JP6157047B2 - Icデバイス用ソケット - Google Patents
Icデバイス用ソケット Download PDFInfo
- Publication number
- JP6157047B2 JP6157047B2 JP2011019937A JP2011019937A JP6157047B2 JP 6157047 B2 JP6157047 B2 JP 6157047B2 JP 2011019937 A JP2011019937 A JP 2011019937A JP 2011019937 A JP2011019937 A JP 2011019937A JP 6157047 B2 JP6157047 B2 JP 6157047B2
- Authority
- JP
- Japan
- Prior art keywords
- layer
- substrate
- power supply
- conductive contact
- divided
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/02—Arrangements of circuit components or wiring on supporting structure
- H05K7/10—Plug-in assemblages of components, e.g. IC sockets
- H05K7/1053—Plug-in assemblages of components, e.g. IC sockets having interior leads
- H05K7/1061—Plug-in assemblages of components, e.g. IC sockets having interior leads co-operating by abutting
- H05K7/1069—Plug-in assemblages of components, e.g. IC sockets having interior leads co-operating by abutting with spring contact pieces
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/04—Housings; Supporting members; Arrangements of terminals
- G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
- G01R1/0433—Sockets for IC's or transistors
- G01R1/0483—Sockets for un-leaded IC's having matrix type contact fields, e.g. BGA or PGA devices; Sockets for unpackaged, naked chips
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/073—Multiple probes
- G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
- G01R1/07364—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch
- G01R1/07371—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch using an intermediate card or back card with apertures through which the probes pass
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Connecting Device With Holders (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
Description
Claims (5)
- 第1面と、該第1面に対向する第2面と、それぞれが該第1面と該第2面を連絡する複数の貫通孔と、を有する基板と、
それぞれの一部が前記複数の貫通孔のうちいずれかに挿入された複数の導電性コンタクトピンと、を備えたIC用ソケットであって、
前記基板は、
前記第1面と、前記第2面と、前記複数の貫通孔と、を有する基材と、
前記複数の貫通孔と交差した状態で前記第1面及び前記第2面の間に設けられた、柔軟性のあるシートからなる少なくとも一つの誘電体層であって、該基材よりも高い誘電率を有する少なくとも一つの誘電体層と、
前記基板の前記第1面と前記第2面との間の前記基材に包埋された電源層及びグラウンド層であって、前記基材の前記第1面から前記第2面に向かう方向に沿って、前記誘電体層を挟む電源層及びグラウンド層と、を備え、前記複数の導電性コンタクトピンは、
それぞれの一部が前記複数の貫通孔のうちいずれかに挿入され、該一部が前記電源層又は前記グラウンド層に電気的に接続された複数の第1導電性コンタクトピンと、
それぞれの一部が前記複数の貫通孔のうち、前記複数の第1導電性コンタクトピンが挿入された貫通孔以外の貫通孔のいずれかに挿入され、該一部が前記電源層及び前記グラウンド層に電気的に接続されていない複数の第2導電性コンタクトピンと、を含み、
前記電源層、前記グラウンド層、及び前記少なくとも一つの誘電体層のそれぞれは、間に挿入される絶縁領域を介して水平方向に2以上の部分に分割されている、ICデバイス用ソケット。 - 前記絶縁領域は、その一方の面が前記基材の第1面に到達するまで伸びる一方、該一方の面と対向する他方の面が前記基材の第2面に到達するまで伸びた形状を有することを特徴とする請求項1記載のICデバイス用ソケット。
- 前記絶縁領域は、少なくとも一部が空気間隙であることを特徴とする請求項2記載のICデバイス用ソケット。
- 前記複数の貫通孔のいずれかは、その内面に導体部材が設けられており、前記電源層は、対応する導体部材を介して前記複数の第1導電性コンタクトピンのうち少なくともいずれかに電気的に接続される一方、前記グラウンド層は、対応する導体部材を介して前記複数の第1導電性コンタクトピンのうち、前記電源層が接続されたコンタクトピン以外のコンタクトピンのいずれかに電気的に接続されている請求項1記載のICデバイス用ソケット。
- 前記基板を支持するボディであって、検査すべきICデバイスを前記基板上の所定位置に配置するためのガイド部と、前記ICデバイスを検査する検査装置の所定位置に当該ICデバイス用ソケットを配置させるための位置決め部と、を有するボディを、更に備えたことを特徴とする請求項1記載のICデバイス用ソケット。
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2011019937A JP6157047B2 (ja) | 2011-02-01 | 2011-02-01 | Icデバイス用ソケット |
PCT/US2012/023061 WO2012106220A1 (en) | 2011-02-01 | 2012-01-30 | Socket for ic device |
TW101103120A TWI521815B (zh) | 2011-02-01 | 2012-01-31 | 用於積體電路裝置之插座 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2011019937A JP6157047B2 (ja) | 2011-02-01 | 2011-02-01 | Icデバイス用ソケット |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2015180991A Division JP6484532B2 (ja) | 2015-09-14 | 2015-09-14 | Icデバイス用ソケット |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2012159422A JP2012159422A (ja) | 2012-08-23 |
JP2012159422A5 JP2012159422A5 (ja) | 2014-03-20 |
JP6157047B2 true JP6157047B2 (ja) | 2017-07-05 |
Family
ID=45563617
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2011019937A Expired - Fee Related JP6157047B2 (ja) | 2011-02-01 | 2011-02-01 | Icデバイス用ソケット |
Country Status (3)
Country | Link |
---|---|
JP (1) | JP6157047B2 (ja) |
TW (1) | TWI521815B (ja) |
WO (1) | WO2012106220A1 (ja) |
Families Citing this family (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI494576B (zh) * | 2013-12-03 | 2015-08-01 | Tohoku Seiki Ind Co Ltd | IC processor |
US10037933B2 (en) | 2014-06-20 | 2018-07-31 | Xcerra Corporation | Test socket assembly and related methods |
KR101735774B1 (ko) | 2015-11-30 | 2017-05-16 | 주식회사 아이에스시 | 테스트용 러버 소켓 |
US9958918B2 (en) * | 2016-05-23 | 2018-05-01 | Qualcomm Incorporated | Systems and methods to separate power domains in a processing device |
IT201600127581A1 (it) | 2016-12-16 | 2018-06-16 | Technoprobe Spa | Testa di misura per un’apparecchiatura di test di dispositivi elettronici con migliorate proprietà di filtraggio |
IT201700021389A1 (it) * | 2017-02-24 | 2018-08-24 | Technoprobe Spa | Testa di misura con migliorate proprietà in frequenza |
TWI713807B (zh) * | 2016-12-16 | 2020-12-21 | 義大利商探針科技公司 | 具有增進的頻率性質的測試頭 |
IT201700021397A1 (it) | 2017-02-24 | 2018-08-24 | Technoprobe Spa | Testa di misura con migliorate proprietà in frequenza |
IT201700021400A1 (it) | 2017-02-24 | 2018-08-24 | Technoprobe Spa | Testa di misura a sonde verticali con migliorate proprietà in frequenza |
KR101920822B1 (ko) * | 2017-04-21 | 2019-02-13 | 리노공업주식회사 | 프로브 소켓 |
EP3698152A4 (en) * | 2017-10-20 | 2021-07-14 | FormFactor, Inc. | DIRECT METALLIC GUIDE PLATE |
JP7346026B2 (ja) | 2018-12-26 | 2023-09-19 | 株式会社日本マイクロニクス | 電気的接続装置 |
KR102295761B1 (ko) * | 2020-06-01 | 2021-09-01 | 리노공업주식회사 | 검사소켓 |
TW202202859A (zh) * | 2020-06-22 | 2022-01-16 | 日商友華股份有限公司 | 檢查裝置 |
TWI788113B (zh) | 2021-11-23 | 2022-12-21 | 創意電子股份有限公司 | 檢測裝置及其測試插座 |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2001249163A (ja) * | 2000-03-06 | 2001-09-14 | Takai Kogyo Kk | Icデバイスの試験用ソケット |
JP4259928B2 (ja) | 2003-06-11 | 2009-04-30 | 株式会社リコー | 移送物体検出装置,原稿読取装置および画像形成装置 |
JP4607004B2 (ja) * | 2005-12-27 | 2011-01-05 | 株式会社ヨコオ | 検査ユニット |
JP5259945B2 (ja) * | 2006-10-30 | 2013-08-07 | スリーエム イノベイティブ プロパティズ カンパニー | 熱放散機能を備えたicソケット |
US7663387B2 (en) * | 2007-09-27 | 2010-02-16 | Yokowo Co., Ltd. | Test socket |
CN101836513B (zh) * | 2007-10-24 | 2013-01-23 | 富士通株式会社 | 印刷电路板单元和插座 |
JP4659087B2 (ja) * | 2008-12-17 | 2011-03-30 | パナソニック株式会社 | 差動平衡信号伝送基板 |
KR101126690B1 (ko) * | 2009-07-02 | 2012-04-02 | 남재우 | Mems 기술을 이용한 테스트 소켓 및 그 제조방법 |
-
2011
- 2011-02-01 JP JP2011019937A patent/JP6157047B2/ja not_active Expired - Fee Related
-
2012
- 2012-01-30 WO PCT/US2012/023061 patent/WO2012106220A1/en active Application Filing
- 2012-01-31 TW TW101103120A patent/TWI521815B/zh not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
JP2012159422A (ja) | 2012-08-23 |
TWI521815B (zh) | 2016-02-11 |
TW201246727A (en) | 2012-11-16 |
WO2012106220A1 (en) | 2012-08-09 |
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