JP6329540B2 - 可撓性ガラス基板の加工並びに可撓性ガラス基板及びキャリヤ基板を含む基板積層体 - Google Patents

可撓性ガラス基板の加工並びに可撓性ガラス基板及びキャリヤ基板を含む基板積層体 Download PDF

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Publication number: JP6329540B2
Authority: JP; Japan
Prior art keywords: substrate; flexible glass; glass substrate; layer; carbon
Prior art date: 2012-08-22
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.): Expired - Fee Related

Application number

JP2015528516A

Other languages

English (en)

Japanese (ja)

Other versions

JP2015534528A (ja

Inventor

ブルースドーズ，スティーヴン

マシューガーナー，ショーン

Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)

Corning Inc

Original Assignee

Corning Inc

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

2012-08-22

Filing date

2013-08-12

Publication date

2018-05-23

2013-08-12 Application filed by Corning Inc filed Critical Corning Inc

2015-12-03 Publication of JP2015534528A publication Critical patent/JP2015534528A/ja

2018-05-23 Application granted granted Critical

2018-05-23 Publication of JP6329540B2 publication Critical patent/JP6329540B2/ja

Status Expired - Fee Related legal-status Critical Current

2033-08-12 Anticipated expiration legal-status Critical

Links

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238000012545 processing Methods 0.000 title claims description 17
229910052799 carbon Inorganic materials 0.000 claims description 64
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OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical group [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 27
230000008859 change Effects 0.000 claims description 9
229920001568 phenolic resin Polymers 0.000 claims description 5
SLGWESQGEUXWJQ-UHFFFAOYSA-N formaldehyde;phenol Chemical compound O=C.OC1=CC=CC=C1 SLGWESQGEUXWJQ-UHFFFAOYSA-N 0.000 claims description 3
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239000003513 alkali Substances 0.000 description 2
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239000004215 Carbon black (E152) Substances 0.000 description 1
208000034656 Contusions Diseases 0.000 description 1
BPQQTUXANYXVAA-UHFFFAOYSA-N Orthosilicate Chemical compound [O-][Si]([O-])([O-])[O-] BPQQTUXANYXVAA-UHFFFAOYSA-N 0.000 description 1
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239000008367 deionised water Substances 0.000 description 1
229910021641 deionized water Inorganic materials 0.000 description 1
HNPSIPDUKPIQMN-UHFFFAOYSA-N dioxosilane;oxo(oxoalumanyloxy)alumane Chemical compound O=[Si]=O.O=[Al]O[Al]=O HNPSIPDUKPIQMN-UHFFFAOYSA-N 0.000 description 1
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Images

Classifications

- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
- B32B7/04—Interconnection of layers
- B32B7/06—Interconnection of layers permitting easy separation
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B17/00—Layered products essentially comprising sheet glass, or glass, slag, or like fibres
- B32B17/06—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
- H01L27/12—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body
- H01L27/1214—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
- H01L27/1259—Multistep manufacturing methods
- H01L27/1262—Multistep manufacturing methods with a particular formation, treatment or coating of the substrate
- H01L27/1266—Multistep manufacturing methods with a particular formation, treatment or coating of the substrate the substrate on which the devices are formed not being the final device substrate, e.g. using a temporary substrate

Landscapes

Engineering & Computer Science (AREA)
Power Engineering (AREA)
Manufacturing & Machinery (AREA)
Physics & Mathematics (AREA)
Condensed Matter Physics & Semiconductors (AREA)
General Physics & Mathematics (AREA)
Computer Hardware Design (AREA)
Microelectronics & Electronic Packaging (AREA)
Laminated Bodies (AREA)
Joining Of Glass To Other Materials (AREA)
Electroluminescent Light Sources (AREA)

JP2015528516A 2012-08-22 2013-08-12 可撓性ガラス基板の加工並びに可撓性ガラス基板及びキャリヤ基板を含む基板積層体 Expired - Fee Related JP6329540B2 (ja)

Applications Claiming Priority (3)

Application Number	Priority Date	Filing Date	Title
US201261691899P	2012-08-22	2012-08-22
US61/691,899		2012-08-22
PCT/US2013/054479 WO2014031374A1 (en)	2012-08-22	2013-08-12	Processing of flexible glass substrates and substrate stacks including flexible glass substrates and carrier substrates

Publications (2)

Publication Number	Publication Date
JP2015534528A JP2015534528A (ja)	2015-12-03
JP6329540B2 true JP6329540B2 (ja)	2018-05-23

Family

ID=49029224

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
JP2015528516A Expired - Fee Related JP6329540B2 (ja)	2012-08-22	2013-08-12	可撓性ガラス基板の加工並びに可撓性ガラス基板及びキャリヤ基板を含む基板積層体

Country Status (5)

Country	Link
JP (1)	JP6329540B2 (zh)
KR (1)	KR20150046219A (zh)
CN (1)	CN104919591A (zh)
TW (1)	TW201412554A (zh)
WO (1)	WO2014031374A1 (zh)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
WO2016112082A1 (en) *	2015-01-06	2016-07-14	Corning Incorporated	A glass-carrier assembly and methods for processing a flexible glass sheet
WO2016112975A1 (de) *	2015-01-14	2016-07-21	Ev Group E. Thallner Gmbh	Verfahren und vorrichtung zum lösen eines substrats von einem substratstapel
US20180154493A1 (en) *	2015-04-22	2018-06-07	Corning Incorporated	Methods of edge finishing laminated glass structures
KR101673417B1 (ko)	2015-07-14	2016-11-07	에스피텍 주식회사	두께 편차를 최소화한 초박형 유리의 제조방법
KR101661278B1 (ko)	2015-07-14	2016-09-29	에스피텍 주식회사	초박형 유리의 가공방법
TWI767948B (zh)	2016-10-31	2022-06-21	美商康寧公司	層狀可彎曲耐刺穿玻璃物件及製造方法
JP2020506817A (ja) *	2016-11-28	2020-03-05	アレスマテリアルズインコーポレイテッド	フレキシブルエレクトロニクス加工のための一時的接着層
WO2019178746A1 (zh) *	2018-03-20	2019-09-26	深圳市柔宇科技有限公司	柔性部件、电子装置及柔性盖板的剥离方法
KR20220052123A (ko)	2020-10-20	2022-04-27	동우 화인켐 주식회사	초박형 글라스 처리장치 및 이를 이용한 초박형 글라스 제조 방법
JP2023005724A (ja) *	2021-06-29	2023-01-18	日本電気硝子株式会社	接合体の製造方法及び接合体の製造装置

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US20050001201A1 (en) *	2003-07-03	2005-01-06	Bocko Peter L.	Glass product for use in ultra-thin glass display applications
JP4405246B2 (ja) *	2003-11-27	2010-01-27	スリーエムイノベイティブプロパティズカンパニー	半導体チップの製造方法
JP4930161B2 (ja) *	2006-05-08	2012-05-16	旭硝子株式会社	薄板ガラス積層体、薄板ガラス積層体を用いた表示装置の製造方法および、支持ガラス基板
KR100820170B1 (ko) *	2006-08-30	2008-04-10	한국전자통신연구원	플렉시블 기판의 적층 방법
JP4866210B2 (ja) *	2006-11-08	2012-02-01	信越化学工業株式会社	単結晶シリコン太陽電池の製造方法
JPWO2009128359A1 (ja) *	2008-04-17	2011-08-04	旭硝子株式会社	ガラス積層体、支持体付き表示装置用パネルおよびこれらの製造方法
KR101458901B1 (ko) *	2008-04-29	2014-11-10	삼성디스플레이 주식회사	가요성 표시 장치의 제조 방법
WO2010047273A1 (ja) *	2008-10-23	2010-04-29	旭硝子株式会社	ガラス基板積層装置及び積層ガラス基板の製造方法
US9063605B2 (en) *	2009-01-09	2015-06-23	Apple Inc.	Thin glass processing using a carrier
TW201033000A (en) *	2009-01-09	2010-09-16	Asahi Glass Co Ltd	Glass laminate and manufacturing method therefor
JPWO2011024690A1 (ja) *	2009-08-27	2013-01-31	旭硝子株式会社	フレキシブル基材−支持体の積層構造体、支持体付き電子デバイス用パネル、および電子デバイス用パネルの製造方法
JP5562597B2 (ja) *	2009-08-28	2014-07-30	荒川化学工業株式会社	支持体、ガラス基板積層体、支持体付き表示装置用パネル、および表示装置用パネルの製造方法
JP5637140B2 (ja) *	2009-10-20	2014-12-10	旭硝子株式会社	ガラス積層体、支持体付き表示装置用パネル、表示装置用パネル、表示装置、およびこれらの製造方法
MY161592A (en) *	2010-01-21	2017-04-28	Denka Company Ltd	Method of manufacturing translucent rigid substrate laminate and translucent rigid substrate bonding apparatus
JP2012109538A (ja) *	2010-10-29	2012-06-07	Tokyo Ohka Kogyo Co Ltd	積層体、およびその積層体の分離方法
WO2012060199A1 (ja) *	2010-11-05	2012-05-10	旭硝子株式会社	積層体、支持板付き表示装置用パネル、表示装置用パネル、および表示装置
JP6006569B2 (ja) *	2012-07-23	2016-10-12	東京応化工業株式会社	積層体及び積層体の製造方法

2013
- 2013-08-12 JP JP2015528516A patent/JP6329540B2/ja not_active Expired - Fee Related
- 2013-08-12 KR KR20157007086A patent/KR20150046219A/ko not_active Application Discontinuation
- 2013-08-12 WO PCT/US2013/054479 patent/WO2014031374A1/en active Application Filing
- 2013-08-12 CN CN201380044389.3A patent/CN104919591A/zh active Pending
- 2013-08-20 TW TW102129846A patent/TW201412554A/zh unknown

Also Published As

Publication number	Publication date
JP2015534528A (ja)	2015-12-03
TW201412554A (zh)	2014-04-01
WO2014031374A1 (en)	2014-02-27
CN104919591A (zh)	2015-09-16
KR20150046219A (ko)	2015-04-29

Legal Events

Date	Code	Title	Description
2016-07-21	A621	Written request for application examination	Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20160721
2017-06-02	A977	Report on retrieval	Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20170602
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2017-09-13	A601	Written request for extension of time	Free format text: JAPANESE INTERMEDIATE CODE: A601 Effective date: 20170913
2017-11-13	A521	Request for written amendment filed	Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20171113
2018-03-22	TRDD	Decision of grant or rejection written
2018-03-27	A01	Written decision to grant a patent or to grant a registration (utility model)	Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20180327
2018-04-26	A61	First payment of annual fees (during grant procedure)	Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20180420
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2021-04-27	LAPS	Cancellation because of no payment of annual fees

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