JP6253306B2 - 電子デバイス - Google Patents
電子デバイス Download PDFInfo
- Publication number
- JP6253306B2 JP6253306B2 JP2013171557A JP2013171557A JP6253306B2 JP 6253306 B2 JP6253306 B2 JP 6253306B2 JP 2013171557 A JP2013171557 A JP 2013171557A JP 2013171557 A JP2013171557 A JP 2013171557A JP 6253306 B2 JP6253306 B2 JP 6253306B2
- Authority
- JP
- Japan
- Prior art keywords
- acoustic wave
- wave device
- chip
- wiring
- device chip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 229910052751 metal Inorganic materials 0.000 claims description 51
- 239000002184 metal Substances 0.000 claims description 51
- 230000005540 biological transmission Effects 0.000 claims description 43
- 238000007789 sealing Methods 0.000 claims description 40
- 239000000758 substrate Substances 0.000 claims description 39
- 238000007747 plating Methods 0.000 claims description 19
- 229910000679 solder Inorganic materials 0.000 claims description 7
- 238000005259 measurement Methods 0.000 description 14
- 230000000052 comparative effect Effects 0.000 description 11
- 238000002955 isolation Methods 0.000 description 10
- 238000004088 simulation Methods 0.000 description 8
- 238000002474 experimental method Methods 0.000 description 6
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 6
- 230000004048 modification Effects 0.000 description 6
- 238000012986 modification Methods 0.000 description 6
- 229920005989 resin Polymers 0.000 description 6
- 239000011347 resin Substances 0.000 description 6
- 229910052782 aluminium Inorganic materials 0.000 description 5
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 5
- 229910052737 gold Inorganic materials 0.000 description 5
- 239000010931 gold Substances 0.000 description 5
- 230000017525 heat dissipation Effects 0.000 description 5
- 239000000919 ceramic Substances 0.000 description 4
- 238000010897 surface acoustic wave method Methods 0.000 description 3
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 230000008901 benefit Effects 0.000 description 2
- 230000007423 decrease Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 229910000833 kovar Inorganic materials 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 229910052594 sapphire Inorganic materials 0.000 description 2
- 239000010980 sapphire Substances 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- WSMQKESQZFQMFW-UHFFFAOYSA-N 5-methyl-pyrazole-3-carboxylic acid Chemical compound CC1=CC(C(O)=O)=NN1 WSMQKESQZFQMFW-UHFFFAOYSA-N 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 239000010408 film Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- GQYHUHYESMUTHG-UHFFFAOYSA-N lithium niobate Chemical compound [Li+].[O-][Nb](=O)=O GQYHUHYESMUTHG-UHFFFAOYSA-N 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- YDLQKLWVKKFPII-UHFFFAOYSA-N timiperone Chemical compound C1=CC(F)=CC=C1C(=O)CCCN1CCC(N2C(NC3=CC=CC=C32)=S)CC1 YDLQKLWVKKFPII-UHFFFAOYSA-N 0.000 description 1
- 229950000809 timiperone Drugs 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/18—High density interconnect [HDI] connectors; Manufacturing methods related thereto
- H01L24/19—Manufacturing methods of high density interconnect preforms
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/18—High density interconnect [HDI] connectors; Manufacturing methods related thereto
- H01L2224/19—Manufacturing methods of high density interconnect preforms
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
- H01L2924/191—Disposition
- H01L2924/19101—Disposition of discrete passive components
- H01L2924/19107—Disposition of discrete passive components off-chip wires
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Surface Acoustic Wave Elements And Circuit Networks Thereof (AREA)
Description
12 弾性波デバイスチップ
14 金属封止部
16 第2配線基板
18 ワイヤ
24 バンプ
36 リッド
38 メッキ層
40a〜40c ビア配線
46 グランド配線
70 送信フィルタチップ
72 受信フィルタチップ
80 送信フィルタ
82 受信フィルタ
100、200 弾性波デバイス
Claims (6)
- 第1配線基板上にフリップチップ実装されたデバイスチップと、
前記第1配線基板上に前記デバイスチップを囲んで設けられ、前記第1配線基板に接合し、前記デバイスチップを封止する金属封止部と、
前記金属封止部を覆って設けられたメッキ層と、
前記第1配線基板の前記デバイスチップがフリップチップ実装された面とは反対の面側に位置し、前記第1配線基板が実装された第2配線基板と、
前記第2配線基板上に設けられたグランド配線と前記メッキ層とに接続され、前記グランド配線と前記金属封止部とを電気的に接続させるワイヤと、
前記第1配線基板を貫通して設けられ、前記グランド配線と前記金属封止部とを電気的に接続させるビア配線と、を備えることを特徴とする電子デバイス。 - 前記デバイスチップ上に設けられ、前記メッキ層で覆われた金属製のリッド層を備えることを特徴とする請求項1記載の電子デバイス。
- 前記ワイヤは、前記メッキ層のうちの前記デバイスチップの上面に重なる領域で前記メッキ層に接続していることを特徴とする請求項1または2記載の電子デバイス。
- 前記デバイスチップは、弾性波デバイスチップであることを特徴とする請求項1から3のいずれか一項記載の電子デバイス。
- 前記弾性波デバイスチップは、共通のアンテナ端子に接続される送信フィルタと受信フィルタとを含むことを特徴とする請求項4記載の電子デバイス。
- 前記金属封止部は、半田からなることを特徴とする請求項1から5のいずれか一項記載の電子デバイス。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2013171557A JP6253306B2 (ja) | 2013-08-21 | 2013-08-21 | 電子デバイス |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2013171557A JP6253306B2 (ja) | 2013-08-21 | 2013-08-21 | 電子デバイス |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2015041680A JP2015041680A (ja) | 2015-03-02 |
JP6253306B2 true JP6253306B2 (ja) | 2017-12-27 |
Family
ID=52695675
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2013171557A Active JP6253306B2 (ja) | 2013-08-21 | 2013-08-21 | 電子デバイス |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP6253306B2 (ja) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2019049823A1 (ja) * | 2017-09-07 | 2019-03-14 | 株式会社村田製作所 | 弾性波フィルタ装置及び複合フィルタ装置 |
JP7054429B2 (ja) * | 2019-03-13 | 2022-04-14 | 日亜化学工業株式会社 | 発光装置、発光モジュール及びその製造方法 |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS645025A (en) * | 1987-06-29 | 1989-01-10 | Sumitomo Electric Industries | Integrated circuit package |
JP3058869U (ja) * | 1998-11-04 | 1999-06-22 | 船井電機株式会社 | 電気機器におけるシールドケースの接地構造及びこれに用いるリードワイヤ |
JP4204206B2 (ja) * | 2001-06-01 | 2009-01-07 | 三菱電機株式会社 | 半導体装置 |
JP2009068936A (ja) * | 2007-09-12 | 2009-04-02 | Citizen Holdings Co Ltd | 物理量検出装置 |
JPWO2011086612A1 (ja) * | 2010-01-15 | 2013-05-16 | パナソニック株式会社 | 半導体装置 |
KR101711048B1 (ko) * | 2010-10-07 | 2017-03-02 | 삼성전자 주식회사 | 차폐막을 포함하는 반도체 장치 및 제조 방법 |
JP5583612B2 (ja) * | 2011-01-31 | 2014-09-03 | 太陽誘電株式会社 | 分波器 |
JP2012164852A (ja) * | 2011-02-08 | 2012-08-30 | Murata Mfg Co Ltd | 半導体パッケージのシールド構造 |
-
2013
- 2013-08-21 JP JP2013171557A patent/JP6253306B2/ja active Active
Also Published As
Publication number | Publication date |
---|---|
JP2015041680A (ja) | 2015-03-02 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US10601399B2 (en) | Elastic wave filter apparatus | |
US9385686B2 (en) | Acoustic wave device | |
JP5686943B2 (ja) | 弾性波デバイス及びその製造方法 | |
JP6242597B2 (ja) | 弾性波デバイス及びその製造方法 | |
US9680446B2 (en) | Demultiplexing apparatus with heat transfer via electrodes | |
JP6284774B2 (ja) | モジュール | |
JP7117828B2 (ja) | 弾性波デバイス | |
US20180248535A1 (en) | Filter device | |
JP6368091B2 (ja) | モジュール | |
JP2017152870A (ja) | 弾性波デバイス | |
US9160301B2 (en) | Acoustic wave device | |
JP6253306B2 (ja) | 電子デバイス | |
JP6934322B2 (ja) | 電子部品 | |
JP4858985B2 (ja) | 弾性表面波フィルタパッケージ | |
JP2022044314A (ja) | 弾性波デバイス | |
US11621739B2 (en) | Radio-frequency module and communications device | |
JP2022113172A (ja) | 弾性波デバイス | |
JP5277883B2 (ja) | 弾性波フィルタ装置 | |
JP7465515B1 (ja) | 弾性波デバイス | |
JP5082726B2 (ja) | 弾性波装置 | |
JP7361343B2 (ja) | モジュール | |
JP6793009B2 (ja) | 弾性波デバイス及び多面取り基板 | |
JP6351371B2 (ja) | 弾性波デバイス | |
JP2023053471A (ja) | 弾性波デバイスチップ、弾性波デバイス、その弾性波デバイスチップまたは弾性波デバイスを備えたモジュール | |
JP2023024082A (ja) | 弾性波デバイスおよびその弾性波デバイスを備えるモジュール |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20160127 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20161115 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20161221 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20170404 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20170531 |
|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20171031 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20171128 |
|
R150 | Certificate of patent or registration of utility model |
Ref document number: 6253306 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |