JP6334962B2 - 配線基板、及び、配線基板の製造方法 - Google Patents
配線基板、及び、配線基板の製造方法 Download PDFInfo
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- JP6334962B2 JP6334962B2 JP2014043318A JP2014043318A JP6334962B2 JP 6334962 B2 JP6334962 B2 JP 6334962B2 JP 2014043318 A JP2014043318 A JP 2014043318A JP 2014043318 A JP2014043318 A JP 2014043318A JP 6334962 B2 JP6334962 B2 JP 6334962B2
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Description
図1は、実施の形態の配線基板100を示す断面図である。以下では、直交座標系の一例として、配線基板100の表面及び裏面と平行なXY平面を含むXYZ座標系を用いて説明を行う。
110、110X コア
110A、110XA1、110XA2 突出部
110A1 頂部
110H、110HX 貫通孔
111A 配線層
120A、120B 貫通電極
130A、130B 絶縁層
140A1、140A2、140A3、140A4、140A5、140A6、140B1、140B2、140B3、140B4、140B5、140B6 ビア
150A1、150A2、150A3、150A4、150A5、150A6、150B1、150B2、150B3、150B4、150B5、150B6 配線層
160A、160B ソルダーレジスト層
200 キャパシタチップ
Claims (8)
- 貫通孔が形成され、前記貫通孔の内壁から平面視で前記貫通孔の内側に突出する突出部を有するコア層と、
前記貫通孔の内部に互いに離間した状態で平面視で並べて収容され、互いが並べられる方向に対する側部が前記突出部に係合される複数の電子部品と、
前記貫通孔の内部に充填され、前記電子部品の少なくとも側面を保持する樹脂層と
を含み、
前記電子部品は、本体部と、前記互いが並べられる方向における前記本体部の両端にそれぞれ配置される一対の電極とを有するキャパシタチップであり、
前記本体部は、平面視で前記互いが並べられる方向に対する前記貫通孔の幅方向において、前記一対の電極よりも幅が狭く、
前記一対の電極の前記互いが並べられる方向に対する側部が前記突出部に係合され、前記本体部の側面が前記樹脂層によって保持される、配線基板。 - 前記貫通孔は平面視で矩形状であり、前記突出部は、少なくとも、前記複数の電子部品が並べられる方向に対する側方に位置する一対の前記内壁から突出しており、前記電子部品は、互いが並べられる方向に対する両側の側部が前記突出部に係合される、請求項1記載の配線基板。
- 前記突出部は、平面視で矩形状の前記貫通孔の前記内壁に沿って矩形環状に形成されており、前記電子部品は、互いが並べられる方向に対する両側の側部が前記突出部に係合される、請求項2記載の配線基板。
- 前記貫通孔は平面視で矩形状であり、前記突出部は、前記複数の電子部品が並べられる方向に対する側方に位置する一対の前記内壁から突出する一対の突出部であり、前記電子部品は、前記両側の側部がそれぞれ前記一対の突出部に係合される、請求項2記載の配線基板。
- 前記突出部の突出方向と前記コア層の厚さ方向とで規定される前記突出部の断面の形状は、前記コア層の両方の面からテーパ状に形成される形状である、請求項1乃至4のいずれか一項記載の配線基板。
- 前記電子部品は直方体状であり、長手方向の両端に電極が形成されており、前記電極の側部が前記突出部に係合される、請求項1乃至5のいずれか一項記載の配線基板。
- 前記電子部品は直方体状であり、前記電子部品の長手方向に沿って前記複数の電子部品が配列される、請求項1乃至6のいずれか一項記載の配線基板。
- コア層の一方の面及び他方の面から底に向かって開口が徐々に小さくなる穴部を形成することにより、内壁から平面視で内側に突出するとともに、断面視で先端に向かって細くなるテーパ状の突出部を有する貫通孔を前記コア層に形成する工程と、
前記貫通孔の内部に互いに離間した状態で複数の電子部品を平面視で並べて収容し、前記複数の電子部品が互いに並べられる方向に対する側部を前記突出部に係合させる工程と、
前記貫通孔の内部に樹脂材料を充填することにより、前記電子部品の少なくとも側面を保持する樹脂層を形成する工程と
を含み、
前記電子部品は、本体部と、前記互いが並べられる方向における前記本体部の両端にそれぞれ配置される一対の電極とを有するキャパシタチップであり、
前記本体部は、平面視で前記互いが並べられる方向に対する前記貫通孔の幅方向において、前記一対の電極よりも幅が狭く、
前記一対の電極の前記互いが並べられる方向に対する側部が前記突出部に係合され、前記本体部の側面が前記樹脂層によって保持される、配線基板の製造方法。
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