JP6058491B2 - 気相成長用反応装置 - Google Patents
気相成長用反応装置 Download PDFInfo
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- JP6058491B2 JP6058491B2 JP2013145076A JP2013145076A JP6058491B2 JP 6058491 B2 JP6058491 B2 JP 6058491B2 JP 2013145076 A JP2013145076 A JP 2013145076A JP 2013145076 A JP2013145076 A JP 2013145076A JP 6058491 B2 JP6058491 B2 JP 6058491B2
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- 238000010438 heat treatment Methods 0.000 claims description 23
- 238000001947 vapour-phase growth Methods 0.000 claims description 19
- 239000012792 core layer Substances 0.000 claims description 16
- 239000000463 material Substances 0.000 claims description 16
- 239000010410 layer Substances 0.000 claims description 12
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 6
- 238000005229 chemical vapour deposition Methods 0.000 claims description 6
- 229910002804 graphite Inorganic materials 0.000 claims description 6
- 239000010439 graphite Substances 0.000 claims description 6
- 239000010409 thin film Substances 0.000 description 35
- 239000000758 substrate Substances 0.000 description 27
- 238000000034 method Methods 0.000 description 15
- 239000007789 gas Substances 0.000 description 10
- 239000002994 raw material Substances 0.000 description 6
- 238000000151 deposition Methods 0.000 description 5
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 4
- 238000005240 physical vapour deposition Methods 0.000 description 3
- 239000012495 reaction gas Substances 0.000 description 3
- 238000000427 thin-film deposition Methods 0.000 description 3
- 238000007740 vapor deposition Methods 0.000 description 3
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- 239000013078 crystal Substances 0.000 description 2
- 239000012535 impurity Substances 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 230000035484 reaction time Effects 0.000 description 2
- 229920006395 saturated elastomer Polymers 0.000 description 2
- 229910010271 silicon carbide Inorganic materials 0.000 description 2
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000012159 carrier gas Substances 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 239000002019 doping agent Substances 0.000 description 1
- 239000001257 hydrogen Substances 0.000 description 1
- 229910052739 hydrogen Inorganic materials 0.000 description 1
- 238000012994 industrial processing Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 230000003746 surface roughness Effects 0.000 description 1
- 238000000927 vapour-phase epitaxy Methods 0.000 description 1
- -1 various temperatures Substances 0.000 description 1
Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/458—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for supporting substrates in the reaction chamber
- C23C16/4582—Rigid and flat substrates, e.g. plates or discs
- C23C16/4583—Rigid and flat substrates, e.g. plates or discs the substrate being supported substantially horizontally
- C23C16/4585—Devices at or outside the perimeter of the substrate support, e.g. clamping rings, shrouds
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/455—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for introducing gases into reaction chamber or for modifying gas flows in reaction chamber
- C23C16/45597—Reactive back side gas
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/458—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for supporting substrates in the reaction chamber
- C23C16/4582—Rigid and flat substrates, e.g. plates or discs
- C23C16/4583—Rigid and flat substrates, e.g. plates or discs the substrate being supported substantially horizontally
- C23C16/4586—Elements in the interior of the support, e.g. electrodes, heating or cooling devices
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/46—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for heating the substrate
Landscapes
- Chemical & Material Sciences (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Chemical Vapour Deposition (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Description
4 載置体
6 ヒーター
8 核心層
10 包囲層
16 隙間
22 基板
24 第二載置体
26 ヒーター
28 第一載置体
240 表面
242 凹部
30 核心層
32 包囲層
34 柱体
36 空気孔
100、200、300 反応装置
Claims (10)
- 載置体と、前記載置体を加熱する加熱装置とを含む気相成長用反応装置であって、
前記載置体は、第一載置体と、前記第一載置体上に形成されている第二載置体とを含み、前記第二載置体は、核心層と、前記核心層を覆う包囲層とを含み、
前記第一載置体は、前記第二載置体とは異なる材料を含み、前記核心層は、前記包囲層とは異なる材料を含む、気相成長用反応装置。 - 前記第二載置体の伝熱係数が前記第一載置体の伝熱係数より大きく、且つ前記第一載置体の電磁波加熱係数が前記第二載置体の電磁波加熱係数より大きい、請求項1に記載の気相成長用反応装置。
- 前記核心層は、石墨、BN、Mo、TiW、又はこれらの組み合わせを含む、請求項1に記載の気相成長用反応装置。
- 前記加熱装置は、周波数範囲が15KHz〜20KHzである電磁波を生成する電磁波生成装置を含む、請求項1に記載の気相成長用反応装置。
- 前記第二載置体は、ウェハを載置する複数の凹部を含む、請求項1に記載の気相成長用反応装置。
- 前記第一載置体は、空気孔をさらに含む、請求項1に記載の気相成長用反応装置。
- 前記気相成長用反応装置は、前記第一載置体上に形成されている複数の第二載置体をさらに含む、請求項1に記載の気相成長用反応装置。
- 気相成長用反応装置の載置装置であって、
第一載置体と、前記第一載置体上に形成されている第二載置体とを含み、
前記第一載置体は、第二載置体とは異なる材料を含み、前記第二載置体は、核心層と、前記核心層を覆う包囲層とを含み、前記核心層は、前記包囲層とは異なる材料を含む、気相成長用反応装置の載置装置。 - 前記第二載置体の伝熱係数が前記第一載置体の伝熱係数より大きく、且つ前記第一載置体の電磁波加熱係数が前記第二載置体の電磁波加熱係数より大きい、請求項8に記載の気相成長用反応装置の載置装置。
- 前記核心層は、石墨、BN、Mo、TiW、又はこれらの組み合わせを含む、請求項8に記載の気相成長用反応装置の載置装置。
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW101125504 | 2012-07-13 | ||
TW101125504 | 2012-07-13 | ||
TW101147714A TWI506163B (zh) | 2012-07-13 | 2012-12-14 | 應用於氣相沉積的反應器及其承載裝置 |
TW101147714 | 2012-12-14 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2014022732A JP2014022732A (ja) | 2014-02-03 |
JP6058491B2 true JP6058491B2 (ja) | 2017-01-11 |
Family
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Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2013145076A Active JP6058491B2 (ja) | 2012-07-13 | 2013-07-11 | 気相成長用反応装置 |
Country Status (3)
Country | Link |
---|---|
JP (1) | JP6058491B2 (ja) |
KR (1) | KR20140009075A (ja) |
CN (1) | CN103540913B (ja) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6215798B2 (ja) * | 2014-08-26 | 2017-10-18 | 株式会社ブリヂストン | サセプタ |
JP6219794B2 (ja) * | 2014-08-26 | 2017-10-25 | 株式会社ブリヂストン | サセプタ |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
IT1215444B (it) * | 1987-04-24 | 1990-02-14 | L P E S P A | Perfezionamenti ad induttori e suscettori impiegabili in reattori epitassiali. |
JPH06678B2 (ja) * | 1984-11-28 | 1994-01-05 | 株式会社東芝 | 有機金属熱分解気相結晶成長装置 |
JPH1092913A (ja) * | 1996-09-18 | 1998-04-10 | Sony Corp | 半導体成長用サセプタ |
DE602004031741D1 (de) * | 2004-06-09 | 2011-04-21 | E T C Epitaxial Technology Ct Srl | Halterungssystem für behandlungsapparaturen |
JP2006196807A (ja) * | 2005-01-17 | 2006-07-27 | Matsushita Electric Ind Co Ltd | 真空成膜装置および薄膜形成方法 |
JP2007243060A (ja) * | 2006-03-10 | 2007-09-20 | Taiyo Nippon Sanso Corp | 気相成長装置 |
KR20110136583A (ko) * | 2010-06-15 | 2011-12-21 | 삼성엘이디 주식회사 | 서셉터 및 이를 구비하는 화학 기상 증착 장치 |
KR20120065841A (ko) * | 2010-12-13 | 2012-06-21 | 삼성전자주식회사 | 기판 지지 유닛과, 이를 이용한 박막 증착 장치 |
CN201962357U (zh) * | 2010-12-27 | 2011-09-07 | 中芯国际集成电路制造(上海)有限公司 | 化学气相沉积设备 |
-
2013
- 2013-07-11 JP JP2013145076A patent/JP6058491B2/ja active Active
- 2013-07-12 CN CN201310294354.7A patent/CN103540913B/zh active Active
- 2013-07-12 KR KR1020130082359A patent/KR20140009075A/ko not_active Application Discontinuation
Also Published As
Publication number | Publication date |
---|---|
JP2014022732A (ja) | 2014-02-03 |
CN103540913B (zh) | 2017-07-28 |
KR20140009075A (ko) | 2014-01-22 |
CN103540913A (zh) | 2014-01-29 |
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