JP6250614B2 - Ｃｕ積層膜、およびＣｕ合金スパッタリングターゲット - Google Patents

Ｃｕ積層膜、およびＣｕ合金スパッタリングターゲット Download PDF

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Publication number
JP6250614B2
JP6250614B2 JP2015224068A JP2015224068A JP6250614B2 JP 6250614 B2 JP6250614 B2 JP 6250614B2 JP 2015224068 A JP2015224068 A JP 2015224068A JP 2015224068 A JP2015224068 A JP 2015224068A JP 6250614 B2 JP6250614 B2 JP 6250614B2
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Japan
Prior art keywords
film
layer
atomic
alloy
atom
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Expired - Fee Related
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JP2015224068A
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English (en)
Japanese (ja)
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JP2016156087A (ja
Inventor
陽子 志田
陽子 志田
後藤　裕史
裕史 後藤
釘宮　敏洋
敏洋 釘宮
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kobe Steel Ltd
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Kobe Steel Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by Kobe Steel Ltd filed Critical Kobe Steel Ltd
Priority to PCT/JP2016/052499 priority Critical patent/WO2016132847A1/ja
Priority to CN201680003374.6A priority patent/CN107075614A/zh
Priority to KR1020177014556A priority patent/KR20170078759A/ko
Priority to TW105104525A priority patent/TWI576443B/zh
Publication of JP2016156087A publication Critical patent/JP2016156087A/ja
Application granted granted Critical
Publication of JP6250614B2 publication Critical patent/JP6250614B2/ja
Expired - Fee Related legal-status Critical Current
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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Organic Chemistry (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Physical Vapour Deposition (AREA)
  • Laminated Bodies (AREA)
  • Electrodes Of Semiconductors (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Weting (AREA)
  • ing And Chemical Polishing (AREA)
JP2015224068A 2015-02-19 2015-11-16 Ｃｕ積層膜、およびＣｕ合金スパッタリングターゲット Expired - Fee Related JP6250614B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
PCT/JP2016/052499 WO2016132847A1 (ja) 2015-02-19 2016-01-28 Ｃｕ合金膜およびＣｕ積層膜
CN201680003374.6A CN107075614A (zh) 2015-02-19 2016-01-28 Cu合金膜和Cu层叠膜
KR1020177014556A KR20170078759A (ko) 2015-02-19 2016-01-28 Cu 합금막 및 Cu 적층막
TW105104525A TWI576443B (zh) 2015-02-19 2016-02-17 Copper alloy film, copper laminated film, wiring electrode, input device and touch panel sensor

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2015030823 2015-02-19
JP2015030823 2015-02-19

Publications (2)

Publication Number Publication Date
JP2016156087A JP2016156087A (ja) 2016-09-01
JP6250614B2 true JP6250614B2 (ja) 2017-12-20

Family

ID=56825261

Family Applications (1)

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JP2015224068A Expired - Fee Related JP6250614B2 (ja) 2015-02-19 2015-11-16 Ｃｕ積層膜、およびＣｕ合金スパッタリングターゲット

Country Status (4)

Country Link
JP (1) JP6250614B2 (zh)
KR (1) KR20170078759A (zh)
CN (1) CN107075614A (zh)
TW (1) TWI576443B (zh)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20190132342A (ko) * 2017-04-13 2019-11-27 가부시키가이샤 알박 액정 표시 장치, 유기 el 표시 장치, 반도체 소자, 배선막, 배선 기판, 타깃
CN108155154A (zh) * 2017-11-29 2018-06-12 苏州诺纳可电子科技有限公司 一种三极管
CN108172614A (zh) * 2017-11-29 2018-06-15 苏州诺纳可电子科技有限公司 一种电子三极管
CN115896722A (zh) * 2022-11-23 2023-04-04 昆明理工大学 一种提高Cu-Ni-Sn合金耐磨性和导电性的方法

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0762274B2 (ja) * 1986-01-14 1995-07-05 三菱化学株式会社 金色調鏡面製品
JP5580619B2 (ja) * 2010-02-19 2014-08-27 株式会社神戸製鋼所 薄膜トランジスタ基板および表示デバイス
JP2012211378A (ja) * 2011-03-31 2012-11-01 Kobe Steel Ltd Ｃｕ合金膜、及びそれを備えた表示装置または電子装置
TWI537400B (zh) * 2011-12-06 2016-06-11 神戶製鋼所股份有限公司 觸控面板感測器用銅合金配線膜及其之製造方法、以及觸控面板感測器、以及濺鍍靶
JP5632821B2 (ja) * 2011-12-06 2014-11-26 株式会社神戸製鋼所 タッチパネルセンサー用Ｃｕ合金配線膜、及びその製造方法、並びにタッチパネルセンサー
JP5724998B2 (ja) * 2012-12-10 2015-05-27 三菱マテリアル株式会社 保護膜形成用スパッタリングターゲットおよび積層配線膜
JP6135275B2 (ja) * 2013-04-22 2017-05-31 三菱マテリアル株式会社 保護膜形成用スパッタリングターゲット
JP2015131998A (ja) * 2014-01-14 2015-07-23 住友金属鉱山株式会社 Ｃｕ合金配線、およびＣｕ合金スパッタリングターゲット

Also Published As

Publication number Publication date
CN107075614A (zh) 2017-08-18
JP2016156087A (ja) 2016-09-01
TW201631166A (zh) 2016-09-01
TWI576443B (zh) 2017-04-01
KR20170078759A (ko) 2017-07-07

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