JP6147248B2 - 自動車内で用いるためのゲッター層を備えた制御装置 - Google Patents
自動車内で用いるためのゲッター層を備えた制御装置 Download PDFInfo
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- JP6147248B2 JP6147248B2 JP2014509605A JP2014509605A JP6147248B2 JP 6147248 B2 JP6147248 B2 JP 6147248B2 JP 2014509605 A JP2014509605 A JP 2014509605A JP 2014509605 A JP2014509605 A JP 2014509605A JP 6147248 B2 JP6147248 B2 JP 6147248B2
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- 239000002184 metal Substances 0.000 claims description 17
- 239000004020 conductor Substances 0.000 claims description 15
- 238000000034 method Methods 0.000 claims description 10
- NINIDFKCEFEMDL-UHFFFAOYSA-N Sulfur Chemical compound [S] NINIDFKCEFEMDL-UHFFFAOYSA-N 0.000 claims description 8
- 229910052717 sulfur Inorganic materials 0.000 claims description 8
- 239000011593 sulfur Substances 0.000 claims description 8
- 238000007789 sealing Methods 0.000 claims description 7
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 5
- 239000007921 spray Substances 0.000 claims description 5
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 4
- 229910052782 aluminium Inorganic materials 0.000 claims description 4
- 239000004332 silver Substances 0.000 claims description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 3
- 229910001252 Pd alloy Inorganic materials 0.000 claims description 3
- 229910000831 Steel Inorganic materials 0.000 claims description 3
- 239000010949 copper Substances 0.000 claims description 3
- 238000004377 microelectronic Methods 0.000 claims description 3
- 239000010959 steel Substances 0.000 claims description 3
- 229910052802 copper Inorganic materials 0.000 claims description 2
- SWELZOZIOHGSPA-UHFFFAOYSA-N palladium silver Chemical compound [Pd].[Ag] SWELZOZIOHGSPA-UHFFFAOYSA-N 0.000 claims description 2
- 229910052709 silver Inorganic materials 0.000 claims description 2
- 239000002994 raw material Substances 0.000 claims 1
- 239000011347 resin Substances 0.000 claims 1
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- 230000007797 corrosion Effects 0.000 description 9
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- 229910001316 Ag alloy Inorganic materials 0.000 description 2
- 229910000838 Al alloy Inorganic materials 0.000 description 2
- 239000010953 base metal Substances 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 2
- 238000005229 chemical vapour deposition Methods 0.000 description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 238000007747 plating Methods 0.000 description 2
- 239000000843 powder Substances 0.000 description 2
- 229920002379 silicone rubber Polymers 0.000 description 2
- 238000001179 sorption measurement Methods 0.000 description 2
- 229920003002 synthetic resin Polymers 0.000 description 2
- 239000000057 synthetic resin Substances 0.000 description 2
- 229910000881 Cu alloy Inorganic materials 0.000 description 1
- COHCXWLRUISKOO-UHFFFAOYSA-N [AlH3].[Ba] Chemical compound [AlH3].[Ba] COHCXWLRUISKOO-UHFFFAOYSA-N 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 238000004210 cathodic protection Methods 0.000 description 1
- 150000001768 cations Chemical class 0.000 description 1
- 230000003111 delayed effect Effects 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000003792 electrolyte Substances 0.000 description 1
- 238000002309 gasification Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
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- 229910052760 oxygen Inorganic materials 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
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- 239000003566 sealing material Substances 0.000 description 1
- 239000004945 silicone rubber Substances 0.000 description 1
- 238000007751 thermal spraying Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K5/00—Casings, cabinets or drawers for electric apparatus
- H05K5/06—Hermetically-sealed casings
- H05K5/069—Other details of the casing, e.g. wall structure, passage for a connector, a cable, a shaft
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
- H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
- H01L23/053—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having an insulating or insulated base as a mounting for the semiconductor body
- H01L23/055—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having an insulating or insulated base as a mounting for the semiconductor body the leads having a passage through the base
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
- H01L23/10—Containers; Seals characterised by the material or arrangement of seals between parts, e.g. between cap and base of the container or between leads and walls of the container
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/16—Fillings or auxiliary members in containers or encapsulations, e.g. centering rings
- H01L23/18—Fillings characterised by the material, its physical or chemical properties, or its arrangement within the complete device
- H01L23/26—Fillings characterised by the material, its physical or chemical properties, or its arrangement within the complete device including materials for absorbing or reacting with moisture or other undesired substances, e.g. getters
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/306—Lead-in-hole components, e.g. affixing or retention before soldering, spacing means
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
- H01L2224/48228—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item the bond pad being disposed in a recess of the surface of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
- H01L2224/4912—Layout
- H01L2224/49175—Parallel arrangements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/161—Cap
- H01L2924/1615—Shape
- H01L2924/16152—Cap comprising a cavity for hosting the device, e.g. U-shaped cap
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
- Y10T29/49139—Assembling to base an electrical component, e.g., capacitor, etc. by inserting component lead or terminal into base aperture
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Casings For Electric Apparatus (AREA)
- Connector Housings Or Holding Contact Members (AREA)
- Electrical Control Of Air Or Fuel Supplied To Internal-Combustion Engine (AREA)
- Wire Bonding (AREA)
Description
但しここで重要なことは、ゲッター層10が、守るべき部品5,6,7,8,9,11の合計表面と比較して、何倍もの固有表面積を有していることである。有害ガスを、不可逆的に吸収する能力を持つゲッター層10は、塗布方法によって、ハウジング・カバー2の内面の輪郭(形状)に合わせることが可能である。ゲッター層10のゲット(吸着/吸収)効果は、守るべき部品5,6,7,8,9,11に近く配置されればされる程、大きくなる。
Claims (9)
- −ハウジング・カバー(2)とハウジング・ボトム(3)からなるハウジング(1)と、−該ハウジング・カバー(2)とハウジング・ボトム(3)の間のシーリング手段(4)と、
−電導性の配線を有する少なくとも一つの回路基板(5)−但し、該回路基板(5)上には、少なくとも一つの電子部品(6,7)が配置されている−と、
−ハウジング(1)内から外へ導かれている少なくとも一本の通電ストラクチャー(8)と、
−電子部品(6,7)と該通電ストラクチャー(8)とをつないでいる少なくとも一本の接続配線(9)を包含する、自動車用の制御装置において、
ハウジング(1)の内面上には、制御装置内にある金属製の電流、或いは、データを流すための部品(5,6,7,8,9,11)を硫黄を含有するガスから保護するために、サーマル・スプレー法によってスプレー塗布されたゲッター層(10)が設けられており、前記ゲッター層(10)が、保護されるべき前記部品(5,6,7,8,9,11)の合計表面と比較して、複数倍の固有表面積を有し、
前記ゲッター層(10)が、前記部品(5,6,7,8,9,11)と同様の素材から構成されていることを特徴とする制御装置。 - 該ゲッター層(10)が、ハウジング(1)の内面上に選択的に塗布されていることを特徴とする請求項1に記載の制御装置(1)。
- 該ゲッター層(10)が、ハウジング・カバー(2)の内面に、ハウジング・カバー(2)とハウジング・ボトム(3)との接触面にゲッター層(10)が被さらないように、選択的に設けられていることを特徴とする請求項2に記載の制御装置(1)。
- 該ゲッター層(10)が、アルミニウム、銅、銀、銀・パラジウム合金、或いは、鋼鉄などの金属製であることを特徴とする請求項1〜3の何れか一項に記載の制御装置(1)。
- 該通電ストラクチャー(8)が、それぞれ端末に配置されたオープンな接続領域(11)を有するフレックス・フィルム導体であることを特徴とする請求項1〜4の何れか一項に記載の制御装置(1)。
- 該通電ストラクチャー(8)のオープンな接続領域(11)が、少なくとも、制御装置内においては、ボンディング・パッドとして形成されていることを特徴とする請求項5に記載の制御装置(1)。
- 該接続配線(9)が、それぞれ端末に配置されたオープンな接続領域(11)を有するフレックス・フィルム導体であることを特徴とする請求項1〜6の何れか一項に記載の制御装置(1)。
- 電子部品(6,7)が、ハウジングされていないマイクロ・エレクトロニクス部品であることを特徴とする請求項1〜7の何れか一項に記載の制御装置(1)。
- 該回路基板(5)と接続配線(9)が、腐食性ガスに対する付加的な保護としての柔軟な樹脂層によって覆われていることを特徴とする請求項1〜8の何れか一項に記載の制御装置(1)。
Applications Claiming Priority (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE102011100977 | 2011-05-09 | ||
DE102011100977.2 | 2011-05-09 | ||
DE102011056742.9A DE102011056742B4 (de) | 2011-05-09 | 2011-12-21 | Steuergerät mit einer Getterschicht in einem Kraftfahrzeug |
DE102011056742.9 | 2011-12-21 | ||
PCT/DE2012/100131 WO2012152271A1 (de) | 2011-05-09 | 2012-05-08 | Steuergerät mit einer getterschicht zum einsatz in einem kraftfahrzeug |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2014516204A JP2014516204A (ja) | 2014-07-07 |
JP6147248B2 true JP6147248B2 (ja) | 2017-06-14 |
Family
ID=47070269
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2014509605A Active JP6147248B2 (ja) | 2011-05-09 | 2012-05-08 | 自動車内で用いるためのゲッター層を備えた制御装置 |
Country Status (5)
Country | Link |
---|---|
US (1) | US9497875B2 (ja) |
EP (1) | EP2707897B1 (ja) |
JP (1) | JP6147248B2 (ja) |
DE (1) | DE102011056742B4 (ja) |
WO (1) | WO2012152271A1 (ja) |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2967302B1 (fr) * | 2010-11-09 | 2012-12-21 | Commissariat Energie Atomique | Structure d'encapsulation d'un micro-dispositif comportant un matériau getter |
JP6618745B2 (ja) * | 2015-09-18 | 2019-12-11 | セイコーインスツル株式会社 | 電子部品 |
EP3193368B1 (en) * | 2016-01-13 | 2020-03-18 | ams AG | An optoelectronic device with a refractive element and a method of producing such an optoelectronic device |
US10615314B2 (en) * | 2016-03-31 | 2020-04-07 | Nichia Corporation | Light-emitting device |
EP3886155A1 (en) * | 2020-03-24 | 2021-09-29 | Infineon Technologies AG | Module with gas flow-inhibiting sealing at module interface to mounting base |
US11784554B2 (en) * | 2020-09-14 | 2023-10-10 | Rockwell Automation Technologies, Inc. | Power conversion system with enhanced protection for gaseous corrosive atmospheres |
Family Cites Families (13)
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US4352119A (en) | 1979-09-17 | 1982-09-28 | Beckman Instruments, Inc. | Electrical device and method for particle entrapment device for an electrical component |
DE3442132A1 (de) | 1984-11-17 | 1986-05-22 | Messerschmitt-Bölkow-Blohm GmbH, 8012 Ottobrunn | Verfahren zur verkapselung von mikroelektronikschaltungen mit organischen komponenten |
DE3913066A1 (de) | 1989-04-21 | 1990-11-08 | Schoppe & Faeser Gmbh | Verfahren zur herstellung eines hermetisch dichten gehaeuses sowie nach diesem verfahren hergestelltes gehaeuse |
JP2000231880A (ja) | 1999-02-12 | 2000-08-22 | Canon Inc | 非蒸発型ゲッタの形成方法、該非蒸発型ゲッタを用いた画像形成装置およびその製造方法 |
US6423575B1 (en) * | 2001-07-27 | 2002-07-23 | Dean Tran | Hydrogen gettering structure including silver-doped palladium layer to increase hydrogen gettering of module component and semiconductor device module having such structure, and methods of fabrication |
US20050238803A1 (en) * | 2003-11-12 | 2005-10-27 | Tremel James D | Method for adhering getter material to a surface for use in electronic devices |
US20060284556A1 (en) * | 2003-11-12 | 2006-12-21 | Tremel James D | Electronic devices and a method for encapsulating electronic devices |
FR2883099B1 (fr) | 2005-03-14 | 2007-04-13 | Commissariat Energie Atomique | Protection d'un getter en couche mince |
JP5114898B2 (ja) | 2006-09-07 | 2013-01-09 | 日産自動車株式会社 | パッケージ型電子部品及びパッケージ型電子部品の製造方法 |
DE102006049593A1 (de) | 2006-10-20 | 2008-04-24 | Conti Temic Microelectronic Gmbh | Kompaktes Steuergerät für ein Kraftfahrzeug |
DE102006049592A1 (de) * | 2006-10-20 | 2008-04-30 | Conti Temic Microelectronic Gmbh | Steuergerät für ein Kraftfahrzeug |
KR100872265B1 (ko) * | 2007-05-16 | 2008-12-05 | 삼성전기주식회사 | 웨이퍼 레벨 패키지 및 그 패키징 방법 |
FR2950877B1 (fr) | 2009-10-07 | 2012-01-13 | Commissariat Energie Atomique | Structure a cavite comportant une interface de collage a base de materiau getter |
-
2011
- 2011-12-21 DE DE102011056742.9A patent/DE102011056742B4/de not_active Expired - Fee Related
-
2012
- 2012-05-08 WO PCT/DE2012/100131 patent/WO2012152271A1/de active Application Filing
- 2012-05-08 JP JP2014509605A patent/JP6147248B2/ja active Active
- 2012-05-08 EP EP12727271.4A patent/EP2707897B1/de active Active
- 2012-05-08 US US14/116,411 patent/US9497875B2/en active Active
Also Published As
Publication number | Publication date |
---|---|
US9497875B2 (en) | 2016-11-15 |
WO2012152271A1 (de) | 2012-11-15 |
US20140111947A1 (en) | 2014-04-24 |
JP2014516204A (ja) | 2014-07-07 |
DE102011056742A1 (de) | 2012-11-15 |
DE102011056742B4 (de) | 2019-07-18 |
EP2707897A1 (de) | 2014-03-19 |
EP2707897B1 (de) | 2018-09-19 |
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