JP6138133B2 - 導電性材料およびプロセス - Google Patents
導電性材料およびプロセス Download PDFInfo
- Publication number
- JP6138133B2 JP6138133B2 JP2014529812A JP2014529812A JP6138133B2 JP 6138133 B2 JP6138133 B2 JP 6138133B2 JP 2014529812 A JP2014529812 A JP 2014529812A JP 2014529812 A JP2014529812 A JP 2014529812A JP 6138133 B2 JP6138133 B2 JP 6138133B2
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- JP
- Japan
- Prior art keywords
- silver
- conductive ink
- ink
- reducing agent
- conductive
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41M—PRINTING, DUPLICATING, MARKING, OR COPYING PROCESSES; COLOUR PRINTING
- B41M5/00—Duplicating or marking methods; Sheet materials for use therein
- B41M5/0023—Digital printing methods characterised by the inks used
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/027—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed by irradiation, e.g. by photons, alpha or beta particles
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D11/00—Inks
- C09D11/52—Electrically conductive inks
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/20—Conductive material dispersed in non-conductive organic material
- H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
- H05K1/092—Dispersed materials, e.g. conductive pastes or inks
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/105—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by conversion of non-conductive material on or in the support into conductive material, e.g. by using an energy beam
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
- H05K2203/1131—Sintering, i.e. fusing of metal particles to achieve or improve electrical conductivity
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/12—Using specific substances
- H05K2203/125—Inorganic compounds, e.g. silver salt
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
- H05K3/1283—After-treatment of the printed patterns, e.g. sintering or curing methods
Description
本出願は、内容が参照により本明細書に組み込まれる2011年9月6日出願の米国特許出願第61/531,347号の優先権を主張する。
シュウ酸銀を水溶液中で硝酸銀およびシュウ酸二水和物から調製した。脱水シュウ酸30gを350mlの水に溶解した。それとは別に、硝酸銀30gを120mlの水に溶解した。硝酸銀溶液をシュウ酸溶液に攪拌しながら滴下すると、直ぐにシュウ酸銀の白色沈殿が生じた。反応が完結したら、1μmの濾紙を使用して溶液を濾過し、沈殿を単離した。単離した沈殿を水で2回洗浄して可溶成分および残存する酸を除去し、次にさらにエタノールで2回洗浄した。
例1で得たインクの導電性を評価するために、スライドガラス(25×25mm)をインク溜め中にインクで被覆されるまで浸漬した。被覆されたスライドを直ちにホットプレート上に置いてシュウ酸銀が分解して銀ナノ粒子が形成されるまで30分間120℃から130℃の間の温度を保った。(銀ナノ粒子はどのようなパターンでも堆積しなかった;インク溜めに浸漬すると、そうではなく、ナノ粒子のコーティングまたはフィルムを形成した。商業的な適用では、インクは所定のパターンで堆積して導電性トレースを形成したであろう。)
ナノ銀ペースト(Ferro Corporationから得た製品R7000−95)を、カルビトールで銀濃度が20重量%になるように希釈した。ポリビニルピロリドン(PVP)を溶液に加え、PVPの濃度を2重量%にして、銀とPVPとの比を10対1にした。溶液を3000rpmで30秒間完全に混合した(SPEEDMIXER、Houschild、モデルDAC150SP)。
Claims (13)
- ポリマーおよび/または樹脂のマトリックス内に焼結銀の導電性ネットワークを作製する方法であって、
(a)銀化合物およびポリマーおよび/または樹脂のマトリックスを形成する結合剤を含む導電性インクを調製するステップと、
(b)導電性インクを基材上に堆積させ、外部エネルギー源を照射して堆積した導電性インクを乾燥するステップと、
(c)乾燥した導電性インクにパルスUVを照射して銀化合物を銀元素に分解し、銀元素を焼結してポリマーおよび/または樹脂のマトリックス内に焼結銀の導電性ネットワークを作製するステップと
を含む方法。 - 導電性インクが、酸化銀、炭酸銀、カルボン酸銀、酢酸銀、ギ酸銀、シュウ酸銀、プロピオン酸銀、ブタン酸銀、エチルヘキサン酸銀、ネオデカン酸銀、ペンタフルオロプロピオン酸銀、クエン酸銀、グリコール酸銀、安息香酸銀、トリフルオロ酢酸銀、フェニル酢酸銀、銀アセチルアセトナートおよび銀ヘキサフルオロアセチルアセトナートからなる群から選択される銀化合物を含む、請求項1に記載の方法。
- 銀化合物が、ギ酸銀、シュウ酸銀またはギ酸銀とシュウ酸銀の組合せである、請求項2に記載の方法。
- 銀化合物が、導電性インク全体の1から70重量%の量で存在する、請求項1〜3のいずれか1項に記載の方法。
- 結合剤が、ポリビニルピロリドン、エポキシ樹脂、フェノール樹脂、アクリル樹脂、ウレタン樹脂、シリコーン樹脂、スチレンアリルアルコール、ポリアルキレンカーボネートおよびポリビニルアセタールからなる群から選択される、請求項1〜4のいずれか1項に記載の方法。
- 結合剤が、ポリビニルピロリドンである、請求項5に記載の方法。
- 結合剤が、導電性インク全体の0.1から30重量%の量で存在する、請求項1〜6のいずれか1項に記載の方法。
- 導電性インクが、アミン、オキシム、グアニジン、カルバゾン、アルコールおよびポリオール、ヒドラジン、ヒドラゾン、ヒドラジド、アルデヒドならびにアミドからなる群から選択される還元剤をさらに含む、請求項1〜7のいずれか1項に記載の方法。
- 還元剤が、ブチルアミン、ノニルアミン、ジブチルアミン、トリブチルアミン、ジエチレンアミン、テトラエチレンペンタアミン、オクチルアミン、トリエチルアミンおよびイソプロパノールアミンからなる群から選択されるアミンである、請求項8に記載の方法。
- 還元剤が、オクチルアミンである、請求項9に記載の方法。
- 還元剤が、アセトンオキシム、メチルアルドオキシムおよびメチルエチルケトオキシムからなる群から選択されるオキシムである、請求項8に記載の方法。
- 還元剤が、メタノール、エタノール、イソプロパノール、テルピネオール、t−ブタノール、エチレングリコール、ジエチレングリコール、トリエチレングリコール、エチレングリコールジアセテート、ホルムアルデヒド、オクタナール、デカナール、ドデカナールおよびジメチルホルムアミドからなる群から選択される、請求項8に記載の方法。
- 導電性インクを乾燥するための外部エネルギー源が、25℃から200℃の温度または温度範囲内の熱である、請求項1〜12のいずれか1項に記載の方法。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US201161531347P | 2011-09-06 | 2011-09-06 | |
US61/531,347 | 2011-09-06 | ||
PCT/US2012/053764 WO2013036519A1 (en) | 2011-09-06 | 2012-09-05 | Conductive material and process |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2014529875A JP2014529875A (ja) | 2014-11-13 |
JP6138133B2 true JP6138133B2 (ja) | 2017-05-31 |
Family
ID=47832524
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2014529812A Active JP6138133B2 (ja) | 2011-09-06 | 2012-09-05 | 導電性材料およびプロセス |
Country Status (7)
Country | Link |
---|---|
US (1) | US10999933B2 (ja) |
EP (1) | EP2753668B1 (ja) |
JP (1) | JP6138133B2 (ja) |
KR (1) | KR102020914B1 (ja) |
CN (1) | CN104024351B (ja) |
TW (1) | TWI597004B (ja) |
WO (1) | WO2013036519A1 (ja) |
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