JP6484734B2 - 基板搬送装置および方法 - Google Patents
基板搬送装置および方法 Download PDFInfo
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- JP6484734B2 JP6484734B2 JP2018026871A JP2018026871A JP6484734B2 JP 6484734 B2 JP6484734 B2 JP 6484734B2 JP 2018026871 A JP2018026871 A JP 2018026871A JP 2018026871 A JP2018026871 A JP 2018026871A JP 6484734 B2 JP6484734 B2 JP 6484734B2
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- 239000000758 substrate Substances 0.000 title claims description 331
- 238000000034 method Methods 0.000 title claims description 26
- 230000033001 locomotion Effects 0.000 claims description 38
- 238000005339 levitation Methods 0.000 claims description 29
- 230000000712 assembly Effects 0.000 claims description 8
- 238000000429 assembly Methods 0.000 claims description 8
- 238000000206 photolithography Methods 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000011521 glass Substances 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 230000007704 transition Effects 0.000 description 1
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- H—ELECTRICITY
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- B65G49/06—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for fragile sheets, e.g. glass
- B65G49/063—Transporting devices for sheet glass
- B65G49/064—Transporting devices for sheet glass in a horizontal position
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- B—PERFORMING OPERATIONS; TRANSPORTING
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- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G49/00—Conveying systems characterised by their application for specified purposes not otherwise provided for
- B65G49/05—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles
- B65G49/06—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for fragile sheets, e.g. glass
- B65G49/063—Transporting devices for sheet glass
- B65G49/064—Transporting devices for sheet glass in a horizontal position
- B65G49/065—Transporting devices for sheet glass in a horizontal position supported partially or completely on fluid cushions, e.g. a gas cushion
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- B—PERFORMING OPERATIONS; TRANSPORTING
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- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G49/00—Conveying systems characterised by their application for specified purposes not otherwise provided for
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- B65G49/06—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for fragile sheets, e.g. glass
- B65G49/063—Transporting devices for sheet glass
- B65G49/066—Transporting devices for sheet glass being suspended; Suspending devices, e.g. clamps, supporting tongs
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- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G49/00—Conveying systems characterised by their application for specified purposes not otherwise provided for
- B65G49/05—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles
- B65G49/06—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for fragile sheets, e.g. glass
- B65G49/067—Sheet handling, means, e.g. manipulators, devices for turning or tilting sheet glass
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G49/00—Conveying systems characterised by their application for specified purposes not otherwise provided for
- B65G49/05—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles
- B65G49/06—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for fragile sheets, e.g. glass
- B65G49/068—Stacking or destacking devices; Means for preventing damage to stacked sheets, e.g. spaces
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70691—Handling of masks or workpieces
- G03F7/70733—Handling masks and workpieces, e.g. exchange of workpiece or mask, transport of workpiece or mask
- G03F7/7075—Handling workpieces outside exposure position, e.g. SMIF box
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
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- H—ELECTRICITY
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67706—Mechanical details, e.g. roller, belt
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67712—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations the substrate being handled substantially vertically
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67751—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber vertical transfer of a single workpiece
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67784—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations using air tracks
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G2249/00—Aspects relating to conveying systems for the manufacture of fragile sheets
- B65G2249/04—Arrangements of vacuum systems or suction cups
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- Microelectronics & Electronic Packaging (AREA)
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Description
S1、マニピュレータが基板を基板移送テーブルに置くステップと、
S2:基板移送テーブルに設けられた基板移送アセンブリは基板を吸着し、かつ前記基板をワークステージの方向へ運動させるよう駆動するステップと、
S3:前記基板が前記基板移送テーブルの前記ワークステージに近接した側まで運動するとき、基板移行空気浮上アセンブリは空気膜を生成し、前記基板を突き上げ、かつ前記基板移送アセンブリにより前記基板を第2方向に沿って前記ワークステージまで移送するステップと、を含む。
図1a‐図3に示すように、本発明は基板搬送装置を提供するものであり、マニピュレータ1とワークステージ2との間に順次設けられた基板移送テーブル3と、基板移行空気浮上アセンブリ4と、を有し、前記基板移送テーブル3は、X方向に沿って平行に設けられた基板上板移送テーブル5および基板下板移送テーブル6を有し、前記基板上板移送テーブル5および基板下板移送テーブル6の前記マニピュレータ1に近接した側には基板移送アセンブリ(図1cに示す)がそれぞれ設けられる。具体的には、前記基板上板移送テーブル5および基板下板移送テーブル6の両者の相対位置は変わらず、全体として全体フレーム8に平行であり、かつ前記全体フレーム8に摺接される。前記基板上板移送テーブル5および基板下板移送テーブル6はX方向に沿って移動可能であり、基板上板移送テーブル5は、マニピュレータ1における基板7をワークステージ2へ移送するために用いられ、基板下板移送テーブル6は、ワークステージ2における基板7をマニピュレータ1へ移送するために用いられる。前記基板移行空気浮上アセンブリ4は全体フレーム8に固定して接続される。基板移送テーブル3および基板移行空気浮上アセンブリ4を設けることで、基板7がマニピュレータ1とワークステージ2との間で高効率に、安全に搬送され、しかも移送サブシステムのコストを大幅に低減させる。
S1:マニピュレータ1が基板7を基板移送テーブル3に置き、具体的には、本実施例は主に上板の過程についてであり、このとき基板7は基板移送テーブル3の基板上板移送テーブル5に置かれ、基板上板移送テーブル5におけるガイドローラ91に接触するステップ。
実施例1と異なるのは、図5‐6に示すように、前記基板上板移送テーブル5および基板下板移送テーブル6は、前記基板ガイドアセンブリ9と間隔を開けて分布された基板位置調節アセンブリをさらに有することである。具体的には、前記基板位置調節アセンブリは、前記ガイドローラ列と間隔を開けて分布された複数のボールトランスファ群を有し、各ボールトランスファ群は、X方向に沿って間隔を開けて設けられた複数のボールトランスファユニット12を有し、ここで、ボールは基板の調節過程に受動的に適応し、位置調節過程において生じた摩擦により基板を損傷することを防ぐ。各前記ボールトランスファユニット12は、支持ホルダ13と、前記支持ホルダ13に設けられた複数のボールトランスファ14と、前記支持ホルダ13が上下に運動するよう駆動するシリンダ(図示せず)と、を有する。具体的には、支持ホルダ13は、全体フレーム8に固定され、マニピュレータ1が基板7を基板移送テーブル3に置くときに、先ず、ボールトランスファユニット12におけるシリンダは支持ホルダ13が上昇するよう駆動し、基板をボールトランスファ12の平面に置き、位置決めシリンダおよび締め付けシリンダの協働により、基板はボールトランスファの平面で指定位置まで移動し、これにより位置の調整を実現するが、実現方法はこれに限定されない。この実施例における基板は長方形であり、基板の二つの辺には位置決めシリンダが設けられ、基板の他の二つの辺には締め付けシリンダが設けられ、基板を置くときに位置決めシリンダに正確に合わせ、その後、締め付けシリンダが運動し、位置に位置決め微調整を行う。図7aに示すように、ボールトランスファは任意の方向に回転可能であるという良好な特性を有するので、調整過程において、基板を傷つけることを防ぐ。基板7の位置調整完了後、シリンダは支持ホルダ13が下降するよう駆動し、図7bに示すように、基板移送テーブル3におけるガイドローラ91の位置に基板7を置きなおし、このとき、基板移送アセンブリにおける吸着盤はシリンダの駆動下で上昇するとともに、吸着盤による真空が開始され、基板を吸着し、続いて、運動モジュールは、基板移送アセンブリおよび吸着された基板をともにワークステージ2側へ運動させるよう駆動するとともに、基板の運動はガイドローラ91に力を附勢し、ガイドローラが時計回りの方向に沿って転がるようにし、基板7の搬送にガイドの作用を果たし、ガイドローラ91の良好なガイド性により、基板7をY方向に沿って運動させるようにし、しかもX方向に沿った移動を防ぐことで、移送精度を高める。
2 ワークステージ
3 基板移送テーブル
4 基板移行空気浮上アセンブリ
5 基板上板移送テーブル
6 基板下板移送テーブル
7 基板
8 全体フレーム
9 基板ガイドアセンブリ
91 ガイドローラ
10 前端空気浮上アセンブリ
11 T型支柱
12 ボールトランスファユニット
13 支持ホルダ
14 ボールトランスファ
Claims (18)
- 基板搬送装置であって、
マニピュレータとワークステージとの間に設けられ、かつ第1方向に沿って平行に設けられた基板上板移送テーブルおよび基板下板移送テーブルを有し、前記第1方向に垂直な第2方向に沿って、前記ワークステージと前記マニピュレータとの間で基板を移送するための基板移送テーブルと、
全体フレームと、前記全体フレームの前記ワークステージに近接した側に固定して接続され、かつ前記基板上板移送テーブルと前記基板下板移送テーブルのうちのそれぞれと接続され、前記基板上板移送テーブルまたは前記基板下板移送テーブルにより前記基板を移送する過程において空気膜を生成して前記基板を持ち上げるための基板移行空気浮上アセンブリと、を有する、ことを特徴とする装置。 - 前記基板上板移送テーブルおよび基板下板移送テーブルの相対位置は変わらず、全体として前記全体フレームに平行であり、かつ前記全体フレームに摺接される、ことを特徴とする請求項1に記載の基板搬送装置。
- 前記基板上板移送テーブルおよび基板下板移送テーブルの前記マニピュレータに近接した側には基板移送アセンブリがそれぞれ設けられる、ことを特徴とする請求項1に記載の基板搬送装置。
- 前記基板移送アセンブリは、前記全体フレームに設けられた運動モジュールと、前記運動モジュールに設けられた複数の吸着盤と、を有し、
前記吸着盤は、前記基板を吸着し、かつ前記運動モジュールの運動下で前記基板を前記第2方向に沿って運動させるよう駆動するために用いられる、ことを特徴とする請求項3に記載の基板搬送装置。 - 前記運動モジュールは、モータとスクリュの組み合わせである、ことを特徴とする請求項4に記載の基板搬送装置。
- 前記基板上板移送テーブルおよび前記基板下板移送テーブルは、前記第1方向に沿って設けられるとともに高さが同一な基板ガイドアセンブリ、および前端空気浮上アセンブリをそれぞれ有する、ことを特徴とする請求項1に記載の基板搬送装置。
- 前記基板ガイドアセンブリは、平行に設けられた複数のガイドローラ列を有し、各ガイドローラ列は、前記第2方向に沿って間隔を開けて設けられた複数のガイドローラを有する、ことを特徴とする請求項6に記載の基板搬送装置。
- 前記前端空気浮上アセンブリは、空気膜を生成して基板を持ち上げるために用いられる、ことを特徴とする請求項6に記載の基板搬送装置。
- 前記基板上板移送テーブルおよび前記基板下板移送テーブルは、前記基板ガイドアセンブリと間隔を開けて分布された基板位置調節アセンブリをそれぞれさらに有する、ことを特徴とする請求項7に記載の基板搬送装置。
- 前記基板位置調節アセンブリは、前記ガイドローラ列と間隔を開けて分布された複数のボールトランスファ群を有し、
各ボールトランスファ群は、前記第2方向に沿って間隔を開けて設けられた複数のボールトランスファユニットを有する、ことを特徴とする請求項9に記載の基板搬送装置。 - 各前記ボールトランスファユニットは、支持ホルダと、前記支持ホルダに設けられた複数のボールトランスファと、前記支持ホルダが上下に運動するよう駆動するシリンダと、を有する、ことを特徴とする請求項10に記載の基板搬送装置。
- 前記基板上板移送テーブルおよび前記基板下板移送テーブルは、前記第1方向に沿って前記基板ガイドアセンブリの両側に設けられたエッジ保護アセンブリをそれぞれさらに有し、前記基板が第1方向に偏移することを防ぐために用いられる、ことを特徴とする請求項6に記載の基板搬送装置。
- 前記エッジ保護アセンブリは、前記第1方向に沿って前記基板ガイドアセンブリの両側に設けられた複数のT型支柱を有する、ことを特徴とする請求項12に記載の基板搬送装置。
- 前記基板上板移送テーブルと前記基板下板移送テーブルの構造は同一である、ことを特徴とする請求項1に記載の基板搬送装置。
- 以下のステップ、
S1、マニピュレータが基板を基板移送テーブルに置くステップと、
S2:基板移送テーブルに設けられた基板移送アセンブリは基板を吸着し、かつ前記基板をワークステージの方向へ運動させるよう駆動するステップと、
S3:前記基板が前記基板移送テーブルの前記ワークステージに近接した側まで運動するとき、基板移行空気浮上アセンブリは空気膜を生成し、前記基板を突き上げ、かつ前記基板移送アセンブリにより前記基板を第2方向に沿って前記ワークステージまで移送するステップと、を含む、ことを特徴とする請求項1〜14のいずれか1項に記載の基板搬送装置の搬送方法。 - 前記ステップS2において、前記基板移送アセンブリにおける吸着盤は前記基板を吸着し、続いて、運動モジュールは、前記基板をワークステージ側へ運動させるよう駆動し、前記基板の運動は前記基板搬送テーブルにおけるガイドローラが転がるように駆動し、前記基板の移動をガイドする、ことを特徴とする請求項15に記載の搬送方法。
- 前記基板移送テーブルは、第1方向に沿って間隔を開けて設けられた複数のボールトランスファユニットをさらに有し、
各前記ボールトランスファユニットは、支持ホルダと、前記支持ホルダに設けられた複数のボールトランスファと、前記支持ホルダが上下に運動するよう駆動するシリンダと、をさらに有し、
前記ステップS1と前記ステップS2との間に、前記ボールトランスファユニットにおけるシリンダが前記支持ホルダを上昇させるよう駆動し、前記基板を前記ボールトランスファの平面に置き、位置調整を実現し、続いて、前記シリンダが前記支持ホルダを下降させるよう駆動し、前記基板を前記基板移送テーブルに置きなおすことをさらに含む、ことを特徴とする請求項15に記載の搬送方法。 - 以下のステップ、
S10:前記基板が前記基板移送テーブルの前記ワークステージに近接した側まで移動するとき、基板移行空気浮上アセンブリは空気膜を生成し、前記基板を持ち上げ、かつ前記基板移送アセンブリにより前記基板を第2方向に沿って前記ワークステージから基板移送テーブルまで移送するステップと、
S20:前記基板移送テーブルに設けられた基板移送アセンブリは前記基板を吸着し、かつ前記基板をマニピュレータの方向へ運動させるよう駆動するステップと、
S30:前記マニピュレータは、前記基板移送テーブルから前記基板を取り外すステップと、を含む、ことを特徴とする請求項1〜14のいずれか1項に記載の基板搬送装置の搬送方法。
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