-17 | 2018-09-25 | 株式会社Lg化学 | 光固化和热固性树脂组合物、由其制备的阻焊干膜及包含所述阻焊干膜的电路板 |
JP6356582B2 (ja) * | 2014-11-25 | 2018-07-11 | 日東電工株式会社 | 接着シート、ダイシングシート付き接着シート及び半導体装置の製造方法 |
CN104536264A (zh) * | 2014-12-26 | 2015-04-22 | 上海孚赛特新材料科技有限公司 | 黑色感光性树脂组合物及其应用 |
KR101799094B1 (ko) * | 2015-03-27 | 2017-11-17 | 주식회사 엘지화학 | 광경화성 및 열경화성을 갖는 수지 조성물 및 드라이 필름 솔더 레지스트 |
-
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- 2018-05-25 CN CN201880025666.9A patent/CN110536908B/zh active Active
- 2018-05-25 WO PCT/JP2018/020226 patent/WO2018225544A1/ja active Application Filing
- 2018-05-25 KR KR1020197034155A patent/KR20200015487A/ko not_active Application Discontinuation
- 2018-05-31 TW TW107118679A patent/TWI774777B/zh active
Patent Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2001233842A (ja) * | 1999-12-15 | 2001-08-28 | Ciba Specialty Chem Holding Inc | オキシムエステルの光開始剤 |
JP2005154494A (ja) * | 2003-11-21 | 2005-06-16 | Toyo Ink Mfg Co Ltd | 光ラジカル重合開始剤及びそれを用いた光ラジカル重合性組成物 |
JP2007199135A (ja) * | 2006-01-24 | 2007-08-09 | Mitsubishi Chemicals Corp | 感光性組成物、及び青紫色レーザー用感光性組成物並びにそれを用いた画像形成材料、画像形成材、及び画像形成方法 |
JP2010527339A (ja) * | 2007-05-11 | 2010-08-12 | ビーエーエスエフ ソシエタス・ヨーロピア | オキシムエステル光重合開始剤 |
JP2009116112A (ja) * | 2007-11-07 | 2009-05-28 | Taiyo Ink Mfg Ltd | 光硬化性樹脂組成物及びその硬化物パターン、並びに該硬化物パターンを具備するプリント配線板 |
JP2012122045A (ja) * | 2010-05-19 | 2012-06-28 | Fujifilm Corp | 重合性組成物 |
JP2014141583A (ja) * | 2013-01-24 | 2014-08-07 | Nippon Kagaku Kogyosho:Kk | 新規な光重合開始剤及びその使用方法 |
CN106569388A (zh) * | 2015-09-30 | 2017-04-19 | 奇美实业股份有限公司 | 黑色矩阵用的感光性树脂组成物及其应用 |
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KR20200015487A (ko) | 2020-02-12 |
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WO2018225544A1 (ja) | 2018-12-13 |
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