JP6129497B2 - Continuous plating equipment - Google Patents

Continuous plating equipment Download PDF

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JP6129497B2
JP6129497B2 JP2012190977A JP2012190977A JP6129497B2 JP 6129497 B2 JP6129497 B2 JP 6129497B2 JP 2012190977 A JP2012190977 A JP 2012190977A JP 2012190977 A JP2012190977 A JP 2012190977A JP 6129497 B2 JP6129497 B2 JP 6129497B2
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nozzles
workpiece
plating
nozzle
electrode
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JP2013082996A (en
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仁志 薄田
仁志 薄田
朝裕 野田
朝裕 野田
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Almex Pe Inc
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    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D21/00—Processes for servicing or operating cells for electrolytic coating
    • C25D21/10—Agitating of electrolytes; Moving of racks
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/10—Electrodes, e.g. composition, counter electrode
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/10—Electrodes, e.g. composition, counter electrode
    • C25D17/12—Shape or form
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/08—Electroplating with moving electrolyte e.g. jet electroplating

Description

本発明は、連続メッキ装置に関する。   The present invention relates to a continuous plating apparatus.

連続メッキ装置は、搬送治具に垂下されて保持されるメッキ槽内を連続搬送されると共に通電されるワーク（陰極）とメッキ槽内に配置される電極（陽極）との間に電界を形成して、ワークの被処理面をメッキしている。   A continuous plating device forms an electric field between a workpiece (cathode) that is continuously conveyed and energized in a plating tank that is suspended and held by a conveying jig, and an electrode (anode) that is arranged in the plating tank. Then, the surface to be processed of the workpiece is plated.

ここで、特許文献１〜３に示すように、ワークと電極（陽極板）との間には、ワークにメッキ液を噴出するノズルが設けられる。よって、ワークと電極（陽極板）との間には、少なくともノズルの直径以上の空間を必要とする。特許文献２には、陰極と陽極との距離が１００ｍｍ以上であることが開示されている。   Here, as shown in Patent Documents 1 to 3, a nozzle for ejecting a plating solution to the work is provided between the work and the electrode (anode plate). Therefore, a space at least larger than the diameter of the nozzle is required between the workpiece and the electrode (anode plate). Patent Document 2 discloses that the distance between the cathode and the anode is 100 mm or more.

特開２０００−１７８７８４号公報（図１、図３）JP 2000-178784 A (FIGS. 1 and 3) 特開２００６−２１４００６号公報（図１）JP 2006-214006 A (FIG. 1) 特開昭５８−６９９８号公報（図４）Japanese Patent Laid-Open No. 58-6998 (FIG. 4)

特許文献２，３には高速メッキが開示されているが、高速にメッキするには、ワーク及び電極間にメッキ液を介して流れる電流値または電流密度を高くする必要がある。この電流値または電流密度を高くするには、ワーク及び電極間距離を短くし、ワーク及び電極間に介在するメッキ液の抵抗値を下げて電流損失を少なくすることが効率的である。   Patent Documents 2 and 3 disclose high-speed plating. However, in order to perform high-speed plating, it is necessary to increase the current value or current density flowing between the workpiece and the electrode via the plating solution. In order to increase the current value or current density, it is effective to reduce the current loss by shortening the distance between the workpiece and the electrode and lowering the resistance value of the plating solution interposed between the workpiece and the electrode.

しかし、特許文献２，３ではワークと電極（陽極板）との間にはノズルが介在するので、ワークと電極（陽極板）との間の距離を狭めるには限界があった。   However, in Patent Documents 2 and 3, since a nozzle is interposed between the workpiece and the electrode (anode plate), there is a limit in reducing the distance between the workpiece and the electrode (anode plate).

もし、ワークに電極（陽極板）を近づけると、ノズルと電極（陽極板）とが干渉するか、あるいはノズルと電極（陽極板）との間の隙間が狭くなり、メッキ液の流動性が悪化してしまう。   If the electrode (anode plate) is brought close to the workpiece, the nozzle and the electrode (anode plate) interfere with each other, or the gap between the nozzle and the electrode (anode plate) becomes narrow, and the fluidity of the plating solution deteriorates. Resulting in.

本発明の幾つかの形態によれば、ワークと陽極電極との間の距離を、ノズルと陽極電極とを干渉させずに短くできる構造を採用することで、ワークに通電する電流密度を効率的に高めることができる連続メッキ装置を提供することができる。   According to some embodiments of the present invention, by adopting a structure in which the distance between the workpiece and the anode electrode can be shortened without causing interference between the nozzle and the anode electrode, the current density applied to the workpiece can be efficiently reduced. It is possible to provide a continuous plating apparatus that can be improved to a high level.

本発明の他のいくつかの形態によれば、ワーク及び陽極電極間距離を狭めることに起因してメッキ液の逃げ場がなくなり、ノズルから噴射されるフレッシュなメッキ液がワークに接触することが阻害されることを抑制できる連続メッキ装置を提供することができる。   According to some other aspects of the present invention, the escape space for the plating solution is eliminated due to the decrease in the distance between the workpiece and the anode electrode, and the contact of the fresh plating solution sprayed from the nozzle with the workpiece is hindered. Therefore, it is possible to provide a continuous plating apparatus that can suppress the occurrence.

本発明のさらに他のいくつかの形態によれば、ワーク及び陽極電極間距離を狭めることに起因してメッキ液の逃げ場がなくなり、ノズルから高速噴射される領域の近傍が負圧となって、ワークがノズル側に引っ張られる現象を抑制できる連続メッキ装置を提供することができる。   According to still another embodiment of the present invention, there is no escape space for the plating solution due to narrowing the distance between the workpiece and the anode electrode, and the vicinity of the region sprayed at high speed from the nozzle becomes a negative pressure, It is possible to provide a continuous plating apparatus that can suppress the phenomenon that the workpiece is pulled toward the nozzle.

（１）本発明の一態様は、
メッキ液を収容して、搬送治具に保持されて連続搬送されると共に陰極に設定される複数のワークにメッキするメッキ槽と、
前記メッキ槽内にて前記複数のワークと対向する位置に配置され、前記メッキ液を前記複数のワークに向けて噴出する複数のノズルと、
前記メッキ槽内にて連続搬送される前記複数のワークと対向する位置に配置される複数の陽極電極と、
を有し、
前記複数のワークが連続搬送される搬送方向に沿って、前記複数のノズルの一つと前記複数の陽極電極の少なくとも一つとが交互に繰り返し配置される連続メッキ装置に関する。 (1) One aspect of the present invention is
A plating tank that contains a plating solution, is continuously transported while being held by a transport jig, and plating a plurality of workpieces set as cathodes;
A plurality of nozzles disposed in positions facing the plurality of workpieces in the plating tank, and spraying the plating solution toward the plurality of workpieces;
A plurality of anode electrodes arranged at positions facing the plurality of workpieces continuously conveyed in the plating tank;
Have
The present invention relates to a continuous plating apparatus in which one of the plurality of nozzles and at least one of the plurality of anode electrodes are alternately and repeatedly arranged along a conveyance direction in which the plurality of workpieces are continuously conveyed.

本発明の一態様によれば、従来は複数のノズルの背面側にあった所定長さの陽極電極を分割して、複数のワークが連続搬送される搬送方向に沿って配置される複数のノズルのうちの各２つのノズル間に少なくとも一つの陽極電極を配置している。これにより、ワーク側から見てノズルの背面側に陽極電極板を配置する無駄が省け、複数の陽極電極をワークの被処理面に近づけることができる。そのため、ワークの被処理面と陽極電極との距離が縮まり、介在するメッキ液による抵抗が小さくなって、ワークの被処理面と陽極電極との間に流れる電流密度が効率的に高まる。電流密度が高いほどワークの被処理面に堆積される単位時間当たりのメッキ厚は厚くなり、スループットが向上し、ワークに貫通形成されたスルーホール内をメッキ被膜する効率が高まる。よって、メッキ槽の全長を長くしなくても、所定のメッキ厚に仕上げることができる。それにより、連続メッキ装置の全長を短くすることができる。また、ワークの被処理面と陽極電極との距離が縮まることから、連続メッキ装置の幅方向でも小型化を図ることが可能となる。   According to one aspect of the present invention, a plurality of nozzles are arranged along a conveying direction in which a plurality of workpieces are continuously conveyed by dividing an anode electrode of a predetermined length that has conventionally been on the back side of the plurality of nozzles. At least one anode electrode is disposed between each two nozzles. Thereby, the waste of disposing the anode electrode plate on the back side of the nozzle as viewed from the workpiece side can be saved, and the plurality of anode electrodes can be brought close to the surface to be processed of the workpiece. For this reason, the distance between the workpiece surface to be processed and the anode electrode is reduced, the resistance due to the intervening plating solution is reduced, and the current density flowing between the workpiece surface to be processed and the anode electrode is efficiently increased. The higher the current density, the thicker the plating thickness per unit time deposited on the work surface of the workpiece, the throughput is improved, and the efficiency of plating a through-hole formed in the workpiece is increased. Therefore, a predetermined plating thickness can be achieved without increasing the overall length of the plating tank. Thereby, the full length of a continuous plating apparatus can be shortened. Further, since the distance between the workpiece surface to be processed and the anode electrode is reduced, it is possible to reduce the size even in the width direction of the continuous plating apparatus.

さらに、複数のノズル一つと複数の陽極電極の少なくとも一つとが搬送方向で交互に繰り返し配置される結果として、ノズルと電極との間の隙間が狭くなってメッキ液の流動性を悪化させることなく、ワークに対するノズルと陽極電極の配置密度を確保することができる。このように、本発明の一態様では、従来は複数のノズルの背面側にあった所定長さの陽極電極を分割して、２つのノズル間に少なくとも一つの陽極電極を配置している。   Furthermore, as a result of the plurality of nozzles and at least one of the plurality of anode electrodes being alternately and repeatedly disposed in the transport direction, the gap between the nozzles and the electrodes is narrowed and the fluidity of the plating solution is not deteriorated. The arrangement density of the nozzle and the anode electrode with respect to the workpiece can be ensured. As described above, in one aspect of the present invention, the anode electrode having a predetermined length, which has conventionally been on the back side of the plurality of nozzles, is divided and at least one anode electrode is disposed between the two nozzles.

（２）本発明の一態様では、前記搬送方向から見た側面視で、前記複数のノズルと前記複数の陽極電極とが重なる位置関係にて配置することができる。   (2) In one aspect of the present invention, the plurality of nozzles and the plurality of anode electrodes can be arranged in a positional relationship, as viewed from the side as viewed from the transport direction.

側面視で複数のノズルと複数の陽極電極とが重なる位置関係にて配置される結果として、複数の陽極電極をワークの被処理面により近づけることができる。このレイアウトは、隣り合う２つのノズル３０の間に少なくとも一つの陽極電極４０が配置することで初めて達成され、複数のノズルの背面側（ワークとは反対側）に設けられる従来の陽極板では不可能である。   As a result of the positional relationship in which the plurality of nozzles and the plurality of anode electrodes overlap in a side view, the plurality of anode electrodes can be brought closer to the surface to be processed of the workpiece. This layout is achieved for the first time by arranging at least one anode electrode 40 between two adjacent nozzles 30 and is not possible with a conventional anode plate provided on the back side (the side opposite to the workpiece) of a plurality of nozzles. Is possible.

（３）本発明の一態様では、前記複数の陽極電極の各々の輪郭は、平面視で前記複数の陽極電極の各々を二分して前記搬送方向と直交する電極中心線からの距離が離れるに従い、前記複数のワークの各々の被処理面からの距離が大きくなるように形成することができる。   (3) In one aspect of the present invention, the outline of each of the plurality of anode electrodes is divided as the distance from the electrode center line perpendicular to the transport direction increases by dividing each of the plurality of anode electrodes in plan view. The plurality of workpieces can be formed such that the distance from the surface to be processed increases.

陽極電極が平面視で矩形であるとすると、平板のワークの被処理面から陽極電極までの距離は一定となり、この一定距離の狭い範囲に噴出されたメッキ液が集中し、ノズルと陽極電極との隙間が狭くメッキ液の逃げ場がなくなる。メッキ液の逃げ場がないと、ノズルからのフレッシュなメッキ液がワークと接触することの阻害原因となり、ノズル流の周囲に生ずる負圧領域にワークが吸着される現象も生ずる。本発明の一態様によれば、電極中心線から離れるほど、ワークの被処理面と陽極電極との間の距離が拡大し、それによりノズルと陽極電極とのより広い隙間を介してメッキ液の逃げ場が確保される。   If the anode electrode is rectangular in plan view, the distance from the surface to be processed of the flat workpiece to the anode electrode is constant, and the plating solution sprayed in a narrow range of this constant distance concentrates, and the nozzle and anode electrode The gap of the plating is narrow and there is no escape for plating solution. If the plating solution does not escape, the fresh plating solution from the nozzle is obstructed from coming into contact with the workpiece, and the workpiece is also attracted to the negative pressure region around the nozzle flow. According to one aspect of the present invention, the farther from the center line of the electrode, the larger the distance between the workpiece surface to be processed and the anode electrode, thereby allowing the plating solution to pass through a wider gap between the nozzle and the anode electrode. An escape is secured.

（４）本発明の一態様では、前記複数の陽極電極の各々は、横断面の輪郭を湾曲させることができる。   (4) In one aspect of the present invention, each of the plurality of anode electrodes can be curved in cross section.

このように、複数の陽極電極の各々は、横断面の輪郭が角部で交差する２本の線を有するものよりもむしろ、横断面の輪郭を楕円や円のように湾曲させることができる。   Thus, each of the plurality of anode electrodes can be curved like an ellipse or a circle, rather than having two lines whose cross-sectional contours intersect at the corners.

（５）本発明の一態様では、前記複数の陽極電極の各々は、横断面の輪郭を円とすることができる。ノズルとの干渉を避けて陽極電極をワークの被処理面に近づける要請から言えば、陽極電極の輪郭は、横断面積が同一である限りにおいて楕円よりも円の方が好ましい。   (5) In one aspect of the present invention, each of the plurality of anode electrodes may have a circular cross-sectional profile. Speaking from the demand for avoiding interference with the nozzle and bringing the anode electrode closer to the workpiece surface, the outline of the anode electrode is preferably a circle rather than an ellipse as long as the cross-sectional area is the same.

（６）本発明の一態様では、前記複数の陽極電極の各々は、不溶性電極とすることができる。陽極電極は、可溶性及び不溶性のいずれも採用できる。ただし、電極成分がメッキ槽内の浴中にて溶解する可溶性電極は、電流密度を高めて駆動すると消耗が激しいが、不溶性電極であれば電流密度を高めて駆動しても弊害はない。   (6) In one aspect of the present invention, each of the plurality of anode electrodes may be an insoluble electrode. The anode electrode can be either soluble or insoluble. However, the soluble electrode in which the electrode component is dissolved in the bath in the plating tank is consumed rapidly when the current density is increased, but if it is an insoluble electrode, it is not harmful even if the current density is increased.

（７）本発明の一態様では、前記複数のノズルの各々は、横断面の輪郭が、前記複数の陽極電極の各々の横断面の直径よりも小さい円とすることができる。円形とされて面取りされたノズルとの干渉を避けて、陽極電極をワークの被処理面により近づけることができる。   (7) In one aspect of the present invention, each of the plurality of nozzles may be a circle having a cross-sectional outline smaller than the diameter of each of the plurality of anode electrodes. The anode electrode can be brought closer to the surface to be processed of the workpiece while avoiding interference with the nozzle chamfered in a circular shape.

（８）本発明の一態様では、前記複数のノズルの各々の横断面の中心は、前記複数の陽極電極の各々の横断面の中心よりも、前記複数のワークの各々の被処理面からの距離が短い位置に配置することができる。   (8) In one aspect of the present invention, the center of each cross section of the plurality of nozzles is closer to the surface to be processed of each of the plurality of workpieces than the center of each cross section of the plurality of anode electrodes. It can be placed at a short distance.

つまり、複数のノズルの各々の横断面の中心と複数の陽極電極の各々の横断面の中心とは、搬送方向に沿った同一直線上になく、ノズル中心と電極中心とが千鳥状にずれて配置されることを意味する。こうすると、ノズル中心と電極中心とが同一直線上にある場合よりも、隣り合うノズルと陽極電極との間の最小間隔を確保しやすくなる。つまり、陽極電極の直径を最大限に大きくしながら、ノズルとの干渉を防止しやすくなる。   That is, the center of the cross section of each of the plurality of nozzles and the center of the cross section of each of the plurality of anode electrodes are not on the same straight line along the transport direction, and the nozzle center and the electrode center are shifted in a staggered manner. It means to be placed. This makes it easier to secure the minimum distance between the adjacent nozzle and the anode electrode than when the nozzle center and the electrode center are on the same straight line. That is, it becomes easy to prevent interference with the nozzle while maximizing the diameter of the anode electrode.

（９）本発明の一態様では、前記複数のノズルの各々から前記複数のワークの各々の被処理面に至る第１最短距離δ１は、前記複数の陽極電極の各々から前記複数のワークの各々の被処理面に至る第２最短距離δ２よりも小さく、前記複数のノズルの外径は前記第２最短距離δ２よりも小さくすることができる。   (9) In one aspect of the present invention, the first shortest distance δ1 from each of the plurality of nozzles to each surface to be processed of each of the plurality of workpieces is determined from each of the plurality of anode electrodes. The outer diameter of the plurality of nozzles can be made smaller than the second shortest distance δ2, which is smaller than the second shortest distance δ2 reaching the surface to be processed.

このように、ノズルを陽極電極よりもワークに近づけて配置することができ、それによりメッキ液の供給圧を高める必要はない。しかも、平面視にてノズルからある噴射角を持ってワークに向けて噴射されるメッキ液が、陽極電極によって遮られることが少なくなる。また、ワークに近づけて配置されたノズルの直径は、陽極電極−ワーク間の第２最短距離δ２よりも小さく、それによりノズルの曲率が大きく確保できるので、メッキ液の逃げ場も確保しやすくなる。   In this way, the nozzle can be disposed closer to the workpiece than the anode electrode, so that it is not necessary to increase the supply pressure of the plating solution. In addition, the plating solution sprayed toward the work with a certain spray angle from the nozzle in plan view is less likely to be blocked by the anode electrode. Further, the diameter of the nozzle arranged close to the workpiece is smaller than the second shortest distance δ2 between the anode electrode and the workpiece, whereby the curvature of the nozzle can be ensured to be large, and it is easy to ensure the escape place for the plating solution.

（１０）本発明の一態様では、前記複数の陽極電極の各々と前記複数のノズルの各々との第３最短距離δ３は、前記第２最短距離δ２よりも小さくすることができる。それにより、陽極電極をワークの被処理面により近づけることができる。なお、ノズルよりワークに向けて噴出されたメッキ液は、ノズル及び陽極電極とワークとの間の隙間から、隣り合うノズル及び陽極電極間の隙間を介して、メッキ槽内の広い空間に逃がすことができる。それにより、ワークには常にフレッシュなメッキ液と接触させることができる。   (10) In one aspect of the present invention, the third shortest distance δ3 between each of the plurality of anode electrodes and each of the plurality of nozzles can be smaller than the second shortest distance δ2. Thereby, the anode electrode can be brought closer to the surface to be processed of the workpiece. The plating solution ejected from the nozzle toward the work escapes from the gap between the nozzle and the anode electrode and the work to a wide space in the plating tank through the gap between the adjacent nozzle and the anode electrode. Can do. Thereby, the workpiece can always be brought into contact with a fresh plating solution.

（１１）本発明の一態様では、前記第３最短距離δ３は前記第１最短距離δ１以上とすることができる。こうすると、ノズルと陽極電極との隙間の流路抵抗は、ワークとノズルとの間の流路抵抗以下となり、ノズル及び陽極電極間の隙間を介してメッキ液をメッキ槽内の広い空間に逃がし易くなる。 (11) In one aspect of the invention, the third shortest distance δ3 may be greater than or equal to the first shortest distance δ1 . As a result, the flow path resistance in the gap between the nozzle and the anode electrode is less than the flow path resistance between the workpiece and the nozzle, and the plating solution escapes to a wide space in the plating tank through the gap between the nozzle and the anode electrode. It becomes easy.

本発明の実施形態に係る連続メッキ装置の概略断面図である。It is a schematic sectional drawing of the continuous plating apparatus which concerns on embodiment of this invention. 図１に示す連続メッキ装置の概略平面図である。It is a schematic plan view of the continuous plating apparatus shown in FIG. 図３（Ａ）〜図３（Ｃ）は、陽極電極の横断面図である。3A to 3C are cross-sectional views of the anode electrode. 第１〜第３最短距離の関係を示す図である。It is a figure which shows the relationship of the 1st-3rd shortest distance. 図５（Ａ）はノズル中心と電極中心とを同一直線上に配置した例を示す図であり、図５（Ｂ）は２つのノズル間に複数の陽極電極を配置した例を示す図である。FIG. 5A is a diagram showing an example in which the nozzle center and the electrode center are arranged on the same straight line, and FIG. 5B is a diagram showing an example in which a plurality of anode electrodes are arranged between two nozzles. . 陽極電極の横断面を矩形とした例を示す図である。It is a figure which shows the example which made the cross section of the anode electrode the rectangle.

以下、本発明の好適な実施の形態について詳細に説明する。なお、以下に説明する本実施形態は特許請求の範囲に記載された本発明の内容を不当に限定するものではなく、本実施形態で説明される構成の全てが本発明の解決手段として必須であるとは限らない。   Hereinafter, preferred embodiments of the present invention will be described in detail. The present embodiment described below does not unduly limit the contents of the present invention described in the claims, and all the configurations described in the present embodiment are indispensable as means for solving the present invention. Not always.

１．全体構成
図１は本実施形態に係る連続メッキ装置の断面図であり、図２は平面図である。図１において、メッキ槽１０は、搬送治具２０に垂下して支持されるワーク１をメッキ液２中に収容してワーク１をメッキする槽である。メッキ槽１０は、周壁１０Ａと底壁１０Ｂとを有し、メッキ液２を液面Ｌで収容している。 1. Overall Configuration FIG. 1 is a cross-sectional view of a continuous plating apparatus according to this embodiment, and FIG. 2 is a plan view. In FIG. 1, a plating tank 10 is a tank in which a work 1 that is suspended and supported by a conveying jig 20 is accommodated in a plating solution 2 to plate the work 1. The plating tank 10 has a peripheral wall 10 </ b> A and a bottom wall 10 </ b> B, and contains the plating solution 2 at the liquid level L.

ワーク１は、回路基板またはフレキシブル回路基板等であり、例えばその両面が被処理面となる。搬送治具２０は、ワークを連続搬送すると共にワーク１に通電することができる。ワーク１は陰極として機能する。実際には、搬送治具２０と摺接する給電部（搬送レールでも良い）が電源のマイナス端子に接続され、給電部及び搬送治具２０を介してワーク１に通電される。   The work 1 is a circuit board, a flexible circuit board, or the like, and for example, both surfaces thereof are processed surfaces. The conveyance jig 20 can energize the workpiece 1 while continuously conveying the workpiece. The workpiece 1 functions as a cathode. In practice, a power feeding unit (which may be a transport rail) that is in sliding contact with the transport jig 20 is connected to the negative terminal of the power source, and the work 1 is energized through the power feed unit and the transport jig 20.

搬送治具２０に垂下して支持されるワーク１は、図１の紙面と直交する方向であって、図２に示す搬送方向Ａに沿って連続搬送される。ワーク１を連続搬送する手段の図示は省略するが、スプロケットにより連続駆動されるチェーン、シリンダ等で構成することができる。搬送治具２０に一枚のワーク１が保持され、図２に示すようにメッキ槽１０では複数のワーク１が連続搬送される。なお、搬送治具２０は、ワーク１が回路基板のように剛体であれば、ワーク１の上端をチャックしてワーク１を垂下状態で保持できる。ワーク１がフレキシブル回路基板などのように柔軟である場合には、搬送治具２０は枠部を有し、ワーク１の上下端をチャックすることができる。なお、図１では、搬送治具２０の上枠２１と下枠２２を示している。   The workpiece 1 supported by being suspended by the conveying jig 20 is continuously conveyed along the conveying direction A shown in FIG. 2 in a direction orthogonal to the paper surface of FIG. Although illustration of a means for continuously conveying the workpiece 1 is omitted, it can be constituted by a chain, a cylinder or the like continuously driven by a sprocket. A single workpiece 1 is held on the conveying jig 20, and a plurality of workpieces 1 are continuously conveyed in the plating tank 10 as shown in FIG. 2. In addition, if the workpiece | work 1 is a rigid body like a circuit board, the conveyance jig | tool 20 can chuck | suck the upper end of the workpiece | work 1 and can hold | maintain the workpiece | work 1 in a suspended state. When the workpiece 1 is flexible such as a flexible circuit board, the conveyance jig 20 has a frame portion and can chuck the upper and lower ends of the workpiece 1. In FIG. 1, an upper frame 21 and a lower frame 22 of the conveying jig 20 are shown.

図１及び図２に示すように、メッキ槽１０内には、ワーク１と対向する位置に配置され、メッキ液をワークに向けて噴出する複数のノズル３０が設けられている。本実施形態では、ワーク１の両面が被処理面であるので、ワーク１の連続搬送路を挟んで２列でノズル３０が配置されている。ノズル３０の上端は閉鎖され、ノズル３０の下端は、メッキ槽１０の下部に設けられたメッキ液供給部１１の供給路と連通している。メッキ液供給部１１の供給路途中には多孔板１１Ａを有することができる。   As shown in FIGS. 1 and 2, a plurality of nozzles 30 are provided in the plating tank 10 so as to be disposed at positions facing the workpiece 1 and eject a plating solution toward the workpiece. In this embodiment, since both surfaces of the workpiece 1 are the surfaces to be processed, the nozzles 30 are arranged in two rows across the continuous conveyance path of the workpiece 1. The upper end of the nozzle 30 is closed, and the lower end of the nozzle 30 communicates with the supply path of the plating solution supply unit 11 provided at the lower part of the plating tank 10. A perforated plate 11 </ b> A can be provided in the supply path of the plating solution supply unit 11.

ノズル３０がワーク１と対向する面には、縦方向にて間隔をあけて複数のノズル孔（図示せず）が形成されている。メッキ供給部１１よりノズル３０に供給されたフレッシュなメッキ液は、ノズル孔よりある噴射角をもってワーク１の被処理面に向けて噴出される。なお、ノズル３０は絶縁体で形成され、ワーク１に作用する電界に悪影響を与えることはない。   A plurality of nozzle holes (not shown) are formed on the surface of the nozzle 30 facing the workpiece 1 at intervals in the vertical direction. The fresh plating solution supplied from the plating supply unit 11 to the nozzle 30 is ejected toward the surface to be processed of the workpiece 1 with a certain spray angle from the nozzle hole. The nozzle 30 is formed of an insulator and does not adversely affect the electric field acting on the workpiece 1.

ノズル３０の下端はメッキ液供給部１１に固定されている。ノズル３０の上端には上端固定部３１が固定される。この上端固定部３１は、メッキ槽１０内にてＡ方向に延びる梁部材３２に固定されている。梁部材３２は、梁支持部材３３によりメッキ槽１０の周壁１０Ａに支持されている。   The lower end of the nozzle 30 is fixed to the plating solution supply unit 11. An upper end fixing portion 31 is fixed to the upper end of the nozzle 30. The upper end fixing portion 31 is fixed to a beam member 32 extending in the A direction in the plating tank 10. The beam member 32 is supported on the peripheral wall 10 </ b> A of the plating tank 10 by a beam support member 33.

メッキ槽１０内には、連続搬送される数のワークと対向する位置に配置される複数の陽極電極４０が設けられている。この陽極電極４０もノズル３０と同様な理由で、ワーク１の連続搬送路を挟んで２列で配置されている。陽極電極４０は図示しない電源のプラス端子に接続されている。なお、一つの陽極電極４０に接続された電源は、それぞれ独立して電流値を制御することができる。   In the plating tank 10, a plurality of anode electrodes 40 disposed at positions facing the number of workpieces that are continuously conveyed are provided. The anode electrodes 40 are also arranged in two rows across the continuous conveyance path of the workpiece 1 for the same reason as the nozzle 30. The anode electrode 40 is connected to a positive terminal of a power source (not shown). In addition, each power supply connected to one anode electrode 40 can control the current value independently.

陽極電極４０の上下端には、絶縁部例えば絶縁キャップ４１，４２を配置することができる。陽極電極４０の下端の絶縁キャップ４１は、取付部４３を介してメッキ液供給部１１に固定されている。絶縁キャップ４１，４２は、陽極電極４０の上下を絶縁することで、上下方向にて電界領域を画定している。陽極電極４０の上端の絶縁キャップ４２には、陽極電極４０と電気的に接続された電極取出部４４が設けられている。個々の陽極電極４０に接続された個々の電極取出部４４はメッキ槽１０の液面Ｌより上方に取り出され、個々の電極取出部４４は共通電極４５に接続される。なお、個々の電極取出部４４を個々の電源に接続し、複数の陽極電極４０の電流値を独立して制御できるようにしても良い。また、絶縁キャップ４１，４２をワーク１のサイズに合わせて上下位置を調整できるようにしても良い。   Insulating portions such as insulating caps 41 and 42 can be disposed on the upper and lower ends of the anode electrode 40. The insulating cap 41 at the lower end of the anode electrode 40 is fixed to the plating solution supply part 11 via the attachment part 43. The insulating caps 41 and 42 insulate the upper and lower sides of the anode electrode 40, thereby defining an electric field region in the vertical direction. An insulating cap 42 at the upper end of the anode electrode 40 is provided with an electrode extraction portion 44 that is electrically connected to the anode electrode 40. The individual electrode extraction portions 44 connected to the individual anode electrodes 40 are extracted above the liquid level L of the plating tank 10, and the individual electrode extraction portions 44 are connected to the common electrode 45. In addition, each electrode extraction part 44 may be connected to each power supply, and you may enable it to control the electric current value of the some anode electrode 40 independently. Further, the vertical positions of the insulating caps 41 and 42 may be adjusted according to the size of the work 1.

なお、ワーク１の直下にマスク部材５０を設けることができる。このマスク部材５０は図２の搬送方向Ａに沿った溝を有する。このマスク部材５０の溝にワーク１の下端を挿入して、ワーク１の下端側をマスクすることができる。本実施形態では、搬送治具２０の下枠２２が、マスク部材５０の溝に挿入されてマスクされると同時に、搬送ガイドされる。なお、マスク部材５０は、ワーク１のサイズに合わせて上下位置を調整できる。   A mask member 50 can be provided immediately below the workpiece 1. The mask member 50 has a groove along the conveying direction A in FIG. The lower end side of the workpiece 1 can be masked by inserting the lower end of the workpiece 1 into the groove of the mask member 50. In the present embodiment, the lower frame 22 of the conveying jig 20 is inserted into the groove of the mask member 50 and masked, and at the same time is guided to convey. Note that the vertical position of the mask member 50 can be adjusted according to the size of the workpiece 1.

２．ノズルと陽極電極の配置関係
本実施形態では、図２に示すように複数のワーク１が連続搬送される搬送方向Ａにて、複数のノズル３０と複数の陽極電極４０とが交互に配置されている。これにより、ワーク１の被処理面に対して、ノズル３０と陽極電極４の配置密度を確保することができる。このために、平面視にて適度な間隔で配置される隣り合う２つのノズル３０の間に、少なくとも一つの陽極電極４０が配置される。なお、ノズル３０の配列ピッチは、例えば６０ｍｍ〜９０ｍｍとすることができる。このように、本実施形態では、従来は複数のノズル３０の背面側（ワーク１とは反対側）にあった所定長さの陽極電極を分割して、２つのノズル間に少なくとも一つの陽極電極４０（図２では一つの陽極電極４０）を配置している。 2. In this embodiment, a plurality of nozzles 30 and a plurality of anode electrodes 40 are alternately arranged in the conveyance direction A in which a plurality of workpieces 1 are continuously conveyed as shown in FIG. Yes. Thereby, the arrangement density of the nozzles 30 and the anode electrodes 4 can be ensured with respect to the surface to be processed of the workpiece 1. For this purpose, at least one anode electrode 40 is arranged between two adjacent nozzles 30 arranged at an appropriate interval in plan view. The arrangement pitch of the nozzles 30 can be set to 60 mm to 90 mm, for example. As described above, in the present embodiment, the anode electrode having a predetermined length that is conventionally on the back side (the side opposite to the workpiece 1) of the plurality of nozzles 30 is divided, and at least one anode electrode is provided between the two nozzles. 40 (one anode electrode 40 in FIG. 2) is arranged.

本実施形態では特に、図１に示すように、個々のノズル３０と干渉しない範囲で、複数の陽極電極４０をワーク１の被処理面に近づけることができる。そのため、ワーク１の被処理面と陽極電極４０との距離が縮まり、陰極となるワーク１の被処理面と陽極電極４０との間に流れる電流密度が高まる。電流密度が高いほどワーク１の被処理面に堆積される単位時間当たりのメッキ厚は厚くなる。よって、メッキ槽１０の全長を長くしなくても、所定のメッキ厚に仕上げることができる。それにより、連続メッキ装置の全長を短くすることができる。また、ワーク１の被処理面と陽極電極４０との距離が縮まることから、連続メッキ装置の幅方向でも小型化を図ることが可能となる。   Particularly in the present embodiment, as shown in FIG. 1, the plurality of anode electrodes 40 can be brought close to the surface to be processed of the workpiece 1 as long as they do not interfere with the individual nozzles 30. Therefore, the distance between the surface to be processed of the workpiece 1 and the anode electrode 40 is reduced, and the current density flowing between the surface to be processed of the workpiece 1 serving as a cathode and the anode electrode 40 is increased. The higher the current density is, the thicker the plating thickness per unit time deposited on the surface to be processed of the workpiece 1 is. Therefore, it is possible to finish to a predetermined plating thickness without increasing the overall length of the plating tank 10. Thereby, the full length of a continuous plating apparatus can be shortened. Moreover, since the distance between the surface to be processed of the workpiece 1 and the anode electrode 40 is reduced, it is possible to reduce the size even in the width direction of the continuous plating apparatus.

陽極電極４０を最大限にワーク１に近づけると、図２の搬送方向Ａから見た側面視（図１）で、ノズル３０と陽極電極４０とが重なる位置関係にて配置することできる。このレイアウトは、隣り合う２つのノズル３０の間に少なくとも一つの陽極電極４０が配置することで初めて達成され、複数のノズルの背面側（ワークとは反対側）に設けられる従来の陽極板では不可能である。   When the anode electrode 40 is brought as close to the workpiece 1 as possible, the nozzle 30 and the anode electrode 40 can be disposed so as to overlap each other as viewed from the side (see FIG. 1) viewed from the conveying direction A in FIG. This layout is achieved for the first time by arranging at least one anode electrode 40 between two adjacent nozzles 30 and is not possible with a conventional anode plate provided on the back side (the side opposite to the workpiece) of a plurality of nozzles. Is possible.

３．陽極電極の輪郭形状
本実施形態では、ノズル３０及び陽極電極４０の横断面の輪郭形状については特に制約はないが、ワーク１の被処理面からノズル３０及び陽極電極４０までの距離を縮める結果として、ノズル３０からワーク１に噴射されたメッキ液の逃げ場を確保することが好ましい。 3. Contour shape of anode electrode In this embodiment, there are no particular restrictions on the contour shape of the cross section of the nozzle 30 and the anode electrode 40. It is preferable to secure a escape place for the plating solution sprayed from the nozzle 30 onto the workpiece 1.

そのために、例えば複数の陽極電極４０の各々の輪郭は、図２に示す平面視で複数の陽極電極の各々を二分して搬送方向Ａと直交する電極中心線Ｂからの距離が離れるに従い複数のワーク１の各々の被処理面からの距離が大きくなるように湾曲させることができる。例えば、複数の陽極電極４０の各々は、図２に示すように横断面の輪郭を円とすることができるが、楕円等であっても良い。つまり、陽極電極４０が平面視で矩形であるとすると、平板のワーク１の被処理面から陽極電極４０までの距離は一定となり、この一定距離の狭い範囲に噴出されたメッキ液が集中し、ノズルと電極との間の隙間が狭くなってメッキ液の逃げ場がなくなる。本実施形態によれば、電極中心線Ｂから離れるほど、ワーク１の被処理面と陽極電極４０との間の距離が拡大し、それによりノズルと電極との間の隙間が広くなってメッキ液の逃げ場が確保される。なお、ノズル３０との干渉を避けて陽極電極４０をワーク１の被処理面に近づける要請から言えば、陽極電極４０の輪郭は、横断面積が同一である限りにおいて楕円よりも円の方が好ましい。   Therefore, for example, each of the plurality of anode electrodes 40 has a plurality of contours as the distance from the electrode center line B perpendicular to the transport direction A increases as the plurality of anode electrodes are bisected in the plan view shown in FIG. The workpiece 1 can be curved so that the distance from each processing surface of the workpiece 1 increases. For example, each of the plurality of anode electrodes 40 may have a circular cross section as shown in FIG. 2, but may be an ellipse or the like. That is, when the anode electrode 40 is rectangular in plan view, the distance from the surface to be processed of the flat workpiece 1 to the anode electrode 40 is constant, and the plating solution sprayed in a narrow range of this constant distance is concentrated, The gap between the nozzle and the electrode is narrowed, and the escape place for the plating solution is eliminated. According to the present embodiment, as the distance from the electrode center line B increases, the distance between the surface to be processed of the workpiece 1 and the anode electrode 40 increases, thereby widening the gap between the nozzle and the electrode and the plating solution. The escape place is secured. In addition, if it says from the request | requirement which avoids interference with the nozzle 30 and the anode electrode 40 approaches the to-be-processed surface of the workpiece | work 1, the outline of the anode electrode 40 is more preferable than an ellipse as long as the cross-sectional area is the same. .

なお、陽極電極４０の横断面の輪郭を湾曲させると、ワークと陽極電極との間の距離は、陽極電極の輪郭位置によって区々となる。ただし、ワーク１は連続搬送されるものであるので、ワーク１の連続搬送方向Ａではメッキ厚は均一化される。よって、ワーク１の縦方向にてメッキ厚の分布が生じないように、陽極電極４０の垂直度などが管理されていれば、ワーク１のメッキ厚の面内均一性は確保される。   When the contour of the cross section of the anode electrode 40 is curved, the distance between the workpiece and the anode electrode varies depending on the contour position of the anode electrode. However, since the workpiece 1 is continuously conveyed, the plating thickness is made uniform in the continuous conveyance direction A of the workpiece 1. Therefore, in-plane uniformity of the plating thickness of the workpiece 1 is ensured if the verticality of the anode electrode 40 is managed so that the distribution of the plating thickness does not occur in the longitudinal direction of the workpiece 1.

４．陽極電極の構造
ここで、陽極電極４０の種類としては、可溶性電極と不溶性電極とが知られている。可溶性電極では、電極材料が溶解してメッキ成分となる。可溶性電極は消耗品であり、交換を要する。なお、可溶性電極はメッキ成分のみから形成されず不純物（例えばリンＰ）を含む欠点がある。一方、不溶性電極とは、電極材料は溶解せず、メッキ槽１０内のメッキ液中の金属イオン（例えば酸化第二銅）がメッキ成分となり、不溶性電極は電極のみとして用いられる。本実施形態の陽極電極４０では、いずれのタイプも用いることができるが、不溶性電極を用いることが好ましい。特に、本実施形態のように例えば１０〜１０数Ａ／ｄｍ２レベルの高電流密度を達成すると、可溶性電極は消耗が大きいので、不溶性電極を好適に用いることができる。 4). Here, as the types of the anode electrode 40, a soluble electrode and an insoluble electrode are known. In the soluble electrode, the electrode material is dissolved to become a plating component. The fusible electrode is a consumable and requires replacement. In addition, the soluble electrode has a defect that it is not formed only from the plating component but contains impurities (for example, phosphorus P). On the other hand, the insoluble electrode does not dissolve the electrode material, and metal ions (for example, cupric oxide) in the plating solution in the plating tank 10 become a plating component, and the insoluble electrode is used only as an electrode. Although any type can be used for the anode electrode 40 of this embodiment, it is preferable to use an insoluble electrode. In particular, when a high current density of, for example, 10 to 10 several A / dm 2 level is achieved as in the present embodiment, the insoluble electrode can be used favorably because the soluble electrode is highly consumed.

不溶性電極にて形成される陽極電極４０は、図３（Ａ）に示すように、中心側に位置する例えば金属又は合金から成る電極本体４０Ａと、その電極本体４０Ａの周囲を覆う隔膜４０Ｂを含むことができる。電極本体４０Ａは軽量化のために筒状に形成されるが、中実棒状であっても良い。隔膜４０Ｂは、電界（電子）を遮ることなくメッキ液を浸透させない材料にて形成され、中心にある電極本体４０Ａをメッキ液から隔離するものである。それにより、陽極電極４０を不溶性電極として機能させることができる。この場合、例えば隔膜４０Ｂの横断面の輪郭が円とされる。また、隔膜４０Ｂは電極本体４０Ａから離して配置されることが好ましい。電極本体４０Ａから発生するガスの逃げ場を確保するためである。隔膜４０Ｂは、メッキ槽１０に浸漬される下端は気密及び液密に密閉されるが、上端は開放して大気に開放させることができる。   As shown in FIG. 3A, the anode electrode 40 formed of an insoluble electrode includes an electrode body 40A made of, for example, a metal or an alloy located on the center side, and a diaphragm 40B covering the periphery of the electrode body 40A. be able to. The electrode body 40A is formed in a cylindrical shape for weight reduction, but may be a solid bar shape. The diaphragm 40B is formed of a material that does not penetrate the plating solution without blocking the electric field (electrons), and isolates the electrode body 40A at the center from the plating solution. Thereby, the anode electrode 40 can be functioned as an insoluble electrode. In this case, for example, the outline of the cross section of the diaphragm 40B is a circle. Moreover, it is preferable that the diaphragm 40B is arranged apart from the electrode body 40A. This is to secure a escape place for the gas generated from the electrode body 40A. The lower end of the diaphragm 40B immersed in the plating tank 10 is hermetically and liquid tightly sealed, but the upper end can be opened and opened to the atmosphere.

隔膜４０Ｂが柔軟材であり保形性がない場合であって、隔膜４０Ｂを電極本体４０Ａから離して配置する場合には、図３（Ｂ）に示すように、電極本体４０Ａと隔膜４０Ｂとの間に保形性部材４０Ｃを追加配置することができる。隔膜４０Ｂは、保形性部材４０Ｃに取り付けられることで、保形性が維持される。さらに、図３（Ｃ）に示すように、電極本体４０Ａから隔壁４０Ｂを離すために、電極本体４０Ａと保形性部材４０Ｃとの間に、複数のスペーサ部材４０Ｄを配置しても良い。   In the case where the diaphragm 40B is a flexible material and has no shape retention, and when the diaphragm 40B is arranged apart from the electrode body 40A, as shown in FIG. 3B, the electrode body 40A and the diaphragm 40B A shape-retaining member 40C can be additionally disposed between them. The diaphragm 40B is attached to the shape retaining member 40C, so that the shape retaining property is maintained. Further, as shown in FIG. 3C, a plurality of spacer members 40D may be disposed between the electrode body 40A and the shape retaining member 40C in order to separate the partition wall 40B from the electrode body 40A.

５．ノズルの輪郭形状
一方ノズル３０の横断面の輪郭形状に関して言えば、ノズル３０の横断面積は一般に陽極電極４０よりも小さいので、陽極電極４０よりも制約は少ない。よって、ノズル３０の横断面の輪郭は矩形であっても良い。ただし、ノズル３０との干渉を避けて陽極電極４０をワーク１の被処理面に近づける要請から言えば、ノズル３０は面取りされた輪郭形状が好ましい。そのために、本実施形態では、複数のノズル３０の各々は、横断面の輪郭が、複数の陽極電極４０の各々の横断面の直径Ｄ２よりも小さい直径Ｄ１の円としている。 5. Contour Shape of Nozzle On the other hand, with regard to the contour shape of the cross section of the nozzle 30, the cross-sectional area of the nozzle 30 is generally smaller than that of the anode electrode 40, so there are fewer restrictions than the anode electrode 40. Therefore, the outline of the cross section of the nozzle 30 may be rectangular. However, if it says from the request | requirement which avoids interference with the nozzle 30 and the anode electrode 40 approaches the to-be-processed surface of the workpiece | work 1, the nozzle 30 has a preferable chamfered outline shape. Therefore, in this embodiment, each of the plurality of nozzles 30 has a cross-sectional contour that is a circle having a diameter D1 that is smaller than the diameter D2 of each of the cross-sections of the plurality of anode electrodes 40.

６．ノズルと陽極電極の平面視における詳細な配置関係
本実施形態では、複数のノズルの各々の横断面の中心Ｐ１は、図２及び図４に示すように、複数の陽極電極４０の各々の横断面の中心Ｐ２よりも、複数のワーク１の各々の被処理面からの距離が短い位置に配置することができる。 6). In this embodiment, the center P1 of the cross section of each of the plurality of nozzles is the cross section of each of the plurality of anode electrodes 40 as shown in FIGS. It can arrange | position in the position where the distance from each to-be-processed surface of the some workpiece | work 1 is shorter than center P2.

つまり、複数のノズル３０の各々の横断面の中心Ｐ１と複数の陽極電極４０の各々の横断面の中心Ｐ２とは、図５（Ａ）に示す搬送方向Ａに沿った同一直線Ｌ１上にあるものを除外するものではないが、ノズル中心Ｐ１と電極中心Ｐ２とが図２及び図４に示すように千鳥状にずれて配置することができる。こうすると、ノズル中心Ｐ１と電極中心Ｐ２とが同一直線Ｌ１上にある図５（Ａ）よりも、隣り合う２つのノズル３０間に配置される陽極電極４０の直径Ｄ２を最大限に大きくしながら、ノズル３０との干渉を防止しやすくなる。   That is, the center P1 of each cross section of the plurality of nozzles 30 and the center P2 of each cross section of the plurality of anode electrodes 40 are on the same straight line L1 along the transport direction A shown in FIG. Although not excluded, the nozzle center P1 and the electrode center P2 can be arranged in a staggered manner as shown in FIGS. In this way, the diameter D2 of the anode electrode 40 disposed between the two adjacent nozzles 30 is maximized as compared with FIG. 5A in which the nozzle center P1 and the electrode center P2 are on the same straight line L1. It becomes easy to prevent interference with the nozzle 30.

また、２つのノズル３０，３０の間に少なくとも一つの陽極電極４０を配置する例として、図５（Ｂ）に示すように、２つノズル３０，３０の間に複数の陽極電極４０，４０を配置しても良い。図５（Ｂ）では、図４と同様に、複数のノズルの各々の横断面の中心Ｐ１を、複数の陽極電極４０の各々の横断面の中心Ｐ２よりも、ワーク１の被処理面からの距離が短い位置に配置している。図４と図５（Ｂ）とでノズル３０の配列ピッチが同一であれば、図５（Ｂ）の陽極電極４０の直径Ｄ２を図４よりも小さくしなければならないことは明らかである。図５（Ｂ）の陽極電極４０の直径Ｄ２を図４と同じにしようとすると、ノズル３０の配列ピッチは図４により図５（Ｂ）の方が大きくなることは明らかである。これらのことから、図４のレイアウトの方が図５（Ｂ）よりも優れている。   As an example of disposing at least one anode electrode 40 between two nozzles 30, 30, a plurality of anode electrodes 40, 40 are provided between two nozzles 30, 30 as shown in FIG. It may be arranged. In FIG. 5B, as in FIG. 4, the center P <b> 1 of the cross section of each of the plurality of nozzles is closer to the surface to be processed of the workpiece 1 than the center P <b> 2 of each cross section of the plurality of anode electrodes 40. It is located at a short distance. If the arrangement pitch of the nozzles 30 is the same in FIG. 4 and FIG. 5B, it is obvious that the diameter D2 of the anode electrode 40 in FIG. 5B must be smaller than that in FIG. If the diameter D2 of the anode electrode 40 in FIG. 5B is made the same as that in FIG. 4, it is apparent that the arrangement pitch of the nozzles 30 in FIG. Accordingly, the layout of FIG. 4 is superior to FIG. 5B.

本実施形態では、図４に示すように、複数のノズル３０の各々から複数のワーク１の各々の被処理面に至る第１最短距離δ１は、複数の陽極電極４０の各々からのワーク１の被処理面に至る第２最短距離δ２よりも小さく（δ１＜δ２）、複数のノズル３０の外径Ｄ１は第２最短距離δ２よりも小さくすることができる（Ｄ１＜δ２）。ここで、第１最短距離δ１は、例えば１０ｍｍ≦δ１≦２０ｍｍであり、第２最短距離δ２は、例えば１５ｍｍ≦δ２≦３５ｍｍとすることができる。 In the present embodiment, as shown in FIG. 4, the first shortest distance δ1 from each of the plurality of nozzles 30 to each surface to be processed of each of the plurality of workpieces 1 is the number of the workpieces 1 from each of the plurality of anode electrodes 40. The outer diameter D1 of the plurality of nozzles 30 can be smaller than the second shortest distance δ2 (D1 <δ2), which is smaller than the second shortest distance δ2 reaching the surface to be processed. Here, the first shortest distance δ1 may be, for example, 10 mm ≦ δ1 ≦ 20 mm, and the second shortest distance δ2 may be, for example, 15 mm ≦ δ2 ≦ 35 mm.

このように、ノズル３０を陽極電極４０よりもワーク１に近づけて配置することができ、それによりメッキ液の供給圧を高める必要はない。しかも、平面視にてノズル３０からある噴射角を持ってワーク１に向けて噴射されるメッキ液が、陽極電極４０によって遮られることが少なくなる。   In this way, the nozzle 30 can be arranged closer to the workpiece 1 than the anode electrode 40, so that it is not necessary to increase the supply pressure of the plating solution. Moreover, the plating solution sprayed toward the work 1 with a certain spray angle from the nozzle 30 in plan view is less likely to be blocked by the anode electrode 40.

また、ワーク１に近づけて配置されたノズル３０の直径Ｄ１は、陽極電極４０−ワーク１間の第２最短距離δ２よりも小さくすると、ノズル３０の曲率が大きく確保できるので、メッキ液の逃げ場も確保しやすくなる。   Further, if the diameter D1 of the nozzle 30 disposed close to the work 1 is smaller than the second shortest distance δ2 between the anode electrode 40 and the work 1, a large curvature of the nozzle 30 can be ensured, so that the plating solution escapes also. It becomes easy to secure.

ここで、ノズル３０とワーク１との最短距離δ１を例えば１０ｍｍ≦δ１≦２０ｍｍに短くすると、ノズル３０から噴出されてワーク１に到達するジェットノズル流が速くなり、ジェットノズル流の領域は加圧であるから、その周囲に負圧領域が生ずることがある。ノズル３０の縦方向には間隔をもって複数のノズル孔が設けられるので、２つのノズル孔間が負圧領域となる。   Here, when the shortest distance δ1 between the nozzle 30 and the workpiece 1 is shortened to, for example, 10 mm ≦ δ1 ≦ 20 mm, the jet nozzle flow ejected from the nozzle 30 and reaching the workpiece 1 becomes faster, and the jet nozzle flow region is pressurized. Therefore, a negative pressure region may be generated around it. Since a plurality of nozzle holes are provided at intervals in the longitudinal direction of the nozzle 30, a negative pressure region is formed between the two nozzle holes.

ワーク１と、ノズル３０及び陽極電極４０との間の領域にてメッキ液の流動が足りないと、負圧領域にメッキ液が行き渡らず、特に柔軟なワーク１はノズル側に吸着される現象が観察された。そのため、ノズル３０から噴出されたメッキ液の逃げ場を確保することは、ワーク１が負圧領域側に吸着される現象を防止する観点からも重要である。   If the plating solution does not flow sufficiently in the region between the workpiece 1 and the nozzle 30 and the anode electrode 40, the plating solution does not reach the negative pressure region, and the particularly flexible workpiece 1 is attracted to the nozzle side. Observed. Therefore, it is important from the viewpoint of preventing a phenomenon in which the workpiece 1 is attracted to the negative pressure region side to secure a escape place for the plating solution ejected from the nozzle 30.

本実施形態では、図６に示すように、陽極電極４０の横断面の輪郭を円以外の例えば矩形とすることができる。図６でも、δ１＜δ２及びＤ１＜δ２を満たしている。ただし、図６では陽極電極４０の横断面が矩形であるので、感激幅δ２の領域が長く、かつ、陽極電極４０が面取りされてなく角部を有するので、メッキ液の逃げ場は図４のレイアウトよりも狭められる。この点で、図４のレイアウトの方が図６よりも優れている。   In this embodiment, as shown in FIG. 6, the contour of the cross section of the anode electrode 40 can be, for example, a rectangle other than a circle. Also in FIG. 6, δ1 <δ2 and D1 <δ2 are satisfied. However, since the cross section of the anode electrode 40 is rectangular in FIG. 6, the region of the sensitive width δ2 is long, and the anode electrode 40 is not chamfered and has corners. It is narrower than. In this respect, the layout of FIG. 4 is superior to FIG.

本実施形態では、複数の陽極電極４０の各々と複数のノズル３０の各々との第３最短距離δ３は、複数の陽極電極４０の各々からのワーク１の被処理面に至る第２最短距離δ２よりも小さくすることができる（δ２＞δ３）。それにより、陽極電極４０をワーク１の被処理面により近づけることができる。なお、ノズル３０よりワーク１に向けて噴出されたメッキ液は、ノズル３０及び陽極電極４０とワーク１との間の隙間から、隣り合うノズル３０及び陽極電極４０間の隙間を介して、メッキ槽１０内の広い空間に逃がすことができる。それにより、ワーク１を常にフレッシュなメッキ液と接触させ、ワーク１の負圧側への吸着を防止することができる。 In the present embodiment, the third shortest distance δ3 between each of the plurality of anode electrodes 40 and each of the plurality of nozzles 30 is the second shortest distance δ2 from each of the plurality of anode electrodes 40 to the surface to be processed of the workpiece 1. ( Δ2> δ3 ). Thereby, the anode electrode 40 can be brought closer to the surface to be processed of the workpiece 1. The plating solution ejected from the nozzle 30 toward the workpiece 1 is plated from the gap between the nozzle 30 and the anode electrode 40 and the workpiece 1 through the gap between the adjacent nozzle 30 and the anode electrode 40. It is possible to escape to a wide space within 10. Thereby, the workpiece | work 1 can always be contacted with a fresh plating solution, and the adsorption | suction to the negative pressure side of the workpiece | work 1 can be prevented.

また、複数の陽極電極４０の各々と複数のノズル３０の各々との第３最短距離δ３は、複数のノズル３０の各々からのワーク１の被処理面に至る第１最短距離δ１以上にすることができる（δ３≧δ１）。こうすると、ノズル３０と陽極電極４０との隙間の流路抵抗は、ワーク１とノズル３０との間の流路抵抗以下となり、ノズル３０及び陽極電極４０間の隙間を介してメッキ液をメッキ槽１０内の広い空間に逃がし易くなる。 The third shortest distance δ3 between each of the plurality of anode electrodes 40 and each of the plurality of nozzles 30 is set to be equal to or more than the first shortest distance δ1 from each of the plurality of nozzles 30 to the surface to be processed of the workpiece 1. ( Δ3 ≧ δ1 ). In this way, the flow path resistance in the gap between the nozzle 30 and the anode electrode 40 becomes equal to or lower than the flow path resistance between the workpiece 1 and the nozzle 30, and the plating solution is plated through the gap between the nozzle 30 and the anode electrode 40. It becomes easy to escape to the wide space in 10.

以上、いくつかの実施形態について説明したが、本発明の新規事項および効果から実体的に逸脱しない多くの変形が可能であることは当業者には容易に理解できるものである。従って、このような変形例はすべて本発明の範囲に含まれるものとする。例えば、明細書又は図面において、少なくとも一度、より広義または同義な異なる用語と共に記載された用語は、明細書又は図面のいかなる箇所においても、その異なる用語に置き換えることができる。   Although several embodiments have been described above, it is easily understood by those skilled in the art that many modifications can be made without substantially departing from the novel matters and effects of the present invention. Accordingly, all such modifications are intended to be included in the scope of the present invention. For example, a term described at least once together with a different term having a broader meaning or the same meaning in the specification or the drawings can be replaced with the different term in any part of the specification or the drawings.

１ ワーク、２ メッキ液、１０ メッキ槽、１０Ａ 周壁、１０Ｂ 底壁、１１ メッキ供給部、１１Ａ 多孔板、２０ 搬送治具、２０Ａ 上枠、２０Ｂ 下枠、３０ ノズル、４０ 陽極電極、４０Ａ 電極本体、４０Ｂ 隔膜、４０Ｃ 保形性部材、４０Ｄ スペーサ部材、５０ マスク部材、Ａ 搬送方向、Ｂ 電極中心線、Ｐ１ ノズル中心、Ｐ２ 電極中心、δ１ 第１最短距離、δ２ 第２最短距離、δ３ 第３最短距離   DESCRIPTION OF SYMBOLS 1 Workpiece, 2 Plating solution, 10 Plating tank, 10A Perimeter wall, 10B Bottom wall, 11 Plating supply part, 11A Perforated plate, 20 Transport jig, 20A Upper frame, 20B Lower frame, 30 Nozzle, 40 Anode electrode, 40A Electrode body , 40B diaphragm, 40C shape retaining member, 40D spacer member, 50 mask member, A transport direction, B electrode center line, P1 nozzle center, P2 electrode center, δ1 first shortest distance, δ2 second shortest distance, δ3 third Shortest distance

Claims (4)

メッキ液を収容して、搬送治具に垂下して保持されて連続搬送されると共に陰極に設定される複数のワークにメッキするメッキ槽と、
前記メッキ槽内にて前記複数のワークと対向する位置に配置され、前記メッキ液を前記複数のワークに向けて噴出する複数のノズルと、
前記メッキ槽内にて連続搬送される前記複数のワークと対向する位置に配置される複数の不溶性陽極電極と、
を有し、
前記複数のノズル及び前記複数の不溶性陽極電極の各々は、長手軸が垂直方向に沿って配置され、前記複数のノズルの各々は前記垂直方向にて間隔をあけて配置された複数のノズル孔を含み、
前記複数のノズル及び前記複数の不溶性陽極電極の各々の横断面の輪郭は円であり、前記複数のノズルの各々の外径Ｄ１は、前記複数の不溶性陽極電極の各々の外径Ｄ２よりも小さく、
前記複数の不溶性陽極の各々は、陽極本体と、前記陽極本体とは離れて配置されて前記陽極本体を覆う隔膜と、を有し、前記隔膜は、前記陽極本体と前記ワークとの間に電界が形成されることを許容しながら、前記陽極本体を前記メッキ槽内の前記メッキ液から隔離し、
前記複数のワークが連続搬送される搬送方向に沿って、前記複数のノズルの１つと前記複数の不溶性陽極電極の一つとが交互に繰り返し配置され、
前記複数のノズルの各々の横断面の中心は、前記複数の不溶性陽極電極の各々の横断面の中心よりも、前記複数のワークの各々の被処理面からの距離が短い位置に配置され、
前記複数のノズルの各々から前記被処理面に至る第１最短距離δ１と、前記複数の不溶性陽極電極の各々から前記被処理面に至る第２最短距離δ２と、前記複数の不溶性陽極電極の各々と前記複数のノズルの各々との第３最短距離δ３とは、δ１≦δ３＜δ２、かつ、δ２＞Ｄ１の関係を満たし、
前記メッキ槽は、平面視において前記複数のノズル及び前記複数の不溶性陽極電極よりも前記複数のワークの前記被処理面に近い処理領域と、前記複数のノズル及び前記複数の不溶性陽極電極により前記処理領域と区画される非処理領域とを含み、前記処理領域には、前記複数のノズルの各々の前記複数のノズル孔より前記メッキ液が噴出されて前記複数のワークの各々に到達するジェットノズル流により形成される複数の加圧領域が、前記垂直方向にて間隔をあけて形成され、前記処理領域の前記メッキ液を、前記第３最短距離δ３の隙間を介して前記非処理領域側に逃がして流動させることで、前記垂直方向にて隣り合う２つの加圧領域の間に負圧領域が形成されることを抑制して、前記複数のワークが前記複数のノズル側に吸引されることを防止することを特徴とする連続メッキ装置。 A plating tank that contains a plating solution, is suspended and held on a conveying jig and is continuously conveyed, and plating a plurality of workpieces set as cathodes;
A plurality of nozzles disposed in positions facing the plurality of workpieces in the plating tank, and spraying the plating solution toward the plurality of workpieces;
A plurality of insoluble anode electrodes disposed at positions facing the plurality of workpieces continuously conveyed in the plating tank;
Have
Each of the plurality of nozzles and the plurality of insoluble anode electrodes has a longitudinal axis arranged along a vertical direction, and each of the plurality of nozzles has a plurality of nozzle holes arranged at intervals in the vertical direction. Including
The outlines of the cross sections of the plurality of nozzles and the plurality of insoluble anode electrodes are circles, and the outer diameter D1 of each of the plurality of nozzles is smaller than the outer diameter D2 of each of the plurality of insoluble anode electrodes. ,
Each of the plurality of insoluble anodes includes an anode body and a diaphragm that is disposed away from the anode body and covers the anode body, and the diaphragm has an electric field between the anode body and the workpiece. While isolating the anode body from the plating solution in the plating bath,
Along a conveying direction in which the plurality of workpieces are successively conveyed, and one of one of the plurality of the insoluble anode of the plurality of nozzles are repeatedly arranged alternately,
The center of the cross section of each of the plurality of nozzles is disposed at a position where the distance from the surface to be processed of each of the plurality of workpieces is shorter than the center of the cross section of each of the plurality of insoluble anode electrodes.
A first shortest distance δ1 from each of the plurality of nozzles to the processing surface, a second shortest distance δ2 from each of the plurality of insoluble anode electrodes to the processing surface, and each of the plurality of insoluble anode electrodes And the third shortest distance δ3 between each of the plurality of nozzles satisfies a relationship of δ1 ≦ δ3 <δ2 and δ2> D1,
The plating tank includes a processing region closer to the processing surface of the plurality of workpieces than the plurality of nozzles and the plurality of insoluble anode electrodes in a plan view, and the processing by the plurality of nozzles and the plurality of insoluble anode electrodes. A jet nozzle flow that reaches each of the plurality of workpieces by ejecting the plating solution from the plurality of nozzle holes of each of the plurality of nozzles. Are formed at intervals in the vertical direction, and the plating solution in the processing region is released to the non-processing region side through the gap of the third shortest distance δ3. The plurality of workpieces are sucked toward the plurality of nozzles by suppressing the formation of a negative pressure region between two pressure regions adjacent in the vertical direction. Continuous plating apparatus characterized by preventing and. 請求項１において、
前記搬送方向から見た側面視で、前記複数のノズルと前記複数の不溶性陽極電極とが重なる位置関係にて配置されることを特徴とする連続メッキ装置。 In claim 1,
The continuous plating apparatus, wherein the plurality of nozzles and the plurality of insoluble anode electrodes are disposed so as to overlap each other in a side view as viewed from the transport direction. 請求項１または２において、
１０ｍｍ≦δ１≦２０ｍｍを満たすことを特徴とする連続メッキ装置。 In claim 1 or 2,
A continuous plating apparatus satisfying 10 mm ≦ δ1 ≦ 20 mm . 請求項３において、
１５ｍｍ≦δ２≦３５ｍｍを満たすことを特徴とする連続メッキ装置。 In claim 3,
A continuous plating apparatus satisfying 15 mm ≦ δ2 ≦ 35 mm .
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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102245402B1 (en) 2020-01-21 2021-04-28 주식회사 우리선테크 Plating Apparatus for Printed Circuit Board

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI530593B (en) * 2014-08-11 2016-04-21 亞智科技股份有限公司 Multi-anode control device and electroplating equipment having the same
JP2016089186A (en) * 2014-10-30 2016-05-23 京セラサーキットソリューションズ株式会社 Electrolytic plating apparatus
US20180087170A1 (en) * 2015-05-08 2018-03-29 Hitachi, Ltd. Wet Surface Treatment Apparatus
TWI698554B (en) * 2015-10-20 2020-07-11 香港商亞洲電鍍器材有限公司 An electroplating machine and an electroplating method
KR101593378B1 (en) * 2015-10-23 2016-02-12 선호경 Spraying apparatus for plating solution on printed circuit board
KR20190057319A (en) * 2016-09-29 2019-05-28 아루멕쿠스 피이 가부시키가이샤 Work holding jig and surface treatment device
CN113584563A (en) * 2021-08-20 2021-11-02 葛小家 Electroplating device for printed circuit board

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4378281A (en) 1981-06-25 1983-03-29 Napco, Inc. High speed plating of flat planar workpieces
JPS58177487A (en) * 1982-04-08 1983-10-18 Sumitomo Metal Ind Ltd Method and device for diaphragm electroplating
JPH0726235B2 (en) * 1986-07-10 1995-03-22 三菱重工業株式会社 Continuous electrical plating device
JPH0274000A (en) * 1988-09-09 1990-03-13 Permelec Electrode Ltd Method and apparatus for plating printed board with copper
JPH086198B2 (en) * 1990-08-15 1996-01-24 株式会社アルメックス Horizontal transfer type plating equipment
US5211826A (en) * 1991-09-26 1993-05-18 Siemens Aktiengesellschaft Electroplating means for perforated printed circuit boards to be treated in a horizontal pass
JPH05140795A (en) * 1991-11-21 1993-06-08 Toagosei Chem Ind Co Ltd Production of electrolytic copper foil supported by metallic sheet
JPH06212492A (en) * 1993-01-12 1994-08-02 Nkk Corp Continuous electroplating device
JP3426394B2 (en) * 1995-04-12 2003-07-14 新日本製鐵株式会社 Strip electroplating equipment
JP3299725B2 (en) 1998-12-11 2002-07-08 株式会社ケミトロン Plating method and its equipment
CN100523309C (en) * 2003-12-25 2009-08-05 亚洲电镀器材有限公司 Liquid conveying system for electroplating equipment, electroplating equipment with the system and its operation method
DE102005005095A1 (en) * 2005-02-04 2006-08-10 Höllmüller Maschinenbau GmbH Process and device for the electrochemical treatment of components in continuous flow systems
JP5457010B2 (en) * 2007-11-01 2014-04-02 アルメックスＰｅ株式会社 Continuous plating equipment
JP5437665B2 (en) * 2009-03-06 2014-03-12 住友電気工業株式会社 High-speed continuous plating equipment
JP5435355B2 (en) * 2009-09-04 2014-03-05 日立金属株式会社 Plating equipment
JP5660281B2 (en) 2010-03-31 2015-01-28 Toto株式会社 Water discharge device

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102245402B1 (en) 2020-01-21 2021-04-28 주식회사 우리선테크 Plating Apparatus for Printed Circuit Board

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