JP6080132B2 - 有機電子装置封止用光硬化型粘接着フィルム、有機電子装置及びその封止方法 - Google Patents
有機電子装置封止用光硬化型粘接着フィルム、有機電子装置及びその封止方法 Download PDFInfo
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- JP6080132B2 JP6080132B2 JP2014542250A JP2014542250A JP6080132B2 JP 6080132 B2 JP6080132 B2 JP 6080132B2 JP 2014542250 A JP2014542250 A JP 2014542250A JP 2014542250 A JP2014542250 A JP 2014542250A JP 6080132 B2 JP6080132 B2 JP 6080132B2
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- 125000000484 butyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- LYQFWZFBNBDLEO-UHFFFAOYSA-M caesium bromide Chemical compound [Br-].[Cs+] LYQFWZFBNBDLEO-UHFFFAOYSA-M 0.000 description 1
- WGEFECGEFUFIQW-UHFFFAOYSA-L calcium dibromide Chemical compound [Ca+2].[Br-].[Br-] WGEFECGEFUFIQW-UHFFFAOYSA-L 0.000 description 1
- 125000004432 carbon atom Chemical group C* 0.000 description 1
- 239000012952 cationic photoinitiator Substances 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 239000007795 chemical reaction product Substances 0.000 description 1
- KTVIXTQDYHMGHF-UHFFFAOYSA-L cobalt(2+) sulfate Chemical compound [Co+2].[O-]S([O-])(=O)=O KTVIXTQDYHMGHF-UHFFFAOYSA-L 0.000 description 1
- 238000012790 confirmation Methods 0.000 description 1
- 238000010924 continuous production Methods 0.000 description 1
- ORTQZVOHEJQUHG-UHFFFAOYSA-L copper(II) chloride Chemical compound Cl[Cu]Cl ORTQZVOHEJQUHG-UHFFFAOYSA-L 0.000 description 1
- 239000007822 coupling agent Substances 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 125000005442 diisocyanate group Chemical group 0.000 description 1
- XUCJHNOBJLKZNU-UHFFFAOYSA-M dilithium;hydroxide Chemical compound [Li+].[Li+].[OH-] XUCJHNOBJLKZNU-UHFFFAOYSA-M 0.000 description 1
- 125000003438 dodecyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000008393 encapsulating agent Substances 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 150000002118 epoxides Chemical group 0.000 description 1
- 150000002148 esters Chemical class 0.000 description 1
- VIBDJEWPNNCFQO-UHFFFAOYSA-N ethane-1,1,2-triol Chemical compound OCC(O)O VIBDJEWPNNCFQO-UHFFFAOYSA-N 0.000 description 1
- XYIBRDXRRQCHLP-UHFFFAOYSA-N ethyl acetoacetate Chemical compound CCOC(=O)CC(C)=O XYIBRDXRRQCHLP-UHFFFAOYSA-N 0.000 description 1
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 1
- 239000005038 ethylene vinyl acetate Substances 0.000 description 1
- 229920006244 ethylene-ethyl acrylate Polymers 0.000 description 1
- 229920006225 ethylene-methyl acrylate Polymers 0.000 description 1
- 238000010528 free radical solution polymerization reaction Methods 0.000 description 1
- 230000006870 function Effects 0.000 description 1
- 229910000373 gallium sulfate Inorganic materials 0.000 description 1
- SBDRYJMIQMDXRH-UHFFFAOYSA-N gallium;sulfuric acid Chemical compound [Ga].OS(O)(=O)=O SBDRYJMIQMDXRH-UHFFFAOYSA-N 0.000 description 1
- 238000004817 gas chromatography Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- RRAMGCGOFNQTLD-UHFFFAOYSA-N hexamethylene diisocyanate Chemical compound O=C=NCCCCCCN=C=O RRAMGCGOFNQTLD-UHFFFAOYSA-N 0.000 description 1
- 230000005525 hole transport Effects 0.000 description 1
- 125000004435 hydrogen atom Chemical group [H]* 0.000 description 1
- 238000005286 illumination Methods 0.000 description 1
- 239000011256 inorganic filler Substances 0.000 description 1
- 229910003475 inorganic filler Inorganic materials 0.000 description 1
- 230000003993 interaction Effects 0.000 description 1
- KFZAUHNPPZCSCR-UHFFFAOYSA-N iron zinc Chemical compound [Fe].[Zn] KFZAUHNPPZCSCR-UHFFFAOYSA-N 0.000 description 1
- 125000001449 isopropyl group Chemical group [H]C([H])([H])C([H])(*)C([H])([H])[H] 0.000 description 1
- INHCSSUBVCNVSK-UHFFFAOYSA-L lithium sulfate Inorganic materials [Li+].[Li+].[O-]S([O-])(=O)=O INHCSSUBVCNVSK-UHFFFAOYSA-L 0.000 description 1
- BLQJIBCZHWBKSL-UHFFFAOYSA-L magnesium iodide Chemical compound [Mg+2].[I-].[I-] BLQJIBCZHWBKSL-UHFFFAOYSA-L 0.000 description 1
- 229910052943 magnesium sulfate Inorganic materials 0.000 description 1
- 235000019341 magnesium sulphate Nutrition 0.000 description 1
- VZCYOOQTPOCHFL-UPHRSURJSA-N maleic acid Chemical compound OC(=O)\C=C/C(O)=O VZCYOOQTPOCHFL-UPHRSURJSA-N 0.000 description 1
- 239000011976 maleic acid Substances 0.000 description 1
- FPYJFEHAWHCUMM-UHFFFAOYSA-N maleic anhydride Chemical compound O=C1OC(=O)C=C1 FPYJFEHAWHCUMM-UHFFFAOYSA-N 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 229910001507 metal halide Inorganic materials 0.000 description 1
- 150000005309 metal halides Chemical class 0.000 description 1
- JKJJSJJGBZXUQV-UHFFFAOYSA-N methyl 2-methylidenebutanoate Chemical compound CCC(=C)C(=O)OC JKJJSJJGBZXUQV-UHFFFAOYSA-N 0.000 description 1
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 1
- LVHBHZANLOWSRM-UHFFFAOYSA-N methylenebutanedioic acid Natural products OC(=O)CC(=C)C(O)=O LVHBHZANLOWSRM-UHFFFAOYSA-N 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 125000001421 myristyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- WYOXPIKARMAQFM-UHFFFAOYSA-N n,n,n',n'-tetrakis(oxiran-2-ylmethyl)ethane-1,2-diamine Chemical compound C1OC1CN(CC1OC1)CCN(CC1OC1)CC1CO1 WYOXPIKARMAQFM-UHFFFAOYSA-N 0.000 description 1
- 125000004123 n-propyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- LGQLOGILCSXPEA-UHFFFAOYSA-L nickel sulfate Chemical compound [Ni+2].[O-]S([O-])(=O)=O LGQLOGILCSXPEA-UHFFFAOYSA-L 0.000 description 1
- 229910000363 nickel(II) sulfate Inorganic materials 0.000 description 1
- 229920003986 novolac Polymers 0.000 description 1
- AFEQENGXSMURHA-UHFFFAOYSA-N oxiran-2-ylmethanamine Chemical compound NCC1CO1 AFEQENGXSMURHA-UHFFFAOYSA-N 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- AOLPZAHRYHXPLR-UHFFFAOYSA-I pentafluoroniobium Chemical compound F[Nb](F)(F)(F)F AOLPZAHRYHXPLR-UHFFFAOYSA-I 0.000 description 1
- 125000001147 pentyl group Chemical group C(CCCC)* 0.000 description 1
- 239000004014 plasticizer Substances 0.000 description 1
- 229920001200 poly(ethylene-vinyl acetate) Polymers 0.000 description 1
- 229920002857 polybutadiene Polymers 0.000 description 1
- 229920001083 polybutene Polymers 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 229920000139 polyethylene terephthalate Polymers 0.000 description 1
- 239000005020 polyethylene terephthalate Substances 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 229920000307 polymer substrate Polymers 0.000 description 1
- 230000000379 polymerizing effect Effects 0.000 description 1
- 229920005862 polyol Polymers 0.000 description 1
- 229920000098 polyolefin Polymers 0.000 description 1
- 150000003077 polyols Chemical class 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
- 239000004810 polytetrafluoroethylene Substances 0.000 description 1
- 229920001343 polytetrafluoroethylene Polymers 0.000 description 1
- 229920006264 polyurethane film Polymers 0.000 description 1
- UOMUPDCRXJLVGR-UHFFFAOYSA-N propane-1,2,2-triol Chemical compound CC(O)(O)CO UOMUPDCRXJLVGR-UHFFFAOYSA-N 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- 150000003254 radicals Chemical class 0.000 description 1
- 239000012744 reinforcing agent Substances 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- 239000011734 sodium Substances 0.000 description 1
- KKCBUQHMOMHUOY-UHFFFAOYSA-N sodium oxide Chemical compound [O-2].[Na+].[Na+] KKCBUQHMOMHUOY-UHFFFAOYSA-N 0.000 description 1
- 229910052938 sodium sulfate Inorganic materials 0.000 description 1
- 235000011152 sodium sulphate Nutrition 0.000 description 1
- 238000001179 sorption measurement Methods 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 125000001424 substituent group Chemical group 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 150000003467 sulfuric acid derivatives Chemical class 0.000 description 1
- 239000004094 surface-active agent Substances 0.000 description 1
- 238000010557 suspension polymerization reaction Methods 0.000 description 1
- YRGLXIVYESZPLQ-UHFFFAOYSA-I tantalum pentafluoride Chemical compound F[Ta](F)(F)(F)F YRGLXIVYESZPLQ-UHFFFAOYSA-I 0.000 description 1
- RBTVSNLYYIMMKS-UHFFFAOYSA-N tert-butyl 3-aminoazetidine-1-carboxylate;hydrochloride Chemical compound Cl.CC(C)(C)OC(=O)N1CC(N)C1 RBTVSNLYYIMMKS-UHFFFAOYSA-N 0.000 description 1
- 125000000999 tert-butyl group Chemical group [H]C([H])([H])C(*)(C([H])([H])[H])C([H])([H])[H] 0.000 description 1
- 229910052718 tin Inorganic materials 0.000 description 1
- 239000010936 titanium Substances 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- HDUMBHAAKGUHAR-UHFFFAOYSA-J titanium(4+);disulfate Chemical compound [Ti+4].[O-]S([O-])(=O)=O.[O-]S([O-])(=O)=O HDUMBHAAKGUHAR-UHFFFAOYSA-J 0.000 description 1
- DVKJHBMWWAPEIU-UHFFFAOYSA-N toluene 2,4-diisocyanate Chemical compound CC1=CC=C(N=C=O)C=C1N=C=O DVKJHBMWWAPEIU-UHFFFAOYSA-N 0.000 description 1
- VZCYOOQTPOCHFL-UHFFFAOYSA-N trans-butenedioic acid Natural products OC(=O)C=CC(O)=O VZCYOOQTPOCHFL-UHFFFAOYSA-N 0.000 description 1
- IUCJMVBFZDHPDX-UHFFFAOYSA-N tretamine Chemical compound C1CN1C1=NC(N2CC2)=NC(N2CC2)=N1 IUCJMVBFZDHPDX-UHFFFAOYSA-N 0.000 description 1
- 229950001353 tretamine Drugs 0.000 description 1
- 125000005409 triarylsulfonium group Chemical group 0.000 description 1
- 239000000326 ultraviolet stabilizing agent Substances 0.000 description 1
- 238000001771 vacuum deposition Methods 0.000 description 1
- 150000003681 vanadium Chemical class 0.000 description 1
- 229910052720 vanadium Inorganic materials 0.000 description 1
- GPPXJZIENCGNKB-UHFFFAOYSA-N vanadium Chemical compound [V]#[V] GPPXJZIENCGNKB-UHFFFAOYSA-N 0.000 description 1
- 239000008096 xylene Substances 0.000 description 1
Classifications
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J175/00—Adhesives based on polyureas or polyurethanes; Adhesives based on derivatives of such polymers
- C09J175/04—Polyurethanes
- C09J175/14—Polyurethanes having carbon-to-carbon unsaturated bonds
- C09J175/16—Polyurethanes having carbon-to-carbon unsaturated bonds having terminal carbon-to-carbon unsaturated bonds
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/12—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by using adhesives
- B32B37/1207—Heat-activated adhesive
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/4007—Curing agents not provided for by the groups C08G59/42 - C08G59/66
- C08G59/4014—Nitrogen containing compounds
- C08G59/4028—Isocyanates; Thioisocyanates
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/68—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L33/00—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides or nitriles thereof; Compositions of derivatives of such polymers
- C08L33/04—Homopolymers or copolymers of esters
- C08L33/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, which oxygen atoms are present only as part of the carboxyl radical
- C08L33/062—Copolymers with monomers not covered by C08L33/06
- C08L33/066—Copolymers with monomers not covered by C08L33/06 containing -OH groups
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
- C09J133/04—Homopolymers or copolymers of esters
- C09J133/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, the oxygen atom being present only as part of the carboxyl radical
- C09J133/062—Copolymers with monomers not covered by C09J133/06
- C09J133/066—Copolymers with monomers not covered by C09J133/06 containing -OH groups
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
- C09J133/04—Homopolymers or copolymers of esters
- C09J133/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, the oxygen atom being present only as part of the carboxyl radical
- C09J133/08—Homopolymers or copolymers of acrylic acid esters
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K30/00—Organic devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation
- H10K30/80—Constructional details
- H10K30/88—Passivation; Containers; Encapsulations
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/841—Self-supporting sealing arrangements
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/842—Containers
- H10K50/8426—Peripheral sealing arrangements, e.g. adhesives, sealants
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/844—Encapsulations
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/846—Passivation; Containers; Encapsulations comprising getter material or desiccants
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
- Y02E10/549—Organic PV cells
Landscapes
- Chemical & Material Sciences (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Organic Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Electromagnetism (AREA)
- Electroluminescent Light Sources (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Adhesive Tapes (AREA)
Description
ブチルアクリレート15重量部、メチルエチルアクリレート40重量部、イソボニルアクリレート20重量部、メチルアクリレート15重量部及びヒドロキシエチルアクリレート10重量部の粘着剤を重合して、ガラス転移温度が、約−20℃であり、重量平均分子量が、100万のアクリル系重合体を製造した。
前記コーティング溶液に水分吸着剤で金属酸化物(MgO)をアクリル系重合体100重量部に対して、10重量部を追加で使用したことの以外の全ての過程は、前記実施例1と同一に実施した。
後硬化(熟成工程)したことの以外の全ての過程は、前記実施例1と同一に実施した。
イソシアネート架橋剤を除外させてコーティング溶液を製造したことの以外の全ての過程は、前記実施例1と同一に実行した。
前記エポキシ樹脂でYD−128(KUKDO化学製)5重量部を使用したことの以外は、実施例1と同一に実行した。
前記実施例1で使用したアクリル系重合体のみを使用し、イソシアネート系架橋剤、トリメチルーロプロパンタイプのエポキシ樹脂及びトリアリールするホニウム塩タイプの陽イオン光重合開始剤を使用しないことの以外は、実施例1と同一に実行した。
前記実施例1で使用したトリメテロールプロパンタイプのエポキシ樹脂(SR−TMP、SAKAMOTO社製)40重量部を使用したことの以外は、実施例1と同一に実行した。
前記実施例1、実施例3及び比較例1〜比較例4で製造された粘接着フィルムを熱硬化してMOCON社のPERMATRAN−W Model 3/61を利用して、37.8℃、100%RHの条件で、面積1cm2に対する水分透過度を測定して、表1に示した(但し、測定部分は、UVを照射した部分とする)。
前記実施例1、実施例3及び比較例1〜比較例4で製造された粘接着フィルムをヘイズメーターHR−100(MURAKAMI COLOR RESEARCH LABORATORY製)を利用して透過率とヘイズを測定して、表1に示した(但し、測定部分は、UVを照射しない部分で、実際に光が透過される部分とする。)。
前記実施例1、実施例3及び比較例1〜比較例4で製造された粘接着フィルムを25mm×100mmのサイズで切断してガラスにラミネーティングした後、硬化させたフィルムを180゜で剥離する時の剥離力(peel strength)を測定した。引く速度は、300mm/minであり、各サンプル当たり2回ずつ測定した平均を求めて、下記表1に示した(但し、測定部分は、UVを照射した部分とする)。
前記実施例1で製造された粘接着フィルムから離型PETフィルムを除去した後、1次でインキャップ用ガラス(上板)に合着し、残りの離型PETフィルムも除去した後、光照射の前に、真空合着器を利用して100mTorr未満の真空度で、70℃の熱と約2kgfの圧力を加えて上板とOLEDが形成された下板を合着した後、マスクの使用なしに全体領域に10J/cm2のUVを照射したことの以外は、実施例1と同様に実施した。
実施例1及び比較例5で製造された有機電子装置の有機発光素子の色座標を対比した結果、実施例1対比比較例5の有機発光素子の色座標が、5%以上変更されたことを確認することができた。また、実施例1対比高温高湿での寿命が、10%以上減少することを確認することができた。
Claims (22)
- 上部に有機発光素子が形成されている基板と、前記基板上で前記有機発光素子の全面を封止する粘接着フィルムを含む有機電子装置であって、
前記粘接着フィルムは、アクリル系重合体、多官能エポキシ樹脂、多官能性架橋剤及び光開始剤を含む光硬化型粘接着剤組成物を含む粘接着層を含み、
前記アクリル系重合体は、前記多官能性架橋剤と反応できる架橋性官能基を含み、且つ、前記アクリル系重合体は、アルキル(メタ)アクリレート及び架橋性官能基を有する共重合性単量体を重合された形態で含み、
前記エポキシ樹脂は、アクリル系重合体100重量部に対して、1重量部〜30重量部であり、
前記粘接着層は、有機発光素子と直接接触しない縁部のみ光硬化された状態で存在し、
光硬化及び熱硬化が完了された状態である最終製品で、前記有機発光素子と直接接触しない縁部のみ光硬化された状態で存在する粘接着層部位と有機発光素子と直接接触する粘接着層部位とのゲル含量の差が、10%以上であり、
前記粘接着フィルムは、常温で半固相であり、粘度が、10 5 〜10 7 Pa・sであることを特徴とする有機電子装置。 - 前記粘接着フィルムの光硬化された状態で存在する部位が有機発光素子のまわりを取り囲んでいることを特徴とする請求項1に記載の有機電子装置。
- 光硬化及び熱硬化が完了された状態である最終製品で、前記有機発光素子と直接接触しない縁部のみ光硬化された状態で存在する粘接着層部位に存在する光硬化型粘接着剤組成物の未反応物質が有機発光装置と直接接触する粘接着層部位より少ないことを特徴とする請求項1に記載の有機電子装置。
- 前記粘接着フィルムの光硬化された状態で存在する部位が有機発光素子のまわりを取り囲んでいることを特徴とする請求項1に記載の有機電子装置。
- 前記アクリル系重合体は、重量平均分子量が、40万〜200万であることを特徴とする請求項1に記載の有機電子装置。
- 前記架橋性官能基は、グリシジル基、イソシアネート基、ヒドロキシ基、カルボキシル基、アミド基、エポキシド基、環状エーテル基、スルフィド基、アセタール基またはラクトン基から選択される一つ以上であることを特徴とする請求項1に記載の有機電子装置。
- 前記架橋剤は、イソシアネート系化合物、エポキシ系化合物、アジリジン系化合物または金属キレート系化合物であることを特徴とする請求項1に記載の有機電子装置。
- 前記光硬化型粘接着剤組成物は、前記架橋剤をアクリル系重合体100重量部に対して、0.01重量部〜10重量部で含むことを特徴とする請求項1に記載の有機電子装置。
- 前記光開始剤は、陽イオン光重合開始剤であることを特徴とする請求項1に記載の有機電子装置。
- 前記陽イオン光重合開始剤は、芳香族ジアゾニウム塩、芳香族ヨードアルミニウム塩、芳香族スルホニウム塩または鉄−アレン錯体であることを特徴とする請求項9に記載の有機電子装置。
- 前記光硬化型粘接着剤組成物は、前記光開始剤をアクリル系重合体100重量部に対して、0.01重量部〜10重量部で含むことを特徴とする請求項1に記載の有機電子装置。
- 前記光硬化型粘接着剤組成物は、水分吸着剤をさらに含むことを特徴とする請求項1に記載の有機電子装置。
- 前記水分吸着剤は、アルミナ、金属酸化物、有機金属酸化物、金属塩または五酸化リンであることを特徴とする請求項12に記載の有機電子装置。
- 前記水分吸着剤は、P2O5、Li2O、Na2O、BaO、CaO、MgO、Li2SO4、Na2SO4、CaSO4、MgSO4、CoSO4、Ga2(SO4)3、Ti(SO4)2、NiSO4、CaCl2、MgCl2、SrCl2、YCl3、CuCl2、CsF、TaF5、NbF5、LiBr、CaBr2、CeBr3、SeBr4、VBr3、MgBr2、BaI2、MgI2、Ba(ClO4)2及びMg(ClO4)2からなる群より選択される一つ以上であることを特徴とする請求項12に記載の有機電子装置。
- 前記光硬化型粘接着剤組成物は、フィラーをさらに含むことを特徴とする請求項1に記載の有機電子装置。
- 前記フィラーは、クレイ、タルク、シリカ、硫酸バリウム、水酸化アルミニウム、炭酸カルシウム、炭酸マグネシウム、ゼオライト、ジルコニア、チタニアまたはモンモリルロナイトからなる群より選択される一つ以上であることを特徴とする請求項15に記載の有機電子装置。
- 前記粘接着フィルム及び有機発光素子の間に前記有機発光素子を封止している保護層をさらに含むことを特徴とする請求項1に記載の有機電子装置。
- アクリル系重合体、多官能エポキシ樹脂、多官能性架橋剤及び光開始剤を含む粘接着層を含む光硬化型粘接着フィルムを上部基板に合着する段階と、
上部に有機発光素子が形成された下部基板に前記粘接着層が前記有機発光素子の全面を覆うように上部基板を合着する段階と、
前記合着された上下部基板の有機発光素子が配置されない縁部にのみ光を照射して光硬化させる段階と、を含み、
前記アクリル系重合体は、前記多官能性架橋剤と反応できる架橋性官能基を含み、且つ、前記アクリル系重合体は、アルキル(メタ)アクリレート及び架橋性官能基を有する共重合性単量体を重合された形態で含むことを特徴とする請求項1に記載の有機電子装置の製造方法。 - 光硬化後、低温で熱硬化させる段階をさらに実行することを特徴とする請求項18に記載の有機電子装置の製造方法。
- 前記低温で熱硬化させる段階は、30℃〜80℃の温度で30分〜3時間の間実行することを特徴とする請求項19に記載の有機電子装置の製造方法。
- アクリル系重合体、多官能エポキシ樹脂、多官能性架橋剤及び光開始剤を含み、
前記アクリル系重合体は、前記多官能性架橋剤と反応できる架橋性官能基を含み、且つ、前記アクリル系重合体は、アルキル(メタ)アクリレート及び架橋性官能基を有する共重合性単量体を重合された形態で含むことを特徴とする請求項1に記載の有機電子装置封止用光硬化型粘接着剤組成物。 - 請求項21に記載の組成物を含むフィルム状の成形物であって、
25℃での粘度が、105〜107Pa・sの粘接着層を含むことを特徴とする有機電子装置封止用光硬化型粘接着フィルム。
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Families Citing this family (25)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2017531049A (ja) | 2014-07-25 | 2017-10-19 | カティーバ, インコーポレイテッド | 有機薄膜インク組成物および方法 |
JP6383211B2 (ja) * | 2014-08-01 | 2018-08-29 | 三星エスディアイ株式会社SAMSUNG SDI Co., LTD. | 粘着剤組成物、光学部材および粘着シート |
US10355239B2 (en) | 2015-02-04 | 2019-07-16 | Lg Chem, Ltd. | Encapsulation film |
KR20180048690A (ko) | 2015-08-31 | 2018-05-10 | 카티바, 인크. | 디- 및 모노(메트)아크릴레이트 기초 유기 박막 잉크 조성물 |
CN106541310B (zh) * | 2015-09-23 | 2019-09-17 | 上海和辉光电有限公司 | 显示面板的切割方法 |
CN105514286B (zh) * | 2016-01-08 | 2019-01-04 | 中国计量学院 | 一种基于氟化锂缓冲层的光敏有机场效应管薄膜封装技术 |
CN105655273B (zh) * | 2016-03-18 | 2019-03-12 | 京东方科技集团股份有限公司 | 一种封装方法和一种封装装置 |
TWI609028B (zh) | 2016-05-06 | 2017-12-21 | 財團法人工業技術研究院 | 共聚物與含其之樹脂組合物、封裝膜及封裝結構 |
CN106905550B (zh) * | 2016-11-23 | 2019-09-24 | 武汉市三选科技有限公司 | Oled封装用胶片及其制造方法及使用该胶片的封装oled方法 |
KR20180062201A (ko) * | 2016-11-30 | 2018-06-08 | 모멘티브퍼포먼스머티리얼스코리아 주식회사 | 유기 전자 소자 봉지재용 조성물 및 이를 이용하여 형성된 봉지재 |
WO2018105901A1 (ko) * | 2016-12-08 | 2018-06-14 | 주식회사 엘지화학 | 기판의 접착방법 및 이를 통해 제조된 디스플레이용 기판 |
CN110235262B (zh) * | 2016-12-27 | 2023-07-18 | 莫门蒂夫性能材料韩国株式会社 | 用于有机电子器件密封剂的组合物以及采用该组合物形成的密封剂 |
CN111788265B (zh) | 2017-04-21 | 2024-04-23 | 柯狄公司 | 用于形成有机薄膜的组合物和技术 |
US11024827B2 (en) | 2017-05-24 | 2021-06-01 | Lg Chem, Ltd. | Organic electronic device |
KR102031621B1 (ko) * | 2017-10-25 | 2019-10-14 | (주)켐베이스 | 감온성 점착제 조성물 |
WO2019111182A1 (en) | 2017-12-06 | 2019-06-13 | 3M Innovative Properties Company | Barrier adhesive compositions and articles |
KR102192565B1 (ko) * | 2018-05-21 | 2020-12-17 | 한국과학기술원 | 보호막이 형성된 유기 소자 및 그 제조 방법 |
US10879489B2 (en) | 2018-05-21 | 2020-12-29 | Korea Advanced Institute Of Science And Technology | Organic device having protective film and method of manufacturing the same |
KR20210003272A (ko) * | 2018-05-25 | 2021-01-11 | 쓰리엠 이노베이티브 프로퍼티즈 컴파니 | 상 분리된 물품 |
CN109309172A (zh) * | 2018-10-11 | 2019-02-05 | 信利半导体有限公司 | 柔性oled器件及其制造方法、显示装置 |
CN111048686A (zh) * | 2019-11-19 | 2020-04-21 | Tcl华星光电技术有限公司 | 一种显示装置及采用该显示装置的封装方法 |
US11753497B2 (en) * | 2021-04-29 | 2023-09-12 | Canon Kabushiki Kaisha | Photocurable composition |
CN113563810A (zh) * | 2021-08-24 | 2021-10-29 | 天津派森新材料技术有限责任公司 | 一种用于封装的uv胶及其制备方法 |
CN114736627A (zh) * | 2022-05-17 | 2022-07-12 | 新纶电子材料(常州)有限公司 | 半固化压敏聚合物膜和可折叠玻璃盖板及二者的制备方法 |
CN115717041B (zh) * | 2022-11-23 | 2023-12-12 | 世晨材料技术(上海)有限公司 | 一种可uv固化的组合物及包含该组合物的胶膜、胶带 |
Family Cites Families (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2002317172A (ja) * | 2001-04-20 | 2002-10-31 | Nippon Kayaku Co Ltd | 液晶表示装置用シール材樹脂組成物 |
JP2003197366A (ja) * | 2001-12-25 | 2003-07-11 | Sanyo Electric Co Ltd | 表示装置及びその製造方法 |
KR20100080632A (ko) * | 2002-06-17 | 2010-07-09 | 세키스이가가쿠 고교가부시키가이샤 | 유기 전계 발광 소자의 밀봉 방법 |
AU2003261188A1 (en) * | 2002-07-24 | 2004-02-09 | Adhesives Research, Inc. | Transformable pressure sensitive adhesive tape and use thereof in display screens |
TWI225501B (en) * | 2002-11-06 | 2004-12-21 | Delta Optoelectronics Inc | Packaging material used for a display device and method of forming thereof |
KR100552974B1 (ko) | 2003-11-17 | 2006-02-15 | 삼성에스디아이 주식회사 | 유기 전계 발광 표시 장치 및 그의 제조 방법 |
KR100604351B1 (ko) | 2004-08-31 | 2006-07-25 | 한국화학연구원 | 내화학성이 우수한 플라스틱 기판과 그의 제조방법 |
EP1804310B1 (en) * | 2005-12-30 | 2016-10-19 | Samsung Display Co., Ltd. | Organic light emiting device and method of manufacturing the same |
US8038495B2 (en) * | 2006-01-20 | 2011-10-18 | Samsung Mobile Display Co., Ltd. | Organic light-emitting display device and manufacturing method of the same |
JP2008003216A (ja) * | 2006-06-21 | 2008-01-10 | Asahi Glass Co Ltd | 液晶表示パネルの製造方法 |
JP2008122897A (ja) * | 2006-10-19 | 2008-05-29 | Hitachi Chem Co Ltd | ネガ露光用フォトマスク及びこれを用いて製造される光硬化型パターン |
CN101632010A (zh) * | 2006-12-28 | 2010-01-20 | 新加坡科技研究局 | 带有集成气体渗透传感器的封装器件 |
JP5469059B2 (ja) * | 2007-05-18 | 2014-04-09 | ヘンケル・アクチェンゲゼルシャフト・ウント・コムパニー・コマンディットゲゼルシャフト・アウフ・アクチェン | 弾性積層接着剤によって保護された有機電子デバイス |
JP5201347B2 (ja) * | 2008-11-28 | 2013-06-05 | 株式会社スリーボンド | 有機el素子封止用光硬化性樹脂組成物 |
KR20100069205A (ko) * | 2008-12-16 | 2010-06-24 | 동우 화인켐 주식회사 | 광경화 수지 조성물, 이로부터 제조된 프리즘 필름, 백라이트 유닛 및 액정표시소자 |
TWI564361B (zh) * | 2009-10-16 | 2017-01-01 | Lg化學股份有限公司 | 晶粒接附膜 |
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