JP6230730B2 - 半導体加工用テープ - Google Patents

半導体加工用テープ Download PDF

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Publication number
JP6230730B2
JP6230730B2 JP2016570125A JP2016570125A JP6230730B2 JP 6230730 B2 JP6230730 B2 JP 6230730B2 JP 2016570125 A JP2016570125 A JP 2016570125A JP 2016570125 A JP2016570125 A JP 2016570125A JP 6230730 B2 JP6230730 B2 JP 6230730B2
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JP
Japan
Prior art keywords
wafer
tape
adhesive layer
semiconductor processing
processing tape
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2016570125A
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English (en)
Japanese (ja)
Other versions
JPWO2016152957A1 (ja
Inventor
佐野　透
透 佐野
二朗 杉山
二朗 杉山
真沙美 青山
真沙美 青山
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
THE FURUKAW ELECTRIC CO., LTD.
Original Assignee
THE FURUKAW ELECTRIC CO., LTD.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by THE FURUKAW ELECTRIC CO., LTD. filed Critical THE FURUKAW ELECTRIC CO., LTD.
Publication of JPWO2016152957A1 publication Critical patent/JPWO2016152957A1/ja
Application granted granted Critical
Publication of JP6230730B2 publication Critical patent/JP6230730B2/ja
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Anticipated expiration legal-status Critical

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
    • C09J2301/312—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier parameters being the characterizing feature

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Dicing (AREA)
  • Adhesive Tapes (AREA)
  • Laser Beam Processing (AREA)
  • Manufacture Of Macromolecular Shaped Articles (AREA)
  • Laminated Bodies (AREA)
  • Shaping By String And By Release Of Stress In Plastics And The Like (AREA)
JP2016570125A 2015-03-24 2016-03-24 半導体加工用テープ Active JP6230730B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2015060783 2015-03-24
JP2015060783 2015-03-24
PCT/JP2016/059313 WO2016152957A1 (ja) 2015-03-24 2016-03-24 半導体加工用テープ

Publications (2)

Publication Number Publication Date
JPWO2016152957A1 JPWO2016152957A1 (ja) 2017-05-25
JP6230730B2 true JP6230730B2 (ja) 2017-11-15

Family

ID=56977489

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2016570125A Active JP6230730B2 (ja) 2015-03-24 2016-03-24 半導体加工用テープ

Country Status (7)

Country Link
JP (1) JP6230730B2 (zh)
KR (1) KR102007111B1 (zh)
CN (1) CN107431002B (zh)
MY (1) MY181315A (zh)
SG (1) SG11201707829WA (zh)
TW (1) TWI699420B (zh)
WO (1) WO2016152957A1 (zh)

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6577341B2 (ja) * 2015-11-13 2019-09-18 日東電工株式会社 積層体および半導体装置の製造方法
WO2018083986A1 (ja) * 2016-11-02 2018-05-11 リンテック株式会社 ステルスダイシング用粘着シート
JP7041476B2 (ja) * 2017-07-04 2022-03-24 日東電工株式会社 ダイシングテープおよびダイシングダイボンドフィルム
JP6535119B1 (ja) * 2018-03-28 2019-06-26 古河電気工業株式会社 半導体加工用テープ
JP6535138B1 (ja) * 2018-03-28 2019-06-26 古河電気工業株式会社 半導体加工用テープ
JP6535118B1 (ja) 2018-03-28 2019-06-26 古河電気工業株式会社 半導体加工用テープ
JP6535117B1 (ja) 2018-03-28 2019-06-26 古河電気工業株式会社 半導体加工用テープ
KR102112771B1 (ko) 2018-03-28 2020-05-19 후루카와 덴키 고교 가부시키가이샤 반도체 가공용 테이프
TWI677932B (zh) * 2019-02-01 2019-11-21 相豐科技股份有限公司 拉伸膜擴張方法及其膜擴張機
CN111524848A (zh) * 2019-02-01 2020-08-11 相丰科技股份有限公司 拉伸膜扩张方法及膜扩张机
JP7269096B2 (ja) 2019-05-29 2023-05-08 古河電気工業株式会社 ガラス加工用テープ
JP7060548B2 (ja) 2019-05-29 2022-04-26 古河電気工業株式会社 ガラス加工用テープ
JP7060547B2 (ja) 2019-05-29 2022-04-26 古河電気工業株式会社 ガラス加工用テープ
JP7269095B2 (ja) 2019-05-29 2023-05-08 古河電気工業株式会社 ガラス加工用テープ
JP7446773B2 (ja) * 2019-11-07 2024-03-11 日東電工株式会社 ダイシングテープ及びダイシングダイボンドフィルム
JP2024000458A (ja) 2022-06-20 2024-01-05 マクセル株式会社 ダイシングテープおよびダイシングテープを使用する、半導体チップおよび半導体装置の製造方法

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4947564B2 (ja) * 2000-01-21 2012-06-06 日東電工株式会社 半導体ウエハ加工用粘着シート
JP2003138228A (ja) * 2001-11-02 2003-05-14 Nitto Denko Corp 半導体ウエハ保護用粘着シート
JP4358502B2 (ja) 2002-03-12 2009-11-04 浜松ホトニクス株式会社 半導体基板の切断方法
JP4342775B2 (ja) * 2002-07-31 2009-10-14 日東電工株式会社 透明導電性フィルム用表面保護フィルム及びその製造方法並びに表面保護フィルム付き透明導電性フィルム
JP2004273895A (ja) 2003-03-11 2004-09-30 Disco Abrasive Syst Ltd 半導体ウエーハの分割方法
CN1771585A (zh) * 2003-04-08 2006-05-10 帝人杜邦菲林日本株式会社 半导体晶片加工用基膜
JP4566527B2 (ja) * 2003-08-08 2010-10-20 日東電工株式会社 再剥離型粘着シート
JP4754278B2 (ja) 2005-06-23 2011-08-24 リンテック株式会社 チップ体の製造方法
JP5554118B2 (ja) * 2010-03-31 2014-07-23 古河電気工業株式会社 ウエハ加工用テープ
JP5323779B2 (ja) * 2010-07-26 2013-10-23 古河電気工業株式会社 ウエハ加工用テープ

Also Published As

Publication number Publication date
MY181315A (en) 2020-12-21
CN107431002B (zh) 2020-09-11
WO2016152957A1 (ja) 2016-09-29
TW201702334A (zh) 2017-01-16
SG11201707829WA (en) 2017-10-30
TWI699420B (zh) 2020-07-21
CN107431002A (zh) 2017-12-01
JPWO2016152957A1 (ja) 2017-05-25
KR102007111B1 (ko) 2019-08-02
KR20170131504A (ko) 2017-11-29

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