JP6343439B2 - プリント配線板用硬化型組成物、これを用いた硬化塗膜及びプリント配線板 - Google Patents
プリント配線板用硬化型組成物、これを用いた硬化塗膜及びプリント配線板 Download PDFInfo
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- JP6343439B2 JP6343439B2 JP2013205343A JP2013205343A JP6343439B2 JP 6343439 B2 JP6343439 B2 JP 6343439B2 JP 2013205343 A JP2013205343 A JP 2013205343A JP 2013205343 A JP2013205343 A JP 2013205343A JP 6343439 B2 JP6343439 B2 JP 6343439B2
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- printed wiring
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- wiring board
- acrylate
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- SLCVBVWXLSEKPL-UHFFFAOYSA-N neopentyl glycol Chemical compound OCC(C)(C)CO SLCVBVWXLSEKPL-UHFFFAOYSA-N 0.000 description 1
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- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 1
- RUELTTOHQODFPA-UHFFFAOYSA-N toluene 2,6-diisocyanate Chemical compound CC1=C(N=C=O)C=CC=C1N=C=O RUELTTOHQODFPA-UHFFFAOYSA-N 0.000 description 1
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Classifications
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- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
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- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F287/00—Macromolecular compounds obtained by polymerising monomers on to block polymers
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- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
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- C08F2/46—Polymerisation initiated by wave energy or particle radiation
- C08F2/48—Polymerisation initiated by wave energy or particle radiation by ultraviolet or visible light
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- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
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- C08F220/02—Monocarboxylic acids having less than ten carbon atoms; Derivatives thereof
- C08F220/10—Esters
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- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G18/00—Polymeric products of isocyanates or isothiocyanates
- C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
- C08G18/28—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the compounds used containing active hydrogen
- C08G18/40—High-molecular-weight compounds
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- C08G18/633—Block or graft polymers obtained by polymerising compounds having carbon-to-carbon double bonds on to polymers onto polymers of compounds having carbon-to-carbon double bonds
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G18/00—Polymeric products of isocyanates or isothiocyanates
- C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
- C08G18/28—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the compounds used containing active hydrogen
- C08G18/40—High-molecular-weight compounds
- C08G18/63—Block or graft polymers obtained by polymerising compounds having carbon-to-carbon double bonds on to polymers
- C08G18/637—Block or graft polymers obtained by polymerising compounds having carbon-to-carbon double bonds on to polymers characterised by the in situ polymerisation of the compounds having carbon-to-carbon double bonds in a reaction mixture of saturated polymers and isocyanates
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G18/00—Polymeric products of isocyanates or isothiocyanates
- C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
- C08G18/28—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the compounds used containing active hydrogen
- C08G18/67—Unsaturated compounds having active hydrogen
- C08G18/671—Unsaturated compounds having only one group containing active hydrogen
- C08G18/672—Esters of acrylic or alkyl acrylic acid having only one group containing active hydrogen
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- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L33/00—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides or nitriles thereof; Compositions of derivatives of such polymers
- C08L33/04—Homopolymers or copolymers of esters
- C08L33/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, which oxygen atoms are present only as part of the carboxyl radical
- C08L33/10—Homopolymers or copolymers of methacrylic acid esters
- C08L33/12—Homopolymers or copolymers of methyl methacrylate
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D11/00—Inks
- C09D11/02—Printing inks
- C09D11/10—Printing inks based on artificial resins
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D11/00—Inks
- C09D11/02—Printing inks
- C09D11/10—Printing inks based on artificial resins
- C09D11/101—Inks specially adapted for printing processes involving curing by wave energy or particle radiation, e.g. with UV-curing following the printing
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D11/00—Inks
- C09D11/30—Inkjet printing inks
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D133/00—Coating compositions based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Coating compositions based on derivatives of such polymers
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- C09D133/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, the oxygen atom being present only as part of the carboxyl radical
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D133/00—Coating compositions based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Coating compositions based on derivatives of such polymers
- C09D133/04—Homopolymers or copolymers of esters
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-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D133/00—Coating compositions based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Coating compositions based on derivatives of such polymers
- C09D133/04—Homopolymers or copolymers of esters
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D4/00—Coating compositions, e.g. paints, varnishes or lacquers, based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; Coating compositions, based on monomers of macromolecular compounds of groups C09D183/00 - C09D183/16
- C09D4/06—Organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond in combination with a macromolecular compound other than an unsaturated polymer of groups C09D159/00 - C09D187/00
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- G—PHYSICS
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- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
- G03F7/028—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with photosensitivity-increasing substances, e.g. photoinitiators
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/285—Permanent coating compositions
- H05K3/287—Photosensitive compositions
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/01—Tools for processing; Objects used during processing
- H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
- H05K2203/013—Inkjet printing, e.g. for printing insulating material or resist
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- Spectroscopy & Molecular Physics (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
- Macromonomer-Based Addition Polymer (AREA)
- Inks, Pencil-Leads, Or Crayons (AREA)
Description
(式中、Xはガラス転移点Tgが0℃以上のポリマー単位であり、Yはガラス転移点Tgが0℃未満のポリマー単位である。)
で表されるブロック共重合体であることが好ましい。
(A)ブロック共重合体とは、性質の異なる二種類以上のポリマーが、共有結合で繋がり長い連鎖になった分子構造の共重合体のことである。(A)ブロック共重合体を配合することに起因して、プリント配線板用硬化型レジスト組成物に柔軟性が与えられ、基材への追従性が増し、良好な密着性が得られる。
また、X−Y−XあるいはX−Y−X’型ブロック共重合体のうち、X又はX’が上記(B)水酸基を有する(メタ)アクリレートとの相溶性が高いものが好ましく、Yが上記(B)水酸基を有する(メタ)アクリレートとの相溶性が低いものが好ましい。このように、両端のブロックがマトリックスに相溶であり、中央のブロックがマトリックスに不相溶であるブロック共重合体とすることで、マトリックス中において特異的な構造を示しやすくなると考えられる。
また、株式会社クラレ製のKURARITYもメタクリル酸メチルとアクリル酸ブチルより誘導されるブロック共重合体であり、LA1114、LA2140e、LA2330、LA2250、LA4285等が挙げられる。
また本発明で用いるブロック共重合体は、25℃の温度において液状であるものが好ましい。ブロック共重合体が液体である場合、組成物中に容易に溶解させることが出来る為、組成物が均一となり、安定した特性を得ることが出来る。
(B)水酸基を有する(メタ)アクリレート化合物は、モノマー又はオリゴマー等の低分子量の材料が使用され、具体的には分子量100〜1000の範囲、好ましくは分子量110〜700の範囲の材料が用いられる。
(C)光重合開始剤としては、特に限定されるものではなく、例えば光ラジカル重合開始剤を用いることができる。この光ラジカル重合開始剤としては、光、レーザー、電子線等によりラジカルを発生し、ラジカル重合反応を開始する化合物であれば全て用いることができる。
本発明のプリント配線板用硬化型組成物は、更に、2官能(メタ)アクリレート化合物(水酸基を有するものを除く)を含むことが好ましい。2官能(メタ)アクリレート化合物(水酸基を有するものを除く)を添加することにより、プリント配線板用硬化型組成物における各成分の相溶性をさらに向上させることができる。
本発明の硬化型組成物には、熱硬化成分を加えることができる。熱硬化成分を加えることにより密着性や耐熱性が向上することが期待できる。本発明に用いられる熱硬化成分としては、メラミン樹脂、ベンゾグアナミン樹脂、メラミン誘導体、ベンゾグアナミン誘導体等のアミノ樹脂、ブロックイソシアネート化合物、シクロカーボネート化合物、環状(チオ)エーテル基を有する熱硬化成分、ビスマレイミド、カルボジイミド樹脂等の公知の熱硬化性樹脂が使用できる。特に好ましいのは、保存安定性に優れる点より、ブロックイソシアネート化合物である。
芳香族ポリイソシアネートの具体例としては、例えば、4,4’−ジフェニルメタンジイソシアネート、2,4−トリレンジイソシアネート、2,6−トリレンジイソシアネート、ナフタレン−1,5−ジイソシアネート、o−キシリレンジイソシアネート、m−キシリレンジイソシアネートおよび2,4−トリレンダイマー等が挙げられる。
(式中、nは10〜300を示す。)
で表わされる繰り返し単位から構成されることが好ましい。このような繰り返し単位のオレフィン性二重結合に起因して、プリント配線板用硬化型レジスト組成物に柔軟性が与えられ、基材への追従性が増し、良好な密着性が得られる。
(メタ)アクリル酸とのエステル化反応により得られる液状ポリブタジエン(メタ)アクリレート、ヒドロキシル基を有する液状ポリブタジエンと、(メタ)アクリル酸クロリドとの脱塩素反応によって得られる液状ポリブタジエン(メタ)アクリレート、分子両末端にヒドロキシル基を有する液状ポリブタジエンの不飽和二重結合を水素添加した液状水素化1,2ポリブタジエングリコールを、ウレタン(メタ)アクリレート変成した液状水素化1,2ポリブタジエン(メタ)アクリレート等である。
希釈剤としては、希釈溶剤、光反応性希釈剤、熱反応性希釈剤等が挙げられる。これらの希釈剤の中でも光反応性希釈剤が好ましい。
光反応性希釈剤としては、(メタ)アクリレート類、ビニルエーテル類、エチレン誘導体、スチレン、クロロメチルスチレン、α−メチルスチレン、無水マレイン酸、ジシクロペンタジエン、N−ビニルピロリドン、N−ビニルホルムアミド、キシリレンジオキセタン、オキセタンアルコール、3−エチル−3−(フェノキシメチル)オキセタン、レゾルシノールジグリシジルエーテル等の不飽和二重結合やオキセタニル基、エポキシ基を有する化合物が挙げられる。
これらの中でも(メタ)アクリレート類が好ましく、さらに好ましくは単官能(メタ)アクリレート類が好ましい。単官能(メタ)アクリレート類としては、例えば、メチル(メタ)アクリレート、エチル(メタ)アクリレート、ブチル(メタ)アクリレート、イソブチル(メタ)アクリレート、ラウリル(メタ)アクリレート、ステアリル(メタ)アクリレート、2−ヒドロキシエチル(メタ)アクリレート、ヒドロキシプロピル(メタ)アクリレート、ヒドロキシブチル(メタ)アクリレート、グリシジルメタクリレート等の(メタ)アクリレート類や、アクリロイルモルホリン等を挙げることができる。
これらの希釈剤の配合量は、本発明の硬化型組成物100質量部中、1〜30質量部が好ましい。
3官能以上の(メタ)アクリレート化合物としては、トリメチロールプロパントリアクリレート、トリメチロールメタントリアクリレート、エチレンオキシド変性トリメチロールプロパントリアクリレート、プロピレンオキシド変性トリメチロールプロパントリアクリレート、エピクロルヒドリン変性トリメチロールプロパントリアクリレート、ペンタエリスリトールテトラアクリレート、テトラメチロールメタンテトラアクリレート、エチレンオキシド変性リン酸トリアクリレート、プロピレンオキシド変性リン酸トリアクリレート、エピクロルヒドリン変性グリセロールトリアクリレート、ジペンタエリスリトールヘキサアクリレート、ジトリメチロールプロパンテトラアクリレート、あるいはこれらのシルセスキオキサン変性物等に代表される多官能アクリレート、あるいはこれらに対応するメタアクリレートモノマー、εカプロラクトン変性トリスアクリロキシエチルイソシアヌレートが挙げられる。当該3官能以上の多官能(メタ)アクリレート化合物の配合量は本発明の硬化型組成物100質量部中、1〜40質量部が好ましい。
表1に示す成分を、同表に示す割合(単位:部)にて配合し、攪拌機にて予備混合し、硬化型組成物を調製した。
実施例1〜4及び比較例1〜3により得られた硬化型組成物の50℃、100rpmにおける粘度をコーンプレート型粘度計(東機産業社製TVH−33H)にて測定した。
評価基準
○:20mPa・S以下
△:20mPa・S超50mPa・S以下
×:50mPa・S超
実施例1〜4及び比較例1〜3により得られた硬化型組成物を30μmのアプリケーター(ERICHSEN社製)を使って銅張積層板上に塗布し、高圧水銀灯(ORC社製HMW−713)150mJ/cm2にて硬化を行った。得られたサンプルの指触乾燥性を評価した。
○:タックフリー
×:ベタ付きあり
実施例1〜4及び比較例1〜3により得られた組成物を30μmのアプリケーター(ERICHSEN社製)を使ってポリイミド基材(ユーピレックス25S)上に塗布し、高圧水銀灯(ORC社製HMW−713)150mJ/cm2にて硬化を行った。その後、150℃の熱風循環式乾燥炉にて60分間加熱処理を行った。作製したサンプルに対してクロスカットテープピール試験(JIS K5600)を実施した。
○:剥離なし
×:剥離あり
測定結果を表2に示す。
実施例1〜4及び比較例1〜3により得られたプリント配線板用硬化型組成物を30μmのアプリケーター(ERICHSEN社製)を使って銅箔(銘柄を後程記載)上に塗布し、高圧水銀灯(ORC社製HMW−713)150mJ/cm2にて硬化を行った。その後、150℃の熱風循環式乾燥炉にて60分間加熱処理を行った。作製したサンプルに対してクロスカットテープピール試験を実施した。
○:剥離なし
×:剥離あり
測定結果を表2に示す。
4.で得られた硬化塗膜を用いて、表面における鉛筆硬度をJIS K 5600−5−4に準拠して測定を行った。
厚さ25μmのポリイミドフィルムと、厚さ12μmの銅箔により形成された櫛形の銅配線(配線パターン)とから構成されるフレキシブル銅張り積層板(長さ110mm、幅60mm、銅配線幅/銅配線間幅=200μm/200μm)を準備した。このフレキシブル銅張り積層板の基板にピエゾ型インクジェット印刷機を用いてインクジェット印刷により膜厚が15μmになるように塗布した。この時、印刷直後にインクジェットヘッドに付帯の高圧水銀灯にてUV仮硬化を行った。その後150℃で1時間の加熱により硬化を行い試験片を得た。硬化後の試験片に対して、MIT(Massachusetts Institute of Technology)試験機を用いて下記条件にて保護膜を内側にして折り曲げを繰り返し実施し、導通がとれなくなるサイクル数を求めた。1回の評価につき3試験片に対して試験を実施し、導通がとれなくなる平均値を計算した。試験基準と判定基準は以下に示す通りである。
耐MIT試験条件
荷重:500gf
角度:角対向135°
速度:175回/分
先端:R0.38mm円筒
評価基準
○:50回以上
×:50回未満
4.で得られた硬化塗膜をアセトンに30分間浸漬した後の塗膜状態を目視にて観察し、以下の基準で評価した。
評価基準
○:全く変化が認められないもの。
×:塗膜の膨潤又は剥離が認められるもの。
4.で得られた硬化塗膜を5wt%の硫酸水溶液に10分間浸漬した後の塗膜状態を目視にて観察し、以下の基準で観察した。
評価基準
○:全く変化が認められないもの。
×:塗膜の膨潤又は剥離が認められるもの。
4.で得られた硬化塗膜を、JIS C−5012の方法に準拠し、260℃のはんだ槽に10秒間浸漬後、セロハン粘着テープによるピーリング試験を行った後の塗膜状態を目視にて観察し、以下の基準で評価した。
評価基準
○:塗膜に変化がないもの。
△:塗膜が変化しているもの。
×:塗膜が剥離したもの。
市販の無電解ニッケルめっき浴及び無電解金めっき浴を用いて、ニッケル0.5μm、金0.03μmの条件で4.で得られた硬化塗膜に金めっきを行ない、硬化塗膜表面状態の観察を行った。判定基準は以下の通りである。
評価基準
○:全く変化が認められないもの。
×:顕著に白化若しくは曇りが生じたもの。
※1:DPGDA、ジプロピレングリコールジアクリレート(BASFジャパン社製)
※2:4HBA、4−ヒドロキシブチルアクリレート(日本化成社製)
※3:Laromer LR8863:EO変性トリメチロールプロパントリアクリレート(BASFジャパン社製)
※4:エベクリル168(ダイセル・サイテック社製)
※5:ダロキュア1173、2−ヒドロキシ−2−メチル−1−フェニル−プロパン−1−オン(BASFジャパン社製)
※6:2−エチルAQ、2−エチルアントラキノン(BASFジャパン社製)
※7:イルガキュア 819、ビス(2,4,6−トリメチルベンゾイル)−フェニルフォスフィンオキサイド(BASFジャパン社製)
※8:BI7982、ブロックイソシアネート(Baxenden社製)
※9:BYK−307、シリコン系添加剤(ビックケミー・ジャパン社製)
※10:kurarity LA1114、X−Y−X型ブロック共重合体(液状)(クラレ社製)
※11:Nanostrength M52N、X−Y−X型ブロック共重合体(固体)(アルケマ社製)
※12:BR−87(三菱レイヨン社製)
※13:AS−3000E(根上工業社製)
また、インクジェット方式で噴射する場合、噴射可能とするには低粘度としなければならない。一般的に低粘度の光硬化型組成物は密着性・耐熱性などの特性が低いとされているが、本組成物は低粘度としても、プリント配線板のインクジェット方式によるソルダーレジストパターン形成に好適に用いることができる。そのため、レジストインキやマーキングインキなどのプリント配線版用材料以外にも、例えば、UV成形品材料、光造形用材料、3Dインクジェット用材料などの用途に利用可能である。
Claims (12)
- (A)ブロック共重合体と、
(B)分子量が100〜1000の範囲である水酸基を有する(メタ)アクリレート化合物と、
(C)光重合開始剤と、を含み、
さらに、2官能(メタ)アクリレートモノマー(水酸基を有するものを除く)を含むことを特徴とするプリント配線板用硬化型組成物。 - 前記(A)ブロック共重合体の重量平均分子量(Mw)が10,000以上100,000以下であり、分子量分布(Mw/Mn)が3以下であることを特徴とする請求項1に記載のプリント配線板用硬化型組成物。
- 前記(A)ブロック共重合体が、下記式(I)、
X−Y−X (I)
(式中、Xはガラス転移点Tgが0℃以上のポリマー単位であり、Yはガラス転移点Tgが0℃未満のポリマー単位である。)
で表されるブロック共重合体であることを特徴とする請求項1又は2に記載のプリント配線板用硬化型組成物。 - 前記式(I)のYがポリn−ブチル(メタ)アクリレートを含み、Xがポリメチル(メタ)アクリレートを含むことを特徴とする請求項3に記載のプリント配線板用硬化型組成物。
- 前記(A)ブロック共重合体が20℃以上の温度において液状であることを特徴とする請求項1〜4のいずれか一項に記載のプリント配線板用硬化型組成物。
- 前記2官能(メタ)アクリレートモノマーの25℃における粘度が5〜50mPa・sであることを特徴とする請求項1〜5のいずれか一項に記載のプリント配線板用硬化型組成物。
- さらに、熱硬化成分を含むことを特徴とする請求項1〜6のいずれか一項に記載のプリント配線板用硬化型組成物。
- 50℃における粘度が5〜50mPa・sであることを特徴とする請求項1〜7のいずれか一項に記載のプリント配線板用硬化型組成物。
- 請求項1〜8のいずれか一項に記載のプリント配線板用硬化型組成物に対して光照射することにより得られることを特徴とする硬化塗膜。
- 請求項1〜8のいずれか一項に記載のプリント配線板用硬化型組成物が基板上に印刷され、これを光照射することにより得られるパターン硬化塗膜を有することを特徴とするプリント配線板。
- 請求項1〜8のいずれか一項に記載のプリント配線板用硬化型組成物がインクジェット印刷法により基板上に印刷され、これを光照射することにより得られるパターン硬化塗膜を有することを特徴とするプリント配線板。
- 前記基板がプラスチック基板であることを特徴とする請求項10または11に記載のプリント配線板。
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US14/916,344 US10759890B2 (en) | 2013-09-30 | 2014-09-30 | Curable composition for printed circuit board, and cured coating film and printed circuit board incorporating same |
PCT/JP2014/076101 WO2015046571A1 (ja) | 2013-09-30 | 2014-09-30 | プリント配線板用硬化型組成物、これを用いた硬化塗膜及びプリント配線板 |
CN201480054036.6A CN105594308B (zh) | 2013-09-30 | 2014-09-30 | 印刷电路板用固化型组合物、使用其的固化涂膜以及印刷电路板 |
EP14849338.0A EP3054752B1 (en) | 2013-09-30 | 2014-09-30 | Curable composition for printed circuit board, and cured coating film and printed circuit board incorporating same |
KR1020167010626A KR102360803B1 (ko) | 2013-09-30 | 2014-09-30 | 프린트 배선판용 경화형 조성물, 이를 사용한 경화 도막 및 프린트 배선판 |
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