JP2010186805A - 半導体装置 - Google Patents
半導体装置 Download PDFInfo
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- JP2010186805A JP2010186805A JP2009028530A JP2009028530A JP2010186805A JP 2010186805 A JP2010186805 A JP 2010186805A JP 2009028530 A JP2009028530 A JP 2009028530A JP 2009028530 A JP2009028530 A JP 2009028530A JP 2010186805 A JP2010186805 A JP 2010186805A
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- 239000004065 semiconductor Substances 0.000 title claims abstract description 45
- 239000000758 substrate Substances 0.000 claims abstract description 36
- 238000009792 diffusion process Methods 0.000 claims abstract description 24
- 238000005468 ion implantation Methods 0.000 claims abstract description 18
- 239000012535 impurity Substances 0.000 claims abstract description 17
- 229910052751 metal Inorganic materials 0.000 claims abstract description 8
- 239000002184 metal Substances 0.000 claims abstract description 8
- 238000000926 separation method Methods 0.000 claims description 7
- 239000004020 conductor Substances 0.000 claims description 3
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- 108091006146 Channels Proteins 0.000 description 17
- 230000015572 biosynthetic process Effects 0.000 description 16
- 239000011229 interlayer Substances 0.000 description 11
- 229910052782 aluminium Inorganic materials 0.000 description 10
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- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 description 3
- 229910052796 boron Inorganic materials 0.000 description 3
- 230000005684 electric field Effects 0.000 description 3
- 238000002347 injection Methods 0.000 description 3
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- 244000126211 Hericium coralloides Species 0.000 description 1
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- 230000001133 acceleration Effects 0.000 description 1
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- 229910052785 arsenic Inorganic materials 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
- H01L29/06—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions
- H01L29/08—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions with semiconductor regions connected to an electrode carrying current to be rectified, amplified or switched and such electrode being part of a semiconductor device which comprises three or more electrodes
- H01L29/083—Anode or cathode regions of thyristors or gated bipolar-mode devices
- H01L29/0834—Anode regions of thyristors or gated bipolar-mode devices, e.g. supplementary regions surrounding anode regions
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/70—Bipolar devices
- H01L29/72—Transistor-type devices, i.e. able to continuously respond to applied control signals
- H01L29/739—Transistor-type devices, i.e. able to continuously respond to applied control signals controlled by field-effect, e.g. bipolar static induction transistors [BSIT]
- H01L29/7393—Insulated gate bipolar mode transistors, i.e. IGBT; IGT; COMFET
- H01L29/7395—Vertical transistors, e.g. vertical IGBT
- H01L29/7396—Vertical transistors, e.g. vertical IGBT with a non planar surface, e.g. with a non planar gate or with a trench or recess or pillar in the surface of the emitter, base or collector region for improving current density or short circuiting the emitter and base regions
- H01L29/7397—Vertical transistors, e.g. vertical IGBT with a non planar surface, e.g. with a non planar gate or with a trench or recess or pillar in the surface of the emitter, base or collector region for improving current density or short circuiting the emitter and base regions and a gate structure lying on a slanted or vertical surface or formed in a groove, e.g. trench gate IGBT
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- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Ceramic Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Electrodes Of Semiconductors (AREA)
- Metal-Oxide And Bipolar Metal-Oxide Semiconductor Integrated Circuits (AREA)
Abstract
【解決手段】ゲートパッド電極領域内であって、金属電極が絶縁膜を介して載置される高不純物濃度のp型領域が、複数の分離表面領域からのイオン注入と熱拡散とにより表面で相互に連結した構造にされている半導体装置とする。
【選択図】図1
Description
51 IGBT部
52 FWD部
53 n+エミッタ領域
54 p-チャネル形成領域
55 n-ドリフト層
56 トレンチ
57 ゲート絶縁膜
58 ポリシリコンゲート電極
59 層間絶縁膜
60 エミッタ(アノード)電極
61 n型フィールドストップ層
62 コレクタ領域
63 カソード領域
64 コレクタ(カソード)電極
65 p+領域
66 耐圧構造部
67 ガードリング
68a ゲート電極配線
69 活性領域
80 逆導通IGBTチップ
Claims (3)
- 一導電型半導体基板の一方の主面に、他導電型ベース領域と、該ベース領域表面に形成される一導電型エミッタ領域と、該エミッタ領域表面と前記ベース領域表面とに共通にオーミック接触するエミッタ電極と、前記エミッタ領域表面と前記半導体基板表面とに挟まれる前記ベース領域の表面にゲート絶縁膜を介して積層されるゲート電極とを含む活性領域と、
前記ゲート電極と実質的に同電位であって、前記他導電型ベース領域より高不純物濃度の他導電型領域表面に絶縁膜を介して設けられ、前記エミッタ電極とは前記他導電型ベース領域を介して電気的に接続されるとともに、ゲート外部導線を接続させるための金属電極を載置するゲートパッド電極領域と、
該ゲートパッド電極領域と前記活性領域との外周をリング状に取り囲む耐圧構造部と、
少なくとも前記活性領域に対向する他方の主面側領域に選択的に形成される他導電型コレクタ領域と該他方の主面側領域にオーミック接触するコレクタ電極と、
を備えるIGBT部と、
前記活性領域に対向する他方の主面側領域に選択的に前記他導電型コレクタ領域と交互に形成される一導電型領域を有し、該一導電型領域にオーミック接触するコレクタ電極をカソード電極、前記エミッタ電極をアノード電極とするダイオード部と、
を備える半導体装置において、
前記ゲートパッド電極領域内であって、金属電極が絶縁膜を介して載置される高不純物濃度の前記他導電型領域が、複数の分離表面領域からのイオン注入と熱拡散とにより表面で相互に連結した構造にされていることを特徴とする半導体装置。 - 前記複数の分離表面領域が櫛歯状の表面形状であることを特徴とする請求項1に記載の半導体装置。
- 前記複数の分離表面領域が格子状パターンに囲まれる領域状の表面形状であることを特徴とする請求項1に記載の半導体装置。
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Cited By (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2012001967A1 (ja) * | 2010-07-01 | 2012-01-05 | 株式会社デンソー | 半導体装置 |
DE102011080747A1 (de) | 2010-08-24 | 2012-03-01 | Fuji Jukogyo K.K. | Fahrzeugscheinwerfer |
WO2013110994A1 (en) * | 2012-01-24 | 2013-08-01 | Toyota Jidosha Kabushiki Kaisha | Semiconductor device |
JP2014241433A (ja) * | 2010-05-26 | 2014-12-25 | 三菱電機株式会社 | 半導体装置 |
US9082813B2 (en) | 2011-01-17 | 2015-07-14 | Infineon Technologies Austria Ag | Power device and a reverse conducting power IGBT |
US9231581B2 (en) | 2012-06-21 | 2016-01-05 | Infineon Technologies Ag | Method of operating a reverse conducting IGBT |
WO2016098199A1 (ja) * | 2014-12-17 | 2016-06-23 | 三菱電機株式会社 | 半導体装置 |
JP2016197678A (ja) * | 2015-04-06 | 2016-11-24 | 三菱電機株式会社 | 半導体装置 |
DE102015118550A1 (de) * | 2015-10-29 | 2017-05-04 | Infineon Technologies Austria Ag | Halbleitervorrichtung |
WO2018016283A1 (ja) * | 2016-07-21 | 2018-01-25 | 株式会社デンソー | 半導体装置 |
JP2018157040A (ja) * | 2017-03-16 | 2018-10-04 | ローム株式会社 | 半導体装置 |
JP2019021931A (ja) * | 2012-09-12 | 2019-02-07 | 富士電機株式会社 | 逆導通型絶縁ゲートバイポーラトランジスタの製造方法および逆導通型絶縁ゲートバイポーラトランジスタ |
CN109817697A (zh) * | 2017-11-22 | 2019-05-28 | 三菱电机株式会社 | 半导体装置及其制造方法 |
JP2019134072A (ja) * | 2018-01-31 | 2019-08-08 | トヨタ自動車株式会社 | スイッチング素子の製造方法 |
CN117650165A (zh) * | 2023-10-31 | 2024-03-05 | 海信家电集团股份有限公司 | 半导体装置 |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP7193371B2 (ja) | 2019-02-19 | 2022-12-20 | 株式会社東芝 | 半導体装置 |
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JP2008016461A (ja) * | 2006-06-30 | 2008-01-24 | Toshiba Corp | 半導体装置 |
JP2008085189A (ja) * | 2006-09-28 | 2008-04-10 | Sanyo Electric Co Ltd | 絶縁ゲート型半導体装置 |
JP2008103590A (ja) * | 2006-10-20 | 2008-05-01 | Mitsubishi Electric Corp | 半導体装置およびその製造方法 |
JP2008300529A (ja) * | 2007-05-30 | 2008-12-11 | Denso Corp | 半導体装置 |
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2009
- 2009-02-10 JP JP2009028530A patent/JP5366297B2/ja active Active
Patent Citations (8)
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JPH03219678A (ja) * | 1990-01-25 | 1991-09-27 | Nissan Motor Co Ltd | 半導体装置 |
JPH03252166A (ja) * | 1990-03-01 | 1991-11-11 | Toshiba Corp | Mos型電界効果トランジスタ |
JP2003197911A (ja) * | 2001-12-27 | 2003-07-11 | Denso Corp | 半導体装置とその製造方法 |
JP2007227806A (ja) * | 2006-02-24 | 2007-09-06 | Denso Corp | 半導体装置 |
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JP2008300529A (ja) * | 2007-05-30 | 2008-12-11 | Denso Corp | 半導体装置 |
Cited By (30)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2014241433A (ja) * | 2010-05-26 | 2014-12-25 | 三菱電機株式会社 | 半導体装置 |
US20130087829A1 (en) * | 2010-07-01 | 2013-04-11 | Denso Corporation | Semiconductor device |
US8847276B2 (en) | 2010-07-01 | 2014-09-30 | Denso Corporation | Semiconductor device |
JP2012033897A (ja) * | 2010-07-01 | 2012-02-16 | Denso Corp | 半導体装置 |
US9224730B2 (en) | 2010-07-01 | 2015-12-29 | Denso Corporation | Semiconductor device |
WO2012001967A1 (ja) * | 2010-07-01 | 2012-01-05 | 株式会社デンソー | 半導体装置 |
DE102011080747A1 (de) | 2010-08-24 | 2012-03-01 | Fuji Jukogyo K.K. | Fahrzeugscheinwerfer |
US9082813B2 (en) | 2011-01-17 | 2015-07-14 | Infineon Technologies Austria Ag | Power device and a reverse conducting power IGBT |
DE102012100349B4 (de) * | 2011-01-17 | 2016-08-18 | Infineon Technologies Austria Ag | Halbleiterbauelement und IGBT mit integrierter Freilaufdiode |
WO2013110994A1 (en) * | 2012-01-24 | 2013-08-01 | Toyota Jidosha Kabushiki Kaisha | Semiconductor device |
US9571087B2 (en) | 2012-06-21 | 2017-02-14 | Infineon Technologies Ag | Method of operating a reverse conducting IGBT |
US9231581B2 (en) | 2012-06-21 | 2016-01-05 | Infineon Technologies Ag | Method of operating a reverse conducting IGBT |
JP2019021931A (ja) * | 2012-09-12 | 2019-02-07 | 富士電機株式会社 | 逆導通型絶縁ゲートバイポーラトランジスタの製造方法および逆導通型絶縁ゲートバイポーラトランジスタ |
US9972618B2 (en) | 2014-12-17 | 2018-05-15 | Mitsubishi Electric Corporation | Semiconductor device |
WO2016098199A1 (ja) * | 2014-12-17 | 2016-06-23 | 三菱電機株式会社 | 半導体装置 |
JPWO2016098199A1 (ja) * | 2014-12-17 | 2017-05-25 | 三菱電機株式会社 | 半導体装置 |
CN107112324A (zh) * | 2014-12-17 | 2017-08-29 | 三菱电机株式会社 | 半导体装置 |
JP2016197678A (ja) * | 2015-04-06 | 2016-11-24 | 三菱電機株式会社 | 半導体装置 |
CN107039501A (zh) * | 2015-10-29 | 2017-08-11 | 英飞凌科技奥地利有限公司 | 半导体器件 |
US9865717B2 (en) | 2015-10-29 | 2018-01-09 | Infineon Technologies Austria Ag | Semiconductor device |
DE102015118550A1 (de) * | 2015-10-29 | 2017-05-04 | Infineon Technologies Austria Ag | Halbleitervorrichtung |
DE102015118550B4 (de) | 2015-10-29 | 2018-10-11 | Infineon Technologies Austria Ag | Halbleitervorrichtung und Verfahren zur Herstellung einer Halbleitervorrichtung |
WO2018016283A1 (ja) * | 2016-07-21 | 2018-01-25 | 株式会社デンソー | 半導体装置 |
JP2018014417A (ja) * | 2016-07-21 | 2018-01-25 | 株式会社デンソー | 半導体装置 |
JP2018157040A (ja) * | 2017-03-16 | 2018-10-04 | ローム株式会社 | 半導体装置 |
CN109817697A (zh) * | 2017-11-22 | 2019-05-28 | 三菱电机株式会社 | 半导体装置及其制造方法 |
JP2019134072A (ja) * | 2018-01-31 | 2019-08-08 | トヨタ自動車株式会社 | スイッチング素子の製造方法 |
JP7013898B2 (ja) | 2018-01-31 | 2022-02-01 | 株式会社デンソー | スイッチング素子の製造方法 |
CN117650165A (zh) * | 2023-10-31 | 2024-03-05 | 海信家电集团股份有限公司 | 半导体装置 |
CN117650165B (zh) * | 2023-10-31 | 2024-05-31 | 海信家电集团股份有限公司 | 半导体装置 |
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