JP6066385B2 - 硬化性組成物 - Google Patents
硬化性組成物 Download PDFInfo
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- JP6066385B2 JP6066385B2 JP2015524195A JP2015524195A JP6066385B2 JP 6066385 B2 JP6066385 B2 JP 6066385B2 JP 2015524195 A JP2015524195 A JP 2015524195A JP 2015524195 A JP2015524195 A JP 2015524195A JP 6066385 B2 JP6066385 B2 JP 6066385B2
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- chemical formula
- sio
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- polyorganosiloxane
- formula
- Prior art date
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- 239000000203 mixture Substances 0.000 title claims description 135
- 239000000126 substance Substances 0.000 claims description 146
- 150000001875 compounds Chemical class 0.000 claims description 48
- 125000003118 aryl group Chemical group 0.000 claims description 47
- 229910004298 SiO 2 Inorganic materials 0.000 claims description 37
- 125000003700 epoxy group Chemical group 0.000 claims description 32
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical group [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 30
- 125000004432 carbon atom Chemical group C* 0.000 claims description 29
- 125000003342 alkenyl group Chemical group 0.000 claims description 28
- -1 siloxane unit Chemical group 0.000 claims description 22
- 125000000217 alkyl group Chemical group 0.000 claims description 21
- 229910052710 silicon Inorganic materials 0.000 claims description 19
- 125000004435 hydrogen atom Chemical group [H]* 0.000 claims description 15
- 150000003377 silicon compounds Chemical class 0.000 claims description 15
- 125000000524 functional group Chemical group 0.000 claims description 14
- 239000004065 semiconductor Substances 0.000 claims description 14
- 239000002954 polymerization reaction product Substances 0.000 claims description 13
- 150000001923 cyclic compounds Chemical class 0.000 claims description 12
- 125000001931 aliphatic group Chemical group 0.000 claims description 9
- 229910004283 SiO 4 Inorganic materials 0.000 claims description 6
- 229910052739 hydrogen Inorganic materials 0.000 claims description 6
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 claims description 5
- 239000001257 hydrogen Substances 0.000 claims description 5
- 230000003287 optical effect Effects 0.000 claims description 5
- 239000004973 liquid crystal related substance Substances 0.000 claims description 3
- 125000001183 hydrocarbyl group Chemical group 0.000 claims 9
- 230000001588 bifunctional effect Effects 0.000 claims 2
- 238000000034 method Methods 0.000 description 26
- 239000003054 catalyst Substances 0.000 description 24
- 239000000047 product Substances 0.000 description 19
- 238000001723 curing Methods 0.000 description 18
- 150000002430 hydrocarbons Chemical group 0.000 description 18
- KPUWHANPEXNPJT-UHFFFAOYSA-N disiloxane Chemical group [SiH3]O[SiH3] KPUWHANPEXNPJT-UHFFFAOYSA-N 0.000 description 17
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 17
- WGTYBPLFGIVFAS-UHFFFAOYSA-M tetramethylammonium hydroxide Chemical compound [OH-].C[N+](C)(C)C WGTYBPLFGIVFAS-UHFFFAOYSA-M 0.000 description 14
- 125000004122 cyclic group Chemical group 0.000 description 12
- 238000006459 hydrosilylation reaction Methods 0.000 description 12
- 238000004519 manufacturing process Methods 0.000 description 11
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- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 9
- 239000000758 substrate Substances 0.000 description 9
- 230000000704 physical effect Effects 0.000 description 8
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- 238000006243 chemical reaction Methods 0.000 description 7
- 238000007151 ring opening polymerisation reaction Methods 0.000 description 7
- 229910052697 platinum Inorganic materials 0.000 description 6
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- 125000002723 alicyclic group Chemical group 0.000 description 5
- 125000003545 alkoxy group Chemical group 0.000 description 5
- 230000000052 comparative effect Effects 0.000 description 5
- RCNRJBWHLARWRP-UHFFFAOYSA-N ethenyl-[ethenyl(dimethyl)silyl]oxy-dimethylsilane;platinum Chemical compound [Pt].C=C[Si](C)(C)O[Si](C)(C)C=C RCNRJBWHLARWRP-UHFFFAOYSA-N 0.000 description 5
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- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 4
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- 125000000304 alkynyl group Chemical group 0.000 description 4
- 238000000605 extraction Methods 0.000 description 4
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 4
- 239000010703 silicon Substances 0.000 description 4
- 125000001424 substituent group Chemical group 0.000 description 4
- 238000002834 transmittance Methods 0.000 description 4
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 3
- UHOVQNZJYSORNB-UHFFFAOYSA-N Benzene Chemical compound C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 description 3
- XEKOWRVHYACXOJ-UHFFFAOYSA-N Ethyl acetate Chemical compound CCOC(C)=O XEKOWRVHYACXOJ-UHFFFAOYSA-N 0.000 description 3
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 3
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- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 3
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 3
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 3
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 3
- 230000001070 adhesive effect Effects 0.000 description 3
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- 238000011156 evaluation Methods 0.000 description 3
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- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
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- 238000002156 mixing Methods 0.000 description 3
- 229920000647 polyepoxide Polymers 0.000 description 3
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- 229920001296 polysiloxane Polymers 0.000 description 3
- 238000000746 purification Methods 0.000 description 3
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 3
- FYGHSUNMUKGBRK-UHFFFAOYSA-N 1,2,3-trimethylbenzene Chemical compound CC1=CC=CC(C)=C1C FYGHSUNMUKGBRK-UHFFFAOYSA-N 0.000 description 2
- VSIKJPJINIDELZ-UHFFFAOYSA-N 2,2,4,4,6,6,8,8-octakis-phenyl-1,3,5,7,2,4,6,8-tetraoxatetrasilocane Chemical compound O1[Si](C=2C=CC=CC=2)(C=2C=CC=CC=2)O[Si](C=2C=CC=CC=2)(C=2C=CC=CC=2)O[Si](C=2C=CC=CC=2)(C=2C=CC=CC=2)O[Si]1(C=1C=CC=CC=1)C1=CC=CC=C1 VSIKJPJINIDELZ-UHFFFAOYSA-N 0.000 description 2
- AFABGHUZZDYHJO-UHFFFAOYSA-N 2-Methylpentane Chemical compound CCCC(C)C AFABGHUZZDYHJO-UHFFFAOYSA-N 0.000 description 2
- QQZOPKMRPOGIEB-UHFFFAOYSA-N 2-Oxohexane Chemical compound CCCCC(C)=O QQZOPKMRPOGIEB-UHFFFAOYSA-N 0.000 description 2
- PGSGVVCMUJKRJN-UHFFFAOYSA-N C[Si](C)(C)O[Si](C)(C=C)C=C.N Chemical compound C[Si](C)(C)O[Si](C)(C=C)C=C.N PGSGVVCMUJKRJN-UHFFFAOYSA-N 0.000 description 2
- CXYAFFSHJZNAKZ-UHFFFAOYSA-N C[Si]1(O[Si](O[Si](O[Si](O1)(C)C)(C)C)(C)C)C.C[Si]1(O[Si](O[Si](O[Si](O1)(C)C)(C)C)(C)C)C Chemical compound C[Si]1(O[Si](O[Si](O[Si](O1)(C)C)(C)C)(C)C)C.C[Si]1(O[Si](O[Si](O[Si](O1)(C)C)(C)C)(C)C)C CXYAFFSHJZNAKZ-UHFFFAOYSA-N 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 2
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 2
- XTHFKEDIFFGKHM-UHFFFAOYSA-N Dimethoxyethane Chemical compound COCCOC XTHFKEDIFFGKHM-UHFFFAOYSA-N 0.000 description 2
- YNQLUTRBYVCPMQ-UHFFFAOYSA-N Ethylbenzene Chemical compound CCC1=CC=CC=C1 YNQLUTRBYVCPMQ-UHFFFAOYSA-N 0.000 description 2
- ZHNUHDYFZUAESO-UHFFFAOYSA-N Formamide Chemical compound NC=O ZHNUHDYFZUAESO-UHFFFAOYSA-N 0.000 description 2
- ATHHXGZTWNVVOU-UHFFFAOYSA-N N-methylformamide Chemical compound CNC=O ATHHXGZTWNVVOU-UHFFFAOYSA-N 0.000 description 2
- OFBQJSOFQDEBGM-UHFFFAOYSA-N Pentane Chemical compound CCCCC OFBQJSOFQDEBGM-UHFFFAOYSA-N 0.000 description 2
- NINIDFKCEFEMDL-UHFFFAOYSA-N Sulfur Chemical compound [S] NINIDFKCEFEMDL-UHFFFAOYSA-N 0.000 description 2
- WYURNTSHIVDZCO-UHFFFAOYSA-N Tetrahydrofuran Chemical compound C1CCOC1 WYURNTSHIVDZCO-UHFFFAOYSA-N 0.000 description 2
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- YRKCREAYFQTBPV-UHFFFAOYSA-N acetylacetone Chemical compound CC(=O)CC(C)=O YRKCREAYFQTBPV-UHFFFAOYSA-N 0.000 description 2
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- FSIJKGMIQTVTNP-UHFFFAOYSA-N bis(ethenyl)-methyl-trimethylsilyloxysilane Chemical compound C[Si](C)(C)O[Si](C)(C=C)C=C FSIJKGMIQTVTNP-UHFFFAOYSA-N 0.000 description 2
- HUCVOHYBFXVBRW-UHFFFAOYSA-M caesium hydroxide Chemical compound [OH-].[Cs+] HUCVOHYBFXVBRW-UHFFFAOYSA-M 0.000 description 2
- 150000004292 cyclic ethers Chemical class 0.000 description 2
- JHIVVAPYMSGYDF-UHFFFAOYSA-N cyclohexanone Chemical compound O=C1CCCCC1 JHIVVAPYMSGYDF-UHFFFAOYSA-N 0.000 description 2
- LZCLXQDLBQLTDK-UHFFFAOYSA-N ethyl 2-hydroxypropanoate Chemical compound CCOC(=O)C(C)O LZCLXQDLBQLTDK-UHFFFAOYSA-N 0.000 description 2
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- 125000005417 glycidoxyalkyl group Chemical group 0.000 description 2
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- UAEPNZWRGJTJPN-UHFFFAOYSA-N methylcyclohexane Chemical compound CC1CCCCC1 UAEPNZWRGJTJPN-UHFFFAOYSA-N 0.000 description 2
- VLKZOEOYAKHREP-UHFFFAOYSA-N n-Hexane Chemical compound CCCCCC VLKZOEOYAKHREP-UHFFFAOYSA-N 0.000 description 2
- 125000004430 oxygen atom Chemical group O* 0.000 description 2
- 229910052763 palladium Inorganic materials 0.000 description 2
- XNLICIUVMPYHGG-UHFFFAOYSA-N pentan-2-one Chemical compound CCCC(C)=O XNLICIUVMPYHGG-UHFFFAOYSA-N 0.000 description 2
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- LRGJRHZIDJQFCL-UHFFFAOYSA-M tetraethylazanium;hydroxide Chemical compound [OH-].CC[N+](CC)(CC)CC LRGJRHZIDJQFCL-UHFFFAOYSA-M 0.000 description 2
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- KERBAAIBDHEFDD-UHFFFAOYSA-N n-ethylformamide Chemical compound CCNC=O KERBAAIBDHEFDD-UHFFFAOYSA-N 0.000 description 1
- 125000001624 naphthyl group Chemical group 0.000 description 1
- JRZJOMJEPLMPRA-UHFFFAOYSA-N olefin Natural products CCCCCCCC=C JRZJOMJEPLMPRA-UHFFFAOYSA-N 0.000 description 1
- 150000003961 organosilicon compounds Chemical class 0.000 description 1
- 238000002161 passivation Methods 0.000 description 1
- 125000000286 phenylethyl group Chemical group [H]C1=C([H])C([H])=C(C([H])=C1[H])C([H])([H])C([H])([H])* 0.000 description 1
- 125000004344 phenylpropyl group Chemical group 0.000 description 1
- 239000000049 pigment Substances 0.000 description 1
- 229920000570 polyether Polymers 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 230000000379 polymerizing effect Effects 0.000 description 1
- 229920002223 polystyrene Polymers 0.000 description 1
- 229910052700 potassium Inorganic materials 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- LLHKCFNBLRBOGN-UHFFFAOYSA-N propylene glycol methyl ether acetate Chemical compound COCC(C)OC(C)=O LLHKCFNBLRBOGN-UHFFFAOYSA-N 0.000 description 1
- 150000003856 quaternary ammonium compounds Chemical class 0.000 description 1
- 239000002683 reaction inhibitor Substances 0.000 description 1
- 230000035484 reaction time Effects 0.000 description 1
- 125000006413 ring segment Chemical group 0.000 description 1
- 229910052594 sapphire Inorganic materials 0.000 description 1
- 239000010980 sapphire Substances 0.000 description 1
- 229920006395 saturated elastomer Polymers 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 229910010271 silicon carbide Inorganic materials 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 239000007790 solid phase Substances 0.000 description 1
- 238000001228 spectrum Methods 0.000 description 1
- 229910052596 spinel Inorganic materials 0.000 description 1
- 239000011029 spinel Substances 0.000 description 1
- 229910052717 sulfur Inorganic materials 0.000 description 1
- 239000011593 sulfur Substances 0.000 description 1
- FBEIPJNQGITEBL-UHFFFAOYSA-J tetrachloroplatinum Chemical compound Cl[Pt](Cl)(Cl)Cl FBEIPJNQGITEBL-UHFFFAOYSA-J 0.000 description 1
- YLQBMQCUIZJEEH-UHFFFAOYSA-N tetrahydrofuran Natural products C=1C=COC=1 YLQBMQCUIZJEEH-UHFFFAOYSA-N 0.000 description 1
- LPSKDVINWQNWFE-UHFFFAOYSA-M tetrapropylazanium;hydroxide Chemical compound [OH-].CCC[N+](CCC)(CCC)CCC LPSKDVINWQNWFE-UHFFFAOYSA-M 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- 125000003396 thiol group Chemical group [H]S* 0.000 description 1
- 230000009974 thixotropic effect Effects 0.000 description 1
- 238000004448 titration Methods 0.000 description 1
- 125000003944 tolyl group Chemical group 0.000 description 1
- 238000001721 transfer moulding Methods 0.000 description 1
- 239000008096 xylene Substances 0.000 description 1
- 125000005023 xylyl group Chemical group 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
- C08L83/04—Polysiloxanes
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
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- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/04—Polysiloxanes
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- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/54—Silicon-containing compounds
- C08K5/541—Silicon-containing compounds containing oxygen
- C08K5/5415—Silicon-containing compounds containing oxygen containing at least one Si—O bond
- C08K5/5419—Silicon-containing compounds containing oxygen containing at least one Si—O bond containing at least one Si—C bond
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/56—Organo-metallic compounds, i.e. organic compounds containing a metal-to-carbon bond
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
- C08L83/04—Polysiloxanes
- C08L83/06—Polysiloxanes containing silicon bound to oxygen-containing groups
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
- H01L23/293—Organic, e.g. plastic
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- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
- H01L23/293—Organic, e.g. plastic
- H01L23/296—Organo-silicon compounds
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- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
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- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/04—Polysiloxanes
- C08G77/14—Polysiloxanes containing silicon bound to oxygen-containing groups
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- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/04—Polysiloxanes
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- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
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- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
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- Condensed Matter Physics & Semiconductors (AREA)
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- Compositions Of Macromolecular Compounds (AREA)
- Silicon Polymers (AREA)
- Led Device Packages (AREA)
Description
(R1R2SiO2/2)
(R3 2SiO2/2)
(R4 3SiO1/2)a(R4 2SiO2/2)b(R4SiO3/2)c(SiO4/2)d
(R5R6 2SiO1/2)e(R7R8SiO2/2)f(R9 2SiO2/2)g(R10SiO3/2)h
[RjSiO3/2]
[RkRl 2SiO1/2]p[RmSiO3/2]q
(RnRo 2Si)2O
(R11 3SiO1/2)a(R11 2SiO2/2)b(R11SiO3/2)c(SiO4/2)d
R12 3SiO(R12 2SiO)nSiR12 3
(R13 3SiO1/2)a(R13 2SiO2/2)b(R13SiO3/2)c(SiO2)d
(R14 3SiO1/2)a(R14 2SiO2/2)b(R14SiO3/2)c(SiO4/2)d
ポリフタルアミド(PPA)で製造された5450LEDパッケージを用いて素子特性を評価する。ポリフタルアミドカップ内に硬化性組成物をディスペンシングし、70℃で30分間維持した後、さらに150℃で1時間維持して硬化させて表面実装型LEDを製造する。その後、下記提示した方法でテストを行う。
LEDを200Lのガラス瓶容器に入れて硫黄粉末0.2gをさらに投入した後70℃で40時間維持した後に光束を測定して初期光束に対する光束の低下率を測定し、下記基準で評価する。
A:初期輝度に対する輝度減少率が15%以下である場合
B:初期に対する輝度減少率が15%を超え、20%以下である場合
C:初期に対する輝度減少率が20%を超え、25%以下である場合
D:初期に対する輝度減少率が25%を超える場合
LEDを85℃および85%の相対湿度の条件下に維持した状態で30mAの電流を流しながら500時間の間動作させる。続いて動作前の初期輝度に対する動作後の輝度減少率を測定し、下記基準で評価する。
A:初期輝度に対する輝度減少率が5%以下である場合
B:初期に対する輝度減少率が5%を超え、7%以下である場合
C:初期に対する輝度減少率が7%を超える場合
それぞれ下記の化学式A〜Eに示す化合物を混合してヒドロシリル化反応により硬化することができる硬化性組成物を製造した(配合量:化学式A:70g、化学式B:200g、化学式C:25g、化学式D:45g、化学式E:4g)。上記において、化学式Aのポリオルガノシロキサンは、オクタメチルシクロテトラシロキサン(octamethylcyclotetrasiloxane)およびオクタフェニルシクロテトラシロキサン(octaphenylcyclotetrasiloxane)の混合物をジビニルテトラメチルジシロキサン(divinyltetramethyldisiloxane)と混合した状態で触媒であるテトラメチルアンモニウムヒドロキシド(TMAH;tetramethylammonium hydroxide)存在下、約115℃の温度で約20時間反応させて製造した。その後に周知の精製方法によりGPCで測定した分子量800以下の環状化合物(前記化学式6において、RaおよびRbがすべてメチル基であり、Rcはフェニル基であり、mおよびnがそれぞれ0〜4の範囲内であり、m+nが1〜8の範囲内である化合物を含む)の重量比が約7%になるようにした後、硬化性組成物の製造に用いた。続いて、前記組成物にPt(0)の含量が10ppmになる量に触媒(Platinum(0)−1,3−divinyl−1,1,3,3−tetramethyldisiloxane)を配合し、均一に混合して硬化性組成物を製造した。
(ViMe2SiO1/2)2(Me2SiO2/2)6(Ph2SiO2/2)10
[化学式B]
(ViMe2SiO1/2)2(PhSiO3/2)6
[化学式C]
(HMe2SiO1/2)2(MePhSiO2/2)1.5
[化学式D]
(HMe2SiO1/2)2(Ph2SiO2/2)1.5
[化学式E]
(ViMe2SiO1/2)2(EpSiO3/2)3(MePhSiO2/2)10(Ph2SiO2/2)15
それぞれ下記の化学式A、B、DおよびFに示す化合物を混合してヒドロシリル化反応により硬化することができる硬化性組成物を製造した(配合量:化学式A:70g、化学式B:200g、化学式D:70g、化学式F:4g)。上記において、化学式Aのポリオルガノシロキサンは、オクタメチルシクロテトラシロキサン(octamethylcyclotetrasiloxane)およびオクタフェニルシクロテトラシロキサン(octaphenylcyclotetrasiloxane)の混合物をジビニルテトラメチルジシロキサン(divinyltetramethyldisiloxane)と混合した状態で触媒であるテトラメチルアンモニウムヒドロキシド(TMAH;tetramethylammonium hydroxide)存在下、約115℃の温度で約20時間反応させて製造した。その後に周知の精製方法によりGPCで測定した分子量800以下の環状化合物(前記化学式6において、RaおよびRbがすべてメチル基であり、Rcはフェニル基であり、mおよびnがそれぞれ0〜4の範囲内であり、m+nが1〜8の範囲内である化合物を含む)の重量比が約5%になるようにした後、硬化性組成物の製造に用いた。続いて、前記組成物にPt(0)の含量が10ppmになる量に触媒(Platinum(0)−1,3−divinyl−1,1,3,3−tetramethyldisiloxane)を配合し、均一に混合して硬化性組成物を製造した。
(ViMe2SiO1/2)2(Me2SiO2/2)6(Ph2SiO2/2)10
[化学式B]
(ViMe2SiO1/2)2(PhSiO3/2)6
[化学式D]
(HMe2SiO1/2)2(Ph2SiO2/2)1.5
[化学式F]
(ViMe2SiO1/2)2(EpSiO3/2)3(MePhSiO2/2)20
それぞれ下記の化学式G、H、DおよびFに示す化合物を混合してヒドロシリル化反応により硬化することができる硬化性組成物を製造した(配合量:化学式G:70g、化学式H:200g、化学式D:70g、化学式F:4g)。上記において、化学式Gのポリオルガノシロキサンは、テトラメチルテトラフェニルシクロテトラシロキサン(tetramethyltetraphenylcyclotetrasiloxane)、オクタメチルシクロテトラシロキサン(octamethylcyclotetrasiloxane)およびオクタフェニルシクロテトラシロキサン(octaphenylcyclotetrasiloxane)の混合物をジビニルテトラメチルジシロキサン(divinyltetramethyldisiloxane)と混合した状態で、触媒であるテトラメチルアンモニウムヒドロキシド(TMAH;tetramethylammonium hydroxide)存在下、約115℃の温度で約20時間反応させて製造した。その後に周知の精製方法によりGPCで測定した分子量800以下の環状化合物(前記化学式6において、RaおよびRbがすべてメチル基であり、Rcはフェニル基であり、mおよびnがそれぞれ0〜4の範囲内であり、m+nが1〜8の範囲内である化合物を含み)の重量比が約7%になるようにした後、硬化性組成物の製造に用いた。続いて、前記組成物にPt(0)の含量が10ppmになる量に触媒(Platinum(0)−1、3−divinyl−1,1,3,3−tetramethyldisiloxane)を配合し、均一に混合して硬化性組成物を製造した。
(ViMe2SiO1/2)2(Me2SiO2/2)5(Ph2SiO2/2)18(MePhSiO2/2)2
[化学式H]
(ViMe2SiO1/2)2(PhSiO3/2)7
[化学式D]
(HMe2SiO1/2)2(Ph2SiO2/2)1.5
[化学式F]
(ViMe2SiO1/2)2(EpSiO3/2)3(MePhSiO2/2)20
それぞれ下記の化学式I、B、C、DおよびEに示す化合物を混合してヒドロシリル化反応により硬化することができる硬化性組成物を製造した(配合量:化学式I:70g、化学式B:200g、化学式C:45g、化学式D:25g、化学式E:4g)。上記において、化学式Iの化合物は実施例1の化学式Aと類似方式で原料の組成比を調節して製造し、低分子量成分を除去した後に適用した。続いて、前記組成物にPt(0)の含量が10ppmになる量に触媒(Platinum(0)−1,3−divinyl−1,1,3,3−tetramethyldisiloxane)を配合し、均一に混合して硬化性組成物を製造した。
(ViMe2SiO1/2)2(Me2SiO2/2)15(Ph2SiO2/2)10
[化学式B]
(ViMe2SiO1/2)2(PhSiO3/2)6
[化学式C]
(HMe2SiO1/2)2(MePhSiO2/2)1.5
[化学式D]
(HMe2SiO1/2)2(Ph2SiO2/2)1.5
[化学式E]
(ViMe2SiO1/2)2(EpSiO3/2)3(MePhSiO2/2)10(Ph2SiO2/2)15
それぞれ下記の化学式J、B、DおよびFに示す化合物を混合してヒドロシリル化反応により硬化することができる硬化性組成物を製造した(配合量:化学式J:70g、化学式B:200g、化学式D:70g、化学式F:4g)。上記において、化学式Jの化合物は実施例1の化学式Aと類似方式で原料の組成比を調節して製造し、低分子量成分を除去した後に適用した。続いて、前記組成物にPt(0)の含量が10ppmになる量に触媒(Platinum(0)−1,3−divinyl−1,1,3,3−tetramethyldisiloxane)を配合し、均一に混合して硬化性組成物を製造した。
(ViMe2SiO1/2)2(Me2SiO2/2)16(Ph2SiO2/2)10
[化学式B]
(ViMe2SiO1/2)2(PhSiO3/2)6
[化学式D]
(HMe2SiO1/2)2(Ph2SiO2/2)1.5
[化学式F]
(ViMe2SiO1/2)2(EpSiO3/2)3(MePhSiO2/2)20
それぞれ下記の化学式K、I、CおよびFに示す化合物を混合してヒドロシリル化反応により硬化することができる硬化性組成物を製造した(配合量:化学式K:70g、化学式I:200g、化学式D:70g、化学式F:4g)。続いて、前記組成物にPt(0)の含量が10ppmになる量に触媒(Platinum(0)−1,3−divinyl−1,1,3,3−tetramethyldisiloxane)を配合し、均一に混合して硬化性組成物を製造した。
(ViMe2SiO1/2)2(Ph2SiO2/2)5(MePhSiO2/2)15
[化学式I]
(ViMe2SiO1/2)2(Me2SiO2/2)0.5((PhSiO3/2)6
[化学式C]
(HMe2SiO1/2)2(MePhSiO2/2)1.5
[化学式F]
(ViMe2SiO1/2)2(EpSiO3/2)3(MePhSiO2/2)20
Claims (13)
- 脂肪族不飽和結合を有する官能基、下記化学式2のシロキサン単位および下記化学式3のシロキサン単位を含み、全ての二官能性シロキサン単位に対する化学式3のシロキサン単位の割合が60%以上であり、アリール基が結合されている二官能性シロキサン単位に対する化学式3のシロキサン単位の割合が70%以上である、線状構造のポリオルガノシロキサン、
下記化学式10または下記化学式11の平均組成式を有するポリオルガノシロキサンを含む混合物の重合反応物である、部分架橋構造のポリオルガノシロキサン、および
ケイ素原子に結合している水素原子を含むケイ素化合物、を含み、
前記混合物は、下記化学式7に示す化合物、または下記化学式8および下記化学式9の化合物を更に含むことを特徴とする硬化性組成物:
[化学式2]
(R1R2SiO2/2)
[化学式3]
(R3 2SiO2/2)
[RjSiO3/2]
[化学式11]
[RkRl 2SiO1/2]p[RmSiO3/2]q
前記化学式2および3において、R1およびR2はそれぞれ独立的なエポキシ基または一価炭化水素基であり、R3はアリール基であり、
前記化学式7において、R d およびR e はそれぞれ独立的な一価炭化水素基であり、oは3〜6であり、
前記化学式8および9において、R f およびR g はアルキル基であり、R h およびR i はアリール基であり、pは3〜6の数であり、qは3〜6の数であり、
前記化学式10および11において、Rj、RkおよびRmはそれぞれ独立的な一価炭化水素基であり、Rlは炭素数1〜4のアルキル基であり、pは1〜3であり、qは1〜10である。 - ポリオルガノシロキサンにおいて、全ての二官能性シロキサン単位に対する化学式3のシロキサン単位の割合が65%を超えることを特徴とする請求項1に記載の硬化性組成物。
- 化学式2において、R1およびR2がそれぞれ独立的なアルキル基であることを特徴とする請求項1に記載の硬化性組成物。
- 化学式6において、RaおよびRbがそれぞれ独立的なアルキル基であることを特徴とする請求項4に記載の硬化性組成物。
- 硬化性組成物中の環状化合物の重量比が10重量%以下であることを特徴とする請求項4に記載の硬化性組成物。
- 前記線状構造のポリオルガノシロキサンまたは前記部分架橋構造のポリオルガノシロキサンは、下記化学式4の平均組成式を有することを特徴とする請求項1に記載の硬化性組成物:
[化学式4]
(R4 3SiO1/2)a(R4 2SiO2/2)b(R4SiO3/2)c(SiO4/2)d
前記化学式4において、R4はそれぞれ独立的なエポキシ基または一価炭化水素基であり、R4のうち少なくとも1つはアルケニル基であり、R4のうち少なくとも1つはアリール基であり、aは正数であり、bは正数であり、cは0または正数であり、dは0または正数であり、b/(b+c+d)は0.7〜1である。 - 前記線状構造のポリオルガノシロキサンまたは前記部分架橋構造のポリオルガノシロキサンは、下記化学式5の平均組成式を有することを特徴とする請求項1に記載の硬化性組成物:
[化学式5]
(R5R6 2SiO1/2)e(R7R8SiO2/2)f(R9 2SiO2/2)g(R10SiO3/2)h
前記化学式5において、R5は一価炭化水素基であり、R6は炭素数1〜4のアルキル基であり、R7およびR8はそれぞれ独立的なアルキル基、アルケニル基またはアリール基であり、R9はアリール基であり、R10はエポキシ基であり、eは正数であり、fは0または正数であり、gは0または正数であり、hは0または正数であり、(f+g)/(f+g+h)は0.7〜1である。 - 下記化学式13の平均組成式を有するポリオルガノシロキサンをさらに含むことを特徴とする請求項1に記載の硬化性組成物:
[化学式13]
(R11 3SiO1/2)a(R11 2SiO2/2)b(R11SiO3/2)c(SiO4/2)d
前記化学式13において、R11はそれぞれ独立的なエポキシ基または一価炭化水素基であり、R11のうち少なくとも1つはアルケニル基であり、R11のうち少なくとも1つはアリール基であり、aは正数であり、bは0または正数であり、cは正数であり、dは0または正数であり、b/(b+c+d)は0.65以下であり、c/(c+d)は0.8以上である。 - ケイ素化合物は、下記化学式14の化合物または下記化学式15の平均組成式を有する化合物であることを特徴とする請求項1に記載の硬化性組成物:
[化学式14]
R12 3SiO(R12 2SiO)nSiR12 3
[化学式15]
(R13 3SiO1/2)a(R13 2SiO2/2)b(R13SiO3/2)c(SiO2)d
前記化学式14および15において、R12はそれぞれ独立的な水素または一価の炭化水素基であり、R12のうち少なくとも2つは水素原子であり、R12のうち少なくとも1つはアリール基であり、nは1〜100であり、R13はそれぞれ独立的な水素または一価の炭化水素基であり、R13のうち少なくとも2つは水素原子であり、R13のうち少なくとも1つはアリール基であり、aは正数であり、bは0または正数であり、cは正数であり、dは0または正数である。 - 硬化された請求項1に記載の硬化性組成物で封止されることを特徴とする光半導体。
- 請求項11に記載の光半導体をバックライトユニットに含むことを特徴とする液晶ディスプレイ。
- 請求項11に記載の光半導体を含むことを特徴とする照明器具。
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