JP6092752B2 - 配線基板 - Google Patents
配線基板 Download PDFInfo
- Publication number
- JP6092752B2 JP6092752B2 JP2013225186A JP2013225186A JP6092752B2 JP 6092752 B2 JP6092752 B2 JP 6092752B2 JP 2013225186 A JP2013225186 A JP 2013225186A JP 2013225186 A JP2013225186 A JP 2013225186A JP 6092752 B2 JP6092752 B2 JP 6092752B2
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor element
- conductor
- solder resist
- resist layer
- thickness
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000004065 semiconductor Substances 0.000 claims description 84
- 239000004020 conductor Substances 0.000 claims description 70
- 229910000679 solder Inorganic materials 0.000 claims description 52
- 239000000758 substrate Substances 0.000 claims description 31
- 238000007747 plating Methods 0.000 description 36
- 229920005989 resin Polymers 0.000 description 33
- 239000011347 resin Substances 0.000 description 33
- 239000002184 metal Substances 0.000 description 21
- 229910052751 metal Inorganic materials 0.000 description 21
- 238000000034 method Methods 0.000 description 13
- 239000010953 base metal Substances 0.000 description 9
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 8
- 229910052802 copper Inorganic materials 0.000 description 7
- 239000010949 copper Substances 0.000 description 7
- 238000004519 manufacturing process Methods 0.000 description 7
- 239000003822 epoxy resin Substances 0.000 description 5
- 229920000647 polyepoxide Polymers 0.000 description 5
- 229920001187 thermosetting polymer Polymers 0.000 description 4
- 238000005530 etching Methods 0.000 description 2
- JYEUMXHLPRZUAT-UHFFFAOYSA-N 1,2,3-triazine Chemical compound C1=CN=NN=C1 JYEUMXHLPRZUAT-UHFFFAOYSA-N 0.000 description 1
- XQUPVDVFXZDTLT-UHFFFAOYSA-N 1-[4-[[4-(2,5-dioxopyrrol-1-yl)phenyl]methyl]phenyl]pyrrole-2,5-dione Chemical compound O=C1C=CC(=O)N1C(C=C1)=CC=C1CC1=CC=C(N2C(C=CC2=O)=O)C=C1 XQUPVDVFXZDTLT-UHFFFAOYSA-N 0.000 description 1
- 206010034972 Photosensitivity reaction Diseases 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 238000005553 drilling Methods 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 239000012777 electrically insulating material Substances 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 239000003365 glass fiber Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 230000001678 irradiating effect Effects 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 230000036211 photosensitivity Effects 0.000 description 1
- 229920003192 poly(bis maleimide) Polymers 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 238000009941 weaving Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3452—Solder masks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/1517—Multilayer substrate
- H01L2924/15172—Fan-out arrangement of the internal vias
- H01L2924/15174—Fan-out arrangement of the internal vias in different layers of the multilayer substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/111—Pads for surface mounting, e.g. lay-out
- H05K1/112—Pads for surface mounting, e.g. lay-out directly combined with via connections
- H05K1/113—Via provided in pad; Pad over filled via
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0183—Dielectric layers
- H05K2201/0191—Dielectric layers wherein the thickness of the dielectric plays an important role
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
- H05K2201/09972—Partitioned, e.g. portions of a PCB dedicated to different functions; Boundary lines therefore; Portions of a PCB being processed separately or differently
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3431—Leadless components
- H05K3/3436—Leadless components having an array of bottom contacts, e.g. pad grid array or ball grid array components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/4007—Surface contacts, e.g. bumps
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
- Wire Bonding (AREA)
Description
図1に示す配線基板50は、本発明の配線基板の実施形態の一例である。配線基板50は、エリアアレイ型の半導体素子Sをフリップチップ接続により搭載する。
1A :搭載部
6 :ソルダーレジスト層
6A :第1の領域
6B :第2の領域
10 :半導体素子接続パッド
11 :導体柱
26 :感光性樹脂層
26A:未露光部
S :半導体素子
T :電極端子
Claims (1)
- 上面に半導体素子が搭載される搭載部を有する絶縁基板と、前記搭載部に形成された半導体素子接続パッドと、該半導体素子接続パッド上に形成された高さが35μmを超える円柱状の導体柱と、前記絶縁基板上に被着されており、前記搭載部およびその近傍において、前記半導体素子接続パッドおよび前記導体柱の下端部を埋設し且つ前記導体柱の上端部を35μm以上の高さ突出させる第1の厚みの第1の領域を有し、前記搭載部の周囲において、前記第1の厚みよりも厚い第2の厚みで前記第1の領域を取り囲むとともに上面の高さが前記導体柱の上端の高さよりも5〜30μm低い第2の領域を有するソルダーレジスト層と、を備えることを特徴とする配線基板。
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2013225186A JP6092752B2 (ja) | 2013-10-30 | 2013-10-30 | 配線基板 |
US14/518,082 US9326389B2 (en) | 2013-10-30 | 2014-10-20 | Wiring board and method of manufacturing the same |
CN201410571887.XA CN104602459A (zh) | 2013-10-30 | 2014-10-23 | 布线基板及其制造方法 |
TW103137151A TWI628982B (zh) | 2013-10-30 | 2014-10-28 | 配線基板及其製造方法 |
KR1020140148244A KR101878242B1 (ko) | 2013-10-30 | 2014-10-29 | 배선 기판 및 그 제조 방법 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2013225186A JP6092752B2 (ja) | 2013-10-30 | 2013-10-30 | 配線基板 |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2016218788A Division JP6235682B2 (ja) | 2016-11-09 | 2016-11-09 | 配線基板の製造方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2015088583A JP2015088583A (ja) | 2015-05-07 |
JP6092752B2 true JP6092752B2 (ja) | 2017-03-08 |
Family
ID=52995200
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2013225186A Expired - Fee Related JP6092752B2 (ja) | 2013-10-30 | 2013-10-30 | 配線基板 |
Country Status (5)
Country | Link |
---|---|
US (1) | US9326389B2 (ja) |
JP (1) | JP6092752B2 (ja) |
KR (1) | KR101878242B1 (ja) |
CN (1) | CN104602459A (ja) |
TW (1) | TWI628982B (ja) |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US9899239B2 (en) * | 2015-11-06 | 2018-02-20 | Apple Inc. | Carrier ultra thin substrate |
JP6715618B2 (ja) * | 2016-02-23 | 2020-07-01 | イビデン株式会社 | プリント配線板 |
KR102559345B1 (ko) * | 2016-07-28 | 2023-07-25 | 삼성전기주식회사 | 인쇄회로기판 |
TWI643532B (zh) * | 2017-05-04 | 2018-12-01 | 南亞電路板股份有限公司 | 電路板結構及其製造方法 |
TWI687142B (zh) * | 2018-12-28 | 2020-03-01 | 南亞電路板股份有限公司 | 電路板結構及其製造方法 |
US11056453B2 (en) * | 2019-06-18 | 2021-07-06 | Deca Technologies Usa, Inc. | Stackable fully molded semiconductor structure with vertical interconnects |
KR20210131149A (ko) * | 2020-04-23 | 2021-11-02 | 엘지이노텍 주식회사 | 인쇄회로기판 및 이의 제조 방법 |
Family Cites Families (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3274619B2 (ja) * | 1996-03-13 | 2002-04-15 | 三菱電機株式会社 | 半導体装置およびその製造方法 |
JP2003068928A (ja) * | 2001-08-28 | 2003-03-07 | Kyocera Corp | 高周波用配線基板の実装構造 |
JP3785083B2 (ja) * | 2001-11-07 | 2006-06-14 | 株式会社東芝 | 半導体装置、電子カード及びパッド再配置基板 |
US7176044B2 (en) * | 2002-11-25 | 2007-02-13 | Henkel Corporation | B-stageable die attach adhesives |
TWI255535B (en) * | 2004-03-31 | 2006-05-21 | Sanyo Electric Co | Device mounting board and semiconductor apparatus using the same |
JP2009224616A (ja) * | 2008-03-17 | 2009-10-01 | Shinko Electric Ind Co Ltd | 電子部品内蔵基板及びその製造方法、及び半導体装置 |
JP2012009586A (ja) * | 2010-06-24 | 2012-01-12 | Shinko Electric Ind Co Ltd | 配線基板、半導体装置及び配線基板の製造方法 |
JP2012054295A (ja) | 2010-08-31 | 2012-03-15 | Kyocer Slc Technologies Corp | 配線基板およびその製造方法 |
KR101296996B1 (ko) * | 2011-07-25 | 2013-08-14 | 니혼도꾸슈도교 가부시키가이샤 | 배선기판 |
JP2013030712A (ja) * | 2011-07-29 | 2013-02-07 | Toshiba Corp | 半導体モジュールおよび半導体モジュールの製造方法 |
JP2013105908A (ja) * | 2011-11-14 | 2013-05-30 | Ngk Spark Plug Co Ltd | 配線基板 |
-
2013
- 2013-10-30 JP JP2013225186A patent/JP6092752B2/ja not_active Expired - Fee Related
-
2014
- 2014-10-20 US US14/518,082 patent/US9326389B2/en active Active
- 2014-10-23 CN CN201410571887.XA patent/CN104602459A/zh active Pending
- 2014-10-28 TW TW103137151A patent/TWI628982B/zh not_active IP Right Cessation
- 2014-10-29 KR KR1020140148244A patent/KR101878242B1/ko active IP Right Grant
Also Published As
Publication number | Publication date |
---|---|
KR20150050454A (ko) | 2015-05-08 |
JP2015088583A (ja) | 2015-05-07 |
US20150116967A1 (en) | 2015-04-30 |
TW201531177A (zh) | 2015-08-01 |
US9326389B2 (en) | 2016-04-26 |
KR101878242B1 (ko) | 2018-07-13 |
CN104602459A (zh) | 2015-05-06 |
TWI628982B (zh) | 2018-07-01 |
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