JP6300937B2 - 静電容量式タッチパネルおよびその間隙部のインジウムスズ酸化物薄膜のエッチング方法 - Google Patents
静電容量式タッチパネルおよびその間隙部のインジウムスズ酸化物薄膜のエッチング方法 Download PDFInfo
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- JP6300937B2 JP6300937B2 JP2016543157A JP2016543157A JP6300937B2 JP 6300937 B2 JP6300937 B2 JP 6300937B2 JP 2016543157 A JP2016543157 A JP 2016543157A JP 2016543157 A JP2016543157 A JP 2016543157A JP 6300937 B2 JP6300937 B2 JP 6300937B2
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- Prior art keywords
- gap
- ito
- etching
- laser etching
- thin film
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- 238000005530 etching Methods 0.000 title claims description 41
- 238000000034 method Methods 0.000 title claims description 35
- 239000010409 thin film Substances 0.000 title claims description 23
- AMGQUBHHOARCQH-UHFFFAOYSA-N indium;oxotin Chemical compound [In].[Sn]=O AMGQUBHHOARCQH-UHFFFAOYSA-N 0.000 title claims description 19
- 238000010329 laser etching Methods 0.000 claims description 50
- 239000000758 substrate Substances 0.000 claims description 9
- 238000001514 detection method Methods 0.000 claims description 6
- 230000000694 effects Effects 0.000 description 8
- 238000004519 manufacturing process Methods 0.000 description 4
- 230000003071 parasitic effect Effects 0.000 description 4
- 239000011521 glass Substances 0.000 description 3
- 239000010408 film Substances 0.000 description 1
- 229910052738 indium Inorganic materials 0.000 description 1
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 description 1
- 238000001459 lithography Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- XOLBLPGZBRYERU-UHFFFAOYSA-N tin dioxide Chemical compound O=[Sn]=O XOLBLPGZBRYERU-UHFFFAOYSA-N 0.000 description 1
- 229910001887 tin oxide Inorganic materials 0.000 description 1
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/361—Removing material for deburring or mechanical trimming
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/362—Laser etching
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
- G06F3/044—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
- G06F3/044—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means
- G06F3/0443—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means using a single layer of sensing electrodes
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
- G06F3/044—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means
- G06F3/0448—Details of the electrode shape, e.g. for enhancing the detection of touches, for generating specific electric field shapes, for enhancing display quality
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
- H01L21/768—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics
- H01L21/76838—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the conductors
- H01L21/76886—Modifying permanently or temporarily the pattern or the conductivity of conductive members, e.g. formation of alloys, reduction of contact resistances
- H01L21/76892—Modifying permanently or temporarily the pattern or the conductivity of conductive members, e.g. formation of alloys, reduction of contact resistances modifying the pattern
- H01L21/76894—Modifying permanently or temporarily the pattern or the conductivity of conductive members, e.g. formation of alloys, reduction of contact resistances modifying the pattern using a laser, e.g. laser cutting, laser direct writing, laser repair
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F2203/00—Indexing scheme relating to G06F3/00 - G06F3/048
- G06F2203/041—Indexing scheme relating to G06F3/041 - G06F3/045
- G06F2203/04103—Manufacturing, i.e. details related to manufacturing processes specially suited for touch sensitive devices
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Engineering & Computer Science (AREA)
- Theoretical Computer Science (AREA)
- Optics & Photonics (AREA)
- General Physics & Mathematics (AREA)
- Human Computer Interaction (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Quality & Reliability (AREA)
- Position Input By Displaying (AREA)
- Manufacture Of Switches (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
Description
他の実施例では、様々な制御チップの要件に従って、間隙領域2の幅は、0.2mm、0.23mm、0.25mm、0.28mm等であってもよい。
2 間隙領域
3 パターンレーザーエッチングライン
4 間隙領域レーザーエッチングライン
5 ITOセクション
6 間隙
7 交差点
Claims (9)
- 複数の間隙領域レーザーエッチングラインを用いて間隙部(2)のインジウムスズ酸化物(以下、ITOと呼ぶ)薄膜を、互いに独立しかつ互いに接続されていない複数のITOセクション(5)に分割する静電容量式タッチパネルの間隙部のインジウムスズ酸化物薄膜のエッチング方法であって、
前記複数の間隙領域レーザーエッチングラインは、複数の間隙(6)において互いに交差する二本のレーザーエッチングライン(4)によって形成され、該複数の間隙(6)は前記間隙部(2)内の前記ITO薄膜を前記複数のITOセクション(5)に分割することを特徴とするエッチング方法。 - 前記複数の間隙(6)の各々において、前記二本のレーザーエッチングライン(4)の中心線の間の距離は一本のレーザーエッチングラインの幅より小さいことを特徴とする請求項1に記載のエッチング方法。
- 前記二本のレーザーエッチングライン(4)は、前記複数の間隙(6)の各々において、互いに平行でかつ一部が重なり合うことを特徴とする請求項1に記載のエッチング方法。
- 前記複数の間隙(6)において、前記二本のレーザーエッチングライン(4)の中心線の間の距離が一本のレーザーエッチングラインの幅より大きい場合、隣接する前記ITOセクション(5)の間にある間隙(6)に間隙部ITOセクションを形成し、該間隙部ITOセクションは隣接する前記ITOセクション(5)から独立しかつ接続されていないことを特徴とする請求項1に記載のエッチング方法。
- 前記ITOセクション(5)の各々の長さの範囲は2mm以上,4mm以下であることを特徴とする請求項1ないし請求項3のいずれか一項に記載のエッチング方法。
- 前記ITOセクション(5)の各々の長さは3mmであることを特徴とする請求項5に記載のエッチング方法。
- 前記間隙部(2)と前記静電容量式タッチパネルの表示領域(1)との間の境界はパターンレーザーエッチングライン(3)によって分割され、前記パターンレーザーエッチングライン(3)の中心線と隣接する前記複数の間隙領域レーザーエッチングラインの中心線との間の距離は、一本のレーザーエッチングラインの幅より小さいことを特徴とする請求項1に記載のエッチング方法。
- 前記間隙部(2)の幅の範囲は0.2mm以上,0.3mm以下であることを特徴とする請求項7に記載のエッチング方法。
- 絶縁透明基板、検知回路層及び駆動回路層を含み、前記絶縁透明基板に、表示領域(1)及び間隙領域(2)を含むインジウムスズ酸化物薄膜が設置された静電容量式タッチパネルであって、
前記間隙部(2)のインジウムスズ酸化物薄膜は、請求項1ないし請求項8のいずれか一項に記載のエッチング方法によってエッチングされることを特徴とする静電容量式タッチパネル。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201310722462.X | 2013-12-24 | ||
CN201310722462.XA CN104731422B (zh) | 2013-12-24 | 2013-12-24 | 电容屏触控面板及其间隙部分氧化铟锡薄膜的刻蚀方法 |
PCT/CN2014/094621 WO2015096691A1 (zh) | 2013-12-24 | 2014-12-23 | 电容屏触控面板及其间隙部分氧化铟锡薄膜的刻蚀方法 |
Publications (2)
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JP2017501503A JP2017501503A (ja) | 2017-01-12 |
JP6300937B2 true JP6300937B2 (ja) | 2018-03-28 |
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JP2016543157A Active JP6300937B2 (ja) | 2013-12-24 | 2014-12-23 | 静電容量式タッチパネルおよびその間隙部のインジウムスズ酸化物薄膜のエッチング方法 |
Country Status (7)
Country | Link |
---|---|
US (1) | US10379667B2 (ja) |
EP (1) | EP3089007B1 (ja) |
JP (1) | JP6300937B2 (ja) |
KR (1) | KR101908974B1 (ja) |
CN (1) | CN104731422B (ja) |
TW (1) | TWI553525B (ja) |
WO (1) | WO2015096691A1 (ja) |
Families Citing this family (3)
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CN107066157A (zh) * | 2017-03-10 | 2017-08-18 | 深圳唯科技股份有限公司 | 大尺寸电容式触摸屏及其柔性生产工艺 |
WO2020206644A1 (zh) * | 2019-04-10 | 2020-10-15 | 深圳市汇顶科技股份有限公司 | 一种触控屏中引线的制作方法、触控屏及电子设备 |
CN111625153B (zh) * | 2020-05-09 | 2022-12-20 | 芜湖伦丰电子科技有限公司 | 一种触控装置及其改善双线激光拼接位良率方法 |
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2013
- 2013-12-24 CN CN201310722462.XA patent/CN104731422B/zh active Active
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2014
- 2014-12-23 KR KR1020167018590A patent/KR101908974B1/ko active IP Right Grant
- 2014-12-23 EP EP14874941.9A patent/EP3089007B1/en active Active
- 2014-12-23 WO PCT/CN2014/094621 patent/WO2015096691A1/zh active Application Filing
- 2014-12-23 US US15/107,301 patent/US10379667B2/en active Active
- 2014-12-23 JP JP2016543157A patent/JP6300937B2/ja active Active
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Also Published As
Publication number | Publication date |
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KR20160096185A (ko) | 2016-08-12 |
EP3089007A1 (en) | 2016-11-02 |
WO2015096691A1 (zh) | 2015-07-02 |
US10379667B2 (en) | 2019-08-13 |
CN104731422A (zh) | 2015-06-24 |
JP2017501503A (ja) | 2017-01-12 |
CN104731422B (zh) | 2018-06-26 |
EP3089007A4 (en) | 2016-12-14 |
TW201525811A (zh) | 2015-07-01 |
US20170003820A1 (en) | 2017-01-05 |
KR101908974B1 (ko) | 2018-10-17 |
EP3089007B1 (en) | 2020-01-08 |
TWI553525B (zh) | 2016-10-11 |
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