JP6295146B2 - 研削装置 - Google Patents
研削装置 Download PDFInfo
- Publication number
- JP6295146B2 JP6295146B2 JP2014122691A JP2014122691A JP6295146B2 JP 6295146 B2 JP6295146 B2 JP 6295146B2 JP 2014122691 A JP2014122691 A JP 2014122691A JP 2014122691 A JP2014122691 A JP 2014122691A JP 6295146 B2 JP6295146 B2 JP 6295146B2
- Authority
- JP
- Japan
- Prior art keywords
- workpiece
- grinding
- holding
- workpieces
- measuring
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 238000005259 measurement Methods 0.000 description 11
- 238000003754 machining Methods 0.000 description 8
- 235000012431 wafers Nutrition 0.000 description 8
- 238000001514 detection method Methods 0.000 description 4
- 238000000034 method Methods 0.000 description 3
- JMASRVWKEDWRBT-UHFFFAOYSA-N Gallium nitride Chemical compound [Ga]#N JMASRVWKEDWRBT-UHFFFAOYSA-N 0.000 description 2
- 239000006061 abrasive grain Substances 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 230000002093 peripheral effect Effects 0.000 description 2
- 229910052594 sapphire Inorganic materials 0.000 description 2
- 239000010980 sapphire Substances 0.000 description 2
- 239000007767 bonding agent Substances 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000004904 shortening Methods 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
- B24B49/02—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation according to the instantaneous size and required size of the workpiece acted upon, the measuring or gauging being continuous or intermittent
- B24B49/04—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation according to the instantaneous size and required size of the workpiece acted upon, the measuring or gauging being continuous or intermittent involving measurement of the workpiece at the place of grinding during grinding operation
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Manufacturing & Machinery (AREA)
- Grinding Of Cylindrical And Plane Surfaces (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
Description
10 保持手段
10a 保持面
20 研削手段
40 高さ測定器
43 計測針
48a 接触点
A 回転軸
C 円周
W 被加工物
WR 裏面(上面)
W1 間隔
W2 間隔
Claims (1)
- 被加工物を保持する保持面を有する保持手段と、該保持手段に保持された被加工物の上面を研削する研削手段と、該研削手段により研削された被加工物の該上面の高さを測定する高さ測定器と、を備えた研削装置であって、
該保持手段は、複数の被加工物を保持し被加工物のサイズよりも大きいサイズに形成された保持面を有し、該保持面に直交するとともに該保持面の中心を通る回転軸を中心として回転可能であり、該保持面上において該回転軸を中心とした円周上で該複数の被加工物を周方向に保持し、
該高さ測定器は、被加工物の上面に接触させる接触点が同一高さ位置に配設された2つの計測針を備え、該2つの計測針は該保持手段の回転軸を中心とした該円周上に沿って並列し且つ隣接する被加工物同士の周方向の間隔よりも大きい間隔離間して配設され、
複数の被加工物を研削時においては、一方の該計測針が該複数の被加工物の間に位置する際にはもう一方の該計測針は複数の被加工物のいずれかの上面に接触して被加工物の高さ位置を常時計測すること、を特徴とする研削装置。
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2014122691A JP6295146B2 (ja) | 2014-06-13 | 2014-06-13 | 研削装置 |
TW104113542A TWI651162B (zh) | 2014-06-13 | 2015-04-28 | 磨削裝置 |
KR1020150073849A KR102151282B1 (ko) | 2014-06-13 | 2015-05-27 | 연삭 장치 |
CN201510313499.6A CN105290969B (zh) | 2014-06-13 | 2015-06-09 | 磨削装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2014122691A JP6295146B2 (ja) | 2014-06-13 | 2014-06-13 | 研削装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2016002606A JP2016002606A (ja) | 2016-01-12 |
JP6295146B2 true JP6295146B2 (ja) | 2018-03-14 |
Family
ID=55082502
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2014122691A Active JP6295146B2 (ja) | 2014-06-13 | 2014-06-13 | 研削装置 |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP6295146B2 (ja) |
KR (1) | KR102151282B1 (ja) |
CN (1) | CN105290969B (ja) |
TW (1) | TWI651162B (ja) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR102586774B1 (ko) * | 2021-05-06 | 2023-10-10 | 주식회사 엔티에스 | 그라인더 |
Family Cites Families (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0740240A (ja) * | 1993-07-29 | 1995-02-10 | Tdk Corp | セラミック板研削方法及び装置 |
JP2000006018A (ja) * | 1998-06-23 | 2000-01-11 | Disco Abrasive Syst Ltd | 研削装置 |
JP4462997B2 (ja) * | 2003-09-26 | 2010-05-12 | 株式会社ディスコ | ウェーハの加工方法 |
JP5025200B2 (ja) * | 2006-09-19 | 2012-09-12 | 株式会社ディスコ | 研削加工時の厚さ測定方法 |
JP5122854B2 (ja) * | 2007-04-13 | 2013-01-16 | 株式会社ディスコ | デバイスの研削方法 |
JP2010247311A (ja) * | 2009-04-20 | 2010-11-04 | Disco Abrasive Syst Ltd | 被加工物の研削方法 |
JP2012101293A (ja) * | 2010-11-08 | 2012-05-31 | Disco Corp | 加工方法 |
JP5836757B2 (ja) * | 2011-11-02 | 2015-12-24 | 株式会社ディスコ | 板状物の研削方法 |
WO2014040001A1 (en) * | 2012-09-07 | 2014-03-13 | Axus Technology, Llc | Method and apparatus for wafer backgrinding and edge trimming on one machine |
CN203390714U (zh) * | 2013-06-28 | 2014-01-15 | 苏州奇盟晶体材料制品有限公司 | 一种晶片研磨装置 |
-
2014
- 2014-06-13 JP JP2014122691A patent/JP6295146B2/ja active Active
-
2015
- 2015-04-28 TW TW104113542A patent/TWI651162B/zh active
- 2015-05-27 KR KR1020150073849A patent/KR102151282B1/ko active IP Right Grant
- 2015-06-09 CN CN201510313499.6A patent/CN105290969B/zh active Active
Also Published As
Publication number | Publication date |
---|---|
KR102151282B1 (ko) | 2020-09-02 |
TWI651162B (zh) | 2019-02-21 |
CN105290969B (zh) | 2019-03-15 |
JP2016002606A (ja) | 2016-01-12 |
TW201600239A (zh) | 2016-01-01 |
KR20150143307A (ko) | 2015-12-23 |
CN105290969A (zh) | 2016-02-03 |
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