JP6103038B2 - 半導体装置 - Google Patents
半導体装置 Download PDFInfo
- Publication number
- JP6103038B2 JP6103038B2 JP2015506750A JP2015506750A JP6103038B2 JP 6103038 B2 JP6103038 B2 JP 6103038B2 JP 2015506750 A JP2015506750 A JP 2015506750A JP 2015506750 A JP2015506750 A JP 2015506750A JP 6103038 B2 JP6103038 B2 JP 6103038B2
- Authority
- JP
- Japan
- Prior art keywords
- region
- semiconductor
- semiconductor region
- conductivity type
- diffusion
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 239000004065 semiconductor Substances 0.000 title claims description 233
- 238000009792 diffusion process Methods 0.000 claims description 157
- 239000012535 impurity Substances 0.000 claims description 60
- 230000002441 reversible effect Effects 0.000 claims description 52
- 238000011084 recovery Methods 0.000 claims description 49
- 230000002093 peripheral effect Effects 0.000 claims description 48
- 239000000758 substrate Substances 0.000 claims description 34
- 238000010586 diagram Methods 0.000 description 36
- 238000000605 extraction Methods 0.000 description 17
- 238000002347 injection Methods 0.000 description 11
- 239000007924 injection Substances 0.000 description 11
- 239000010410 layer Substances 0.000 description 10
- 230000015556 catabolic process Effects 0.000 description 9
- 230000005684 electric field Effects 0.000 description 9
- 238000009825 accumulation Methods 0.000 description 7
- 230000000694 effects Effects 0.000 description 7
- 239000012141 concentrate Substances 0.000 description 5
- 230000006378 damage Effects 0.000 description 4
- 230000007423 decrease Effects 0.000 description 4
- 238000009826 distribution Methods 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 4
- 230000002829 reductive effect Effects 0.000 description 4
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 2
- 239000000969 carrier Substances 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 230000020169 heat generation Effects 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 229910052698 phosphorus Inorganic materials 0.000 description 2
- 239000011574 phosphorus Substances 0.000 description 2
- 229910018125 Al-Si Inorganic materials 0.000 description 1
- 229910018520 Al—Si Inorganic materials 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 230000000670 limiting effect Effects 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 230000036961 partial effect Effects 0.000 description 1
- 238000010992 reflux Methods 0.000 description 1
- 230000002040 relaxant effect Effects 0.000 description 1
- 238000004904 shortening Methods 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- 239000002344 surface layer Substances 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/86—Types of semiconductor device ; Multistep manufacturing processes therefor controllable only by variation of the electric current supplied, or only the electric potential applied, to one or more of the electrodes carrying the current to be rectified, amplified, oscillated or switched
- H01L29/861—Diodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
- H01L29/06—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions
- H01L29/0603—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions characterised by particular constructional design considerations, e.g. for preventing surface leakage, for controlling electric field concentration or for internal isolations regions
- H01L29/0607—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions characterised by particular constructional design considerations, e.g. for preventing surface leakage, for controlling electric field concentration or for internal isolations regions for preventing surface leakage or controlling electric field concentration
- H01L29/0611—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions characterised by particular constructional design considerations, e.g. for preventing surface leakage, for controlling electric field concentration or for internal isolations regions for preventing surface leakage or controlling electric field concentration for increasing or controlling the breakdown voltage of reverse biased devices
- H01L29/0615—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions characterised by particular constructional design considerations, e.g. for preventing surface leakage, for controlling electric field concentration or for internal isolations regions for preventing surface leakage or controlling electric field concentration for increasing or controlling the breakdown voltage of reverse biased devices by the doping profile or the shape or the arrangement of the PN junction, or with supplementary regions, e.g. junction termination extension [JTE]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
- H01L29/06—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions
- H01L29/0603—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions characterised by particular constructional design considerations, e.g. for preventing surface leakage, for controlling electric field concentration or for internal isolations regions
- H01L29/0607—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions characterised by particular constructional design considerations, e.g. for preventing surface leakage, for controlling electric field concentration or for internal isolations regions for preventing surface leakage or controlling electric field concentration
- H01L29/0611—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions characterised by particular constructional design considerations, e.g. for preventing surface leakage, for controlling electric field concentration or for internal isolations regions for preventing surface leakage or controlling electric field concentration for increasing or controlling the breakdown voltage of reverse biased devices
- H01L29/0615—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions characterised by particular constructional design considerations, e.g. for preventing surface leakage, for controlling electric field concentration or for internal isolations regions for preventing surface leakage or controlling electric field concentration for increasing or controlling the breakdown voltage of reverse biased devices by the doping profile or the shape or the arrangement of the PN junction, or with supplementary regions, e.g. junction termination extension [JTE]
- H01L29/0619—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions characterised by particular constructional design considerations, e.g. for preventing surface leakage, for controlling electric field concentration or for internal isolations regions for preventing surface leakage or controlling electric field concentration for increasing or controlling the breakdown voltage of reverse biased devices by the doping profile or the shape or the arrangement of the PN junction, or with supplementary regions, e.g. junction termination extension [JTE] with a supplementary region doped oppositely to or in rectifying contact with the semiconductor containing or contacting region, e.g. guard rings with PN or Schottky junction
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
- H01L29/36—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by the concentration or distribution of impurities in the bulk material
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Ceramic Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Electrodes Of Semiconductors (AREA)
Description
(1)A区間は、IGBT87がオンしてモータに電流が供給された状態である。IGBT87がオンしてモータに電流が供給された状態ではFWD88には電流が流れていない。
(2)B区間は、IGBT87がオフした状態である。このとき、モータに流れる電流は行き場を失い、他のアームのFWD88を介して、インバータ部83を流れる。この電流は、還流電流といわれ、FWD88にとっては順方向電流となる。このFWD88に順方向電流が流れているときが「通電時」である。
(3)Cの区間は、IGBT87を再度オンさせた状態である。IGBT87のオンにより流れる電流は、モータに流れる電流とこのIGBT87に直列接続するFWD88の逆電流となる。FWD88に流れる逆電流は、FWD88が逆回復した段階で停止し、全ての電流はモータに流れる。この一連の動作を繰り返してモータに流れる電流は制御される。FWD88に流れる逆電流が逆回復電流であり、この逆回復電流が流れているときが「逆回復時」である。
(1)nドリフト領域2上に不純物濃度が低いp-アノード領域31を配置し、その上にアノード電極10を配置する(同図(a))。
(2)(1)のp-アノード領域31上全域に拡散深さの浅い高濃度のp領域32を配置し、その上にアノード電極10を配置する。この太線で示すp領域32は図3に示すp領域25に相当する。(同図(b))。
(3)(2)のp領域32をp-アノード領域31上の全域でなく選択的に配置する(同図(c))。
(4)(1)のp-アノード領域31内に高濃度のp領域33を選択的に配置する(同図(d))。
(5)(1)のp-アノード領域31を不純物濃度が高い、拡散深さが浅いpアノード領域34に置き換える(同図(e))。
(6)(5)のpアノード領域34上の全域に拡散深さの浅い高濃度のp領域32を配置し、その上にアノード電極10を配置する(同図(f))。
(7)(5)のpアノード領域34を選択的に配置する(同図(g))。
(8)(7)のアノード電極10下の全域に拡散深さの浅い高濃度のp領域32を配置する(同図(h))。
2 nドリフト領域
3 n-領域
4,54 pアノード領域
5,28 p拡散領域
5a 底部
6,26,56 抵抗領域
6a 外端部
6b 内端部
7 抵抗端部領域
8 pガードリング領域
9 pストッパ領域
10,60 アノード電極
11 絶縁膜
11a 熱酸化膜
11b PSG膜
12 ガードリング電極
13 ストップ電極
14,64 活性部
15 nカソード領域
16 カソード電極
17,67 エッジ終端構造
18 緩衝領域
21,21a,71 正孔の注入
22 正孔の蓄積
23,23a,73 正孔の引き抜き
25 p領域
27 後退箇所
30 コンタクト端
31 p-アノード領域
32,33 p領域
34 pアノード領域
41 等電位線
57 延長端部領域
68 延長構造
87 IGBT
88 FWD
100,200,300,400 半導体装置
W,T 幅
R,Ra 抵抗体
Rp,Rp1 抵抗値
Claims (10)
- 第1導電型の半導体基板と、
該半導体基板の第1主面に形成され、主たる電流を流す活性領域と、
該活性領域を取り囲んで配置されるエッジ終端構造と、
前記活性領域に形成された第2導電型の第1半導体領域と、
前記エッジ終端構造を構成する複数の第2導電型の第2半導体領域と、
前記第1主面上に形成され、前記第1半導体領域に電気的に接続する第1主電極と、
前記第2半導体領域と前記第1半導体領域の間に、前記第1主電極から深さ方向に絶縁膜を挟んで離間した抵抗領域となる第2導電型の第3半導体領域と、
前記第1主電極が前記半導体基板と接触する外周端部からさらに外周方向の前記半導体基板表面に形成され、前記第3半導体領域の他に抵抗の異なる2つ以上の第2導電型拡散領域と、を備え、
前記2つ以上の第2導電型拡散領域のうち第1の拡散領域が、前記第3半導体領域と前記第1半導体領域の間に両方に連接する第2導電型の第4半導体領域であり、
前記2つ以上の第2導電型拡散領域のうち第2の拡散領域が、前記第2半導体領域側で前記第3半導体領域より不純物濃度が高くかつ拡散深さが深い第2導電型の第5半導体領域であり、
前記第4半導体領域の拡散深さが前記第3半導体領域の拡散深さより深く、
前記第4半導体領域の不純物濃度が前記第3半導体領域の不純物濃度より低いことを特徴とする半導体装置。 - 前記第4半導体領域は、前記第1主電極と接することを特徴とする請求項1に記載の半導体装置。
- 前記第4半導体領域および前記第5半導体領域のうち少なくとも1つの領域は前記第1半導体領域の拡散深さよりも深いことを特徴とする請求項1または2に記載の半導体装置。
- 前記第4半導体領域の外周方向の幅は5μm以上50μm以下であることを特徴とする請求項1〜3のいずれか一つに記載の半導体装置。
- 第1導電型の半導体基板と、
該半導体基板の第1主面に形成され、主たる電流を流す活性領域と、
該活性領域を取り囲んで配置されるエッジ終端構造と、
前記活性領域に形成された第2導電型の第1半導体領域と、
前記エッジ終端構造を構成する複数の第2導電型の第2半導体領域と、
前記第1主面上に形成され、前記第1半導体領域に電気的に接続する第1主電極と、
前記第2半導体領域と前記第1半導体領域の間に、前記第1主電極から深さ方向に絶縁膜を挟んで離間した抵抗領域となる第2導電型の第3半導体領域と、
前記第1主電極が前記半導体基板と接触する外周端部からさらに外周方向の前記半導体基板表面に形成され、前記第3半導体領域の他に抵抗の異なる2つ以上の第2導電型拡散領域と、を備え、
前記第3半導体領域の深さ方向の積分濃度が、前記第1半導体領域の不純物濃度より高く、
前記2つ以上の第2導電型拡散領域のうち第1の拡散領域が、前記第3半導体領域よりも拡散深さが深く不純物濃度が高いとともに該第3半導体領域の外周側に接続する第2導電型の第5半導体領域であり、
前記2つ以上の第2導電型拡散領域のうち第2の拡散領域が、前記第1半導体領域が前記第1主電極の外周端部から外周方向に延在した部分であるとともに前記第3半導体領域に接続することを特徴とする半導体装置。 - 前記第1半導体領域の延在部分の長さが2μm以上35μm以下であることを特徴とする請求項5に記載の半導体装置。
- 第1導電型の半導体基板と、
該半導体基板の第1主面に形成され、主たる電流を流す活性領域と、
該活性領域を取り囲んで配置されるエッジ終端構造と、
前記活性領域に形成された第2導電型の第1半導体領域と、
前記エッジ終端構造を構成する複数の第2導電型の第2半導体領域と、
前記第1主面上に形成され、前記第1半導体領域に電気的に接続する第1主電極と、
前記第2半導体領域と前記第1半導体領域の間に、前記第1主電極から深さ方向に絶縁膜を挟んで離間した抵抗領域となる第2導電型の第3半導体領域と、
前記第1主電極が前記半導体基板と接触する外周端部からさらに外周方向の前記半導体基板表面に形成され、前記第3半導体領域の他に抵抗の異なる2つ以上の第2導電型拡散領域と、を備え、
前記第3半導体領域は、前記第1半導体領域が前記第1主電極の外周端部から外周方向に延在した部分であり、
前記2つ以上の第2導電型拡散領域のうち第1の拡散領域が、前記第3半導体領域よりも拡散深さが深く不純物濃度が高いとともに該第3半導体領域の外周側に接続する第2導電型の第5半導体領域であり、
前記2つ以上の第2導電型拡散領域のうち第2の拡散領域が、前記絶縁膜に接する前記第3半導体領域の表面から前記第3半導体領域を貫通して配置される第2導電型の第6半導体領域であり、
該第6半導体領域の不純物濃度が前記第3半導体領域の不純物濃度より高いことを特徴とする半導体装置。 - 前記第6半導体領域と前記第1半導体領域の間に配置される前記第3半導体領域の不純物濃度と拡散深さが前記第1半導体領域の不純物濃度と拡散深さに等しいことを特徴とする請求項7に記載の半導体装置。
- 前記第3半導体領域の不純物濃度と拡散深さが前記第1半導体領域の不純物濃度と拡散深さに等しいことを特徴とする請求項7に記載の半導体装置。
- 前記第2導電型拡散領域を備えることにより、前記第1主電極の外周端部よりも内周側に逆回復電流を分流させることを特徴とする請求項1〜9のいずれか一つに記載の半導体装置。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2013058528 | 2013-03-21 | ||
JP2013058528 | 2013-03-21 | ||
PCT/JP2014/057012 WO2014148400A1 (ja) | 2013-03-21 | 2014-03-14 | 半導体装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPWO2014148400A1 JPWO2014148400A1 (ja) | 2017-02-16 |
JP6103038B2 true JP6103038B2 (ja) | 2017-03-29 |
Family
ID=51580083
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2015506750A Active JP6103038B2 (ja) | 2013-03-21 | 2014-03-14 | 半導体装置 |
Country Status (5)
Country | Link |
---|---|
US (1) | US9450110B2 (ja) |
JP (1) | JP6103038B2 (ja) |
CN (1) | CN104969359B (ja) |
DE (1) | DE112014001529T5 (ja) |
WO (1) | WO2014148400A1 (ja) |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20160020279A1 (en) * | 2014-07-18 | 2016-01-21 | International Rectifier Corporation | Edge Termination Using Guard Rings Between Recessed Field Oxide Regions |
JP6597102B2 (ja) | 2015-09-16 | 2019-10-30 | 富士電機株式会社 | 半導体装置 |
JP7260682B2 (ja) * | 2017-03-16 | 2023-04-18 | ローム株式会社 | 半導体装置 |
JP6804379B2 (ja) | 2017-04-24 | 2020-12-23 | 三菱電機株式会社 | 半導体装置 |
JP7257912B2 (ja) * | 2019-08-01 | 2023-04-14 | 三菱電機株式会社 | 半導体装置 |
CN116195067A (zh) | 2021-09-29 | 2023-05-30 | 丹尼克斯半导体有限公司 | 半导体装置 |
Family Cites Families (20)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3185474B2 (ja) * | 1993-05-18 | 2001-07-09 | 株式会社日立製作所 | 半導体装置 |
US5969400A (en) | 1995-03-15 | 1999-10-19 | Kabushiki Kaisha Toshiba | High withstand voltage semiconductor device |
JP3447884B2 (ja) * | 1995-03-15 | 2003-09-16 | 株式会社東芝 | 高耐圧半導体素子 |
JP3444081B2 (ja) | 1996-02-28 | 2003-09-08 | 株式会社日立製作所 | ダイオード及び電力変換装置 |
JP4017258B2 (ja) * | 1998-07-29 | 2007-12-05 | 三菱電機株式会社 | 半導体装置 |
JP2000114550A (ja) * | 1998-10-06 | 2000-04-21 | Hitachi Ltd | ダイオード及び電力変換装置 |
JP2000150859A (ja) * | 1998-11-18 | 2000-05-30 | Meidensha Corp | ダイオード |
JP2002270857A (ja) * | 2001-03-07 | 2002-09-20 | Toshiba Corp | 半導体装置および電力変換装置 |
JP3708057B2 (ja) * | 2001-07-17 | 2005-10-19 | 株式会社東芝 | 高耐圧半導体装置 |
JP4469584B2 (ja) | 2003-09-12 | 2010-05-26 | 株式会社東芝 | 半導体装置 |
JP2005340528A (ja) | 2004-05-27 | 2005-12-08 | Fuji Electric Device Technology Co Ltd | 半導体装置およびその製造方法 |
JP5092610B2 (ja) | 2007-08-01 | 2012-12-05 | トヨタ自動車株式会社 | 半導体装置 |
JP2009164486A (ja) * | 2008-01-09 | 2009-07-23 | Toyota Motor Corp | 縦型ダイオードとその製造方法 |
JP5003598B2 (ja) * | 2008-06-05 | 2012-08-15 | 富士電機株式会社 | 半導体装置 |
WO2011013379A1 (en) * | 2009-07-31 | 2011-02-03 | Fuji Electric Systems Co., Ltd. | Semiconductor apparatus |
JP5605230B2 (ja) * | 2011-01-14 | 2014-10-15 | トヨタ自動車株式会社 | 半導体装置 |
JP2012186318A (ja) * | 2011-03-05 | 2012-09-27 | Shindengen Electric Mfg Co Ltd | 高耐圧半導体装置 |
EP2725623B1 (en) * | 2011-09-08 | 2019-10-30 | Fuji Electric Co., Ltd. | Semiconductor device |
JP2014038937A (ja) * | 2012-08-16 | 2014-02-27 | Mitsubishi Electric Corp | 半導体装置 |
JP6029411B2 (ja) * | 2012-10-02 | 2016-11-24 | 三菱電機株式会社 | 半導体装置 |
-
2014
- 2014-03-14 DE DE112014001529.6T patent/DE112014001529T5/de active Pending
- 2014-03-14 JP JP2015506750A patent/JP6103038B2/ja active Active
- 2014-03-14 CN CN201480007250.6A patent/CN104969359B/zh active Active
- 2014-03-14 WO PCT/JP2014/057012 patent/WO2014148400A1/ja active Application Filing
-
2015
- 2015-08-07 US US14/821,348 patent/US9450110B2/en active Active
Also Published As
Publication number | Publication date |
---|---|
CN104969359B (zh) | 2017-10-17 |
DE112014001529T5 (de) | 2015-12-24 |
CN104969359A (zh) | 2015-10-07 |
US20150349144A1 (en) | 2015-12-03 |
WO2014148400A1 (ja) | 2014-09-25 |
US9450110B2 (en) | 2016-09-20 |
JPWO2014148400A1 (ja) | 2017-02-16 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP6103038B2 (ja) | 半導体装置 | |
CN106206698B (zh) | 反向导通绝缘栅双极性晶体管 | |
JP6119577B2 (ja) | 半導体装置 | |
JP6277814B2 (ja) | 半導体装置 | |
US9799648B2 (en) | Semiconductor device | |
JP5725083B2 (ja) | 半導体装置 | |
TWI570929B (zh) | 半導體元件 | |
JP5135719B2 (ja) | トレンチ型絶縁ゲート半導体装置 | |
JP2010186805A (ja) | 半導体装置 | |
JP2013115223A (ja) | 半導体装置 | |
CN103426911A (zh) | 半导体装置 | |
JP2014229705A (ja) | 半導体装置 | |
JP5589342B2 (ja) | 半導体装置 | |
JP6673439B2 (ja) | 半導体装置 | |
US20170077089A1 (en) | Semiconductor device | |
JP6790908B2 (ja) | 半導体装置 | |
CN109686789B (zh) | 半导体装置 | |
JP6598756B2 (ja) | 電力用半導体装置およびその製造方法 | |
JP6804379B2 (ja) | 半導体装置 | |
JP6550995B2 (ja) | 半導体装置 | |
JP4269863B2 (ja) | 双方向高耐圧プレーナ型半導体装置 | |
JP2018137392A (ja) | 半導体装置 | |
US11374091B2 (en) | Semiconductor device | |
JP6002387B2 (ja) | ダイオードおよびそれを用いた電力変換システム | |
JP6048003B2 (ja) | Igbtとダイオードが同一半導体基板に形成されている半導体装置 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20161011 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20161108 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20170110 |
|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20170131 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20170213 |
|
R150 | Certificate of patent or registration of utility model |
Ref document number: 6103038 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |