JP6159904B2 - 配線体、配線基板、及びタッチセンサ - Google Patents
配線体、配線基板、及びタッチセンサ Download PDFInfo
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- JP6159904B2 JP6159904B2 JP2017502903A JP2017502903A JP6159904B2 JP 6159904 B2 JP6159904 B2 JP 6159904B2 JP 2017502903 A JP2017502903 A JP 2017502903A JP 2017502903 A JP2017502903 A JP 2017502903A JP 6159904 B2 JP6159904 B2 JP 6159904B2
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
- G06F3/044—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means
- G06F3/0445—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means using two or more layers of sensing electrodes, e.g. using two layers of electrodes separated by a dielectric layer
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
- H05K3/1258—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by using a substrate provided with a shape pattern, e.g. grooves, banks, resist pattern
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
- H05K3/1283—After-treatment of the printed patterns, e.g. sintering or curing methods
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/20—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/20—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
- H05K3/207—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern using a prefabricated paste pattern, ink pattern or powder pattern
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F2203/00—Indexing scheme relating to G06F3/00 - G06F3/048
- G06F2203/041—Indexing scheme relating to G06F3/041 - G06F3/045
- G06F2203/04103—Manufacturing, i.e. details related to manufacturing processes specially suited for touch sensitive devices
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F2203/00—Indexing scheme relating to G06F3/00 - G06F3/048
- G06F2203/041—Indexing scheme relating to G06F3/041 - G06F3/045
- G06F2203/04112—Electrode mesh in capacitive digitiser: electrode for touch sensing is formed of a mesh of very fine, normally metallic, interconnected lines that are almost invisible to see. This provides a quite large but transparent electrode surface, without need for ITO or similar transparent conductive material
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0296—Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
- H05K2201/09681—Mesh conductors, e.g. as a ground plane
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10151—Sensor
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- Engineering & Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Theoretical Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Human Computer Interaction (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Position Input By Displaying (AREA)
- Structure Of Printed Boards (AREA)
- Manufacturing Of Printed Wiring (AREA)
Description
文献の参照による組み込みが認められる指定国については、2015年5月1日に日本国に出願された特願2015−093899号に記載された内容を参照により本明細書に組み込み、本明細書の記載の一部とする。
H 1 ×1/2≦H 2 <H 1 ・・・(1)
但し、上記(1)式において、H 1 は非交差領域における前記導体層の平均高さであり、H 2 は前記凹部における前記導体層の平均高さである。
[3]本発明に係る配線体は、第1の樹脂層と、前記第1の樹脂層上に形成され、複数の細線同士を相互に交差させてなる網目状の導体層と、を備え、前記導体層は、複数の前記細線同士が交差する領域である交差領域と、前記交差領域以外の領域である非交差領域と、を含み、前記導体層は、前記交差領域において、前記第1の樹脂層に接近する側に凹んだ凹部を有し、前記細線の短手方向断面の外形は、前記第1の樹脂層から離れるに従って相互に接近するように傾斜する直線状の2つの側面を有する。
H1×1/2≦H2<H1・・・・(2)
但し、上記(2)式において、H1は非交差領域T2における網目状電極層6の平均高さであり、H2は凹部65における網目状電極層6の平均高さである。
H3×1/2≧H4・・・(3)
但し、上記(3)式において、H3は溝111の平均高さであり、H4は凸部112の平均高さである。
2・・・配線基板
3・・・基材
31・・・主面
4・・・配線体
5・・・接着層
51・・・平坦部
511・・・主面
52・・・支持部
521・・・側面
522・・・接触面
6・・・網目状電極層
61・・・接触面
62・・・頂面
621・・・角部
622・・・頂面平坦部
623・・・突出部
63・・・側面
631,632・・・端部
633・・・側面平坦部
64・・・細線
64a・・・第1の細線
L1・・・中心線
64b・・・第2の細線
L2・・・中心線
65・・・凹部
T1・・・交差領域
T2・・・非交差領域
8・・・樹脂層
9・・・網目状電極層
10・・・平板
11・・・凹版
111・・・溝
112・・・凸部
113・・・空隙
12・・・導電性材料
13,14・・・樹脂材料
Claims (9)
- 第1の樹脂層と、
前記第1の樹脂層上に形成され、複数の細線同士を相互に交差させてなる網目状の導体層と、を備え、
前記導体層は、
複数の前記細線同士が交差する領域である交差領域と、
前記交差領域以外の領域である非交差領域と、を含み、
前記導体層は、前記交差領域において、前記第1の樹脂層に接近する側に凹んだ凹部を有し、下記(1)式を満たす配線体。
H 1 ×1/2≦H 2 <H 1 ・・・(1)
但し、上記(1)式において、H 1 は非交差領域における前記導体層の平均高さであり、H 2 は前記凹部における前記導体層の平均高さである。 - 第1の樹脂層と、
前記第1の樹脂層上に形成され、複数の細線同士を相互に交差させてなる網目状の導体層と、を備え、
前記導体層は、
複数の前記細線同士が交差する領域である交差領域と、
前記交差領域以外の領域である非交差領域と、を含み、
前記導体層は、前記交差領域において、前記第1の樹脂層に接近する側に凹んだ凹部を有し、
前記交差領域において、前記導体層の高さが、前記凹部に向かって漸次的に小さくなるように形成され、
前記凹部の外形は、円弧状である配線体。 - 第1の樹脂層と、
前記第1の樹脂層上に形成され、複数の細線同士を相互に交差させてなる網目状の導体層と、を備え、
前記導体層は、
複数の前記細線同士が交差する領域である交差領域と、
前記交差領域以外の領域である非交差領域と、を含み、
前記導体層は、前記交差領域において、前記第1の樹脂層に接近する側に凹んだ凹部を有し、
前記細線の短手方向断面の外形は、前記第1の樹脂層から離れるに従って相互に接近するように傾斜する直線状の2つの側面を有する配線体。 - 請求項1〜3の何れか1項に記載の配線体であって、
前記細線は、
前記第1の樹脂層と接触する第1の面と、
前記第1の面と反対側の面である第2の面と、を有し、
前記非交差領域において、前記第2の面は、平坦部を含む配線体。 - 請求項4に記載の配線体であって、
前記第2の面は、前記細線の短手断面において、前記第2の面の端部の少なくとも一方に設けられ、前記第1の樹脂層から離れる側に向かって突出する突出部を含み、
相互に交差する前記複数の細線の一方に含まれる前記突出部と、相互に交差する前記複数の細線の他方に含まれる前記突出部とは、前記複数の細線同士が相互に交差する部分で連続的に繋がっている配線体。 - 請求項1〜5の何れか1項に記載の配線体であって、
前記導体層を覆う第2の樹脂層をさらに備え、
前記導体層は、前記第1及び第2の樹脂層の間に介在する配線体。 - 請求項1〜6の何れか1項に記載の配線体と、
前記配線体を支持する支持体と、を備える配線基板。 - 請求項7に記載の配線基板であって、
前記配線体と前記支持体との間に介在する第3の樹脂層をさらに備える配線基板。 - 請求項7又は8に記載の配線基板を備えるタッチセンサ。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2015093899 | 2015-05-01 | ||
JP2015093899 | 2015-05-01 | ||
PCT/JP2016/063384 WO2016178409A1 (ja) | 2015-05-01 | 2016-04-28 | 配線体、配線基板、及びタッチセンサ |
Publications (2)
Publication Number | Publication Date |
---|---|
JPWO2016178409A1 JPWO2016178409A1 (ja) | 2017-05-18 |
JP6159904B2 true JP6159904B2 (ja) | 2017-07-05 |
Family
ID=57217736
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2017502903A Expired - Fee Related JP6159904B2 (ja) | 2015-05-01 | 2016-04-28 | 配線体、配線基板、及びタッチセンサ |
Country Status (6)
Country | Link |
---|---|
US (1) | US20170293382A1 (ja) |
EP (1) | EP3197250A4 (ja) |
JP (1) | JP6159904B2 (ja) |
CN (1) | CN106688313B (ja) |
TW (1) | TWI602106B (ja) |
WO (1) | WO2016178409A1 (ja) |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20150103977A (ko) * | 2014-03-04 | 2015-09-14 | 엘지이노텍 주식회사 | 터치 윈도우 및 이를 포함하는 디스플레이 장치 |
US10101865B2 (en) * | 2015-01-30 | 2018-10-16 | Fujikura Ltd. | Wiring body, wiring board, and touch sensor |
CN106019678B (zh) * | 2016-08-04 | 2020-03-06 | 京东方科技集团股份有限公司 | 一种触控显示装置及其制备方法 |
CN107463296B (zh) * | 2017-09-21 | 2024-03-29 | 京东方科技集团股份有限公司 | 一种显示面板、触摸屏及显示装置 |
JP6730336B2 (ja) * | 2018-01-23 | 2020-07-29 | ファナック株式会社 | プリント配線基板の劣化検出センサ |
JP7232578B2 (ja) * | 2018-03-29 | 2023-03-03 | 株式会社ノリタケカンパニーリミテド | 電磁波シールド板 |
US20240211082A1 (en) * | 2021-09-18 | 2024-06-27 | Beijing Boe Technology Development Co., Ltd. | Metal mesh array and manufacturing method thereof, thin film sensor and manufacturing method thereof |
Family Cites Families (22)
Publication number | Priority date | Publication date | Assignee | Title |
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US20050067378A1 (en) * | 2003-09-30 | 2005-03-31 | Harry Fuerhaupter | Method for micro-roughening treatment of copper and mixed-metal circuitry |
JP2006147867A (ja) * | 2004-11-19 | 2006-06-08 | Sharp Corp | プリント配線板の製造方法 |
US7383629B2 (en) * | 2004-11-19 | 2008-06-10 | Endicott Interconnect Technologies, Inc. | Method of making circuitized substrates utilizing smooth-sided conductive layers as part thereof |
JP5151242B2 (ja) * | 2007-05-11 | 2013-02-27 | 凸版印刷株式会社 | 光透過性電磁波シールド部材の製造方法 |
US8283577B2 (en) * | 2007-06-08 | 2012-10-09 | Dai Nippon Printing Co., Ltd. | Printed matter and its manufacturing method, and electromagnetic shielding material and its manufacturing method |
JP5332510B2 (ja) * | 2008-10-29 | 2013-11-06 | コニカミノルタ株式会社 | 透明導電性基板、及び電気化学表示素子 |
JP2010147860A (ja) * | 2008-12-19 | 2010-07-01 | Hitachi Chem Co Ltd | フィルムアンテナ基材及びその製造法 |
JP2012169353A (ja) * | 2011-02-10 | 2012-09-06 | Dainippon Printing Co Ltd | 光学シート、及びそのシートを用いたプラズマディスプレイ用前面フィルタ |
CN103384870B (zh) * | 2011-02-18 | 2016-06-01 | 富士胶片株式会社 | 导电片和触控面板 |
WO2013100031A1 (ja) * | 2011-12-27 | 2013-07-04 | 積水化学工業株式会社 | 光透過性導電性フィルム及びそれを有する静電容量型タッチパネル |
JP6117620B2 (ja) * | 2012-06-07 | 2017-04-19 | 日東電工株式会社 | タッチパネル部材及びその製造方法 |
EP2735950B1 (en) * | 2012-11-22 | 2019-04-03 | LG Innotek Co., Ltd. | Touch window |
CN104076973A (zh) * | 2013-03-26 | 2014-10-01 | Lg伊诺特有限公司 | 触控面板和具有该触控面板的触控设备 |
JP2014191717A (ja) * | 2013-03-28 | 2014-10-06 | Dainippon Printing Co Ltd | タッチパネルの製造方法 |
JP2014216175A (ja) * | 2013-04-25 | 2014-11-17 | リンテック株式会社 | 透明導電性積層体の製造方法及び透明導電性積層体 |
JP6084127B2 (ja) * | 2013-07-22 | 2017-02-22 | グンゼ株式会社 | 電極付透明面状基材及びタッチパネル |
US10474299B2 (en) * | 2014-02-24 | 2019-11-12 | Lg Innotek Co., Ltd. | Touch window and display with the same |
KR20150103977A (ko) * | 2014-03-04 | 2015-09-14 | 엘지이노텍 주식회사 | 터치 윈도우 및 이를 포함하는 디스플레이 장치 |
CN104076982B (zh) * | 2014-06-24 | 2017-01-18 | 京东方科技集团股份有限公司 | 一种触摸屏及其制作方法、显示装置 |
JP6515928B2 (ja) * | 2014-06-25 | 2019-05-22 | コニカミノルタ株式会社 | メッシュ状の機能性パターンの形成方法、メッシュ状の機能性パターン及び機能性基材 |
JP6577198B2 (ja) * | 2015-02-09 | 2019-09-18 | 株式会社フジクラ | 配線体及び配線基板 |
EP3264234A4 (en) * | 2015-02-27 | 2018-08-08 | Fujikura Ltd. | Wiring body, wiring substrate, and touch sensor |
-
2016
- 2016-04-28 EP EP16789545.7A patent/EP3197250A4/en not_active Withdrawn
- 2016-04-28 US US15/508,842 patent/US20170293382A1/en not_active Abandoned
- 2016-04-28 JP JP2017502903A patent/JP6159904B2/ja not_active Expired - Fee Related
- 2016-04-28 WO PCT/JP2016/063384 patent/WO2016178409A1/ja active Application Filing
- 2016-04-28 CN CN201680002510.XA patent/CN106688313B/zh not_active Expired - Fee Related
- 2016-04-29 TW TW105113406A patent/TWI602106B/zh not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
CN106688313A (zh) | 2017-05-17 |
EP3197250A4 (en) | 2018-01-17 |
CN106688313B (zh) | 2018-12-21 |
JPWO2016178409A1 (ja) | 2017-05-18 |
TWI602106B (zh) | 2017-10-11 |
WO2016178409A1 (ja) | 2016-11-10 |
EP3197250A1 (en) | 2017-07-26 |
TW201710868A (zh) | 2017-03-16 |
US20170293382A1 (en) | 2017-10-12 |
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