JP5598323B2 - Light emitting device and method for manufacturing light emitting device - Google Patents

Light emitting device and method for manufacturing light emitting device Download PDF

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JP5598323B2
JP5598323B2 JP2010293984A JP2010293984A JP5598323B2 JP 5598323 B2 JP5598323 B2 JP 5598323B2 JP 2010293984 A JP2010293984 A JP 2010293984A JP 2010293984 A JP2010293984 A JP 2010293984A JP 5598323 B2 JP5598323 B2 JP 5598323B2
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phosphor
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JP2012142429A (en
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岡田　　聡
祐太 岡
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Nichia Corp
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
    • H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate

Description

本発明は、ＬＥＤ電球、スポットライト等の照明器具等に利用可能な発光装置およびその製造方法に関する。   The present invention relates to a light-emitting device that can be used for lighting fixtures such as LED bulbs and spotlights, and a method for manufacturing the same.

一般に、発光素子を用いた発光装置は、小型で電力効率がよく、鮮やかな色を発光することで知られている。この発光装置に係る発光素子は半導体素子であるため、球切れ等の心配が少ないだけでなく、初期駆動特性に優れ、振動やオン・オフ点灯の繰り返しに強いという特徴を有する。このような優れた特性を有するため、発光ダイオード（ＬＥＤ：Light Emitting Diode）、レーザーダイオード（ＬＤ：Laser Diode）等の発光素子を用いる発光装置は、各種の光源として利用されている。   In general, a light-emitting device using a light-emitting element is known to be small, power efficient, and emit bright colors. Since the light-emitting element according to this light-emitting device is a semiconductor element, the light-emitting element is characterized by not only less fear of ball breakage but also excellent initial drive characteristics and resistance to repeated vibration and on / off lighting. Because of such excellent characteristics, light emitting devices using light emitting elements such as light emitting diodes (LEDs) and laser diodes (LDs) are used as various light sources.

発光装置は、主に、発光素子と、その発光素子を配置し発光素子と電気的に接続する導電配線を有する基材と、その基材上の発光素子を被覆する封止部材と、から構成されている。また、表面実装型のＣＯＢ（Chip on Board）のように、発光素子の周囲に樹脂枠を形成するタイプのものもある。さらには、封止部材に蛍光体を含有させることにより、発光素子からの光と、蛍光体により波長変換された光との混色光が発光する発光装置もある。   The light-emitting device mainly includes a light-emitting element, a base material having a conductive wiring in which the light-emitting element is arranged and electrically connected to the light-emitting element, and a sealing member that covers the light-emitting element on the base material. Has been. Also, there is a type in which a resin frame is formed around a light emitting element, such as a surface mount type COB (Chip on Board). Furthermore, there is a light-emitting device that emits mixed-color light of light from a light-emitting element and light whose wavelength is converted by the phosphor by including a phosphor in the sealing member.

このような蛍光体を用いた発光装置においては、長波側の蛍光体（例えば、赤色を発光するＣＡＳＮ系蛍光体）の吸収スペクトルは、短波側の蛍光体（例えば、黄色を発光するＹＡＧ系蛍光体）の発光スペクトルと一部重複する。このため、短波側の蛍光体による波長変換光の一部が長波側の蛍光体に吸収され、発光効率が低下し発光装置の出力が低下する。また、演色性の向上のためには、吸収された波長を補う第３の蛍光体（緑色を発光するクロロシリケート）が必要となる。しかしながら、クロロシリケートを含有させると、赤色を発光する蛍光体（以下、赤色蛍光体、他の色についても同じ）の励起に、青色を発光する発光素子（以下、青色発光素子、他の色についても同じ）の発光だけなく緑色蛍光体からの緑色光も使用してしまうため、発光効率が低下するという問題があった。   In a light-emitting device using such a phosphor, the absorption spectrum of a long-wave phosphor (for example, a CASN phosphor that emits red light) has a short-wave phosphor (for example, a YAG-based fluorescence that emits yellow light). Part of the emission spectrum. For this reason, a part of the wavelength converted light by the phosphor on the short wave side is absorbed by the phosphor on the long wave side, the luminous efficiency is lowered, and the output of the light emitting device is lowered. Further, in order to improve the color rendering properties, a third phosphor (chlorosilicate that emits green light) that supplements the absorbed wavelength is required. However, when chlorosilicate is contained, a light emitting element emitting blue light (hereinafter referred to as a blue light emitting element, other colors) is excited by excitation of a phosphor emitting red light (hereinafter referred to as red phosphor, the same applies to other colors). In addition, since the green light from the green phosphor is used as well as the light emission of the same), there is a problem that the light emission efficiency is lowered.

そこで、２種類の蛍光体領域（すなわち、蛍光体が含有された領域）を分離した発光装置が提案されている（例えば、特許文献１参照）。この発光装置では、緑色蛍光体を含有し、第１の青色発光素子を封止する緑色封止樹脂と、赤色蛍光体を含有し、第２の青色発光素子を封止する赤色封止樹脂とを隔壁によって分離している。   Thus, a light emitting device in which two types of phosphor regions (that is, regions containing phosphors) are separated has been proposed (see, for example, Patent Document 1). In this light emitting device, a green sealing resin that contains a green phosphor and seals the first blue light emitting element; and a red sealing resin that contains a red phosphor and seals the second blue light emitting element; Are separated by a partition wall.

また、各蛍光体の発光色に対応した発光波長の発光素子を、各蛍光体を含有した封止部材で被覆した発光装置が提案されている（例えば、特許文献２参照）。この発光装置では、青色発光素子および緑色発光素子を、黄色蛍光体と赤色蛍光体とを混合して含有した封止樹脂で被覆したり、青色発光素子を封止する黄色封止樹脂と、緑色発光素子を封止する赤色封止樹脂とを隔壁によって分離したりしている。   In addition, a light emitting device in which a light emitting element having an emission wavelength corresponding to the emission color of each phosphor is covered with a sealing member containing each phosphor has been proposed (see, for example, Patent Document 2). In this light emitting device, a blue light emitting element and a green light emitting element are coated with a sealing resin containing a mixture of a yellow phosphor and a red phosphor, or a yellow sealing resin for sealing a blue light emitting element, and a green A red sealing resin for sealing the light emitting element is separated by a partition wall.

特開２０１０−３４１８４号公報JP 2010-34184 A 特開２００６−２４５４４３号公報JP 2006-245443 A

しかしながら、従来の技術においては、以下に述べる問題がある。
特許文献１に記載の発光装置では、青色発光素子のみで蛍光体を励起しているため、演色性の向上が図れないという問題がある。また、特許文献２に記載の発光装置では、隔壁を設けないものについては２種類の蛍光体が混在しているため、短波側の蛍光体による波長変換光の一部が長波側の蛍光体に吸収され、発光効率が低下するという問題がある。さらに、１種の蛍光体を１種の発光素子で励起しているため、２種類の発光素子の発光はいずれも蛍光体を励起するために吸収される構造であり、さらに発光効率が低下するという問題がある。 However, the conventional techniques have the following problems.
In the light emitting device described in Patent Document 1, since the phosphor is excited only by the blue light emitting element, there is a problem that the color rendering property cannot be improved. In addition, in the light emitting device described in Patent Document 2, since two types of phosphors are mixed for a light emitting device that does not have a partition wall, a part of the wavelength converted light by the short wave side phosphor is changed to the long wave side phosphor. There is a problem that light emission efficiency is reduced due to absorption. Furthermore, since one kind of phosphor is excited by one kind of light emitting element, the light emission of the two kinds of light emitting elements is a structure that is absorbed to excite the phosphor, and the luminous efficiency is further reduced. There is a problem.

本発明は、前記問題点に鑑みてなされたものであり、発光効率が高く、かつ演色性に優れる発光装置および発光装置の製造方法を提供することを課題とする。   The present invention has been made in view of the above-described problems, and an object of the present invention is to provide a light-emitting device having high luminous efficiency and excellent color rendering properties and a method for manufacturing the light-emitting device.

前記課題を解決するために、本発明に係る発光装置は、基材と、前記基材上に配置された複数の発光素子と、前記発光素子を被覆する封止部材と、を備える発光装置であって、前記封止部材は、第１蛍光体を含有して前記基材上に第１領域を形成する第１封止部材と、前記第１蛍光体の発光波長と異なる発光波長の第２蛍光体を含有して前記基材上に第２領域を形成する第２封止部材と、を含み、前記発光素子は、前記第１蛍光体および前記第２蛍光体を励起し、前記第１蛍光体および前記第２蛍光体の発光波長よりも短い波長を発光する第１発光素子と、前記第１発光素子の発光波長と前記第１蛍光体および前記第２蛍光体の発光波長との間の波長を発光する第２発光素子と、からなり、前記第１領域には、前記第１発光素子および前記第２発光素子が配置され、前記第２領域には、前記第１発光素子が配置されており、前記第１蛍光体の発光波長が前記第２蛍光体の発光波長よりも短く、前記第２発光素子が前記第１発光素子よりも前記第１蛍光体を励起する割合が少ないことを特徴とする。
なお、蛍光体を少なくとも一部に含む封止部材（透明部材も含む）が設けられた領域を、以下、適宜、蛍光体領域という。また、発光波長は、ピーク波長を意味する。 In order to solve the above problems, a light emitting device according to the present invention is a light emitting device including a base material, a plurality of light emitting elements disposed on the base material, and a sealing member that covers the light emitting element. The sealing member includes a first sealing member that contains the first phosphor and forms a first region on the substrate, and a second emission wavelength different from the emission wavelength of the first phosphor. A second sealing member containing a phosphor and forming a second region on the substrate, wherein the light emitting element excites the first phosphor and the second phosphor, A first light emitting element that emits a wavelength shorter than the emission wavelengths of the phosphor and the second phosphor, and a light emission wavelength of the first phosphor and the emission wavelength of the first phosphor and the second phosphor. A second light emitting element that emits a wavelength of the first light emitting element, and the first region includes the first light emitting element and the first light emitting element. Emitting element is disposed, wherein the second region, the first light emitting element is disposed, shorter than the emission wavelength of the emission wavelength of the second phosphor of the first phosphor, the second light emitting element However, the ratio of exciting the first phosphor is lower than that of the first light emitting element .
Na us, the area where the sealing member at least partially including a phosphor (including transparent member) is provided, hereinafter referred to as phosphor region. The emission wavelength means a peak wavelength.

このような構成によれば、第１領域に配置された所定の発光波長の第１発光素子により第１蛍光体が励起され、第２領域に配置された第１発光素子により、第１蛍光体と異なる発光波長の第２蛍光体が励起される。そして、蛍光体領域を２つに分けることで、短波側の蛍光体による波長変換光（すなわち、短波）の一部が長波側の蛍光体に吸収されることが抑制され、また２種類の発光素子を用いることでスペクトルが補正されるため、発光効率が向上し、かつ演色性が向上する。   According to such a configuration, the first phosphor is excited by the first light emitting element having a predetermined emission wavelength disposed in the first region, and the first phosphor is disposed by the first light emitting element disposed in the second region. A second phosphor having a different emission wavelength is excited. Then, by dividing the phosphor region into two parts, it is possible to suppress a part of the wavelength converted light (that is, the short wave) by the short wave side phosphor from being absorbed by the long wave side phosphor, and two kinds of light emission. Since the spectrum is corrected by using the element, light emission efficiency is improved and color rendering is improved.

前記第１領域および前記第２領域は、前記第２領域を内側にして同心形状に形成されていることが好ましい。
このような構成によれば、第１領域からの発光と第２領域からの発光が均一に混ざりやすくなり、色ムラが低減される。 The first region and the second region are preferably formed concentrically with the second region inside.
According to such a configuration, light emission from the first region and light emission from the second region are easily mixed uniformly, and color unevenness is reduced.

また、前記第１領域と、前記第２領域との間に光反射部材が設けられていることが好ましい。
このような構成によれば、第１領域と第２領域が光反射部材によって仕切られていることで、長波側の蛍光体による短波側の蛍光体の波長変換光の吸収がさらに抑制される。 In addition, it is preferable that a light reflecting member is provided between the first region and the second region.
According to such a configuration, since the first region and the second region are partitioned by the light reflecting member, absorption of the wavelength-converted light of the short-wave phosphor by the long-wave phosphor is further suppressed.

また、前記複数の発光素子が前記基材上に縦列横列に整列して配置され、前記縦列横列のいずれかの列において、前記列毎に、全ての発光素子が第１発光素子または第２発光素子からなることが好ましい。
このような構成によれば、列毎に同じ種類の発光素子が配置されることで、輝度ムラの発生や輝度分布の差の発生が抑制される。 The plurality of light emitting elements are arranged in a vertical row on the base material, and in any row of the vertical row, all the light emitting devices are the first light emitting device or the second light emitting device for each row. It is preferable to consist of an element.
According to such a configuration, the same kind of light emitting elements is arranged for each column, thereby suppressing occurrence of luminance unevenness and luminance distribution difference.

また、前記第１発光素子と前記第２発光素子を含む列において、前記第１発光素子と前記第２発光素子とが、直列接続されていることが好ましい。さらには、前記直列接続された列が複数あり、１つの列における前記第１発光素子および前記第２発光素子の数が、前記複数の列毎に、互いに同数であることが好ましい。   In the column including the first light emitting element and the second light emitting element, it is preferable that the first light emitting element and the second light emitting element are connected in series. Furthermore, it is preferable that there are a plurality of columns connected in series, and the number of the first light emitting elements and the second light emitting elements in one column is the same for each of the plurality of columns.

このような構成によれば、第１発光素子と第２発光素子とを直列接続することで、直列接続された第１発光素子および第２発光素子に流れる電流が均一化され、この第１発光素子と第２発光素子とに流れる電流がほぼ同じになるため、ほぼ同じ光出力を得ることができる。また、列毎において第１発光素子および第２発光素子の数を同数とすることで、輝度ムラが小さくなる。   According to such a configuration, by connecting the first light emitting element and the second light emitting element in series, the current flowing through the first light emitting element and the second light emitting element connected in series is made uniform, and the first light emitting element Since the currents flowing through the element and the second light emitting element are substantially the same, substantially the same light output can be obtained. Further, by setting the same number of first light emitting elements and second light emitting elements for each column, luminance unevenness is reduced.

さらには、前記第１領域の一部が、蛍光体を含有しない透明部材からなる透明領域であり、前記透明領域に前記第２発光素子が配置されていることが好ましい。
このような構成によれば、第２発光素子からの発光が蛍光体によって光散乱されることがなく、光の取り出し効率が向上する。 Furthermore, it is preferable that a part of the first region is a transparent region made of a transparent member that does not contain a phosphor, and the second light emitting element is arranged in the transparent region.
According to such a configuration, light emitted from the second light emitting element is not scattered by the phosphor, and light extraction efficiency is improved.

本発明に係る発光装置の製造方法は、前記記載の発光装置（透明領域を有さないもの）の製造方法であって、基材上に、第１領域が形成される部位に第１発光素子および第２発光素子を載置するとともに、第２領域が形成される部位に第１発光素子を載置するダイボンディング工程と、第１封止部材によって前記第１領域が形成される部位の第１発光素子および第２発光素子を被覆して第１領域を形成するとともに、第２封止部材によって前記第２領域が形成される部位の第１発光素子を被覆して第２領域を形成する封止部材充填工程と、を含むことを特徴とする。   The manufacturing method of the light-emitting device according to the present invention is a manufacturing method of the above-described light-emitting device (having no transparent region), wherein the first light-emitting element is formed at a site where the first region is formed on the substrate. And a die bonding step of mounting the first light emitting element on a portion where the second region is formed, and a first portion of the portion where the first region is formed by the first sealing member The first region is formed by covering the first light emitting element and the second light emitting element, and the second region is formed by covering the first light emitting element at a portion where the second region is formed by the second sealing member. And a sealing member filling step.

このような製造方法によれば、第１蛍光体を含有した第１封止部材で第１発光素子および第２発光素子を被覆した第１領域と、第２蛍光体を含有した第２封止部材で第１発光素子を被覆した第２領域が形成される。そして、第１領域の第１発光素子により第１蛍光体が励起され、第２領域の第１発光素子により第２蛍光体が励起されることで、発光効率が向上し、かつ演色性が向上した発光装置とすることができる。   According to such a manufacturing method, the 1st area | region which coat | covered the 1st light emitting element and the 2nd light emitting element with the 1st sealing member containing 1st fluorescent substance, and the 2nd sealing containing 2nd fluorescent substance A second region in which the first light emitting element is covered with the member is formed. Then, the first phosphor is excited by the first light emitting element in the first region and the second phosphor is excited by the first light emitting element in the second region, so that the light emission efficiency is improved and the color rendering is improved. The light emitting device can be obtained.

本発明に係る発光装置の製造方法は、前記記載の発光装置（透明領域を有するもの）の製造方法であって、基材上に、第１領域が形成される部位に第１発光素子および第２発光素子を載置するとともに、第２領域が形成される部位に第１発光素子を載置するダイボンディング工程と、透明部材によって前記第２発光素子を被覆し、かつ第１封止部材によって前記第１領域が形成される部位の第１発光素子を被覆して第１領域を形成するとともに、第２封止部材によって前記第２領域が形成される部位の第１発光素子を被覆して第２領域を形成する封止部材充填工程と、を含むことを特徴とする。   A method for manufacturing a light emitting device according to the present invention is a method for manufacturing the above-described light emitting device (having a transparent region). A die bonding step of placing the two light emitting elements and placing the first light emitting element in a portion where the second region is formed, covering the second light emitting element with a transparent member, and using the first sealing member The first region is formed by covering the first light emitting element where the first region is formed, and the first light emitting element where the second region is formed is covered by the second sealing member. And a sealing member filling step for forming the second region.

このような製造方法によれば、第１蛍光体を含有した第１封止部材で第１発光素子を被覆するとともに透明部材によって第２発光素子を被覆した第１領域と、第２蛍光体を含有した第２封止部材で第１発光素子を被覆した第２領域が形成される。そして、第１領域の第１発光素子により第１蛍光体が励起され、第２領域の第１発光素子により第２蛍光体が励起され、第１領域の第２発光素子の発光が蛍光体によって光散乱されることなく取り出されることで、発光効率がさらに向上し、かつ演色性が向上した発光装置とすることができる。   According to such a manufacturing method, the first phosphor covering the first light emitting element with the first sealing member containing the first phosphor and the second light emitting element with the transparent member, and the second phosphor A second region in which the first light emitting element is covered with the contained second sealing member is formed. Then, the first phosphor is excited by the first light emitting element in the first region, the second phosphor is excited by the first light emitting element in the second region, and the light emission of the second light emitting element in the first region is caused by the phosphor. By taking out the light without being scattered, it is possible to obtain a light emitting device with further improved luminous efficiency and improved color rendering.

さらに、前記ダイボンディング工程と前記封止部材充填工程との間に、前記第１領域が形成される箇所と前記第２領域が形成される箇所の間に光反射部材を設ける光反射部材形成工程を行なってもよい。
このような製造方法によれば、第１領域と第２領域が光反射部材によって仕切られ、蛍光体による短波の吸収がさらに抑制されることで、発光効率がさらに向上した発光装置とすることができる。 Further, a light reflecting member forming step of providing a light reflecting member between a portion where the first region is formed and a portion where the second region is formed between the die bonding step and the sealing member filling step. May be performed.
According to such a manufacturing method, the first region and the second region are partitioned by the light reflecting member, and absorption of short waves by the phosphor is further suppressed, so that a light emitting device with further improved luminous efficiency can be obtained. it can.

本発明に係る発光装置によれば、蛍光体領域を第１領域と第２領域とに分離し、第１領域に、所定の発光波長を有する第１発光素子および第２発光素子を配置するとともに、第２領域に第１発光素子のみを配置することで、発光効率が向上するとともに、演色性を向上させることができる。   According to the light emitting device of the present invention, the phosphor region is separated into the first region and the second region, and the first light emitting element and the second light emitting element having a predetermined emission wavelength are disposed in the first region. By arranging only the first light emitting element in the second region, the light emission efficiency can be improved and the color rendering can be improved.

本発明に係る発光装置の製造方法によれば、蛍光領域を、第１発光素子および第２発光素子が配置された第１領域と、第１発光素子のみが配置された第２領域とに分離して形成することで、発光効率が向上するとともに、演色性を向上させることができる発光装置を製造することができる。   According to the method for manufacturing a light-emitting device of the present invention, the fluorescent region is separated into a first region where the first light-emitting element and the second light-emitting element are arranged and a second region where only the first light-emitting element is arranged. By forming the light emitting device in this manner, it is possible to manufacture a light emitting device capable of improving luminous efficiency and color rendering properties.

本発明の実施形態に係る発光装置の全体構成を示す斜視図である。It is a perspective view which shows the whole structure of the light-emitting device which concerns on embodiment of this invention. 本発明の実施形態に係る発光装置の構成を示す正面図である。It is a front view which shows the structure of the light-emitting device which concerns on embodiment of this invention. （ａ）は、本発明に係る発光装置および３種の蛍光体を用いた従来の発光装置について、相対発光強度と発光波長との関係を示すグラフ、（ｂ）は、本発明に係る発光装置および３種の蛍光体を用いた従来の発光装置について、発光効率（ｌｍ／ｗ）および演色性を示すグラフである。(A) is the graph which shows the relationship between relative light emission intensity and light emission wavelength about the light-emitting device which concerns on this invention, and the conventional light-emitting device using 3 types of fluorescent substance, (b) is the light-emitting device which concerns on this invention 4 is a graph showing luminous efficiency (lm / w) and color rendering for a conventional light emitting device using three kinds of phosphors. 本発明の他の実施形態に係る発光装置の構成を示す正面図である。It is a front view which shows the structure of the light-emitting device which concerns on other embodiment of this invention. 本発明の他の実施形態に係る発光装置であって、実装領域を円形にした場合の発光装置について説明するための模式図である。It is a light emitting device concerning other embodiments of the present invention, and is a mimetic diagram for explaining a light emitting device when a mounting field is made circular.

以下、本発明の実施形態に係る発光装置および発光装置の製造方法について、図面を参照しながら説明する。なお、各図面が示す部材のサイズや位置関係等は、説明を明確にするため誇張していることがある。さらに以下の説明において、同一の名称、符号については、原則として同一もしくは同質の部材を示しており、詳細説明を適宜省略する。   Hereinafter, a light emitting device and a method for manufacturing the light emitting device according to an embodiment of the present invention will be described with reference to the drawings. Note that the size, positional relationship, and the like of the members shown in each drawing may be exaggerated for clarity of explanation. Further, in the following description, the same name and reference sign indicate the same or the same members in principle, and the detailed description will be omitted as appropriate.

また、以下の説明で参照する図２、４において、説明の便宜上、光反射部材（第１光反射部材６ａおよび第２光反射部材６ｂ：以下、適宜、光反射部材６ａ，６ｂという）は、外形のみを線で示し、透過させた状態で図示している。また、第１領域１０ａ（透明領域１１を含む）および第２領域１０ｂにおいては、発光素子（第１発光素子２ａおよび第２発光素子２ｂ：以下、適宜、発光素子２ａ，２ｂという）の配置および接続関係がわかるように、発光素子２ａ，２ｂおよびワイヤＷを図示している。さらに、発光素子２ａ，２ｂのｎ電極２１およびｐ電極２２は、各発光素子２ａ，２ｂの向きを示すために実装領域１ａ上の４箇所だけ詳細に図示し、実装領域１ａ上のその他の箇所では詳細な図示を省略している。   2 and 4 referred to in the following description, for the convenience of description, the light reflecting members (first light reflecting member 6a and second light reflecting member 6b: hereinafter referred to as light reflecting members 6a and 6b as appropriate) Only the outer shape is shown by lines and is shown in a transparent state. Further, in the first region 10a (including the transparent region 11) and the second region 10b, the arrangement of the light emitting elements (first light emitting element 2a and second light emitting element 2b: hereinafter referred to as light emitting elements 2a and 2b as appropriate) and The light emitting elements 2a and 2b and the wire W are illustrated so that the connection relationship can be understood. Further, the n-electrode 21 and the p-electrode 22 of the light-emitting elements 2a and 2b are shown in detail in only four places on the mounting area 1a in order to indicate the directions of the light-emitting elements 2a and 2b, and other places on the mounting area 1a. However, detailed illustration is omitted.

≪発光装置≫
本発明の実施形態に係る発光装置１００について、図１、２を参照しながら詳細に説明する。以下の説明では、まず発光装置１００の全体構成について説明した後に、各構成について説明する。 ≪Light emitting device≫
A light emitting device 100 according to an embodiment of the present invention will be described in detail with reference to FIGS. In the following description, the overall configuration of the light emitting device 100 is first described, and then each configuration is described.

＜全体構成＞
発光装置１００は、例えば、ＬＥＤ電球、スポットライト等の照明器具等に利用される装置である。発光装置１００は、図１、２に示すように、基材１上に、基材１の実装領域１ａに配置された複数の発光素子２ａ，２ｂと、基材１上に形成された正極３および負極４を構成する導電部材４０と、発光素子２ａ，２ｂと正極３や負極４等とを接続するワイヤＷと、基材１上に形成された光反射部材６ａ，６ｂと、発光素子２ａ，２ｂをそれぞれ被覆する封止部材（第１封止部材７ａおよび第２封止部材７ｂ：以下、適宜、封止部材７ａ，７ｂという）と、を主に備える。そして、蛍光体領域は、第１封止部材７ａが設けられた領域である第１領域１０ａと、第２封止部材７ｂが設けられた領域である第２領域１０ｂとに分離して設けられており、第１領域１０ａには、第１発光素子２ａおよび第２発光素子２ｂが配置され、第２領域１０ｂには、第１発光素子２ａが配置されている。 <Overall configuration>
The light emitting device 100 is a device that is used for lighting fixtures such as LED bulbs and spotlights, for example. As shown in FIGS. 1 and 2, the light-emitting device 100 includes a plurality of light-emitting elements 2 a and 2 b arranged in a mounting region 1 a of the base material 1, and a positive electrode 3 formed on the base material 1. And the conductive member 40 constituting the negative electrode 4, the wire W connecting the light emitting elements 2a, 2b and the positive electrode 3, the negative electrode 4, etc., the light reflecting members 6a, 6b formed on the substrate 1, and the light emitting element 2a , 2b (first sealing member 7a and second sealing member 7b: hereinafter, appropriately referred to as sealing members 7a, 7b). The phosphor region is provided separately into a first region 10a that is a region where the first sealing member 7a is provided and a second region 10b that is a region where the second sealing member 7b is provided. The first light emitting element 2a and the second light emitting element 2b are disposed in the first region 10a, and the first light emitting element 2a is disposed in the second region 10b.

＜基材＞
基材１は、発光素子２ａ，２ｂ等の電子部品を配置するためのものである。基材１は、図１および図２に示すように、矩形平板状に形成されている。また、基材１上には、図２に示すように複数の発光素子２ａ，２ｂを配置するための実装領域１ａが区画されている。なお、基材１のサイズは特に限定されず、発光素子２ａ，２ｂの数や配列間隔等、目的および用途に応じて適宜選択することができる。なお、一例としては１６ｍｍ×１９ｍｍである。 <Base material>
The base material 1 is for arranging electronic components such as the light emitting elements 2a and 2b. As shown in FIGS. 1 and 2, the substrate 1 is formed in a rectangular flat plate shape. In addition, a mounting region 1a for arranging a plurality of light emitting elements 2a and 2b is defined on the substrate 1 as shown in FIG. In addition, the size of the base material 1 is not specifically limited, It can select suitably according to the objectives and uses, such as the number of light emitting elements 2a and 2b, and arrangement | positioning space | interval. As an example, it is 16 mm × 19 mm.

基材１の材料としては、絶縁性材料を用いることが好ましく、かつ、発光素子２ａ，２ｂから放出される光や外光等が透過しにくい材料を用いることが好ましい。また、ある程度の強度を有する材料を用いることが好ましい。具体的には、セラミックス（Ａｌ２Ｏ３、ＡｌＮ等）、あるいはフェノール樹脂、エポキシ樹脂、ポリイミド樹脂、ＢＴレジン（bismaleimide triazine resin）、ポリフタルアミド（ＰＰＡ）等の樹脂が挙げられる。また、金属板の表面に絶縁層を設けた部材を基材１の材料として用いることもできる。 As a material of the base material 1, it is preferable to use an insulating material, and it is preferable to use a material that hardly transmits light emitted from the light emitting elements 2a and 2b, external light, and the like. Moreover, it is preferable to use a material having a certain degree of strength. Specifically, ceramics (Al 2 O 3 , AlN, etc.), or resins such as phenol resin, epoxy resin, polyimide resin, BT resin (bismaleimide triazine resin), polyphthalamide (PPA), and the like can be given. Moreover, the member which provided the insulating layer on the surface of the metal plate can also be used as a material of the base material 1.

＜実装領域＞
実装領域１ａは、複数の発光素子２ａ，２ｂを配置するための領域である。実装領域１ａは、図２に示すように、基材１の中央の領域に区画されている。実装領域１ａは、互いに対向する辺を有する所定形状で形成されており、より具体的には、図２に示すように、角部を丸めた略矩形状に形成されている。なお、ここでは第１封止部材７ａの外枠が実装領域１ａの外枠となっている。実装領域１ａのサイズは特に限定されず、発光素子２ａ，２ｂの数や配列間隔等、目的および用途に応じて適宜選択することができる。 <Mounting area>
The mounting area 1a is an area for arranging a plurality of light emitting elements 2a and 2b. As shown in FIG. 2, the mounting region 1 a is partitioned into a central region of the base material 1. The mounting region 1a is formed in a predetermined shape having sides facing each other, and more specifically, is formed in a substantially rectangular shape with rounded corners as shown in FIG. Here, the outer frame of the first sealing member 7a is the outer frame of the mounting region 1a. The size of the mounting region 1a is not particularly limited, and can be appropriately selected according to the purpose and application such as the number of light emitting elements 2a and 2b and the arrangement interval.

実装領域１ａは、基材１と同じ材料で構成された領域としてもよいが、例えば、実装領域１ａ上に光を反射する金属膜を形成し、当該金属膜を介して複数の発光素子２ａ，２ｂを配置することが好ましい。このように実装領域１ａ上に金属膜を形成してその上に複数の発光素子２ａ，２ｂを配置することで、基材１の実装領域１ａ側に向う光も金属膜によって反射することができる。従って、出射光のロスを軽減することができ、発光装置１００の光の取り出し効率を向上させることができる。実装領域１ａ上に形成する金属膜は、電解めっきまたは無電解めっきで形成することが好ましい。金属膜の材料としては、特に限定されないが、例えば、Ａｇ（銀）またはＡｕ（金）を用いることが好ましく、特にＡｇを用いることが好ましい。Ａｕは光を吸収しやすい特性を備えているが、例えばＡｕめっきの表面にＴｉＯ２膜をさらに形成することで、光反射率を高めることができる。また、ＡｇはＡｕよりも可視光に対する光反射率が高いため、Ａｕ単独でめっきを行うよりも、発光装置１００の光の取り出し効率を向上させることができる。なお、実装領域１ａ上に形成する金属膜の厚さは特に限定されず、目的および用途に応じて適宜選択することができる。 The mounting region 1a may be a region made of the same material as that of the base material 1. For example, a metal film that reflects light is formed on the mounting region 1a, and a plurality of light emitting elements 2a, It is preferable to arrange 2b. In this way, by forming a metal film on the mounting region 1a and disposing the plurality of light emitting elements 2a and 2b thereon, the light directed toward the mounting region 1a of the substrate 1 can also be reflected by the metal film. . Therefore, loss of emitted light can be reduced, and light extraction efficiency of the light emitting device 100 can be improved. The metal film formed on the mounting region 1a is preferably formed by electrolytic plating or electroless plating. The material for the metal film is not particularly limited. For example, Ag (silver) or Au (gold) is preferably used, and Ag is particularly preferably used. Au has a characteristic of easily absorbing light. For example, the light reflectance can be increased by further forming a TiO 2 film on the surface of Au plating. In addition, since Ag has a higher light reflectivity with respect to visible light than Au, the light extraction efficiency of the light emitting device 100 can be improved as compared with plating with Au alone. The thickness of the metal film formed on the mounting region 1a is not particularly limited and can be appropriately selected according to the purpose and application.

＜発光素子＞
発光素子２ａ，２ｂは、電圧を印加することで自発光する半導体素子であり、第１発光素子２ａと、第２発光素子２ｂと、からなる。発光素子２ａ，２ｂは、図２に示すように、基材１の実装領域１ａに複数配置され、当該複数の発光素子２ａ，２ｂが一体となって発光装置１００の発光部、すなわち発光素子２ａ，２ｂからの発光が行なわれる部位を構成している。具体的には、ここでは、第１領域１０ａには第１発光素子２ａおよび第２発光素子２ｂが複数配置されて第１領域１０ａの発光部を構成している。また、第２領域１０ｂには第１発光素子２ａが複数配置されて第２領域１０ｂの発光部を構成している。 <Light emitting element>
The light emitting elements 2a and 2b are semiconductor elements that emit light by applying a voltage, and include a first light emitting element 2a and a second light emitting element 2b. As shown in FIG. 2, a plurality of light emitting elements 2 a and 2 b are arranged in the mounting region 1 a of the substrate 1, and the plurality of light emitting elements 2 a and 2 b are integrated to form a light emitting portion of the light emitting device 100, i. , 2b is formed. Specifically, here, a plurality of first light emitting elements 2a and second light emitting elements 2b are arranged in the first region 10a to constitute a light emitting portion of the first region 10a. In addition, a plurality of first light emitting elements 2a are arranged in the second region 10b to constitute a light emitting part of the second region 10b.

発光素子２ａ，２ｂのそれぞれは、図２に示すように、矩形状に形成されている。また、発光素子２ａ，２ｂは、図２に示すように、その上面の一側にｎ電極２１が設けられ、発光素子２ａ，２ｂの他側にｐ電極２２が設けられたフェースアップ（ＦＵ）素子である。   Each of the light emitting elements 2a and 2b is formed in a rectangular shape as shown in FIG. Further, as shown in FIG. 2, the light emitting elements 2a and 2b are face-up (FU) in which an n electrode 21 is provided on one side of the upper surface and a p electrode 22 is provided on the other side of the light emitting elements 2a and 2b. It is an element.

発光素子２ａ，２ｂとしては、具体的には発光ダイオードを用いるのが好ましく、用途に応じて任意の波長のものを選択することができる。例えば、青色（波長４３０ｎｍ〜４９０ｎｍの光）、緑色（波長４９０ｎｍ〜５７０ｎｍの光）の発光素子２ａ，２ｂとしては、窒化物系半導体（ＩｎＸＡｌＹＧａ１−Ｘ−ＹＮ、０≦Ｘ、０≦Ｙ、Ｘ＋Ｙ≦１）等を用いることができる。また、赤色（波長６２０ｎｍ〜７５０ｎｍの光）の発光素子２ａ，２ｂとしては、ＧａＡｌＡｓ、ＡｌＩｎＧａＰ等を用いることができる。 Specifically, it is preferable to use light emitting diodes as the light emitting elements 2a and 2b, and those having an arbitrary wavelength can be selected according to applications. For example, as the light emitting elements 2a and 2b of blue (light with a wavelength of 430 nm to 490 nm) and green (light with a wavelength of 490 nm to 570 nm), nitride-based semiconductors (In X Al Y Ga 1-XY N, 0 ≦ X , 0 ≦ Y, X + Y ≦ 1) and the like can be used. Further, as the red light emitting elements 2a and 2b (light having a wavelength of 620 nm to 750 nm), GaAlAs, AlInGaP, or the like can be used.

ここで、第１発光素子２ａは、後記する第１蛍光体および第２蛍光体を励起し、第１蛍光体および第２蛍光体の発光波長よりも短い波長を発光するものであり、第２発光素子２ｂは、第１発光素子２ａの発光波長と第１蛍光体および第２蛍光体の発光波長との間の波長を発光するものである。よって、例えば、第１蛍光体として、短波側の蛍光体であり黄色を発光するＹＡＧ系蛍光体を用い、第２蛍光体として、長波側の蛍光体であり赤色を発光するＣＡＳＮ系蛍光体を用いた場合、第１発光素子２ａとしては、青色（波長４３０ｎｍ〜４９０ｎｍの光）のものを用い、第２発光素子２ｂとしては、青緑色（波長４９０ｎｍ〜５２０ｎｍの光）または緑色（波長４９０ｎｍ〜５７０ｎｍの光）のものを用いることができる。より具体的には、第１発光素子２ａとしては、発光波長が４４５ｎｍ〜４６５ｎｍのものを用い、第２発光素子２ｂとしては、発光波長が４９５ｎｍ〜５２０ｎｍのものを用いることができる。第２発光素子２ｂとしては、少なくとも第１発光素子２ａと発光波長が異なるものが選択され、さらには、第１蛍光体を励起しないもの、少なくとも第１発光素子２ａよりも第１蛍光体を励起する割合（吸収される割合）の少ないものを選択することが好ましい。これによって、第２発光素子２ｂの発光が第１蛍光体に吸収されることなく外部に取り出すことができるため、発光装置の光の取り出し効率が向上し、発光効率が向上する。なお、これらの波長は、ピーク波長で比較することが好ましい。   Here, the first light emitting element 2a excites a first phosphor and a second phosphor, which will be described later, and emits a wavelength shorter than the emission wavelengths of the first phosphor and the second phosphor. The light emitting element 2b emits light having a wavelength between the emission wavelength of the first light emitting element 2a and the emission wavelengths of the first phosphor and the second phosphor. Therefore, for example, a YAG phosphor that emits yellow light, which is a short wave phosphor, is used as the first phosphor, and a CASN phosphor that emits red light, which is a long wave phosphor, is used as the second phosphor. When used, the first light emitting element 2a is blue (light having a wavelength of 430 nm to 490 nm), and the second light emitting element 2b is blue green (light having a wavelength of 490 nm to 520 nm) or green (wavelength of 490 nm to 490 nm). 570 nm light) can be used. More specifically, as the first light emitting element 2a, one having an emission wavelength of 445 nm to 465 nm can be used, and as the second light emitting element 2b, one having an emission wavelength of 495 nm to 520 nm can be used. As the second light emitting element 2b, at least one having a light emission wavelength different from that of the first light emitting element 2a is selected. Further, the second light emitting element 2b does not excite the first phosphor, and at least excites the first phosphor more than the first light emitting element 2a. It is preferable to select one having a small ratio (absorbed ratio). As a result, the light emitted from the second light emitting element 2b can be extracted outside without being absorbed by the first phosphor, so that the light extraction efficiency of the light emitting device is improved and the light emission efficiency is improved. In addition, it is preferable to compare these wavelengths with a peak wavelength.

ただし、発光素子２ａ，２ｂの成分組成や発光色、サイズ等は上記に限定されず、目的に応じて適宜選択することができる。また、発光素子２ａ，２ｂは、可視光領域の光だけではなく、紫外線や赤外線を出力する素子で構成することもできる。また、高出力化のためには、発光素子２ａ，２ｂの合計の個数は、例えば１０個以上、２０〜４００個の範囲内とすることが好ましい。   However, the component composition, emission color, size, and the like of the light emitting elements 2a and 2b are not limited to the above, and can be appropriately selected depending on the purpose. In addition, the light emitting elements 2a and 2b can be configured by elements that output not only visible light but also ultraviolet rays and infrared rays. In order to increase the output, the total number of the light emitting elements 2a and 2b is preferably in the range of 10 or more and 20 to 400, for example.

［発光素子の配置］
図２に示すように、第１領域１０ａには第１発光素子２ａおよび第２発光素子２ｂが配置され、第２領域１０ｂには第１発光素子２ａが配置されている。発光素子２ａ，２ｂは、図２に示すように基材１上において、縦方向および横方向にそれぞれ所定の間隔で配列されており、ここでは、縦９個×横１０個の合計９０個配置されている。また、発光素子２ａ，２ｂは、図２に示すように、縦方向に隣り合う発光素子２ａ，２ｂ同士が導電性のワイヤＷによって電気的に接続され、直列接続されている。なお、ここでの直列接続とは、隣り合う発光素子２ａ，２ｂにおけるｎ電極２１とｐ電極２２とがワイヤＷによって電気的に接続された状態を意味している。 [Arrangement of light emitting elements]
As shown in FIG. 2, the first light emitting element 2a and the second light emitting element 2b are arranged in the first region 10a, and the first light emitting element 2a is arranged in the second region 10b. As shown in FIG. 2, the light emitting elements 2a and 2b are arranged at predetermined intervals in the vertical direction and the horizontal direction on the base material 1, and here, a total of 90 elements of 9 vertical elements and 10 horizontal elements are arranged. Has been. In addition, as shown in FIG. 2, the light emitting elements 2 a and 2 b are connected in series by electrically connecting the light emitting elements 2 a and 2 b adjacent in the vertical direction with a conductive wire W. Here, the series connection means a state in which the n electrode 21 and the p electrode 22 in the adjacent light emitting elements 2a and 2b are electrically connected by the wire W.

また、図２を正面視した場合において、最上部の列の横方向に隣り合う第２発光素子２ｂ同士が導電性のワイヤＷによって電気的に接続され、並列接続されている。なお、ここでの並列接続とは、隣り合う発光素子２ａ，２ｂにおけるｎ電極２１同士またはｐ電極２２同士がワイヤＷによって電気的に接続された状態を意味している。そして、最下部に位置する第２発光素子２ｂと、導電部材４０である配線部４ｂとがワイヤＷによって電気的に接続されており、最上部の左側の端部に位置する第２発光素子２ｂと、導電部材４０である配線部３ｂとがワイヤＷによって電気的に接続されている。   In addition, when FIG. 2 is viewed from the front, the second light emitting elements 2b adjacent in the horizontal direction of the uppermost row are electrically connected by the conductive wires W and are connected in parallel. Here, the parallel connection means a state in which the n electrodes 21 or the p electrodes 22 in the adjacent light emitting elements 2a and 2b are electrically connected by the wire W. The second light emitting element 2b located at the bottom and the wiring part 4b, which is the conductive member 40, are electrically connected by the wire W, and the second light emitting element 2b located at the upper left end. And the wiring part 3b which is the conductive member 40 are electrically connected by a wire W.

そして、基材１の中央に形成された第２領域１０ｂに、第１発光素子２ａが、ここでは縦７個×横６個の合計４２個配置されている。また、第２領域１０ｂの周囲に形成された第１領域１０ａに、第２領域１０ｂの第１発光素子２ａから所定距離離間して、ここでは第１発光素子２ａが２８個、第２発光素子２ｂが２０個の合計４８個配置されている。   Then, in the second region 10b formed in the center of the substrate 1, 42 first light emitting elements 2a in this case, 7 in the vertical direction and 6 in the horizontal direction, are arranged. In addition, the first region 10a formed around the second region 10b is spaced apart from the first light emitting element 2a in the second region 10b by a predetermined distance. Here, there are 28 first light emitting elements 2a, second light emitting elements A total of 48 2b 2 are arranged.

ここで、複数の発光素子２ａ，２ｂが基材１上に縦列横列に整列して配置されている場合に、縦列横列のいずれかの列において、列毎に、全ての発光素子２ａ，２ｂが第１発光素子２ａまたは第２発光素子２ｂからなることが好ましい。すなわち、縦方向の列、あるいは横方向のいずれか一方の列において、列毎に、第１発光素子２ａのみ、または第２発光素子２ｂのみからなることが好ましい。ただし、ここでは第２領域１０ｂには第２発光素子２ｂは設けない構成としている。   Here, when the plurality of light emitting elements 2a and 2b are arranged in the vertical row and the horizontal row on the substrate 1, all the light emitting devices 2a and 2b are arranged for each column in any one of the vertical rows. It is preferable to consist of the 1st light emitting element 2a or the 2nd light emitting element 2b. That is, it is preferable that each of the columns in the vertical direction or the horizontal direction includes only the first light emitting element 2a or only the second light emitting element 2b. However, here, the second light emitting element 2b is not provided in the second region 10b.

１つの列において、順方向降下電圧（以下、Ｖｆという）が異なる素子が配置されていると、発光素子のＶｆのばらつきによって光出力が変化し、発光装置に輝度ムラ（発光ムラ）が生じるとともに、複数の発光装置間における輝度分布（光度分布）に差が生じる場合がある。しかしながら、列毎に同じ種類の発光素子を配置することで、輝度ムラや輝度分布の差の発生を抑制することができる。ここで、Ｖｆとは、発光素子（発光ダイオード）に対して順方向に電流を流すために必要な電圧、すなわち発光素子が光を発光するために必要な電圧である。例えば、Ｖｆの高い発光素子とＶｆの低い発光素子とを並列接続すると、流れる電流はＶｆの低い発光素子の方が大きくなる。 When elements having different forward drop voltages (hereinafter referred to as V f ) are arranged in one column, the light output changes due to the variation in V f of the light emitting elements, and the light emitting device has uneven brightness (light emitting unevenness). In addition, there may be a difference in luminance distribution (luminous intensity distribution) among a plurality of light emitting devices. However, by arranging the same type of light emitting elements for each column, it is possible to suppress the occurrence of uneven brightness and differences in brightness distribution. Here, V f is a voltage necessary for a current to flow in the forward direction with respect to the light emitting element (light emitting diode), that is, a voltage necessary for the light emitting element to emit light. For example, when a light emitting element having a high Vf and a light emitting element having a low Vf are connected in parallel, the current flowing through the light emitting element having a low Vf becomes larger.

また、前記縦列横列のいずれかの方向のうち、特に、並列方向に配置された発光素子２ａ，２ｂが、並列毎に同じ種類からなることが好ましい。なお、並列方向とは、発光素子２ａ，２ｂが並列接続される方向のことをという。すなわち、発光素子２ａ，２ｂのすべてが同じ方向を向いて、並列接続される方向に並ぶ並列方向および直列接続される方向に並ぶ直列方向に配置される場合、並列方向に配置された発光素子２ａ，２ｂが、並列毎にすべて同じ種類であることが好ましい。   Moreover, it is preferable that the light emitting elements 2a and 2b arranged in the parallel direction among any of the vertical and horizontal directions are of the same type for each parallel. Note that the parallel direction refers to a direction in which the light emitting elements 2a and 2b are connected in parallel. That is, when all of the light emitting elements 2a and 2b face the same direction and are arranged in the parallel direction aligned in the parallel connection direction and the serial direction aligned in the serial connection direction, the light emitting elements 2a arranged in the parallel direction. , 2b are preferably the same type for each parallel.

具体的には、図２に示すように、最上部および最下部には、第２発光素子２ｂが横一列に並び、その他の列においては、第１発光素子２ａが横一列に並ぶ。ここで、このような形態をとるのは、第２発光素子２ｂは、第１領域１０ａにのみ配置する構成としているため、最上部および最下部の列以外の列に第２発光素子２ｂを配置すると、第２領域１０ｂに第２発光素子２ｂが配置されることとなるためである。このような構成とすることで、輝度ムラや輝度分布の差の発生をさらに抑制することができる。   Specifically, as shown in FIG. 2, the second light emitting elements 2b are arranged in a horizontal row at the top and the bottom, and the first light emitting elements 2a are arranged in a horizontal row in the other columns. Here, the second light-emitting element 2b is arranged only in the first region 10a because the second light-emitting element 2b is arranged in a column other than the uppermost and lowermost columns. This is because the second light emitting element 2b is disposed in the second region 10b. With such a configuration, it is possible to further suppress the occurrence of luminance unevenness and luminance distribution differences.

また、第１発光素子２ａと第２発光素子２ｂを含む列において、第１発光素子２ａと第２発光素子２ｂとが、直列接続されていることが好ましい。さらには、直列接続された列が複数あり、１つの列における第１発光素子２ａおよび第２発光素子２ｂの数が、複数の列毎に、互いに同数であることが好ましい。ここでは、図２に示すように、最上部および最下部の列に位置する第２発光素子２ｂと、これに直列方向に隣り合う第１発光素子２ａとが直列接続されている。また、直列接続された列において、それぞれ第１発光素子２ａが７個、第２発光素子２ｂが２個配置された構造となっている。   In the column including the first light emitting element 2a and the second light emitting element 2b, the first light emitting element 2a and the second light emitting element 2b are preferably connected in series. Furthermore, it is preferable that there are a plurality of columns connected in series, and the number of the first light emitting elements 2a and the second light emitting elements 2b in one column is the same for each of the plurality of columns. Here, as shown in FIG. 2, the 2nd light emitting element 2b located in the uppermost and lowermost row | line | column and the 1st light emitting element 2a adjacent to this in a serial direction are connected in series. Further, each of the columns connected in series has a structure in which seven first light emitting elements 2a and two second light emitting elements 2b are arranged.

発光素子を直列接続することで、各発光素子に流れる電流を均一化することができる。例えばＶｆの高い発光素子とＶｆの低い発光素子とを並列接続すると、Ｖｆの低い方に流れる電流が大となるが、直列接続すると、流れる電流は両方の発光素子においてほぼ同じとなる。このため、前記したようにＶｆの異なる複数の発光素子を用いる場合にも、直列接続することで各発光素子に流れる電流を均一化でき、各発光素子をほぼ同程度の強度で発光させることができる。特に、発光波長の異なる第１発光素子２ａと第２発光素子２ｂは、Ｖｆも異なる傾向にあるため、これらを直列接続することで、ほぼ同程度の強度で発光させることができ、発光装置１００の輝度ムラを小さくすることができる。また、直列接続された列毎において第１発光素子２ａおよび第２発光素子２ｂの数を同数とすることで、出力の異なる２種類の発光素子２ａ，２ｂが列毎で同数配置されているため、出力の異なる発光素子２ａ，２ｂをより均一の分散させることができ、発光装置１００の輝度ムラをさらに小さくすることができる。またこの直列回路に、例えば隣り合う発光素子を並列に接続してこの組を１つの発光素子とみて、組同士を直列接続する、いわゆる梯子状の配線（ラダー）にすることで、各種電源に対応した発光装置とすることもできる。 By connecting the light emitting elements in series, the current flowing through each light emitting element can be made uniform. For example, if a light emitting element having a high V f and a light emitting element having a low V f are connected in parallel, the current flowing to the lower side of V f becomes large. However, if they are connected in series, the flowing current is substantially the same in both light emitting elements. . For this reason, even when using a plurality of light emitting elements having different V f as described above, the current flowing through each light emitting element can be made uniform by connecting them in series, and each light emitting element emits light with substantially the same intensity. Can do. In particular, since the first light emitting element 2a and the second light emitting element 2b having different emission wavelengths tend to have different V f , they can be made to emit light with substantially the same intensity by connecting them in series. The luminance unevenness of 100 can be reduced. In addition, since the number of the first light emitting elements 2a and the second light emitting elements 2b is the same for each column connected in series, the same number of the two types of light emitting elements 2a and 2b having different outputs is arranged for each column. The light emitting elements 2a and 2b having different outputs can be more uniformly dispersed, and the luminance unevenness of the light emitting device 100 can be further reduced. In addition, by connecting adjacent light emitting elements in parallel to this series circuit, for example, this set is regarded as one light emitting element, and the sets are connected in series, so-called ladder-like wiring (ladder), so that various power supplies A corresponding light-emitting device can also be obtained.

さらに、第１領域１０ａおよび第２領域１０ｂにおいて、発光素子２ａ，２ｂは、同程度の密度で載置されていることが好ましい。また、第１発光素子２ａ、第２発光素子２ｂは、それぞれ、サイズ、出力、波長等の特性がほぼ同等であることが好ましい。特に、第１領域１０ａおよび第２領域１０ｂが矩形の場合には、第１領域１０ａ、第２領域１０ｂの両方において、同様のマトリクス状、例えば、縦横の間隔が同じように発光素子２ａ，２ｂが載置されることが好ましい。   Further, in the first region 10a and the second region 10b, it is preferable that the light emitting elements 2a and 2b are placed with the same density. Further, it is preferable that the first light emitting element 2a and the second light emitting element 2b have substantially the same characteristics such as size, output, and wavelength. In particular, when the first region 10a and the second region 10b are rectangular, both the first region 10a and the second region 10b have the same matrix shape, for example, the light emitting elements 2a and 2b having the same vertical and horizontal intervals. Is preferably placed.

また、第１領域１０ａおよび第２領域１０ｂは、ここでは同心形状であるため、外側の第１領域１０ａのほうが幅狭となりやすい。そのため、第１領域１０ａおよび第２領域１０ｂに実装する発光素子２ａ，２ｂの数は、第１領域１０ａに配置するほうを多くすることが好ましい。第１領域１０ａに多くの発光素子２ａ，２ｂを配置することで、第１領域１０ａを比較的幅広とすることができ、発光素子２ａ，２ｂを実装しやすくなる。また、第１領域１０ａに多くの発光素子２ａ，２ｂを配置する観点から、第１領域１０ａの面積を第２領域１０ｂの面積よりも大きくすることが好ましい。なお、各領域の面積や発光素子２ａ，２ｂの数を変えることによって、各領域の発光強度を変化させることがでる。これによって、第１領域１０ａおよび第２領域１０ｂの発光強度比を調整し、所望の色調を得ることができる。たとえば、黄色味を強くしたい場合は、黄色の蛍光体領域の発光を強めればよい。また、第１発光素子２ａの発光に対する変換効率が低く、より多量の蛍光体を必要とする方の蛍光体の領域を、発光装置１００の中心近傍に配置することが好ましく、内側に配置することが好ましい。   In addition, since the first region 10a and the second region 10b are concentric here, the outer first region 10a tends to be narrower. Therefore, it is preferable to increase the number of light emitting elements 2a and 2b mounted in the first region 10a and the second region 10b in the first region 10a. By disposing many light emitting elements 2a and 2b in the first region 10a, the first region 10a can be made relatively wide and the light emitting elements 2a and 2b can be easily mounted. Further, from the viewpoint of disposing a large number of light emitting elements 2a and 2b in the first region 10a, the area of the first region 10a is preferably larger than the area of the second region 10b. Note that the emission intensity of each region can be changed by changing the area of each region or the number of light emitting elements 2a and 2b. Thereby, the emission intensity ratio between the first region 10a and the second region 10b can be adjusted to obtain a desired color tone. For example, in order to increase the yellowness, the light emission of the yellow phosphor region may be increased. Moreover, it is preferable to arrange | position the area | region of the fluorescent substance of the one where the conversion efficiency with respect to light emission of the 1st light emitting element 2a is low, and requires a larger amount of fluorescent substance in the center vicinity of the light-emitting device 100, and arrange | positions inside. Is preferred.

また、前記したように発光波長の異なる第１発光素子２ａと第２発光素子２ｂは、Ｖｆも異なる傾向にあるため、直列接続の全ての列に第１発光素子２ａと第２発光素子２ｂが含まれることが好ましい。これによって、直列接続された各列における発光素子のＶｆの平均値の差を緩和でき、各列に流れる電流の差を緩和できるため、直列接続の列間における発光強度のムラを低減でき、発光装置１００の色ムラを低減できる。このように直列接続の全ての列に第１発光素子２ａと第２発光素子２ｂが含まれる配置とするためには、図２に示すように第２発光素子２ｂが配置される第１領域１０ａを外側とし、直列接続の全ての列において第１発光素子２ａと第２発光素子２ｂとを同じ割合で配置することが好ましい。 Further, as described above, the first light emitting element 2a and the second light emitting element 2b having different emission wavelengths tend to have different V f , and therefore the first light emitting element 2a and the second light emitting element 2b are arranged in all the columns connected in series. Is preferably included. As a result, the difference in the average value of V f of the light emitting elements in each column connected in series can be relaxed, and the difference in the current flowing in each column can be relaxed, so that unevenness in emission intensity between the columns connected in series can be reduced. Color unevenness of the light emitting device 100 can be reduced. In order to achieve an arrangement in which the first light emitting element 2a and the second light emitting element 2b are included in all the columns connected in series as described above, the first region 10a in which the second light emitting element 2b is arranged as shown in FIG. It is preferable that the first light emitting element 2a and the second light emitting element 2b are arranged in the same ratio in all the columns connected in series.

＜導電部材（正極および負極）＞
導電部材４０は正極３および負極４を構成するものであり、基材１上の複数の発光素子２ａ，２ｂ等の電子部品と、外部電源とを電気的に接続し、これらの電子部品に対して外部電源からの電圧を印加するためのものである。すなわち、導電部材４０（正極３および負極４）は、外部から通電させるための電極、またはその一部としての役割を担うものである。 <Conductive members (positive electrode and negative electrode)>
The conductive member 40 constitutes the positive electrode 3 and the negative electrode 4, and electrically connects the electronic components such as the plurality of light emitting elements 2 a and 2 b on the substrate 1 and an external power source to the electronic components. For applying a voltage from an external power source. That is, the conductive member 40 (the positive electrode 3 and the negative electrode 4) plays a role as an electrode for energizing from the outside or a part thereof.

正極３および負極４は、図２に示すように略矩形状のパッド部（給電部）３ａ，４ａと、線状の配線部３ｂ，４ｂと、を有しており、パッド部３ａ，４ａに印加された電圧が配線部３ｂ，４ｂを介して複数の発光素子２ａ，２ｂからなる発光部へと印加されるように構成されている。パッド部３ａ，４ａは、外部電源からの電圧が印加されるためのものである。パッド部３ａ，４ａは、図２に示すように、基材１上において対向する位置に、一対で形成されている。そして、パッド部３ａ，４ａは、導電性のワイヤＷによって、図示しない外部電源と電気的に接続されている。   As shown in FIG. 2, the positive electrode 3 and the negative electrode 4 have substantially rectangular pad portions (feeding portions) 3a and 4a and linear wiring portions 3b and 4b. The pad portions 3a and 4a The applied voltage is configured to be applied to the light-emitting portion including the plurality of light-emitting elements 2a and 2b via the wiring portions 3b and 4b. The pad portions 3a and 4a are for applying a voltage from an external power source. As shown in FIG. 2, the pad portions 3 a and 4 a are formed in a pair at positions facing each other on the substrate 1. The pad portions 3a and 4a are electrically connected to an external power source (not shown) by a conductive wire W.

配線部３ｂ，４ｂは、外部電源からパッド部３ａ，４ａに印加された電圧を、実装領域１ａ上の発光素子２ａ，２ｂへと伝達するためのものである。配線部３ｂ，４ｂは、図２に示すように、パッド部３ａ，４ａから延出するように形成されるとともに、第１領域１０ａの周囲の一部に沿って形成されることで略Ｌ字状に形成されている。   The wiring portions 3b and 4b are for transmitting the voltage applied to the pad portions 3a and 4a from the external power source to the light emitting elements 2a and 2b on the mounting region 1a. As shown in FIG. 2, the wiring portions 3b and 4b are formed so as to extend from the pad portions 3a and 4a, and are formed along a part of the periphery of the first region 10a so as to be substantially L-shaped. It is formed in a shape.

正極３および負極４を構成する導電部材４０の素材は、Ａｕを用いることが好ましい。これは、後記するように、ワイヤＷの材料として熱伝導性が向上したＡｕを用いた場合に、同素材であるワイヤＷを強固に接合することができるためである。正極３および負極４を構成する導電部材４０の形成方法としては、前記した実装領域１ａ上の金属膜の形成方法と同様に、電解めっきまたは無電解めっきで形成することが好ましい。なお、符号ＡＭはパッド部３ａが正極３であることを示すアノードマーク、符号ＣＭはパッド部４ａが負極４であることを示すカソードマーク、符号８０は発光装置１００の温度計測ポイントであり、これらやその他の導電部位もめっき等により形成される。   Au is preferably used as the material of the conductive member 40 constituting the positive electrode 3 and the negative electrode 4. This is because, as will be described later, when Au having improved thermal conductivity is used as the material of the wire W, the wire W that is the same material can be firmly bonded. As a method for forming the conductive member 40 constituting the positive electrode 3 and the negative electrode 4, it is preferable to form the conductive member 40 by electrolytic plating or electroless plating, similarly to the method for forming the metal film on the mounting region 1 a described above. Note that symbol AM is an anode mark indicating that the pad portion 3a is the positive electrode 3, symbol CM is a cathode mark indicating that the pad portion 4a is the negative electrode 4, and symbol 80 is a temperature measurement point of the light emitting device 100. And other conductive parts are also formed by plating or the like.

＜光反射部材＞
光反射部材６ａ，６ｂは、第１光反射部材６ａと、第２光反射部材６ｂとからなる。
図１および図２に示すように、第１光反射部材６ａは、基材１上において第１領域１０ａを囲うように四角枠状に形成されることが好ましい。このように第１領域１０ａの周囲を囲うように第１光反射部材６ａを形成することで、第１領域１０ａの周囲（外側）に向う光も第１光反射部材６ａによって反射することができる。従って、出射光のロスを軽減することができ、発光装置１００の光の取り出し効率を向上させることができる。 <Light reflecting member>
The light reflecting members 6a and 6b include a first light reflecting member 6a and a second light reflecting member 6b.
As shown in FIGS. 1 and 2, the first light reflecting member 6 a is preferably formed in a square frame shape so as to surround the first region 10 a on the substrate 1. By forming the first light reflecting member 6a so as to surround the first region 10a in this way, the light directed to the periphery (outside) of the first region 10a can also be reflected by the first light reflecting member 6a. . Therefore, loss of emitted light can be reduced, and light extraction efficiency of the light emitting device 100 can be improved.

第２光反射部材６ｂは、第１領域１０ａと、第２領域１０ｂとの間に設けられ、これらを区切る壁として形成される。第２光反射部材６ｂによって第１領域１０ａと第２領域１０ｂを区切ることで、例えば、第１領域１０ａから出射した短波の光が、第２領域１０ｂの第２蛍光体に吸収されることが防止される。具体的には、例えば、第１蛍光体が黄色蛍光体であり、第２蛍光体が赤色蛍光体である場合、第２領域１０ｂの赤色蛍光体により、第１領域１０ａの黄色の発光が吸収されることが防止される。   The 2nd light reflection member 6b is provided between the 1st area | region 10a and the 2nd area | region 10b, and is formed as a wall which divides these. By dividing the first region 10a and the second region 10b by the second light reflecting member 6b, for example, short-wave light emitted from the first region 10a is absorbed by the second phosphor in the second region 10b. Is prevented. Specifically, for example, when the first phosphor is a yellow phosphor and the second phosphor is a red phosphor, the yellow phosphor of the first region 10a is absorbed by the red phosphor of the second region 10b. Is prevented.

また、第１光反射部材６ａと同様に、発光素子２ａ，２ｂから出射した光を第２光反射部材６ｂによって反射することができ、光の取り出し効率を向上させることができる。さらには、第２光反射部材６ｂを設けることにより、発光装置１００の製造において、第２光反射部材６ｂの内側に第２封止部材７ｂを充填し、外側かつ第１光反射部材６ａの内側に第１封止部材７ａを充填することで、第１領域１０ａおよび第２領域１０ｂを同心形状に配置した発光装置１００を容易に製造することができる。なお、第１光反射部材６ａと、第２光反射部材６ｂは、両方設けてもよいし、いずれか一方のみ設けてもよい。また、光反射部材６ａ，６ｂは、平面視で略矩形が好ましい。これによって、複数の発光素子２ａ，２ｂを効率的に載置することができる。   Similarly to the first light reflecting member 6a, the light emitted from the light emitting elements 2a and 2b can be reflected by the second light reflecting member 6b, and the light extraction efficiency can be improved. Furthermore, by providing the second light reflecting member 6b, in the manufacture of the light emitting device 100, the second sealing member 7b is filled inside the second light reflecting member 6b, and outside and inside the first light reflecting member 6a. By filling the first sealing member 7a, the light emitting device 100 in which the first region 10a and the second region 10b are arranged concentrically can be easily manufactured. Both the first light reflecting member 6a and the second light reflecting member 6b may be provided, or only one of them may be provided. The light reflecting members 6a and 6b are preferably substantially rectangular in plan view. Thereby, the plurality of light emitting elements 2a and 2b can be efficiently mounted.

光反射部材６ａ，６ｂの材料としては、絶縁材料を用いることが好ましい。また、ある程度の強度を確保するために、例えば熱硬化性樹脂、熱可塑性樹脂等を用いることができる。より具体的には、フェノール樹脂、エポキシ樹脂、ＢＴレジンや、ＰＰＡやシリコン樹脂等が挙げられる。また、これらの母体となる樹脂に、発光素子２ａ，２ｂからの光を吸収しにくく、かつ母体となる樹脂に対する屈折率差の大きい反射部材（例えばＴｉＯ２，Ａｌ２Ｏ３，ＺｒＯ２，ＭｇＯ）等の粉末を分散することで、効率よく光を反射させることができる。なお、光反射部材６ａ，６ｂのサイズは特に限定されず、目的および用途に応じて適宜選択することができる。 As a material for the light reflecting members 6a and 6b, an insulating material is preferably used. Moreover, in order to ensure a certain amount of strength, for example, a thermosetting resin, a thermoplastic resin, or the like can be used. More specifically, a phenol resin, an epoxy resin, a BT resin, PPA, a silicon resin, etc. are mentioned. In addition, a reflective member (for example, TiO 2 , Al 2 O 3 , ZrO 2 , MgO) that hardly absorbs light from the light emitting elements 2 a and 2 b and has a large refractive index difference with respect to the base resin is absorbed in the base resin. ) And the like can be dispersed to efficiently reflect light. The size of the light reflecting members 6a and 6b is not particularly limited, and can be appropriately selected according to the purpose and application.

＜封止部材＞
封止部材７ａ，７ｂは、蛍光体を含有するものであり、基材１に配置された発光素子２ａ，２ｂおよびワイヤＷ等を、塵芥、水分、外力等から保護するための部材である。封止部材７ａ，７ｂは、第１蛍光体を含有して基材１上に第１領域１０ａを形成する第１封止部材７ａと、第１蛍光体の発光波長と異なる発光波長の第２蛍光体を含有して基材１上に第２領域１０ｂを形成する第２封止部材７ｂと、を含む。一例として、第１蛍光体の発光波長が第２蛍光体の発光波長よりも短い場合、具体的には、第１蛍光体が黄色蛍光体であり、第２蛍光体が赤色蛍光体である場合を挙げられる。 <Sealing member>
The sealing members 7a and 7b contain phosphors, and are members for protecting the light emitting elements 2a and 2b and the wires W arranged on the substrate 1 from dust, moisture, external force, and the like. The sealing members 7a and 7b include a first sealing member 7a that contains the first phosphor and forms the first region 10a on the substrate 1, and a second emission wavelength different from the emission wavelength of the first phosphor. And a second sealing member 7b that contains a phosphor and forms the second region 10b on the substrate 1. As an example, when the emission wavelength of the first phosphor is shorter than the emission wavelength of the second phosphor, specifically, when the first phosphor is a yellow phosphor and the second phosphor is a red phosphor. Can be mentioned.

図２に示すように、本実施形態では、第１領域１０ａおよび第２領域１０ｂは、第２領域１０ｂを内側にして同心形状に形成されている。すなわち、第２領域１０ｂ（第２封止部材７ｂ）が基材１の中央部に略矩形状に設けられており、この第２領域１０ｂを取り囲むように、第１領域１０ａ（第１封止部材７ａ）が第２領域１０ｂから所定の間隔を空けて、つまり第２光反射部材６ｂに区切られて、所定の幅で略矩形環状（四角枠状）に形成されている。   As shown in FIG. 2, in the present embodiment, the first region 10a and the second region 10b are formed concentrically with the second region 10b inside. That is, the second region 10b (second sealing member 7b) is provided in a substantially rectangular shape at the center of the substrate 1, and the first region 10a (first sealing member) is surrounded by the second region 10b. The member 7a) is formed at a predetermined interval from the second region 10b, that is, divided by the second light reflecting member 6b, and is formed in a substantially rectangular ring shape (square frame shape) with a predetermined width.

第１封止部材７ａは、第１領域１０ａが形成される箇所の第１発光素子２ａおよび第２発光素子２ｂを被覆している。すなわち、第１領域１０ａにおいては、この領域に配置された発光素子の少なくとも一部が第２発光素子２ｂである。一方、第２封止部材７ｂは、第２領域１０ｂが形成される箇所の第１発光素子２ａを被覆している。すなわち、第２領域１０ｂにおいては、この領域に配置された発光素子は、すべてが第１発光素子２ａである。このように、第１領域１０ａと第２領域１０ｂに分離することで、第２蛍光体（例えば赤色蛍光体）による第１蛍光体（例えば黄色蛍光体）の発光の吸収を抑制することができる。さらに、例えば、黄色蛍光体を含む第１領域１０ａにおいて、青緑色（または緑色）の第２発光素子２ｂを一部に配置することで演色性を向上させることができる。   The first sealing member 7a covers the first light emitting element 2a and the second light emitting element 2b where the first region 10a is formed. That is, in the first region 10a, at least a part of the light emitting elements arranged in this region is the second light emitting element 2b. On the other hand, the second sealing member 7b covers the first light emitting element 2a where the second region 10b is formed. In other words, in the second region 10b, all of the light emitting elements arranged in this region are the first light emitting elements 2a. Thus, by separating the first region 10a and the second region 10b, absorption of light emission of the first phosphor (for example, a yellow phosphor) by the second phosphor (for example, a red phosphor) can be suppressed. . Furthermore, for example, in the first region 10a including the yellow phosphor, the color rendering can be improved by arranging the blue-green (or green) second light-emitting element 2b in part.

また、青緑色（または緑色）の第２発光素子２ｂは、黄色の第１蛍光体をほとんど励起しないので、第２発光素子２ｂの発光がそのまま取り出される。さらに、黄色蛍光体を含む第１領域１０ａであれば、黄色蛍光体は第２発光素子２ｂの発光色に近いため、第２発光素子２ｂの発光色に近い光をそのまま出射できる。一方、赤色の蛍光体を含む第２領域１０ｂに第２発光素子２ｂを配置すると、青緑色（または緑色）と赤色が混合された混合光が出射され、色のバランスが変化する。   Further, since the blue-green (or green) second light emitting element 2b hardly excites the yellow first phosphor, the light emitted from the second light emitting element 2b is extracted as it is. Further, if the first region 10a includes a yellow phosphor, the yellow phosphor is close to the light emission color of the second light-emitting element 2b, and therefore light close to the light emission color of the second light-emitting element 2b can be emitted as it is. On the other hand, when the second light emitting element 2b is disposed in the second region 10b including the red phosphor, mixed light in which blue green (or green) and red are mixed is emitted, and the color balance changes.

封止部材７ａ，７ｂの材料としては、発光素子２ａ，２ｂからの光を透過可能な透光性を有するものが好ましい。具体的な材料としては、シリコン樹脂、エポキシ樹脂、ユリア樹脂等を挙げることができる。また、このような材料に加えて、所望に応じて着色剤、光拡散剤、フィラー等を含有させることもできる。   As a material of the sealing members 7a and 7b, a material having translucency capable of transmitting light from the light emitting elements 2a and 2b is preferable. Specific examples of the material include silicon resin, epoxy resin, and urea resin. In addition to such materials, a colorant, a light diffusing agent, a filler, and the like can be contained as desired.

なお、封止部材７ａ，７ｂは、単一の部材で形成することもできるし、あるいは、２層以上の複数の層として形成することもできる。また、封止部材７ａ，７ｂの充填量は、発光素子２ａ，２ｂ、ワイヤＷ等が被覆される量であればよい。また、封止部材７ａ，７ｂにレンズ機能をもたせる場合は、封止部材７ａ，７ｂの表面を盛り上がらせて砲弾型形状や凸レンズ形状としてもよい。   The sealing members 7a and 7b can be formed as a single member, or can be formed as a plurality of layers of two or more layers. The filling amount of the sealing members 7a and 7b may be an amount that covers the light emitting elements 2a and 2b, the wires W, and the like. When the sealing members 7a and 7b are provided with a lens function, the surfaces of the sealing members 7a and 7b may be raised so as to have a bullet shape or a convex lens shape.

＜蛍光体＞
蛍光体は、波長変換部材として発光素子２ａ，２ｂからの光の少なくとも一部を吸収して異なる波長を有する光を発する蛍光部材である。蛍光体は、第１封止部材７ａ中に含有される第１蛍光体と、第２封止部材７ｂ中に含有される、第１蛍光体の発光波長と異なる発光波長の第２蛍光体とからなる。 <Phosphor>
The phosphor is a fluorescent member that emits light having different wavelengths by absorbing at least part of light from the light emitting elements 2a and 2b as a wavelength conversion member. The phosphor includes a first phosphor contained in the first sealing member 7a, a second phosphor having an emission wavelength different from the emission wavelength of the first phosphor, contained in the second sealing member 7b. Consists of.

蛍光体の材料としては、例えばイットリウム、アルミニウムおよびガーネットを混合したＹＡＧ系蛍光体や、Ｅｕ，Ｃｅ等のランタノイド系元素で主に賦活される、窒化物系蛍光体、酸窒化物系蛍光体等を用いることができる。そして、第１蛍光体の発光波長が第２蛍光体の発光波長よりも短い場合、第１蛍光体としては、例えば、短波側の蛍光体であり黄色を発光するＹＡＧ系蛍光体が挙げられ、第２蛍光体としては、長波側の蛍光体であり赤色を発光するＳＣＡＳＮ、ＣａＡｌＳｉＮ３：ＥｕのようなＣＡＳＮ系蛍光体や、ＳｒＡｌＳｉＮ３：Ｅｕが挙げられる。 Examples of the phosphor material include a YAG phosphor mixed with yttrium, aluminum and garnet, a nitride phosphor, an oxynitride phosphor and the like mainly activated by a lanthanoid element such as Eu or Ce. Can be used. When the emission wavelength of the first phosphor is shorter than the emission wavelength of the second phosphor, examples of the first phosphor include a YAG phosphor that emits yellow light, which is a short-wave phosphor. Examples of the second phosphor include a CASN phosphor such as SCASN, CaAlSiN 3 : Eu, which is a long-wave side phosphor and emits red light, and SrAlSiN 3 : Eu.

＜ワイヤ＞
ワイヤＷは、発光素子２ａ，２ｂ等の電子部品と、正極３、負極４等を電気的に接続するための導電性の配線である。ワイヤＷの材料としては、Ａｕ、Ｃｕ（銅）、Ｐｔ（白金）、Ａｌ（アルミニウム）等の金属、および、それらの合金を用いたものが挙げられるが、特に、熱伝導率等に優れたＡｕを用いるのが好ましい。なお、ワイヤＷの径は特に限定されず、目的および用途に応じて適宜選択することができる。 <Wire>
The wire W is a conductive wiring for electrically connecting electronic components such as the light emitting elements 2a and 2b and the positive electrode 3, the negative electrode 4, and the like. Examples of the material of the wire W include those using metals such as Au, Cu (copper), Pt (platinum), and Al (aluminum), and alloys thereof, and in particular, excellent in thermal conductivity and the like. It is preferable to use Au. In addition, the diameter of the wire W is not specifically limited, It can select suitably according to the objective and a use.

ここで、第２光反射部材６ｂを介して隣り合った発光素子２ａ，２ｂのペアのうち少なくとも一部が第２光反射部材６ｂを貫通したワイヤＷにて接続されていることが好ましい。すなわち、第１領域１０ａの発光素子２ａ，２ｂと第２領域１０ｂの発光素子２ａ，２ｂとがワイヤによって接続されており、このワイヤＷが第２光反射部材６ｂに埋め込まれていることが好ましい。このような構成により、ワイヤＷの曲がり具合が小さいまま隣接する発光素子２ａ，２ｂ間の距離を小さくすることができる。また、封止部材７ａ，７ｂは、発光装置１００の駆動時の熱によって膨張するが、ワイヤＷが第２光反射部材６ｂに埋め込まれて固定されているため、第２封止部材７ｂの応力の影響を受け難く、ワイヤＷが切断されにくい。   Here, it is preferable that at least a part of the pair of light emitting elements 2a and 2b adjacent to each other via the second light reflecting member 6b is connected by a wire W penetrating the second light reflecting member 6b. That is, it is preferable that the light emitting elements 2a and 2b in the first region 10a and the light emitting elements 2a and 2b in the second region 10b are connected by wires, and the wires W are embedded in the second light reflecting member 6b. . With such a configuration, the distance between the adjacent light emitting elements 2a and 2b can be reduced while the degree of bending of the wire W is small. In addition, the sealing members 7a and 7b expand due to heat when the light emitting device 100 is driven. However, since the wire W is embedded and fixed in the second light reflecting member 6b, the stress of the second sealing member 7b. The wire W is difficult to be cut.

次に、図３を参照して本発明の効果について説明する。
図３において、Ａは本願の発明の発光装置１００、ＢはＹＡＧ系蛍光体およびＳＣＡＳＮ系蛍光体に、クロロシリケートを加えた３種の蛍光体を単一の封止樹脂中に混合し、これによって青色発光素子を封止した従来の発光装置（３ブレンド型の発光装置）についてのデータである。なお、発光装置１００は、第１封止部材７ａにＹＡＧ系蛍光体、第２封止部材７ｂにＳＣＡＳＮ系蛍光体を含有し、第１発光素子２ａとして青色発光素子、第２発光素子２ｂとして青緑色発光素子を用いたものである。各蛍光体および青色発光素子は、従来の発光装置と同じものを用いている。また、Ｒａは平均演色評価数、Ｒ９は特殊演色評価数（赤）である。 Next, the effect of the present invention will be described with reference to FIG.
In FIG. 3, A is a light emitting device 100 of the present invention, B is a YAG phosphor and a SCASN phosphor, and three phosphors added with chlorosilicate are mixed in a single sealing resin. This is data on a conventional light emitting device (three-blend type light emitting device) in which a blue light emitting element is sealed. The light emitting device 100 includes a YAG phosphor in the first sealing member 7a, and a SCASN phosphor in the second sealing member 7b. The blue light emitting element and the second light emitting element 2b are used as the first light emitting element 2a. A blue-green light emitting element is used. Each phosphor and blue light emitting element is the same as the conventional light emitting device. Ra is an average color rendering index and R9 is a special color rendering index (red).

図３（ａ）に示すように、αにより囲った部分である緑色の光の波長（４９０ｎｍ〜５７０ｎｍ）の箇所において、本発明の発光装置では、第２発光素子２ｂとして用いた青緑色発光素子の発光波長が反映され、５２０ｎｍ付近に強い発光強度を示しており、つまり従来の発光装置よりも短波側において強い発光強度を示している。クロロシリケートを入れなくても、従来の発光装置と比べて、５５０ｎｍ付近でわずかに相対発光強度が低下しただけである。また、従来の発光装置と、曲線がほぼ一致している。５５０ｎｍ付近における発光強度の低下は、５２０ｎｍ付近における発光強度の上昇で補われており、図３（ｂ）に示すように、演色性は従来の発光装置と同程度である。さらに従来の発光装置に比べて、発光効率（ｌｍ／ｗ）が約１５％向上している。
このように、本発明の発光装置は、従来の３ブレンド型の発光装置に比べて演色性がほとんど低下せず、ＳＣＡＳＮ系蛍光体にＹＡＧ系蛍光体の発光が吸収されていないため、発光効率（ｌｍ／ｗ）が向上したものとなる。 As shown in FIG. 3A, a blue-green light-emitting element used as the second light-emitting element 2b in the light-emitting device of the present invention at a portion of the wavelength of green light (490 nm to 570 nm) surrounded by α. The emission wavelength is reflected, showing a strong emission intensity near 520 nm, that is, a stronger emission intensity on the short wave side than the conventional light emitting device. Even if chlorosilicate was not added, the relative light emission intensity was only slightly reduced in the vicinity of 550 nm as compared with the conventional light emitting device. Further, the curves are almost the same as those of the conventional light emitting device. The decrease in the emission intensity near 550 nm is compensated by the increase in the emission intensity near 520 nm. As shown in FIG. 3B, the color rendering is comparable to that of the conventional light emitting device. Furthermore, the luminous efficiency (lm / w) is improved by about 15% compared to the conventional light emitting device.
As described above, the light emitting device of the present invention is hardly deteriorated in color rendering as compared with the conventional three blend type light emitting device, and the light emission of the YAG phosphor is not absorbed by the SCASN phosphor. (Lm / w) is improved.

≪発光装置の製造方法≫
次に、本発明の実施形態に係る発光装置の製造方法について、ここでは図１、２の形態のものを例にとり、適宜、図面を参照しながら説明する。 ≪Method for manufacturing light emitting device≫
Next, a method for manufacturing a light emitting device according to an embodiment of the present invention will be described with reference to the drawings as appropriate, taking the embodiment of FIGS.

本発明に係る発光装置１００の製造方法は、ダイボンディング工程と、封止部材充填工程と、を含む。また、本製造方法の前提として、ダイボンディング工程の前に、基材作製工程を含む。さらにここでは、めっき工程、ワイヤボンディング工程、光反射部材形成工程を含む。以下、各工程について説明する。なお、発光装置１００の構成については前記説明したとおりであるので、ここでは適宜、説明を省略する。   The method for manufacturing the light emitting device 100 according to the present invention includes a die bonding step and a sealing member filling step. Moreover, as a premise of this manufacturing method, the base material preparation process is included before the die bonding process. Furthermore, here, a plating process, a wire bonding process, and a light reflecting member forming process are included. Hereinafter, each step will be described. Note that since the configuration of the light emitting device 100 is as described above, the description thereof will be omitted as appropriate.

＜基材作製工程＞
基材作製工程は、めっき用配線が形成された基材１を作製する工程である。基材作製工程では、基材１上の実装領域１ａや、正極３および負極４となる部位を所定の形状にパターニングすることで形成する。また、基材作製工程では、電解めっきによって基材１上の実装領域１ａに金属膜を形成するためのめっき用配線を形成する。 <Base material production process>
The base material manufacturing process is a process of manufacturing the base material 1 on which the wiring for plating is formed. In the base material manufacturing step, the mounting region 1a on the base material 1 and the portions to be the positive electrode 3 and the negative electrode 4 are formed by patterning into a predetermined shape. Further, in the base material preparation step, a plating wiring for forming a metal film on the mounting region 1a on the base material 1 is formed by electrolytic plating.

＜めっき工程＞
めっき工程は、前記めっき配線が形成された基材１上に、少なくとも正極３および負極４を構成する導電部材４０を形成する工程である。めっき工程では、好ましくは無電解めっきにより正極３および負極４を構成する導電部材４０を形成するとともに、基材１上の実装領域１ａ上に、電解めっきにより金属膜を形成する。また、正極３および負極４を形成するときと同様の工程でその他の導電部位が形成される。 <Plating process>
The plating step is a step of forming the conductive member 40 constituting at least the positive electrode 3 and the negative electrode 4 on the base material 1 on which the plated wiring is formed. In the plating step, the conductive member 40 constituting the positive electrode 3 and the negative electrode 4 is preferably formed by electroless plating, and a metal film is formed on the mounting region 1a on the substrate 1 by electrolytic plating. In addition, other conductive parts are formed in the same process as when the positive electrode 3 and the negative electrode 4 are formed.

＜ダイボンディング工程＞
ダイボンディング工程は、基材１上（ここでは金属膜上）に、第１領域１０ａが形成される部位に第１発光素子２ａおよび第２発光素子２ｂを載置するとともに、第２領域１０ｂが形成される部位に第１発光素子２ａを載置する工程である。すなわち、この工程において基材１上の所定位置に第１発光素子２ａおよび第２発光素子２ｂを配置する。 <Die bonding process>
In the die bonding step, the first light-emitting element 2a and the second light-emitting element 2b are placed on the base material 1 (here, on the metal film) at a portion where the first area 10a is formed, and the second area 10b In this step, the first light emitting element 2a is placed on the portion to be formed. That is, in this step, the first light emitting element 2a and the second light emitting element 2b are arranged at predetermined positions on the substrate 1.

発光素子２ａ，２ｂは、例えば樹脂や半田ペースト等の接合部材により、基材１上の金属膜と接合する。なお、発光素子２ａ，２ｂの裏面には、予め、フラックスを塗布しておいてもよい。ここで、接合部材は、金属膜と発光素子２ａ，２ｂとの間に介在するように設ければよいため、金属膜のうち、発光素子２ａ，２ｂを載置する領域に設けてもよく、発光素子２ａ，２ｂ側に設けてもよい。あるいは、その両方に設けてもよい。   The light emitting elements 2a and 2b are joined to the metal film on the substrate 1 by a joining member such as a resin or a solder paste. In addition, you may apply | coat a flux previously to the back surface of light emitting element 2a, 2b. Here, the bonding member may be provided so as to be interposed between the metal film and the light emitting elements 2a and 2b. Therefore, the bonding member may be provided in a region where the light emitting elements 2a and 2b are placed, You may provide in the light emitting elements 2a and 2b side. Or you may provide in both.

液状またはペースト状の接合部材を金属膜上に設ける場合、粘度等に応じてポッティング法、印刷法、転写法等の方法から適宜選択することができる。そして、接合部材を設けた箇所に発光素子２ａ，２ｂを載置する。なお、固体状の接合部材を用いる場合も、固体状の接合部材を載置した後、液状またはペースト状の接合部材を用いる場合と同じ要領で、金属膜上に発光素子２ａ，２ｂを載置することができる。そして発光素子２ａ，２ｂを載置した後に、接合部材を加熱し、発光素子２ａ，２ｂを基材１上（金属膜上）に接合する。   When the liquid or paste-like joining member is provided on the metal film, it can be appropriately selected from methods such as a potting method, a printing method, and a transfer method according to the viscosity and the like. And the light emitting elements 2a and 2b are mounted in the location which provided the joining member. When using a solid joining member, the light emitting elements 2a and 2b are placed on the metal film in the same manner as when using a liquid or paste joining member after placing the solid joining member. can do. And after mounting light emitting element 2a, 2b, a joining member is heated and light emitting element 2a, 2b is joined on the base material 1 (on metal film).

＜ワイヤボンディング工程＞
ワイヤボンディング工程は、ダイボンディング工程の後に、発光素子２ａ，２ｂと、この発光素子２ａ，２ｂに電圧を印加する導電部材４０とをワイヤＷによって電気的に接続する工程である。すなわち、導電部材４０の正極３と、発光素子２ａ，２ｂ上部にある電極端子（パッド電極）とを、ワイヤＷで電気的に接続する工程である。同じく、発光素子２ａ，２ｂ上部にある電極端子（パッド電極）と導電部材４０の負極４とを、ワイヤＷで電気的に接続する工程である。さらにこの工程では、複数の発光素子２ａ，２ｂを、それぞれ電極端子（パッド電極）を介して接続する。ワイヤＷの接続方法は、特に限定されるものではなく、通常用いられる方法で行えばよい。 <Wire bonding process>
The wire bonding step is a step of electrically connecting the light emitting elements 2a and 2b and the conductive member 40 for applying a voltage to the light emitting elements 2a and 2b through the wire W after the die bonding step. That is, it is a step of electrically connecting the positive electrode 3 of the conductive member 40 and the electrode terminal (pad electrode) on the light emitting elements 2a and 2b by the wire W. Similarly, this is a step of electrically connecting the electrode terminals (pad electrodes) on the light emitting elements 2 a and 2 b and the negative electrode 4 of the conductive member 40 with the wire W. Further, in this step, the plurality of light emitting elements 2a and 2b are connected via electrode terminals (pad electrodes), respectively. The connection method of the wire W is not particularly limited, and may be a commonly used method.

＜光反射部材形成工程＞
光反射部材形成工程は、ダイボンディング工程と封止部材充填工程との間に、第１領域１０ａが形成される箇所と第２領域１０ｂが形成される箇所の間に第２光反射部材６ｂを設ける工程である。またここでは、第１領域１０ａが形成される箇所の周囲に第１光反射部材６ａを設ける。すなわち、実装領域１ａの周縁に沿って、導電部材４０の一部、すなわち、少なくとも正極３および負極４の配線部３ｂ，４ｂの一部を被覆するように第１光反射部材６ａを形成する。また、第１封止部材７ａと第２封止部材７ｂが仕切られるように、所定位置に第２光反射部材６ｂを設ける。なお、第１光反射部材６ａと第２光反射部材６ｂはどちらを先に形成してもよく、同時に形成してもよい。また、いずれか一方のみ形成してもよい。 <Light reflecting member forming step>
In the light reflecting member forming step, between the die bonding step and the sealing member filling step, the second light reflecting member 6b is disposed between the portion where the first region 10a is formed and the portion where the second region 10b is formed. It is a process of providing. Further, here, the first light reflecting member 6a is provided around the portion where the first region 10a is formed. That is, the first light reflecting member 6 a is formed along the periphery of the mounting region 1 a so as to cover a part of the conductive member 40, that is, at least a part of the wiring portions 3 b and 4 b of the positive electrode 3 and the negative electrode 4. Moreover, the 2nd light reflection member 6b is provided in a predetermined position so that the 1st sealing member 7a and the 2nd sealing member 7b may be partitioned off. Note that either the first light reflecting member 6a or the second light reflecting member 6b may be formed first, or may be formed simultaneously. Moreover, you may form only any one.

光反射部材６ａ，６ｂの形成は、例えば、固定された基材１の上側において、基材１に対して上下方向あるいは水平方向等に移動（可動）させることができる樹脂吐出装置（図示省略）を用いて行うことができる（特開２００９−１８２３０７号公報参照）。   The light reflecting members 6a and 6b are formed by, for example, a resin discharging device (not shown) that can be moved (moved) in the vertical direction or the horizontal direction with respect to the base material 1 above the fixed base material 1. (See JP 2009-182307 A).

＜封止部材充填工程＞
封止部材充填工程は、第１封止部材７ａによって第１領域１０ａが形成される部位の第１発光素子２ａおよび第２発光素子２ｂを被覆して第１領域１０ａを形成するとともに、第２封止部材７ｂによって第２領域１０ｂが形成される部位の第１発光素子２ａを被覆して第２領域１０ｂを形成する工程である。すなわち、ここでは、第１光反射部材６ａと第２光反射部材６ｂとの間に第１蛍光体を含有する第１封止部材７ａを充填し、かつ第２光反射部材６ｂの内側に、第２蛍光体を含有する第２封止部材７ｂを充填する。その後、加熱や光照射等によってこれらの部材を硬化することで、発光素子２ａ，２ｂ、金属膜およびワイヤＷ等を被覆する透光性の封止部材７ａ，７ｂを形成する。 <Sealing member filling process>
In the sealing member filling step, the first region 10a is formed by covering the first light emitting element 2a and the second light emitting element 2b where the first region 10a is formed by the first sealing member 7a. In this step, the second region 10b is formed by covering the first light emitting element 2a at the portion where the second region 10b is formed by the sealing member 7b. That is, here, the first sealing member 7a containing the first phosphor is filled between the first light reflecting member 6a and the second light reflecting member 6b, and inside the second light reflecting member 6b, The second sealing member 7b containing the second phosphor is filled. Thereafter, these members are cured by heating, light irradiation, or the like, thereby forming translucent sealing members 7a and 7b covering the light emitting elements 2a and 2b, the metal film, the wires W, and the like.

なお、第１封止部材７ａと第２封止部材７ｂはどちらを先に形成してもよく、同時に形成してもよい。また、封止部材７ａ，７ｂとして粘度の高い部材を用いれば、光反射部材６ａ，６ｂを設けなくても、蛍光体領域を容易に形成することができる。光反射部材６ａ，６ｂを設けない場合は、第１封止部材７ａおよび第２封止部材７ｂのうち、先に充填した部材を、後の部材を充填する前に硬化することが好ましい。これによって、先に充填した部材が後に充填する部材と混ざることを防止することができる。封止部材７ａ，７ｂの充填は、前記した樹脂吐出装置を用いることができる。   Note that either the first sealing member 7a or the second sealing member 7b may be formed first or at the same time. Further, if a member having a high viscosity is used as the sealing members 7a and 7b, the phosphor region can be easily formed without providing the light reflecting members 6a and 6b. In the case where the light reflecting members 6a and 6b are not provided, it is preferable that the first filled member of the first sealing member 7a and the second sealing member 7b is cured before filling the subsequent members. Thereby, it is possible to prevent the previously filled member from being mixed with the later filled member. The resin discharge device described above can be used for filling the sealing members 7a and 7b.

以上、本発明の実施形態について説明したが、本発明は前記実施形態に限定されるものではなく、本発明の趣旨を逸脱しない範囲で変更することができる。
すなわち、前記に示す発光装置の形態は、本発明の技術思想を具体化するための発光装置を例示するものであって、本発明は、発光装置を前記の形態に限定するものではない。また、特許請求の範囲に示される部材等を、実施の形態の部材に特定するものではない。特に、実施の形態に記載されている構成部品の寸法、材質、形状、その相対的配置等は、特定的な記載がない限りは、本発明の範囲をそれのみに限定する趣旨ではなく、単なる説明例にすぎない。
例えば、他の実施形態として以下の構成としてもよい。 As mentioned above, although embodiment of this invention was described, this invention is not limited to the said embodiment, It can change in the range which does not deviate from the meaning of this invention.
That is, the form of the light emitting device described above exemplifies the light emitting device for embodying the technical idea of the present invention, and the present invention does not limit the light emitting device to the above form. Moreover, the member etc. which are shown by a claim are not specified as the member of embodiment. In particular, the dimensions, materials, shapes, relative arrangements, and the like of the components described in the embodiments are not intended to limit the scope of the present invention only to the extent that there is no specific description. It is just an example.
For example, it is good also as the following structures as other embodiment.

［他の実施形態］
図４、５を参照して、他の実施形態に係る発光装置１０１，１０２について説明する。なお、前記した発光装置１００と同一構成のものについては同一の符号を付して、以下では主に相違点についてのみ説明する。 [Other Embodiments]
With reference to FIGS. 4 and 5, light-emitting devices 101 and 102 according to other embodiments will be described. In addition, the same code | symbol is attached | subjected about the thing same as the light-emitting device 100 mentioned above, and only a different point is demonstrated below below.

（他の実施形態１）
図４に示すように、発光装置１０１では、第１領域１０ａの一部が、蛍光体を含有しない透明部材７ｃからなる透明領域１１であり、透明領域１１に第２発光素子２ｂが配置されている。この場合、封止部材は、第１封止部材７ａ、第２封止部材７ｂ、および透明部材７ｃからなり、第１封止部材７ａが第１領域１０ａの一部を形成し、透明部材７ｃが第１領域１０ａの残りの一部を形成していることとなる。具体的には、図２を正面視した場合において、最上部および最下部に位置する第２発光素子２ｂが透明部材７ｃにより被覆されており、この部位で透明領域１１が形成されている。このように、第２発光素子２ｂが配置される領域を透明領域１１とすることで、第２発光素子２ｂからの発光が蛍光体によって光散乱されないので、光の取り出し効率を向上させることができ、発光効率を向上させることができる。そのため、出力の向上を図ることができる。なお、透明部材７ｃの材料としては、封止部材７ａ，７ｂと同様のものを用いることができる。 (Other embodiment 1)
As shown in FIG. 4, in the light emitting device 101, a part of the first region 10 a is a transparent region 11 made of a transparent member 7 c that does not contain a phosphor, and the second light emitting element 2 b is arranged in the transparent region 11. Yes. In this case, the sealing member includes a first sealing member 7a, a second sealing member 7b, and a transparent member 7c. The first sealing member 7a forms part of the first region 10a, and the transparent member 7c. Forms the remaining part of the first region 10a. Specifically, when FIG. 2 is viewed from the front, the second light emitting element 2b located at the uppermost part and the lowermost part is covered with the transparent member 7c, and the transparent region 11 is formed at this part. In this way, by setting the region where the second light emitting element 2b is disposed as the transparent region 11, light emission from the second light emitting element 2b is not scattered by the phosphor, so that the light extraction efficiency can be improved. , Luminous efficiency can be improved. Therefore, the output can be improved. In addition, as a material of the transparent member 7c, the thing similar to the sealing members 7a and 7b can be used.

発光装置１０１の製造方法としては、前記した発光装置１００の製造方法と同様にして、基材作製工程と、ダイボンディング工程と、封止部材充填工程と、をこの順で行なう。また、必要に応じて、めっき工程、ワイヤボンディング工程、光反射部材形成工程を行なう。そして、封止部材充填工程において、透明部材７ｃによって第２発光素子２ｂを被覆し、かつ第１封止部材７ａによって第１領域１０ａが形成される部位の第１発光素子２ａを被覆して第１領域１０ａを形成する。また、第２封止部材７ｂによって第２領域１０ｂが形成される部位の第１発光素子２ａに被覆して第２領域１０ｂを形成する。   As a manufacturing method of the light emitting device 101, the base material manufacturing step, the die bonding step, and the sealing member filling step are performed in this order in the same manner as the manufacturing method of the light emitting device 100 described above. Moreover, a plating process, a wire bonding process, and a light reflecting member forming process are performed as necessary. In the sealing member filling step, the transparent member 7c covers the second light emitting element 2b, and the first sealing member 7a covers the first light emitting element 2a where the first region 10a is formed. One region 10a is formed. Further, the second region 10b is formed by covering the first light emitting element 2a where the second region 10b is formed by the second sealing member 7b.

第１封止部材７ａ、第２封止部材７ｂ、および透明部材７ｃはどの順序で形成してもよく、同時に形成してもよい。例えば、まず透明部材７ｃを形成し、次に第１封止部材７ａ形成して第１領域１０ａを形成した後、第２封止部材７ｂを形成して第２領域１０ｂを形成することができる。また、図４に示すように、第２発光素子２ｂを最上部および最下部にライン状に配置することで、透明領域１１をライン状に形成することができるため、蛍光体領域の形成を容易に形成できる。このような透明部材７ｃの形成には前記した樹脂吐出装置を用いることが好ましい。また、第１封止部材７ａ、第２封止部材７ｂ、および透明部材７ｃのうち、先に充填した部材を、後の部材を充填する前に硬化することが好ましい。これによって、先に充填した部材が後に充填する部材と混ざることを防止することができる。なお、透明領域１１は複数形成してもよい。例えば、第２発光素子２ｂを１つずつ封止し、透明領域１１を複数形成してもよい。   The first sealing member 7a, the second sealing member 7b, and the transparent member 7c may be formed in any order, and may be formed simultaneously. For example, the transparent member 7c is formed first, and then the first sealing member 7a is formed to form the first region 10a, and then the second sealing member 7b is formed to form the second region 10b. . Further, as shown in FIG. 4, the transparent region 11 can be formed in a line by arranging the second light emitting elements 2b in a line at the uppermost part and the lowermost part, so that the phosphor region can be easily formed. Can be formed. It is preferable to use the resin discharge device described above for the formation of such a transparent member 7c. Of the first sealing member 7a, the second sealing member 7b, and the transparent member 7c, it is preferable to harden the previously filled member before filling the subsequent member. Thereby, it is possible to prevent the previously filled member from being mixed with the later filled member. A plurality of transparent regions 11 may be formed. For example, the second light emitting elements 2b may be sealed one by one to form a plurality of transparent regions 11.

（他の実施形態２）
図５に示すように、発光装置１０２では、発光装置１００では実装領域１ａが略矩形状であったのに対し、実装領域１ａが円形を呈している。そして、第１光反射部材６ａは、基材１上において実装領域１ａのうち第１領域（第１封止部材７ａ）を囲うように円状に形成されている。また、第２光反射部材６ｂは、第１領域（第１封止部材７ａ）と、第２領域（第２封止部材７ｂ）との間に設けられ、これらを区切る壁として円形に形成されている。また、封止部材７ａ，７ｂも円形に形成されている。このように、実装領域１ａを円形とすることで、発光装置１０２の周辺のどの方向から見ても、発光強度が均一となる。なお、図中の矢印は、発光が均一に進行することを模式的に示したものである。また、実装領域１ａは楕円形であってもよい。 (Other embodiment 2)
As shown in FIG. 5, in the light emitting device 102, the mounting region 1 a has a substantially rectangular shape in the light emitting device 100, whereas the mounting region 1 a has a circular shape. The first light reflecting member 6a is formed in a circular shape on the substrate 1 so as to surround the first region (first sealing member 7a) in the mounting region 1a. The second light reflecting member 6b is provided between the first region (first sealing member 7a) and the second region (second sealing member 7b), and is formed in a circle as a wall that divides them. ing. The sealing members 7a and 7b are also formed in a circular shape. In this way, by making the mounting region 1a circular, the light emission intensity becomes uniform when viewed from any direction around the light emitting device 102. In addition, the arrow in a figure shows typically that light emission advances uniformly. Further, the mounting area 1a may be oval.

その他、第１領域１０ａと第２領域１０ｂは隣接（密着）して設けられていてもよい。また、第１蛍光体の発光波長が前記第２蛍光体の発光波長よりも長いものであってもよい。さらに、基材１として、ここでは基板を用いた場合について説明したが、基材１としては樹脂パッケージ等でもよい。そして、載置する発光素子２ａ，２ｂの数は限定されるものではなく、第１領域１０ａに第１発光素子２ａと第２発光素子２ｂがそれぞれ１つ以上、第２領域１０ｂに第１発光素子２ａが１つ以上であればよい。また、発光素子２ａ，２ｂとして、ここではフェースアップ（ＦＵ）素子を用いた場合について説明したが、フェースダウン（ＦＤ）素子や対向電極構造の素子であってもよい。なお、発光素子や発光装置の形態によっては、光反射部材６ａ，６ｂ、導電部材４０、ワイヤＷ、金属膜等は備えない構成のものであってもよく、また、過大な電圧印加による素子破壊や性能劣化から保護するための保護素子を備える構成としてもよい。さらに、基材作製工程、めっき工程、ワイヤボンディング工程、光反射部材形成工程等を含まない製造方法であってもよい。   In addition, the first region 10a and the second region 10b may be provided adjacent (in close contact). The emission wavelength of the first phosphor may be longer than the emission wavelength of the second phosphor. Furthermore, although the case where the board | substrate was used as the base material 1 was demonstrated here, as the base material 1, a resin package etc. may be sufficient. The number of the light emitting elements 2a and 2b to be placed is not limited. One or more first light emitting elements 2a and 2nd light emitting elements 2b are provided in the first area 10a, and the first light emitting elements are provided in the second area 10b. What is necessary is just to have one or more elements 2a. Although the case where a face-up (FU) element is used here as the light-emitting elements 2a and 2b has been described, a face-down (FD) element or an element having a counter electrode structure may be used. Depending on the form of the light emitting element or the light emitting device, the light reflecting members 6a and 6b, the conductive member 40, the wire W, the metal film, etc. may not be provided, and the element is destroyed by applying an excessive voltage. It is good also as a structure provided with the protection element for protecting from performance degradation. Furthermore, the manufacturing method which does not include a base material preparation process, a plating process, a wire bonding process, a light reflecting member forming process, and the like may be used.

また、発光装置の製造方法においては、本発明を行うにあたり、前記各工程に悪影響を与えない範囲において、前記各工程の間あるいは前後に、前記した工程以外の工程を含めてもよい。例えば、基材を洗浄する基材洗浄工程や、ごみ等の不要物を除去する不要物除去工程や、発光素子や保護素子の載置位置を調整する載置位置調整工程等、他の工程を含めてもよい。   Further, in the method for manufacturing a light emitting device, in carrying out the present invention, steps other than the steps described above may be included between or before and after each step within a range that does not adversely affect each step. For example, other processes such as a substrate cleaning process for cleaning the substrate, an unnecessary object removing process for removing unnecessary substances such as dust, a mounting position adjusting process for adjusting the mounting position of the light emitting element and the protective element, etc. May be included.

１ 基材（基板）
１ａ 実装領域
２ａ 第１発光素子
２ｂ 第２発光素子
３ 正極
３ａ パッド部
３ｂ 配線部
４ 負極
４ａ パッド部
４ｂ 配線部
６ａ 第１光反射部材
６ｂ 第２光反射部材
７ａ 第１封止部材
７ｂ 第２封止部材
７ｃ 透明部材
１０ａ 第１領域
１０ｂ 第２領域
１１ 透明領域
２１ ｎ電極
２２ ｐ電極
４０ 導電部材
８０ 温度計測ポイント
１００，１０１，１０２ 発光装置
ＡＭ アノードマーク
ＣＭ カソードマーク
Ｗ ワイヤ 1 Base material (substrate)
1a Mounting area 2a First light emitting element 2b Second light emitting element 3 Positive electrode 3a Pad part 3b Wiring part 4 Negative electrode 4a Pad part 4b Wiring part 6a First light reflecting member 6b Second light reflecting member 7a First sealing member 7b Second Sealing member 7c Transparent member 10a First region 10b Second region 11 Transparent region 21 N electrode 22 P electrode 40 Conductive member 80 Temperature measurement points 100, 101, 102 Light emitting device AM Anode mark CM Cathode mark W Wire

Claims (10)

基材と、前記基材上に配置された複数の発光素子と、前記発光素子を被覆する封止部材と、を備える発光装置であって、
前記封止部材は、第１蛍光体を含有して前記基材上に第１領域を形成する第１封止部材と、前記第１蛍光体の発光波長と異なる発光波長の第２蛍光体を含有して前記基材上に第２領域を形成する第２封止部材と、を含み、
前記発光素子は、前記第１蛍光体および前記第２蛍光体を励起し、前記第１蛍光体および前記第２蛍光体の発光波長よりも短い波長を発光する第１発光素子と、前記第１発光素子の発光波長と前記第１蛍光体および前記第２蛍光体の発光波長との間の波長を発光する第２発光素子と、からなり、
前記第１領域には、前記第１発光素子および前記第２発光素子が配置され、前記第２領域には、前記第１発光素子が配置されており、
前記第１蛍光体の発光波長が前記第２蛍光体の発光波長よりも短く、
前記第２発光素子が前記第１発光素子よりも前記第１蛍光体を励起する割合が少ないことを特徴とする発光装置。 A light emitting device comprising: a base material; a plurality of light emitting elements disposed on the base material; and a sealing member that covers the light emitting element,
The sealing member includes a first sealing member containing a first phosphor and forming a first region on the substrate, and a second phosphor having an emission wavelength different from the emission wavelength of the first phosphor. A second sealing member containing and forming a second region on the substrate,
The light emitting element excites the first phosphor and the second phosphor to emit light having a wavelength shorter than the emission wavelength of the first phosphor and the second phosphor, and the first light emitting element. A second light emitting element that emits a wavelength between an emission wavelength of the light emitting element and an emission wavelength of the first phosphor and the second phosphor,
The first light emitting element and the second light emitting element are disposed in the first region, and the first light emitting element is disposed in the second region ,
The emission wavelength of the first phosphor is shorter than the emission wavelength of the second phosphor,
The light emitting device, wherein the second light emitting element excites the first phosphor less than the first light emitting element . 前記第１領域および前記第２領域が、前記第２領域を内側にして同心形状に形成されていることを特徴とする請求項１に記載の発光装置。 2. The light emitting device according to claim 1, wherein the first region and the second region are formed concentrically with the second region inside. 前記第１領域と、前記第２領域との間に光反射部材が設けられていることを特徴とする請求項１または請求項２に記載の発光装置。 Said first region, the light emitting device according to claim 1 or claim 2, characterized in that light reflecting member is provided between the second region. 前記複数の発光素子が前記基材上に縦列横列に整列して配置され、前記縦列横列のいずれかの列において、前記列毎に、全ての発光素子が第１発光素子または第２発光素子からなることを特徴とする請求項１から請求項３のいずれか一項に記載の発光装置。 The plurality of light emitting elements are arranged in a vertical row on the base material, and in any row of the vertical rows, all the light emitting devices are separated from the first light emitting device or the second light emitting device. It becomes luminous device according to any one of claims 1 to 3, characterized in. 前記第１発光素子と前記第２発光素子を含む列において、前記第１発光素子と前記第２発光素子とが、直列接続されていることを特徴とする請求項１から請求項４のいずれか一項に記載の発光装置。 In the column containing the second light emitting element and the first light emitting element, the first light emitting element and the second light-emitting element, any of claims 1 to 4, characterized in that connected in series The light emitting device according to one item. 前記直列接続された列が複数あり、１つの列における前記第１発光素子および前記第２発光素子の数が、前記複数の列毎に、互いに同数であることを特徴とする請求項５に記載の発光装置。 Said series connected columns are multiple, the number of the first light emitting element and the second light-emitting elements in one column, for each of the plurality of columns, according to claim 5, characterized in that the same number to each other Light-emitting device. 前記第１領域の一部が、蛍光体を含有しない透明部材からなる透明領域であり、前記透明領域に前記第２発光素子が配置されていることを特徴とする請求項１から請求項６のいずれか一項に記載の発光装置。 The part of said 1st area | region is a transparent area | region which consists of a transparent member which does not contain fluorescent substance, The said 2nd light emitting element is arrange | positioned at the said transparent area | region, The Claim 1-6 characterized by the above-mentioned. The light-emitting device as described in any one. 請求項１から請求項６のいずれか一項に記載の発光装置の製造方法であって、
基材上に、第１領域が形成される部位に第１発光素子および第２発光素子を載置するとともに、第２領域が形成される部位に第１発光素子を載置するダイボンディング工程と、
第１封止部材によって前記第１領域が形成される部位の第１発光素子および第２発光素子を被覆して第１領域を形成するとともに、第２封止部材によって前記第２領域が形成される部位の第１発光素子を被覆して第２領域を形成する封止部材充填工程と、を含むことを特徴とする発光装置の製造方法。 A method for manufacturing a light emitting device according to any one of claims 1 to 6 ,
A die bonding step of placing the first light-emitting element and the second light-emitting element on a portion where the first region is formed on the substrate, and placing the first light-emitting element on the portion where the second region is formed; ,
The first region is formed by covering the first light-emitting element and the second light-emitting element where the first region is formed by the first sealing member, and the second region is formed by the second sealing member. And a sealing member filling step of forming a second region by covering the first light emitting element of the portion to be manufactured. 請求項７に記載の発光装置の製造方法であって、
基材上に、第１領域が形成される部位に第１発光素子および第２発光素子を載置するとともに、第２領域が形成される部位に第１発光素子を載置するダイボンディング工程と、
透明部材によって前記第２発光素子を被覆し、かつ第１封止部材によって前記第１領域が形成される部位の第１発光素子を被覆して第１領域を形成するとともに、第２封止部材によって前記第２領域が形成される部位の第１発光素子を被覆して第２領域を形成する封止部材充填工程と、を含むことを特徴とする発光装置の製造方法。 It is a manufacturing method of the light-emitting device according to claim 7 ,
A die bonding step of placing the first light-emitting element and the second light-emitting element on a portion where the first region is formed on the substrate, and placing the first light-emitting element on the portion where the second region is formed; ,
The second light emitting element is covered with the transparent member, and the first light emitting element is covered with the first sealing member to form the first area, and the second sealing member is formed. And a sealing member filling step of covering the first light emitting element at the portion where the second region is formed to form the second region. 前記ダイボンディング工程と前記封止部材充填工程との間に、前記第１領域が形成される箇所と前記第２領域が形成される箇所の間に光反射部材を設ける光反射部材形成工程を行なうことを特徴とする請求項８または請求項９に記載の発光装置の製造方法。 Between the die bonding step and the sealing member filling step, a light reflecting member forming step of providing a light reflecting member between a portion where the first region is formed and a portion where the second region is formed is performed. A method for manufacturing a light emitting device according to claim 8 or 9 , wherein:
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