JP6186984B2 - 半導体装置の製造方法 - Google Patents
半導体装置の製造方法 Download PDFInfo
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- JP6186984B2 JP6186984B2 JP2013154667A JP2013154667A JP6186984B2 JP 6186984 B2 JP6186984 B2 JP 6186984B2 JP 2013154667 A JP2013154667 A JP 2013154667A JP 2013154667 A JP2013154667 A JP 2013154667A JP 6186984 B2 JP6186984 B2 JP 6186984B2
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- 239000004065 semiconductor Substances 0.000 title claims description 22
- 238000004519 manufacturing process Methods 0.000 title claims description 21
- 239000000758 substrate Substances 0.000 claims description 87
- 150000004767 nitrides Chemical class 0.000 claims description 46
- 238000000034 method Methods 0.000 claims description 21
- 230000001681 protective effect Effects 0.000 claims description 20
- 238000000059 patterning Methods 0.000 claims description 4
- 238000001039 wet etching Methods 0.000 claims description 4
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 29
- 229920005591 polysilicon Polymers 0.000 description 29
- 235000012431 wafers Nutrition 0.000 description 15
- 230000015572 biosynthetic process Effects 0.000 description 4
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 230000003647 oxidation Effects 0.000 description 3
- 238000007254 oxidation reaction Methods 0.000 description 3
- 229910052710 silicon Inorganic materials 0.000 description 3
- 239000010703 silicon Substances 0.000 description 3
- 238000005229 chemical vapour deposition Methods 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- 238000003672 processing method Methods 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 238000001312 dry etching Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 238000002955 isolation Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000000206 photolithography Methods 0.000 description 1
- 238000005268 plasma chemical vapour deposition Methods 0.000 description 1
- 229910052814 silicon oxide Inorganic materials 0.000 description 1
- 238000001179 sorption measurement Methods 0.000 description 1
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- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
- H01L21/308—Chemical or electrical treatment, e.g. electrolytic etching using masks
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- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
- H01L21/3105—After-treatment
- H01L21/311—Etching the insulating layers by chemical or physical means
- H01L21/31144—Etching the insulating layers by chemical or physical means using masks
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02107—Forming insulating materials on a substrate
- H01L21/02225—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer
- H01L21/02227—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a process other than a deposition process
- H01L21/0223—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a process other than a deposition process formation by oxidation, e.g. oxidation of the substrate
- H01L21/02233—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a process other than a deposition process formation by oxidation, e.g. oxidation of the substrate of the semiconductor substrate or a semiconductor layer
- H01L21/02236—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a process other than a deposition process formation by oxidation, e.g. oxidation of the substrate of the semiconductor substrate or a semiconductor layer group IV semiconductor
- H01L21/02238—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a process other than a deposition process formation by oxidation, e.g. oxidation of the substrate of the semiconductor substrate or a semiconductor layer group IV semiconductor silicon in uncombined form, i.e. pure silicon
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
- H01L21/30604—Chemical etching
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- H—ELECTRICITY
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- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
- H01L21/3105—After-treatment
- H01L21/311—Etching the insulating layers by chemical or physical means
- H01L21/31105—Etching inorganic layers
- H01L21/31111—Etching inorganic layers by chemical means
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
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- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
- H01L21/32—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers using masks
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
- H01L21/76—Making of isolation regions between components
- H01L21/762—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers
- H01L21/7624—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers using semiconductor on insulator [SOI] technology
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
- H01L21/76—Making of isolation regions between components
- H01L21/762—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers
- H01L21/7624—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers using semiconductor on insulator [SOI] technology
- H01L21/76251—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers using semiconductor on insulator [SOI] technology using bonding techniques
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- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Inorganic Chemistry (AREA)
- Element Separation (AREA)
- Local Oxidation Of Silicon (AREA)
Description
図1は、本発明の実施の形態1に係る半導体装置の製造方法を示す断面図である。本発明の実施の形態1に係る半導体装置の製造方法は、例えばLOCOS(Local Oxidation of Silicon)酸化膜形成工程で熱酸化により酸化膜を形成する方法に関する。まず、基板に窒化膜を形成する。図1Aは、基板に窒化膜を形成したことを示す断面図である。ここで本発明の実施の形態における基板とはSOI(Silicon On Insulator)ウエハと同義である。この基板は、シリコン(Si)単結晶ウエハからなる支持基板10を備える。支持基板10の表面に埋め込み酸化膜12Aが形成されている。支持基板10の裏面に裏面酸化膜12Bが形成されている。埋め込み酸化膜12Aの膜厚と、裏面酸化膜12Bの膜厚は、例えば2μm以上である。
図2は、本発明の実施の形態2に係る半導体装置の製造方法を示す断面図である。基板15については実施の形態1と同様である。図2Aは、表面酸化膜が形成された基板を示す断面図である。表面酸化膜50は、ウェル形成工程でマスクとして用いる膜厚が200nm以上の酸化膜である。
なお、この場合、基板の裏面へポリシリコンをデポしている際に、基板表面側に微細なキズが入る可能性がある。しかし、基板表面側は将来除去される表面酸化膜に覆われているので実害はない。
Claims (5)
- 基板の表面に表面窒化膜を形成し、前記基板の裏面に裏面窒化膜を形成する工程と、
前記表面窒化膜の上に保護膜を形成する工程と、
前記保護膜で前記表面窒化膜を保護しつつ、ウェットエッチングで前記裏面窒化膜を除去する工程と、
前記裏面窒化膜を除去した後に前記保護膜を除去する工程と、
前記表面窒化膜をパターニングし前記表面窒化膜に開口を形成する工程と、
前記開口に露出した前記基板の表面に第1酸化膜を形成しつつ、前記基板の裏面に第2酸化膜を形成する工程と、を備え、
前記保護膜は酸化膜であることを特徴とする半導体装置の製造方法。 - 基板の裏面に裏面窒化膜を形成せずに、前記基板の表面に表面窒化膜を形成する工程と、
前記表面窒化膜をパターニングし前記表面窒化膜に開口を形成する工程と、
前記開口に露出した前記基板の表面に第1酸化膜を形成しつつ、前記基板の裏面に第2酸化膜を形成する工程と、を備えたことを特徴とする半導体装置の製造方法。 - 前記第1酸化膜は膜厚が1000nm以上のLOCOS酸化膜であることを特徴とする請求項1又は2に記載の半導体装置の製造方法。
- 前記基板は、支持基板、前記支持基板の表面に形成された埋め込み酸化膜、前記支持基板の裏面に形成された裏面酸化膜、及び前記埋め込み酸化膜の表面に形成されたSOI層を有し、
前記埋め込み酸化膜の膜厚と、前記裏面酸化膜の膜厚は、2μm以上であることを特徴とする請求項1乃至3のいずれか1項に記載の半導体装置の製造方法。 - 前記基板は、Si基板であることを特徴とする請求項1乃至3のいずれか1項に記載の半導体装置の製造方法。
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2013154667A JP6186984B2 (ja) | 2013-07-25 | 2013-07-25 | 半導体装置の製造方法 |
US14/245,304 US9082716B2 (en) | 2013-07-25 | 2014-04-04 | Method of manufacturing semiconductor device |
DE102014208307.9A DE102014208307B4 (de) | 2013-07-25 | 2014-05-02 | Verfahren zum Herstellen einer Halbleitervorrichtung |
KR1020140082374A KR101606372B1 (ko) | 2013-07-25 | 2014-07-02 | 반도체장치의 제조방법 |
CN201410360240.2A CN104347381A (zh) | 2013-07-25 | 2014-07-25 | 半导体装置的制造方法 |
Applications Claiming Priority (1)
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JP2013154667A JP6186984B2 (ja) | 2013-07-25 | 2013-07-25 | 半導体装置の製造方法 |
Publications (2)
Publication Number | Publication Date |
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JP2015026683A JP2015026683A (ja) | 2015-02-05 |
JP6186984B2 true JP6186984B2 (ja) | 2017-08-30 |
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JP2013154667A Active JP6186984B2 (ja) | 2013-07-25 | 2013-07-25 | 半導体装置の製造方法 |
Country Status (5)
Country | Link |
---|---|
US (1) | US9082716B2 (ja) |
JP (1) | JP6186984B2 (ja) |
KR (1) | KR101606372B1 (ja) |
CN (1) | CN104347381A (ja) |
DE (1) | DE102014208307B4 (ja) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP3817068B1 (en) | 2019-02-07 | 2023-10-18 | Fuji Electric Co., Ltd. | Semiconductor device and semiconductor module |
CN114121665B (zh) * | 2021-11-08 | 2024-02-23 | 长江存储科技有限责任公司 | 半导体器件的制作方法、半导体器件、存储器及存储*** |
Family Cites Families (22)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5670649A (en) * | 1979-11-13 | 1981-06-12 | Seiko Epson Corp | Manufacture of semiconductor device |
JPS6315439A (ja) * | 1986-07-07 | 1988-01-22 | Seiko Instr & Electronics Ltd | 選択酸化分離方法 |
US5837378A (en) * | 1995-09-12 | 1998-11-17 | Micron Technology, Inc. | Method of reducing stress-induced defects in silicon |
JPH09266317A (ja) * | 1996-03-29 | 1997-10-07 | Matsushita Electric Works Ltd | 半導体装置 |
KR100195244B1 (ko) | 1996-09-10 | 1999-06-15 | 윤종용 | 반도체 메모리 디바이스의 제조방법 |
JP2892321B2 (ja) | 1996-12-12 | 1999-05-17 | 三菱電機株式会社 | 半導体装置及びその製造方法 |
JP3539102B2 (ja) | 1996-12-12 | 2004-07-07 | 株式会社デンソー | トレンチ分離型半導体基板の製造方法 |
JP2927280B2 (ja) * | 1997-09-17 | 1999-07-28 | 日本電気株式会社 | Soi基板の製造方法 |
JPH11345954A (ja) * | 1998-05-29 | 1999-12-14 | Shin Etsu Handotai Co Ltd | 半導体基板及びその製造方法 |
JP3358550B2 (ja) * | 1998-07-07 | 2002-12-24 | 信越半導体株式会社 | Soiウエーハの製造方法ならびにこの方法で製造されるsoiウエーハ |
JP2001007099A (ja) * | 1999-06-22 | 2001-01-12 | Mitsumi Electric Co Ltd | 半導体基板の製造方法及び半導体基板 |
JP2001144275A (ja) * | 1999-08-27 | 2001-05-25 | Shin Etsu Handotai Co Ltd | 貼り合わせsoiウエーハの製造方法および貼り合わせsoiウエーハ |
JP3994856B2 (ja) | 2002-11-07 | 2007-10-24 | 株式会社デンソー | 半導体装置の製造方法 |
US7713838B2 (en) * | 2003-09-08 | 2010-05-11 | Sumco Corporation | SOI wafer and its manufacturing method |
JP5194508B2 (ja) | 2007-03-26 | 2013-05-08 | 信越半導体株式会社 | Soiウエーハの製造方法 |
JP5272329B2 (ja) * | 2007-05-22 | 2013-08-28 | 信越半導体株式会社 | Soiウエーハの製造方法 |
US7598539B2 (en) * | 2007-06-01 | 2009-10-06 | Infineon Technologies Ag | Heterojunction bipolar transistor and method for making same |
US7645666B2 (en) * | 2007-07-23 | 2010-01-12 | Infineon Technologies Ag | Method of making a semiconductor device |
US8476150B2 (en) * | 2010-01-29 | 2013-07-02 | Intersil Americas Inc. | Methods of forming a semiconductor device |
US8404562B2 (en) * | 2010-09-30 | 2013-03-26 | Infineon Technologies Ag | Method for manufacturing a composite wafer having a graphite core, and composite wafer having a graphite core |
US8260098B1 (en) * | 2011-02-17 | 2012-09-04 | Nxp B.V. | Optocoupler circuit |
JP5642628B2 (ja) * | 2011-05-27 | 2014-12-17 | 東京エレクトロン株式会社 | 基板反り除去装置、基板反り除去方法及び記憶媒体 |
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2013
- 2013-07-25 JP JP2013154667A patent/JP6186984B2/ja active Active
-
2014
- 2014-04-04 US US14/245,304 patent/US9082716B2/en not_active Expired - Fee Related
- 2014-05-02 DE DE102014208307.9A patent/DE102014208307B4/de not_active Expired - Fee Related
- 2014-07-02 KR KR1020140082374A patent/KR101606372B1/ko not_active IP Right Cessation
- 2014-07-25 CN CN201410360240.2A patent/CN104347381A/zh active Pending
Also Published As
Publication number | Publication date |
---|---|
KR101606372B1 (ko) | 2016-03-25 |
CN104347381A (zh) | 2015-02-11 |
US20150031208A1 (en) | 2015-01-29 |
DE102014208307A1 (de) | 2015-01-29 |
DE102014208307B4 (de) | 2018-11-08 |
JP2015026683A (ja) | 2015-02-05 |
KR20150013012A (ko) | 2015-02-04 |
US9082716B2 (en) | 2015-07-14 |
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