MY181315A - Semiconductor processing tape - Google Patents

Semiconductor processing tape

Info

Publication number
MY181315A
MY181315A MYPI2017703477A MYPI2017703477A MY181315A MY 181315 A MY181315 A MY 181315A MY PI2017703477 A MYPI2017703477 A MY PI2017703477A MY PI2017703477 A MYPI2017703477 A MY PI2017703477A MY 181315 A MY181315 A MY 181315A
Authority
MY
Malaysia
Prior art keywords
thermal shrinkage
shrinkage rate
semiconductor processing
processing tape
tape
Prior art date
Application number
MYPI2017703477A
Inventor
Jirou Sugiyama
Toru Sano
Masami Aoyama
Original Assignee
Furukawa Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Furukawa Electric Co Ltd filed Critical Furukawa Electric Co Ltd
Publication of MY181315A publication Critical patent/MY181315A/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
    • C09J2301/312—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier parameters being the characterizing feature

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Dicing (AREA)
  • Adhesive Tapes (AREA)
  • Laser Beam Processing (AREA)
  • Manufacture Of Macromolecular Shaped Articles (AREA)
  • Laminated Bodies (AREA)
  • Shaping By String And By Release Of Stress In Plastics And The Like (AREA)

Abstract

A semiconductor processing tape that shows low thermal shrinkage rate and shrinks evenly regardless of the direction of the tape so that the kerf width extends evenly without wrinkles or displacement in chip position occurring is provided. The thermal shrinkage rates in both the lengthwise direction and the widthwise direction of the semiconductor processing tape are 0% or more to 20% or less when heated at 100 ?C for 10 seconds. When the thermal shrinkage rate of either the lengthwise direction or the widthwise direction is 0.1% or more, the thermal shrinkage rate in the lengthwise direction divided by the thermal shrinkage rate in the widthwise direction is 0.01 or more to 100 or less(in the equation, thermal shrinkage rate= (size before heating - size after heating)/size before heating x 100(%)).
MYPI2017703477A 2015-03-24 2016-03-24 Semiconductor processing tape MY181315A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2015060783 2015-03-24

Publications (1)

Publication Number Publication Date
MY181315A true MY181315A (en) 2020-12-21

Family

ID=56977489

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI2017703477A MY181315A (en) 2015-03-24 2016-03-24 Semiconductor processing tape

Country Status (7)

Country Link
JP (1) JP6230730B2 (en)
KR (1) KR102007111B1 (en)
CN (1) CN107431002B (en)
MY (1) MY181315A (en)
SG (1) SG11201707829WA (en)
TW (1) TWI699420B (en)
WO (1) WO2016152957A1 (en)

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6577341B2 (en) * 2015-11-13 2019-09-18 日東電工株式会社 LAMINATE AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD
WO2018083986A1 (en) * 2016-11-02 2018-05-11 リンテック株式会社 Adhesive sheet for stealth dicing
JP7041476B2 (en) * 2017-07-04 2022-03-24 日東電工株式会社 Dicing tape and dicing die bond film
JP6535119B1 (en) * 2018-03-28 2019-06-26 古河電気工業株式会社 Semiconductor processing tape
JP6535138B1 (en) * 2018-03-28 2019-06-26 古河電気工業株式会社 Semiconductor processing tape
JP6535118B1 (en) 2018-03-28 2019-06-26 古河電気工業株式会社 Semiconductor processing tape
JP6535117B1 (en) 2018-03-28 2019-06-26 古河電気工業株式会社 Semiconductor processing tape
KR102112771B1 (en) 2018-03-28 2020-05-19 후루카와 덴키 고교 가부시키가이샤 Semiconductor processing tape
TWI677932B (en) * 2019-02-01 2019-11-21 相豐科技股份有限公司 Expansion method of stretch film and expander thereof
CN111524848A (en) * 2019-02-01 2020-08-11 相丰科技股份有限公司 Stretched film expanding method and film expander
JP7269096B2 (en) 2019-05-29 2023-05-08 古河電気工業株式会社 glass processing tape
JP7060548B2 (en) 2019-05-29 2022-04-26 古河電気工業株式会社 Glass processing tape
JP7060547B2 (en) 2019-05-29 2022-04-26 古河電気工業株式会社 Glass processing tape
JP7269095B2 (en) 2019-05-29 2023-05-08 古河電気工業株式会社 glass processing tape
JP7446773B2 (en) * 2019-11-07 2024-03-11 日東電工株式会社 Dicing tape and dicing die bond film
JP2024000458A (en) 2022-06-20 2024-01-05 マクセル株式会社 Dicing tape, semiconductor chip using dicing tape and manufacturing method of semiconductor device

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4947564B2 (en) * 2000-01-21 2012-06-06 日東電工株式会社 Adhesive sheet for semiconductor wafer processing
JP2003138228A (en) * 2001-11-02 2003-05-14 Nitto Denko Corp Pressure-sensitive adhesive sheet for protecting semiconductor wafer
JP4358502B2 (en) 2002-03-12 2009-11-04 浜松ホトニクス株式会社 Semiconductor substrate cutting method
JP4342775B2 (en) * 2002-07-31 2009-10-14 日東電工株式会社 Surface protective film for transparent conductive film, method for producing the same, and transparent conductive film with surface protective film
JP2004273895A (en) 2003-03-11 2004-09-30 Disco Abrasive Syst Ltd Dividing method of semiconductor wafer
CN1771585A (en) * 2003-04-08 2006-05-10 帝人杜邦菲林日本株式会社 Base film for semiconductor wafer processing
JP4566527B2 (en) * 2003-08-08 2010-10-20 日東電工株式会社 Re-peelable adhesive sheet
JP4754278B2 (en) 2005-06-23 2011-08-24 リンテック株式会社 Chip body manufacturing method
JP5554118B2 (en) * 2010-03-31 2014-07-23 古河電気工業株式会社 Wafer processing tape
JP5323779B2 (en) * 2010-07-26 2013-10-23 古河電気工業株式会社 Wafer processing tape

Also Published As

Publication number Publication date
CN107431002B (en) 2020-09-11
WO2016152957A1 (en) 2016-09-29
TW201702334A (en) 2017-01-16
SG11201707829WA (en) 2017-10-30
JP6230730B2 (en) 2017-11-15
TWI699420B (en) 2020-07-21
CN107431002A (en) 2017-12-01
JPWO2016152957A1 (en) 2017-05-25
KR102007111B1 (en) 2019-08-02
KR20170131504A (en) 2017-11-29

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