JP6082284B2 - 配線基板及びその製造方法 - Google Patents
配線基板及びその製造方法 Download PDFInfo
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- JP6082284B2 JP6082284B2 JP2013051537A JP2013051537A JP6082284B2 JP 6082284 B2 JP6082284 B2 JP 6082284B2 JP 2013051537 A JP2013051537 A JP 2013051537A JP 2013051537 A JP2013051537 A JP 2013051537A JP 6082284 B2 JP6082284 B2 JP 6082284B2
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- metal layer
- aluminum oxide
- oxide substrate
- connection pad
- wiring board
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- 238000004519 manufacturing process Methods 0.000 title claims description 20
- 239000000758 substrate Substances 0.000 claims description 136
- 229910052751 metal Inorganic materials 0.000 claims description 107
- 239000002184 metal Substances 0.000 claims description 107
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 claims description 105
- 239000004020 conductor Substances 0.000 claims description 60
- 238000000034 method Methods 0.000 claims description 23
- 238000009713 electroplating Methods 0.000 claims description 13
- 230000000149 penetrating effect Effects 0.000 claims description 6
- 229920005989 resin Polymers 0.000 description 16
- 239000011347 resin Substances 0.000 description 16
- 239000004065 semiconductor Substances 0.000 description 16
- 238000007747 plating Methods 0.000 description 13
- 229910052782 aluminium Inorganic materials 0.000 description 11
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 11
- 239000010953 base metal Substances 0.000 description 10
- 229920002120 photoresistant polymer Polymers 0.000 description 10
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 6
- 238000005530 etching Methods 0.000 description 6
- 230000035882 stress Effects 0.000 description 5
- 238000001039 wet etching Methods 0.000 description 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 4
- 239000010949 copper Substances 0.000 description 4
- 229910052802 copper Inorganic materials 0.000 description 4
- 239000010408 film Substances 0.000 description 4
- 238000010438 heat treatment Methods 0.000 description 4
- 229920001187 thermosetting polymer Polymers 0.000 description 4
- MUBZPKHOEPUJKR-UHFFFAOYSA-N Oxalic acid Chemical compound OC(=O)C(O)=O MUBZPKHOEPUJKR-UHFFFAOYSA-N 0.000 description 3
- 239000007864 aqueous solution Substances 0.000 description 3
- 239000003990 capacitor Substances 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 238000000206 photolithography Methods 0.000 description 3
- 230000005855 radiation Effects 0.000 description 3
- 230000008646 thermal stress Effects 0.000 description 3
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 2
- ORTQZVOHEJQUHG-UHFFFAOYSA-L copper(II) chloride Chemical compound Cl[Cu]Cl ORTQZVOHEJQUHG-UHFFFAOYSA-L 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000001465 metallisation Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 229910052760 oxygen Inorganic materials 0.000 description 2
- 239000001301 oxygen Substances 0.000 description 2
- 238000005498 polishing Methods 0.000 description 2
- 238000003825 pressing Methods 0.000 description 2
- 230000001681 protective effect Effects 0.000 description 2
- 239000000243 solution Substances 0.000 description 2
- 229920005992 thermoplastic resin Polymers 0.000 description 2
- 239000010936 titanium Substances 0.000 description 2
- 229910021578 Iron(III) chloride Inorganic materials 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- AZDRQVAHHNSJOQ-UHFFFAOYSA-N alumane Chemical group [AlH3] AZDRQVAHHNSJOQ-UHFFFAOYSA-N 0.000 description 1
- 238000002048 anodisation reaction Methods 0.000 description 1
- 238000007743 anodising Methods 0.000 description 1
- 239000003637 basic solution Substances 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 229960003280 cupric chloride Drugs 0.000 description 1
- 238000001312 dry etching Methods 0.000 description 1
- 238000007772 electroless plating Methods 0.000 description 1
- 238000005868 electrolysis reaction Methods 0.000 description 1
- 239000003112 inhibitor Substances 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- RBTARNINKXHZNM-UHFFFAOYSA-K iron trichloride Chemical compound Cl[Fe](Cl)Cl RBTARNINKXHZNM-UHFFFAOYSA-K 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 235000006408 oxalic acid Nutrition 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 229920006122 polyamide resin Polymers 0.000 description 1
- 229920005672 polyolefin resin Polymers 0.000 description 1
- 238000007790 scraping Methods 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 229920002050 silicone resin Polymers 0.000 description 1
- 238000009751 slip forming Methods 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 230000001629 suppression Effects 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/111—Pads for surface mounting, e.g. lay-out
- H05K1/112—Pads for surface mounting, e.g. lay-out directly combined with via connections
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
- H01L21/4814—Conductive parts
- H01L21/4846—Leads on or in insulating or insulated substrates, e.g. metallisation
- H01L21/486—Via connections through the substrate with or without pins
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/12—Mountings, e.g. non-detachable insulating substrates
- H01L23/14—Mountings, e.g. non-detachable insulating substrates characterised by the material or its electrical properties
- H01L23/142—Metallic substrates having insulating layers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/49827—Via connections through the substrates, e.g. pins going through the substrate, coaxial cables
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/153—Connection portion
- H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
- H01L2924/15311—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a ball array, e.g. BGA
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0104—Properties and characteristics in general
- H05K2201/0133—Elastomeric or compliant polymer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10227—Other objects, e.g. metallic pieces
- H05K2201/10378—Interposers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/03—Metal processing
- H05K2203/0315—Oxidising metal
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/4007—Surface contacts, e.g. bumps
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Ceramic Engineering (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
- Structure Of Printed Boards (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
Description
Claims (10)
- 厚み方向に貫通する複数の貫通導体が設けられた酸化アルミニウム基板と、
前記酸化アルミニウム基板の一方の面に配置された第1接続パッドと、
前記酸化アルミニウム基板の他方の面に、前記第1接続パッドに対応して配置された第2接続パッドと、
前記第1接続パッドを取り囲んで配置された第1金属層と、
前記第1金属層に対応して配置され、前記第2接続パッドを取り囲む第2金属層と、
前記第1接続パッドと前記第2接続パッドとを接続すると共に、前記第1金属層と前記第2金属層とを接続する前記複数の貫通導体と、
前記第1接続パッドと前記第1金属層との間の部分の前記酸化アルミニウム基板の上に配置された絶縁層と、
平面視で前記絶縁層と重なる領域の前記酸化アルミニウム基板の部分に貫通して形成された開口部と、
前記酸化アルミニウム基板の開口部に充填された弾性体と
を有し、
前記第1接続パッド、前記第2接続パッド、前記第1金属層、及び前記第2金属層に、前記複数の貫通導体がそれぞれ接続されていることを特徴とする配線基板。 - 前記第1金属層及び前記第2金属層は、それぞれ2つ以上に分割されていることを特徴とする請求項1に記載の配線基板。
- 前記第1金属層及び前記第2金属層の各々において、分割された隣合う金属層は電源パターンとグランドパターンであり、
前記第1金属層及び前記第2金属層の分離された部分の前記酸化アルミニウム基板に、電気的に孤立した前記複数の貫通導体が配置されていることを特徴とする請求項2に記載の配線基板。 - 前記貫通導体の密度は、4×106本/mm2〜1×1010本/mm2の範囲で形成されていることを特徴とする請求項1乃至3のいずれか一項に記載の配線基板。
- 前記弾性体の弾性率は、100MPa以下であることを特徴とする請求項1乃至4のいずれか一項に記載の配線基板。
- 複数のスルーホールを備えた酸化アルミニウム基板を用意する工程と、
前記酸化アルミニウム基板の上に環状パターンの絶縁層を形成する工程と、
前記酸化アルミニウム基板及び前記絶縁層の上にシード金属層を形成する工程と、
前記シード金属層を給電経路とする電解めっきにより、前記酸化アルミニウム基板のスルーホールに貫通導体を充填する工程と、
前記絶縁層の下の前記酸化アルミニウム基板を除去して開口部を形成する工程と、
前記酸化アルミニウム基板の開口部に弾性体を充填する工程とを有することを特徴とする配線基板の製造方法。 - 前記弾性体を充填する工程の後に、
前記絶縁層が露出するまで前記シード金属層を除去して、前記環状パターンの絶縁層の内側に第1接続パッドを形成すると共に、前記絶縁層の外側に第1金属層を形成する工程を有することを特徴とする請求項6に記載の配線基板の製造方法。 - 前記貫通導体を充填する工程は、
前記第1接続パッドに対応する部分の前記酸化アルミニウム基板の下面に、前記貫通導体に繋がる第2接続パッドを形成すると共に、前記第1金属層に対応する部分の前記酸化アルミニウム基板の下面に、前記貫通導体に繋がる第2金属層を形成することを含むことを特徴とする請求項7に配線基板の製造方法。 - 前記第1金属層及び前記第2金属層は、2つ以上に分離されて形成されることを特徴とする請求項8に記載の配線基板の製造方法。
- 前記貫通導体の密度は、4×106本/mm2〜1×1010本/mm2の範囲で形成されることを特徴とする請求項6乃至9のいずれか一項に記載の配線基板の製造方法。
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2013051537A JP6082284B2 (ja) | 2013-03-14 | 2013-03-14 | 配線基板及びその製造方法 |
US14/202,220 US9204544B2 (en) | 2013-03-14 | 2014-03-10 | Wiring substrate and method of manufacturing the same |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2013051537A JP6082284B2 (ja) | 2013-03-14 | 2013-03-14 | 配線基板及びその製造方法 |
Publications (3)
Publication Number | Publication Date |
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JP2014179411A JP2014179411A (ja) | 2014-09-25 |
JP2014179411A5 JP2014179411A5 (ja) | 2016-01-21 |
JP6082284B2 true JP6082284B2 (ja) | 2017-02-15 |
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Country Status (2)
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US (1) | US9204544B2 (ja) |
JP (1) | JP6082284B2 (ja) |
Family Cites Families (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4942400A (en) * | 1990-02-09 | 1990-07-17 | General Electric Company | Analog to digital converter with multilayer printed circuit mounting |
JP3014503B2 (ja) * | 1991-08-05 | 2000-02-28 | 日本特殊陶業株式会社 | 集積回路用パッケージ |
JP2002289998A (ja) * | 2001-03-23 | 2002-10-04 | Citizen Watch Co Ltd | 回路基板とその製造方法 |
US6828513B2 (en) * | 2002-04-30 | 2004-12-07 | Texas Instruments Incorporated | Electrical connector pad assembly for printed circuit board |
JP2004273480A (ja) * | 2003-03-05 | 2004-09-30 | Sony Corp | 配線基板およびその製造方法および半導体装置 |
US7583513B2 (en) * | 2003-09-23 | 2009-09-01 | Intel Corporation | Apparatus for providing an integrated printed circuit board registration coupon |
JP4654942B2 (ja) * | 2006-02-28 | 2011-03-23 | ミネベア株式会社 | 面状照明装置 |
JP5344667B2 (ja) | 2007-12-18 | 2013-11-20 | 太陽誘電株式会社 | 回路基板およびその製造方法並びに回路モジュール |
JP5385682B2 (ja) * | 2009-05-19 | 2014-01-08 | 新光電気工業株式会社 | 電子部品の実装構造 |
JP2011014612A (ja) * | 2009-06-30 | 2011-01-20 | Ibiden Co Ltd | 配線基板及び配線基板の製造方法 |
JP2011151185A (ja) * | 2010-01-21 | 2011-08-04 | Shinko Electric Ind Co Ltd | 配線基板及び半導体装置 |
US8870579B1 (en) * | 2011-01-14 | 2014-10-28 | Paricon Technologies Corporation | Thermally and electrically enhanced elastomeric conductive materials |
-
2013
- 2013-03-14 JP JP2013051537A patent/JP6082284B2/ja active Active
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2014
- 2014-03-10 US US14/202,220 patent/US9204544B2/en active Active
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Publication number | Publication date |
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US9204544B2 (en) | 2015-12-01 |
US20140262465A1 (en) | 2014-09-18 |
JP2014179411A (ja) | 2014-09-25 |
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