JP6117787B2 - Icパッケージ内へのdram及びsocのパッケージング - Google Patents
Icパッケージ内へのdram及びsocのパッケージング Download PDFInfo
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- JP6117787B2 JP6117787B2 JP2014527256A JP2014527256A JP6117787B2 JP 6117787 B2 JP6117787 B2 JP 6117787B2 JP 2014527256 A JP2014527256 A JP 2014527256A JP 2014527256 A JP2014527256 A JP 2014527256A JP 6117787 B2 JP6117787 B2 JP 6117787B2
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- 238000004806 packaging method and process Methods 0.000 title description 12
- 239000000758 substrate Substances 0.000 claims description 97
- 230000015654 memory Effects 0.000 claims description 44
- 230000009977 dual effect Effects 0.000 description 8
- 229910000679 solder Inorganic materials 0.000 description 4
- 238000010586 diagram Methods 0.000 description 3
- 229910052710 silicon Inorganic materials 0.000 description 3
- 239000010703 silicon Substances 0.000 description 3
- 101100498818 Arabidopsis thaliana DDR4 gene Proteins 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 230000010354 integration Effects 0.000 description 1
- 230000003071 parasitic effect Effects 0.000 description 1
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Description
Claims (16)
- 集積回路パッケージであって、
第1のセットの接続部を有する第1のメモリダイと、
前記第1のメモリダイに隣接して配列され、第2のセットの接続部を有する1第2のメモリダイと、
第1の基板であって、(i)前記第1の基板の第1の部分と第2の部分との間の第1の開口及び(ii)前記第1の基板の前記第2の部分と第3の部分との間の第2の開口を有し、前記第1の開口を介して前記第1のメモリダイの前記第1のセットの接続部に接続する前記第1の部分上の第3のセットの接続部及び前記第2の開口を介して前記第2のメモリダイの前記第2のセットの接続部に接続する前記第3の部分上の第4のセットの接続部を有し、前記第2の部分は、(i)前記第1のメモリダイの前記第1のセットの接続部及び(ii)前記第2のメモリダイの前記第2のセットの接続部に対する接続部を含まない、第1の基板と、
第1の集積回路を有する第2の基板と
を備え、
前記第1の集積回路は、前記第2の基板上に配置され、
前記第1の基板は、前記第1の集積回路が前記第1の基板と前記第2の基板との間に配設された状態で前記第2の基板に接続される、集積回路パッケージ。 - 前記第3のセットの接続部及び前記第4のセットの接続部のそれぞれの接続部は、0.4ミリメートル以下のピッチで3列に配列される、請求項1に記載の集積回路パッケージ。
- 前記第1の集積回路はシステムオンチップである、請求項1または2に記載の集積回路パッケージ。
- 前記第1のメモリダイ及び前記第2のメモリダイは、前記第1の基板の上部に配設される、請求項1から3の何れか1項に記載の集積回路パッケージ。
- 前記第1の基板は、前記第2の基板の上部に配設される、請求項1から4の何れか1項に記載の集積回路パッケージ。
- 前記第1のメモリダイ及び前記第2のメモリダイの上部に配設されたヒートシンクを更に備える、請求項1から5の何れか1項に記載の集積回路パッケージ。
- 前記第3のセットの接続部は、ボンディングワイヤによって前記第1のセットの接続部に接続され、前記第2のセットの接続部は、ボンディングワイヤによって前記第4のセットの接続部に接続される、請求項1から6の何れか1項に記載の集積回路パッケージ。
- 前記集積回路パッケージは、プリント回路基板上の接続部又は第2の集積回路の接続部に接続するように構成される、請求項1から7の何れか1項に記載の集積回路パッケージ。
- 前記第1のメモリダイ及び前記第2のメモリダイは、ダイナミックランダムアクセスメモリ(DRAM)である、請求項1から8の何れか1項に記載の集積回路パッケージ。
- DRAMはダブルデータレートDRAMである、請求項9に記載の集積回路パッケージ。
- 請求項1から10の何れか1項に記載の集積回路パッケージを備え、
スマートフォン、タブレット、ラップトップ、パーソナルコンピュータ、テレビジョン、又はセットトップボックスを含む、コンピューティングデバイス。 - 第5のセットの接続部を有する第3のメモリダイと、
前記第3のメモリダイに隣接して配列され、第6のセットの接続部を有する第4のメモリダイと、
第3の開口及び第4の開口を有し、前記第3の開口を介して前記第3のメモリダイの前記第5のセットの接続部に接続する第7のセットの接続部及び前記第4の開口を介して前記第4のメモリダイの前記第6のセットの接続部に接続する第8のセットの接続部を有する第3の基板と
を更に備える、請求項1から10の何れか1項に記載の集積回路パッケージ。 - 前記第3の基板は前記第1の基板の上部に配設され、前記第1のメモリダイ及び前記第2のメモリダイは、前記第1の基板と前記第3の基板との間に配設される、請求項12に記載の集積回路パッケージ。
- 複数のピラーを更に備え、前記複数のピラーは、前記第3の基板を前記第1の基板の上部に固定し、前記第1の基板と前記第3の基板との間に接続部を提供するように使用される、請求項13に記載の集積回路パッケージ。
- 前記第3のメモリダイ及び前記第4のメモリダイは、前記第3の基板の上部に配設される、請求項12から14の何れか1項に記載の集積回路パッケージ。
- 第1の複数の接続部を含む第1の部分と、
接続部を有さない第2の部分と、
第2の複数の接続部を含む第3の部分と、
前記第1の部分と前記第2の部分との間の第1の開口と、
前記第2の部分と前記第3の部分との間の第2の開口と
を有する第1の基板と、
前記第1の基板上に配設され、前記第1の開口を介して前記第1の複数の接続部に接続する第3の複数の接続部を含む第1のダイと、
前記第1の基板上に、前記第1のダイに隣接して配設され、前記第2の開口を介して前記第2の複数の接続部に接続する第4の複数の接続部を含む第2のダイと、
前記第1の基板に接続される第2の基板と、
前記第1の基板と前記第2の基板との間の前記第2の基板上に配設されたシステムオンチップと
を備える集積回路パッケージ。
Applications Claiming Priority (7)
Application Number | Priority Date | Filing Date | Title |
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US201161526586P | 2011-08-23 | 2011-08-23 | |
US61/526,586 | 2011-08-23 | ||
US201161548344P | 2011-10-18 | 2011-10-18 | |
US61/548,344 | 2011-10-18 | ||
US13/590,949 | 2012-08-21 | ||
US13/590,949 US8896126B2 (en) | 2011-08-23 | 2012-08-21 | Packaging DRAM and SOC in an IC package |
PCT/US2012/051841 WO2013028745A1 (en) | 2011-08-23 | 2012-08-22 | Packaging dram and soc in an ic package |
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JP2014529898A JP2014529898A (ja) | 2014-11-13 |
JP6117787B2 true JP6117787B2 (ja) | 2017-04-19 |
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US (2) | US8896126B2 (ja) |
EP (2) | EP2748850B1 (ja) |
JP (1) | JP6117787B2 (ja) |
KR (1) | KR101926102B1 (ja) |
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JP7245131B2 (ja) | 2019-07-16 | 2023-03-23 | 株式会社日本クライメイトシステムズ | 車両用蓄熱システム |
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CN103843136A (zh) | 2014-06-04 |
US8896126B2 (en) | 2014-11-25 |
KR20140060317A (ko) | 2014-05-19 |
US20150076687A1 (en) | 2015-03-19 |
WO2013028745A1 (en) | 2013-02-28 |
US20130049224A1 (en) | 2013-02-28 |
EP2884535A3 (en) | 2015-07-22 |
KR101926102B1 (ko) | 2018-12-06 |
EP2884535A2 (en) | 2015-06-17 |
EP2748850B1 (en) | 2018-08-22 |
US9236350B2 (en) | 2016-01-12 |
CN103843136B (zh) | 2018-11-09 |
JP2014529898A (ja) | 2014-11-13 |
EP2748850A1 (en) | 2014-07-02 |
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