JP6430870B2 - クランプ装置及びこれを用いた基板搬入出装置、並びに基板処理装置 - Google Patents
クランプ装置及びこれを用いた基板搬入出装置、並びに基板処理装置 Download PDFInfo
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- JP6430870B2 JP6430870B2 JP2015058160A JP2015058160A JP6430870B2 JP 6430870 B2 JP6430870 B2 JP 6430870B2 JP 2015058160 A JP2015058160 A JP 2015058160A JP 2015058160 A JP2015058160 A JP 2015058160A JP 6430870 B2 JP6430870 B2 JP 6430870B2
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- 239000000758 substrate Substances 0.000 title claims description 85
- 238000012545 processing Methods 0.000 title claims description 34
- 238000012546 transfer Methods 0.000 claims description 79
- 230000007246 mechanism Effects 0.000 claims description 65
- 238000003860 storage Methods 0.000 claims description 32
- 238000005192 partition Methods 0.000 claims description 23
- 238000010438 heat treatment Methods 0.000 claims description 18
- 230000007723 transport mechanism Effects 0.000 claims description 5
- 238000007664 blowing Methods 0.000 claims description 3
- 238000000638 solvent extraction Methods 0.000 claims description 2
- 238000004140 cleaning Methods 0.000 claims 1
- 235000012431 wafers Nutrition 0.000 description 77
- 239000002245 particle Substances 0.000 description 50
- 239000007789 gas Substances 0.000 description 40
- 239000000428 dust Substances 0.000 description 13
- 238000005259 measurement Methods 0.000 description 9
- 238000010586 diagram Methods 0.000 description 7
- 239000011261 inert gas Substances 0.000 description 6
- 239000004065 semiconductor Substances 0.000 description 5
- 230000003749 cleanliness Effects 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 3
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 230000003028 elevating effect Effects 0.000 description 2
- 238000010926 purge Methods 0.000 description 2
- 238000006467 substitution reaction Methods 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000000969 carrier Substances 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- 238000007599 discharging Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- QJGQUHMNIGDVPM-UHFFFAOYSA-N nitrogen group Chemical group [N] QJGQUHMNIGDVPM-UHFFFAOYSA-N 0.000 description 1
- 230000035515 penetration Effects 0.000 description 1
- 230000002265 prevention Effects 0.000 description 1
- 239000010453 quartz Substances 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F27—FURNACES; KILNS; OVENS; RETORTS
- F27B—FURNACES, KILNS, OVENS, OR RETORTS IN GENERAL; OPEN SINTERING OR LIKE APPARATUS
- F27B5/00—Muffle furnaces; Retort furnaces; Other furnaces in which the charge is held completely isolated
- F27B5/04—Muffle furnaces; Retort furnaces; Other furnaces in which the charge is held completely isolated adapted for treating the charge in vacuum or special atmosphere
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
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- F16B2/00—Friction-grip releasable fastenings
- F16B2/02—Clamps, i.e. with gripping action effected by positive means other than the inherent resistance to deformation of the material of the fastening
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F27—FURNACES; KILNS; OVENS; RETORTS
- F27B—FURNACES, KILNS, OVENS, OR RETORTS IN GENERAL; OPEN SINTERING OR LIKE APPARATUS
- F27B17/00—Furnaces of a kind not covered by any preceding group
- F27B17/0016—Chamber type furnaces
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
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- H01L21/6735—Closed carriers
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- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
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- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F27—FURNACES; KILNS; OVENS; RETORTS
- F27D—DETAILS OR ACCESSORIES OF FURNACES, KILNS, OVENS, OR RETORTS, IN SO FAR AS THEY ARE OF KINDS OCCURRING IN MORE THAN ONE KIND OF FURNACE
- F27D3/00—Charging; Discharging; Manipulation of charge
- F27D2003/0001—Positioning the charge
- F27D2003/0012—Working with piles
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- F27D3/00—Charging; Discharging; Manipulation of charge
- F27D2003/0034—Means for moving, conveying, transporting the charge in the furnace or in the charging facilities
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Description
前記クランプ部材を駆動する駆動機構と、
該駆動機構を覆うケーシングと、
該ケーシングと連通する吸い込み口を有し、該ケーシングの両側面に隣接して設けられた排気室と、
該排気室内に設けられたファンと、
前記ケーシング内に設けられ、前記駆動機構付近に選択的に配置された局所排気ダクトと、を有し、
前記局所排気ダクトの排出口は前記吸い込み口に直結しており、
前記ケーシングの両側に前記ファンが設けられている。
該隔壁に設けられた搬送口と、
該搬送口を開閉可能な開閉ドアと、
該搬送口の上方であって、前記隔壁の前記基板収納容器搬送領域側に取り付けられたクランプ装置と、
前記搬送口の水平方向両側であって、前記隔壁の前記基板収納容器搬送領域側に設けられた側面カバーと、を有し、
前記クランプ装置は、基板収納容器の正面に設けられた蓋体を開閉する際、該基板収納容器に上方から接触して前記基板収納容器を所定位置に固定可能なクランプ部材と、
前記クランプ部材を駆動する駆動機構と、
該駆動機構を覆うケーシングと、
該ケーシングと連通する吸い込み口を有し、該ケーシングの近隣に設けられた排気室と、
該排気室内に設けられたファンと、を有する。
前記基板搬送領域内に設けられた前記基板を搬送する搬送機構と、
前記基板搬送領域内に設けられた処理容器と、を有する。
先ず、本発明の実施形態に係るクランプ装置を用いた本発明の実施形態に係る基板処理装置の構成例について説明する。図1に、本発明の実施形態に係る基板処理装置の一例の概略構成図を示す。また、図2に、本発明の実施形態に係る基板処理装置の一例の概略平面図を示す。さらに、図3に、本発明の実施形態に係るキャリア搬送領域の一例の概略斜視図を示す。なお、図2においては、説明のために、図1のロードポート14の一方とFIMSポート24とに、キャリアCが載置されていない状態を示す。
次に、キャリアCの構成について、図4(a)、図4(b)を参照して説明する。
次に、本発明の実施形態に係るクランプ装置100について説明する。
次に、本発明の実施形態に係るクランプ装置100を含む基板搬入出装置と、ウエハ移載機構56とを用いたウエハWの搬送動作について説明する。
次に、図18及び図19を用いて、本発明の実施形態に係るクランプ装置を実施した実施例について説明する。図18は、本発明の実施例に係るクランプ装置のパーティクル測定点を示した図である。図18に示すように、ドア機構の9箇所において、測定点M1〜M9を設定した。そして、本発明の実施例に係るクランプ装置の動作前と動作後におけるパーティクル数を測定した。
4 隔壁
6 搬送口
7 蓋体開閉装置
8 ドア機構
24 FIMSポート
26 熱処理炉
40 フランジ部
41 係合窪み
56 ウエハ移載機構
68 蓋体
80 クランプ機構部
81 クランプ部材
83 ケーシング可動部
84 ケーシング固定部
85 ケーシング
86 駆動部
86a 駆動力発生部
86b シリンダロッド
87 リニアガイド
87a リニアガイド固定部
87b リニアガイド可動部
88 局所排気ダクト
88b 排出口
89 クランプカバー
90、90a〜90c 排気室
91 局所排気吸い込み口
92 内蔵ファン吸い込み口
93 陰圧室
94 ファン
95 仕切
96 陽圧室
97 フィルタ
100 クランプ装置
200 熱処理装置
C キャリア
W ウエハ
Claims (16)
- 基板収納容器の正面に設けられた蓋体を開閉する際、該基板収納容器に上方から接触して前記基板収納容器を所定位置に固定可能なクランプ部材と、
前記クランプ部材を駆動する駆動機構と、
該駆動機構を覆うケーシングと、
該ケーシングと連通する吸い込み口を有し、該ケーシングの両側面に隣接して設けられた排気室と、
該排気室内に設けられたファンと、
前記ケーシング内に設けられ、前記駆動機構付近に選択的に配置された局所排気ダクトと、を有し、
前記局所排気ダクトの排出口は前記吸い込み口に直結しており、
前記ケーシングの両側に前記ファンが設けられたクランプ装置。 - 前記ケーシングの両側面に隣接して設けられた前記排気室は、互いに連通している請求項1に記載のクランプ装置。
- 前記ケーシングは、前記クランプ部材に連結され、前記クランプ部材とともに上下動可能な可動部と、前記駆動機構の少なくとも一部及び前記局所排気ダクトを収容する固定部と、を有する請求項1又は2に記載のクランプ装置。
- 前記駆動機構は、駆動力を発生させる駆動力発生部と、該駆動力により運動する運動部とを有し、
前記可動部は、前記運動部の少なくとも一部を収容し、
前記固定部は、前記駆動力発生部を収容する請求項3に記載のクランプ装置。 - 前記可動部は、前記固定部の底部の開口に挿入されて設けられ、
該開口の周囲の少なくとも一部には、前記可動部の側面と平行な壁が形成された請求項3又は4に記載のクランプ装置。 - 前記排気室と連続した一体的形状を有し、前記ケーシングを覆うカバー部材を更に有する請求項1乃至5のいずれか一項に記載のクランプ装置。
- 前記ファンは、シロッコファンである請求項1乃至6のいずれか一項に記載のクランプ装置。
- 前記排気室内には清浄フィルタが更に設けられ、
前記吸い込み口から吸い込んだ気体を、該清浄フィルタを介して前記基板収納容器が固定可能な前記所定位置に供給可能である請求項1乃至7のいずれか一項に記載のクランプ装置。 - 前記清浄フィルタは、前記排気室の底面に設けられた請求項8に記載のクランプ装置。
- 前記排気室は、前記ファンが設けられた陰圧室と、前記清浄フィルタが設けられた陽圧室に区分されており、
前記ファンの送風により前記陰圧室に導入された気体が前記陽圧室に送られる請求項8又は9に記載のクランプ装置。 - 前記陰圧室は前記排気室の上面側に設けられるとともに、前記陰圧室の上面には第2の吸い込み口が設けられ、
前記ファンは、該第2の吸い込み口からも気体を吸い込んで前記陽圧室に送風する請求項10に記載のクランプ装置。 - 基板搬送領域と、基板収納容器搬送領域とを区画する隔壁と、
該隔壁に設けられた搬送口と、
該搬送口を開閉可能な開閉ドアと、
該搬送口の上方であって、前記隔壁の前記基板収納容器搬送領域側に取り付けられたクランプ装置と、
前記搬送口の水平方向両側であって、前記隔壁の前記基板収納容器搬送領域側に設けられた側面カバーと、を有し、
前記クランプ装置は、基板収納容器の正面に設けられた蓋体を開閉する際、該基板収納容器に上方から接触して前記基板収納容器を所定位置に固定可能なクランプ部材と、
前記クランプ部材を駆動する駆動機構と、
該駆動機構を覆うケーシングと、
該ケーシングと連通する吸い込み口を有し、該ケーシングの近隣に設けられた排気室と、
該排気室内に設けられたファンと、を有する基板搬入出装置。 - 前記搬送口、前記開閉ドア、前記クランプ装置及び前記側面カバーは、鉛直方向2段で前記隔壁に設けられている請求項12に記載の基板搬入出装置。
- 前記基板搬送領域内に設けられた前記基板収納容器の前記蓋体を開閉する蓋体開閉装置を更に有する請求項12又は13に記載の基板搬入出装置。
- 請求項12乃至14のいずれか一項に記載の基板搬入出装置と、
前記基板搬送領域内に設けられた基板を搬送する搬送機構と、
前記基板搬送領域内に設けられた処理容器と、を有する基板処理装置。 - 前記処理容器は、基板を熱処理する熱処理炉である請求項15に記載の基板処理装置。
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