JP6397079B1 - はんだ材料 - Google Patents
はんだ材料 Download PDFInfo
- Publication number
- JP6397079B1 JP6397079B1 JP2017076417A JP2017076417A JP6397079B1 JP 6397079 B1 JP6397079 B1 JP 6397079B1 JP 2017076417 A JP2017076417 A JP 2017076417A JP 2017076417 A JP2017076417 A JP 2017076417A JP 6397079 B1 JP6397079 B1 JP 6397079B1
- Authority
- JP
- Japan
- Prior art keywords
- solder material
- tensile strength
- variation
- test
- stress
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
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Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
- B23K35/262—Sn as the principal constituent
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C13/00—Alloys based on tin
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/08—Non-ferrous metals or alloys
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
Description
Claims (1)
- Ag:2.5〜3.3重量%、Cu:0.3〜0.5重量%、In:5.5〜6.4重量%、Sb:0.5〜1.4重量%を含み、残部が不可避的不純物及びSnであるとともに、Biを実質的に含まないことを特徴とするはんだ材料。
Priority Applications (6)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2017076417A JP6397079B1 (ja) | 2017-04-07 | 2017-04-07 | はんだ材料 |
EP18781426.4A EP3608050A4 (en) | 2017-04-07 | 2018-03-26 | SOLDER MATERIAL |
US16/500,171 US20210031310A1 (en) | 2017-04-07 | 2018-03-26 | Solder material |
CN201880021975.9A CN110461534A (zh) | 2017-04-07 | 2018-03-26 | 焊料 |
BR112019020826-7A BR112019020826A2 (pt) | 2017-04-07 | 2018-03-26 | Material de solda |
PCT/JP2018/012113 WO2018186218A1 (ja) | 2017-04-07 | 2018-03-26 | はんだ材料 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2017076417A JP6397079B1 (ja) | 2017-04-07 | 2017-04-07 | はんだ材料 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP6397079B1 true JP6397079B1 (ja) | 2018-09-26 |
JP2018176191A JP2018176191A (ja) | 2018-11-15 |
Family
ID=63668552
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2017076417A Active JP6397079B1 (ja) | 2017-04-07 | 2017-04-07 | はんだ材料 |
Country Status (6)
Country | Link |
---|---|
US (1) | US20210031310A1 (ja) |
EP (1) | EP3608050A4 (ja) |
JP (1) | JP6397079B1 (ja) |
CN (1) | CN110461534A (ja) |
BR (1) | BR112019020826A2 (ja) |
WO (1) | WO2018186218A1 (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2020049543A (ja) * | 2018-09-28 | 2020-04-02 | 株式会社ケーヒン | はんだ材料 |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN117139917B (zh) * | 2023-10-31 | 2024-03-08 | 苏州塞一澳电气有限公司 | 一种汽车玻璃用无铅焊料及其制备方法和应用 |
Family Cites Families (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO1997009455A1 (en) | 1995-09-01 | 1997-03-13 | Sarnoff Corporation | Soldering composition |
US6176947B1 (en) * | 1998-12-31 | 2001-01-23 | H-Technologies Group, Incorporated | Lead-free solders |
JP2002120085A (ja) * | 2000-10-12 | 2002-04-23 | H Technol Group Inc | 鉛無含有はんだ合金 |
DE60019651T2 (de) * | 2000-11-16 | 2005-09-22 | Singapore Asahi Chemical & Solder Industries Pte. Ltd. | Bleifreies weichlot |
JP2004188453A (ja) * | 2002-12-11 | 2004-07-08 | Harima Chem Inc | Sn系はんだ合金 |
CN1788918A (zh) * | 2005-12-20 | 2006-06-21 | 徐振五 | 无铅环保焊料 |
DE102006047764A1 (de) * | 2006-10-06 | 2008-04-10 | W.C. Heraeus Gmbh | Bleifreies Weichlot mit verbesserten Eigenschaften bei Temperaturen >150°C |
WO2009011392A1 (ja) * | 2007-07-18 | 2009-01-22 | Senju Metal Industry Co., Ltd. | 車載電子回路用In入り鉛フリーはんだ |
WO2010122764A1 (ja) * | 2009-04-20 | 2010-10-28 | パナソニック株式会社 | はんだ材料および電子部品接合体 |
KR101305801B1 (ko) * | 2012-05-10 | 2013-09-06 | 센주긴조쿠고교 가부시키가이샤 | 음향용 땜납 합금 |
WO2014013632A1 (ja) * | 2012-07-19 | 2014-01-23 | ハリマ化成株式会社 | はんだ合金、ソルダペーストおよび電子回路基板 |
JP6200534B2 (ja) * | 2015-03-24 | 2017-09-20 | 株式会社タムラ製作所 | 鉛フリーはんだ合金、電子回路基板および電子制御装置 |
WO2016185674A1 (ja) * | 2015-05-19 | 2016-11-24 | パナソニックIpマネジメント株式会社 | はんだ合金およびそれを用いた実装構造体 |
-
2017
- 2017-04-07 JP JP2017076417A patent/JP6397079B1/ja active Active
-
2018
- 2018-03-26 EP EP18781426.4A patent/EP3608050A4/en not_active Withdrawn
- 2018-03-26 CN CN201880021975.9A patent/CN110461534A/zh active Pending
- 2018-03-26 WO PCT/JP2018/012113 patent/WO2018186218A1/ja active Application Filing
- 2018-03-26 BR BR112019020826-7A patent/BR112019020826A2/pt not_active Application Discontinuation
- 2018-03-26 US US16/500,171 patent/US20210031310A1/en not_active Abandoned
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2020049543A (ja) * | 2018-09-28 | 2020-04-02 | 株式会社ケーヒン | はんだ材料 |
WO2020066164A1 (ja) * | 2018-09-28 | 2020-04-02 | 株式会社ケーヒン | はんだ材料 |
CN112334268A (zh) * | 2018-09-28 | 2021-02-05 | 株式会社京浜 | 焊接材料 |
Also Published As
Publication number | Publication date |
---|---|
EP3608050A1 (en) | 2020-02-12 |
US20210031310A1 (en) | 2021-02-04 |
EP3608050A4 (en) | 2020-08-05 |
CN110461534A (zh) | 2019-11-15 |
JP2018176191A (ja) | 2018-11-15 |
BR112019020826A2 (pt) | 2020-05-12 |
WO2018186218A1 (ja) | 2018-10-11 |
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