JP6001426B2 - Ceramic substrate for storing electronic components and electronic component mounting package using the same - Google Patents
Ceramic substrate for storing electronic components and electronic component mounting package using the same Download PDFInfo
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- JP6001426B2 JP6001426B2 JP2012258709A JP2012258709A JP6001426B2 JP 6001426 B2 JP6001426 B2 JP 6001426B2 JP 2012258709 A JP2012258709 A JP 2012258709A JP 2012258709 A JP2012258709 A JP 2012258709A JP 6001426 B2 JP6001426 B2 JP 6001426B2
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/161—Cap
- H01L2924/1615—Shape
- H01L2924/16195—Flat cap [not enclosing an internal cavity]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/161—Cap
- H01L2924/163—Connection portion, e.g. seal
- H01L2924/16315—Shape
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Description
本発明は、電子部品を収容するための凹部を有する電子部品収納用セラミック基板およびそれを用いた電子部品実装パッケージに関する。 The present invention relates to an electronic component housing ceramic substrate having a recess for housing an electronic component and an electronic component mounting package using the same.
気密封止を必要とする電子部品の例として、水晶振動子等の水晶応用製品やフラッシュメモリなどの半導体素子があげられる。これらの各製品はいずれも素子の表面に金属薄膜電極が形成されており、この金属薄膜電極を外気から保護するために、電子部品収納用セラミック基板などの筐体に搭載され気密封止されている。 Examples of electronic components that require hermetic sealing include quartz applied products such as quartz resonators and semiconductor elements such as flash memories. In each of these products, a metal thin film electrode is formed on the surface of the element. In order to protect the metal thin film electrode from the outside air, it is mounted on a housing such as a ceramic substrate for storing electronic components and hermetically sealed. Yes.
図８は、従来の電子部品実装パッケージの一例を示す分解斜視図である。図９は、図８に示した電子部品収納用セラミック基板のＸ−Ｘ線断面模式図である。水晶応用製品等の電子部品１００を搭載するための電子部品実装パッケージは、電子部品収納用セラミック基板１０１の上面に蓋体１０３が接合された構成となっている。電子部品収納用セラミック基板１０１はセラミック製の基板底部１０５とその上面に一体的に形成されたセラミック製の基板堤部１０６とを基本構造とし、その基板堤部１０６の表面には金属層１０７が形成されており、この金属層１０７の上面にはさらに蓋体１０３が接合されている。この場合、蓋体１０３と金属層１０７とは、ロウ材を介して、例えば、シーム溶接等の接合方法を用いて接合される（例えば、特許文献１を参照）。 FIG. 8 is an exploded perspective view showing an example of a conventional electronic component mounting package. 9 is a schematic cross-sectional view taken along the line XX of the electronic component housing ceramic substrate shown in FIG. An electronic component mounting package for mounting an electronic component 100 such as a crystal application product has a structure in which a lid 103 is bonded to the upper surface of a ceramic substrate 101 for storing electronic components. The ceramic substrate 101 for storing electronic components has a basic structure including a ceramic substrate bottom 105 and a ceramic substrate bank 106 integrally formed on the upper surface thereof, and a metal layer 107 is formed on the surface of the substrate bank 106. The lid 103 is further bonded to the upper surface of the metal layer 107. In this case, the lid 103 and the metal layer 107 are joined using a joining method such as seam welding via a brazing material (see, for example, Patent Document 1).
近年、携帯電話やＩＣカード等の電子装置が普及しているが、これらの電子装置は高性能化に加えて、ますます小型化や薄型化が要求されてきており、そのため、これらの電子装置に組み込まれる電子部品１００やこれを搭載した電子部品実装パッケージについても一層の小型化や薄型化が求められている。 In recent years, electronic devices such as mobile phones and IC cards have become widespread. However, in addition to high performance, these electronic devices are increasingly required to be smaller and thinner. The electronic component 100 and the electronic component mounting package on which the electronic component 100 is incorporated are also required to be further reduced in size and thickness.
電子部品実装パッケージの小型化や薄型化を図るためには、これを構成する電子部品収納用セラミック基板１０１の構成部材である基板底部１０５や基板堤部１０６の厚みや高さを小さくする必要があるが、これらの部材のうち基板堤部１０６の厚みｔが薄くなると、蓋体１０３を接合するために基板堤部１０６の上面に形成される金属層１０７の幅ｗも狭くなってくるため、電子部品実装パッケージの気密性が損なわれるという問題がある。 In order to reduce the size and thickness of the electronic component mounting package, it is necessary to reduce the thickness and height of the substrate bottom portion 105 and the substrate bank portion 106 which are constituent members of the electronic component storage ceramic substrate 101 constituting the electronic component mounting package. However, when the thickness t of the substrate bank portion 106 is reduced among these members, the width w of the metal layer 107 formed on the upper surface of the substrate bank portion 106 to join the lid 103 is also reduced. There is a problem that the airtightness of the electronic component mounting package is impaired.
従って、本発明は、基板堤部の表面に形成された金属層の幅が狭い場合にも高い気密性を維持できる電子部品収納用セラミック基板とそれを適用した電子部品実装パッケージを提供することを目的とする。 Therefore, the present invention provides a ceramic substrate for storing electronic components that can maintain high airtightness even when the width of the metal layer formed on the surface of the substrate bank is narrow, and an electronic component mounting package to which the ceramic substrate is applied. Objective.
本発明の電子部品収納用セラミック基板は、電子部品の搭載面を有する板状の基板底部と、該基板底部上で前記搭載面を囲むように配置された枠状の基板堤部と、該基板堤部の表面に周状に配置された金属層と、を備えており、前記金属層は前記基板堤部の上面から側面に及ぶように設けられているとともに、前記側面を覆う前記金属層は、前記上面付近の厚みがこれよりも下方であって前記搭載面側の位置における厚みよりも厚くなっている。 The ceramic substrate for electronic component storage according to the present invention includes a plate-like substrate bottom portion having an electronic component mounting surface, a frame-shaped substrate bank portion disposed on the substrate bottom portion so as to surround the mounting surface, and the substrate. a metal layer disposed circumferentially on the surface of the bank portion, Ri Contact comprise, together with the metal layer is provided to span the side from the upper surface of the substrate bank portion, the metal layer covering the side surfaces The thickness in the vicinity of the upper surface is lower than this and thicker than the thickness at the position on the mounting surface side .
本発明の電子部品実装パッケージは、上記の電子部品収納用セラミック基板の前記搭載面に電子部品が実装され、前記基板堤部の上部に蓋体が設けられていることを特徴とする。 The electronic component mounting package of the present invention is characterized in that an electronic component is mounted on the mounting surface of the ceramic substrate for storing electronic components, and a lid is provided on the upper portion of the substrate bank portion.
本発明によれば、基板堤部の表面に形成された金属層の幅が狭い場合にも高い気密性を維持できる電子部品収納用セラミック基板とそれを適用した電子部品実装パッケージを得ることができる。 ADVANTAGE OF THE INVENTION According to this invention, even when the width | variety of the metal layer formed in the surface of a board | substrate bank part is narrow, the ceramic substrate for electronic component accommodation which can maintain high airtightness, and the electronic component mounting package which applied it can be obtained. .
図１は、本発明の電子部品実装パッケージの一実施形態を示す分解斜視図である。図２は、図１に示した電子部品収納用セラミック基板のＸ−Ｘ線断面模式図である。 FIG. 1 is an exploded perspective view showing an embodiment of an electronic component mounting package of the present invention. FIG. 2 is a schematic cross-sectional view taken along the line XX of the electronic component housing ceramic substrate shown in FIG.
本実施形態の電子部品収納用セラミック基板は、電子部品１０の搭載面１を有する板状の基板底部３と、基板底部３上で搭載面１を囲むように配置されている枠状の基板堤部５とを備えており、この基板堤部５の表面には、蓋体７などの金属部材を接合するための金属層９が周状に設けられた構成となっており、ここで、金属層９は基板堤部５の上面５ａから側面５ｂに及ぶように設けられていることを特徴とする。 The ceramic substrate for storing electronic components according to the present embodiment includes a plate-like substrate bottom 3 having a mounting surface 1 for electronic components 10 and a frame-shaped substrate dam arranged so as to surround the mounting surface 1 on the substrate bottom 3. And a metal layer 9 for joining a metal member such as a lid 7 is provided on the surface of the substrate bank portion 5 in a circumferential shape. The layer 9 is provided so as to extend from the upper surface 5 a to the side surface 5 b of the substrate bank portion 5.
本実施形態の電子部品収納用セラミック基板では、基板堤部５の上面５ａを覆うように形成された金属層９が基板堤部５の上面５ａからそれに連なる側面５ｂにも及ぶように形成されているために、基板堤部５の側面５ｂ間の厚みｔが薄くなっても金属層９の幅ｗを大きく取ることができ、これにより、例えば、基板堤部５の上面側に蓋体７を接合したときの接合面積を広くできる。その結果、基板堤部５と蓋体７との間のシール性が高まり、電子部品収納用セラミック基板の気密性を向上させることができる。 In the electronic component storing ceramic substrate of the present embodiment, the metal layer 9 formed so as to cover the upper surface 5a of the substrate bank portion 5 extends from the upper surface 5a of the substrate bank portion 5 to the side surface 5b continuous therewith. Therefore, the width w of the metal layer 9 can be increased even when the thickness t between the side surfaces 5b of the substrate bank portion 5 is reduced. Thus, for example, the lid body 7 is placed on the upper surface side of the substrate bank portion 5. The bonding area when bonded can be widened. As a result, the sealing performance between the substrate bank portion 5 and the lid body 7 is enhanced, and the airtightness of the electronic component housing ceramic substrate can be improved.
このような形状の金属層９を適用する電子部品収納用セラミック基板としては、基板堤部５の厚み（上面５ａの位置における厚み）ｔが平均で０．０５〜０．１５ｍｍ、基板底部３の面積が０．５〜５ｍｍ2、基板底部３の厚みが平均で０．０５〜１ｍｍと、基板底
部３のサイズが小さい上に、基板堤部５および基板底部３の厚みが薄く、その上面に形成される金属層９の幅ｗが狭いような小型の電子部品収納用セラミック基板に適したものとなる。
As an electronic component housing ceramic substrate to which the metal layer 9 having such a shape is applied, the thickness of the substrate bank portion 5 (thickness at the position of the upper surface 5a) t is 0.05 to 0.15 mm on average, The area is 0.5 to 5 mm 2 , the thickness of the substrate bottom 3 is 0.05 to 1 mm on average, the size of the substrate bottom 3 is small, and the thickness of the substrate bank 5 and the substrate bottom 3 is thin, The metal layer 9 to be formed is suitable for a small electronic component housing ceramic substrate in which the width w is narrow.
ここで、金属層９は金属粉末のペーストを基板堤部５となるセラミック製の成形体の表面に印刷し同時焼結させたメタライズ膜である場合に適している。 Here, the metal layer 9 is suitable for a metallized film obtained by printing a metal powder paste on the surface of a ceramic molded body to be the substrate bank portion 5 and simultaneously sintering it.
これは基板堤部５がセラミック製であり、これに金属層９として、上述のようなメタライズ膜を形成した場合には、金属層９の内部あるいは基板堤部５と金属層９との界面にボイドが形成される場合があり、このボイドが基板堤部５と蓋体７との間のシール性を低下させる原因となるからである。 This is because the substrate bank portion 5 is made of ceramic, and when the metallized film as described above is formed on the metal layer 9, the inside of the metal layer 9 or the interface between the substrate bank portion 5 and the metal layer 9 is formed. This is because a void may be formed, and this void causes a decrease in the sealing performance between the substrate bank portion 5 and the lid body 7.
この場合、基板底部３と基板堤部５とも一体的に形成されていることが望ましい。基板底部３と基板堤部５とが一体的に形成されていると、これらの接合界面におけるシール性を高めることができる。 In this case, it is desirable that the substrate bottom 3 and the substrate bank 5 are integrally formed. When the substrate bottom portion 3 and the substrate bank portion 5 are integrally formed, the sealing performance at the bonding interface can be enhanced.
また、基板底部３と基板堤部５とは同じ材質であるのがよい。基板底部３と基板堤部５とが同じ材質であると、同時焼成される際に、基板底部３と基板堤部５との焼結速度が近いことから電子部品収納用セラミック基板の反りや変形を低減することができる。例えば、蓋体７を接合した際の変形が小さくなることから、変形により発生する残留応力が低くなり、急激な温度変化に晒されるような環境においてもクラック等の欠陥の発生を防止することが可能となる。 Further, the substrate bottom 3 and the substrate bank 5 are preferably made of the same material. When the substrate bottom 3 and the substrate bank 5 are made of the same material, when the substrate is fired at the same time, the sintering rate of the substrate bottom 3 and the substrate bank 5 is close, so the warp and deformation of the ceramic substrate for storing electronic components Can be reduced. For example, since the deformation when the lid 7 is joined is reduced, the residual stress generated by the deformation is reduced, and it is possible to prevent the occurrence of defects such as cracks even in an environment exposed to a rapid temperature change. It becomes possible.
ここで、同じ材質というのは、基板底部３および基板堤部５に含まれる主成分のセラミック成分が同じであるという意味である。この場合、主成分とは、基板底部３および基板堤部５に含まれるセラミック成分の含有量が８０質量％以上である場合をいう。 Here, the same material means that the ceramic components of the main components contained in the substrate bottom 3 and the substrate bank 5 are the same. In this case, the main component means a case where the content of the ceramic component contained in the substrate bottom 3 and the substrate bank 5 is 80% by mass or more.
なお、基板底部３および基板堤部５は、高い熱伝導性を有し、かつ高強度であるという点でアルミナを主成分とし、これにＳｉおよびＭｇなどの添加剤を含有するものが望ましい。 The substrate bottom 3 and the substrate bank 5 are preferably composed mainly of alumina in that they have high thermal conductivity and high strength, and contain additives such as Si and Mg.
図３は、本実施形態の他の電子部品収納用セラミック基板を示すものであり、搭載面を含むようにして縦断面視したときに、基板堤部５の上面が凸凹（デコボコ）している構造を部分的に示す断面模式図である。この電子部品収納用セラミック基板では、搭載面１を含むようにして縦断面視したときに、基板堤部５の上面が凸凹（デコボコ）していることが望ましい。言い換えると、基板堤部５の上面５ａが、基板堤部５の側面５ｂ間である厚みｔ方向に向けて凸凹を有しているという状態である。 FIG. 3 shows another ceramic substrate for storing electronic components according to the present embodiment, and shows a structure in which the upper surface of the substrate bank portion 5 is uneven when viewed in a longitudinal section so as to include the mounting surface. It is a cross-sectional schematic diagram shown partially. In the electronic component housing ceramic substrate, it is desirable that the upper surface of the substrate bank portion 5 is uneven when viewed in a longitudinal section so as to include the mounting surface 1. In other words, the upper surface 5a of the substrate bank portion 5 is in a state of being uneven in the thickness t direction between the side surfaces 5b of the substrate bank portion 5.
図３に示しているように、金属層９の形成される基板堤部５の上面５ａが、例えば、厚み方向の中央部辺りに凹みを有するような形状であると、基板堤部５の上面５ａが平坦である場合に比べて、基板堤部５の上面５ａと金属層９との間の接触している長さ（幅、面積）を基板堤部５の厚みｔ方向に長く（広く）することができる。これにより基板堤部５と蓋体７との間のシール性が高まり、気密性をさらに向上させることができる。 As shown in FIG. 3, when the upper surface 5 a of the substrate bank portion 5 on which the metal layer 9 is formed has, for example, a shape having a recess near the center in the thickness direction, the upper surface of the substrate bank portion 5. Compared with the case where 5a is flat, the contact length (width, area) between the upper surface 5a of the substrate bank portion 5 and the metal layer 9 is longer (wider) in the thickness t direction of the substrate bank portion 5. can do. Thereby, the sealing performance between the board | substrate bank part 5 and the cover body 7 improves, and airtightness can further be improved.
なお、図３では、厚み方向の中央部辺りに凹みを有するような形状を示しているが、基板堤部５の上面５ａと金属層９との間の接触している長さ（幅、面積）を基板堤部５の厚みｔ方向に長くすることができる形状であれば、このような形状に限らず、厚み方向の中央部辺りが凸状に盛り上がった形状であってもよい。 Note that FIG. 3 shows a shape having a recess around the center in the thickness direction, but the length (width, area) of contact between the upper surface 5a of the substrate bank portion 5 and the metal layer 9 is shown. ) Is not limited to such a shape as long as it can be elongated in the thickness t direction of the substrate bank portion 5, and may be a shape in which the central portion in the thickness direction is raised in a convex shape.
図４は、本実施形態の他の電子部品収納用セラミック基板を示すものであり、基板堤部
の側面を覆う金属層の厚みに関し、基板堤部の上面付近の厚みがこれよりも下方であって搭載面側の位置における厚みよりも厚くなっている構造を部分的に示す断面模式図である。この電子部品収納用セラミック基板では、側面５ｂの一部を覆う金属層９は、基板堤部５の上面５ａ付近の厚みｔ３がこれよりも下方であって搭載面１側の位置における厚みｔ４よりも厚くなっていることが望ましい。基板堤部５に蓋体７が接合されたときに、基板堤部５の内部でガスのリークが起こり易いのは上述のように基板堤部５の上面５ａと、その表面に形成された金属層９との界面である。このような場合に、側面５ｂの一部を覆う金属層９の基板堤部５の上面５ａ付近の厚みｔ３をこれよりも下方であって搭載面１側の位置における厚みｔ４よりも厚くしておくと、金属層９の厚み分だけ気密性を高めることができる。
FIG. 4 shows another ceramic substrate for storing electronic components of this embodiment. Regarding the thickness of the metal layer covering the side surface of the substrate bank portion, the thickness in the vicinity of the upper surface of the substrate bank portion is lower than this. FIG. 5 is a schematic cross-sectional view partially showing a structure that is thicker than the thickness at the position on the mounting surface side. In this electronic component storing ceramic substrate, a metal layer 9 covering the part of the side surface 5b has a thickness in the mounting surface 1 side position a downward thickness t 3 is than this near the upper surface 5a of the substrate bank portion 5 t Thicker than 4 is desirable. When the lid body 7 is joined to the substrate bank portion 5, the gas leakage is likely to occur inside the substrate bank portion 5 as described above, and the upper surface 5a of the substrate bank portion 5 and the metal formed on the surface thereof. It is an interface with the layer 9. In this case, greater than the thickness t 4 of the mounting surface 1 side position A below which the thickness t 3 of the vicinity of the upper surface 5a of the substrate bank portion 5 of the metal layer 9 covering a part of the side surface 5b In this case, the airtightness can be increased by the thickness of the metal layer 9.
この場合、金属層９は基板堤部５の搭載面１側だけでなく、搭載面１側とは反対の基板堤部５の外側の側面５ｂにも形成されていることがより望ましく、基板堤部５の両側面５ｂが金属層９で覆われた構造となるために、基板堤部５を機械的に強固なものにできる。 In this case, it is more desirable that the metal layer 9 be formed not only on the mounting surface 1 side of the substrate bank portion 5 but also on the outer side surface 5b of the substrate bank portion 5 opposite to the mounting surface 1 side. Since both side surfaces 5b of the portion 5 are covered with the metal layer 9, the substrate bank portion 5 can be made mechanically strong.
そして、基板堤部５の側面５ｂの一部を覆う金属層９の基板堤部５の上面５ａ付近の厚みｔ３をこれよりも下方であって搭載面１側の位置における厚みｔ４よりも厚くしておくような形状の場合には、基板堤部５の形状は、図４に示すように、その基板堤部５を縦断面視したときに、金属層９の厚みの関係とは反対に、基板堤部５の上面５ａ側の厚みｔ１が搭載面１側の厚みｔ２よりも薄くなっている形状であることが望ましい。 Then, than the thickness t 4 of the mounting surface 1 side position A below which the thickness t 3 of the vicinity of the upper surface 5a of the substrate bank portion 5 of the metal layer 9 covering the part of the side surface 5b of the substrate bank portion 5 In the case of a shape that is thickened, the shape of the substrate bank portion 5 is opposite to the relationship of the thickness of the metal layer 9 when the substrate bank portion 5 is viewed in a longitudinal section as shown in FIG. Further, it is desirable that the thickness t 1 on the upper surface 5 a side of the substrate bank portion 5 is thinner than the thickness t 2 on the mounting surface 1 side.
つまり、基板堤部５の厚みとそれを覆っている金属層９の厚みとが基板堤部５の高さ方向に相殺されるような形状であると、電子部品収納用セラミック基板を平面視したときの基板底部３側および金属層９側の面積の差が小さいことから、電子部品収納用セラミック基板がより高い寸法精度を有するものにでき、これによりマザーボード等への実装構造の設計を容易にすることができる。 That is, when the thickness of the substrate bank portion 5 and the thickness of the metal layer 9 covering the substrate bank portion 5 are offset in the height direction of the substrate bank portion 5, the ceramic substrate for storing electronic components is viewed in plan view. Since the difference in the area between the substrate bottom 3 side and the metal layer 9 side is small, the electronic component housing ceramic substrate can have a higher dimensional accuracy, which facilitates the design of a mounting structure on a motherboard or the like can do.
なお、図４に示すような電子部品収納用セラミック基板においては、基板堤部５の側面５ｂを覆う金属層９が基板堤部５の側面５ｂと面一になっていることが望ましい。基板堤部５およびそれを覆う金属層９がこのような形状であると、基板堤部５の側面５ｂの金属層９による段差を小さくすることができ、これにより実装工程等でのハンドリング時に発生する外表面のキズや欠けを防止できる。 In the electronic component housing ceramic substrate as shown in FIG. 4, it is desirable that the metal layer 9 covering the side surface 5 b of the substrate bank portion 5 is flush with the side surface 5 b of the substrate bank portion 5. When the substrate bank portion 5 and the metal layer 9 covering it are in such a shape, the step due to the metal layer 9 on the side surface 5b of the substrate bank portion 5 can be reduced, and this occurs during handling in the mounting process or the like. Can prevent scratches and chips on the outer surface.
本実施形態の電子部品実装パッケージは、上述した電子部品収納用セラミック基板の搭載面１に水晶振動子等の電子部品１０が実装され、基板堤部５の上部に蓋体７が設けられていることを特徴とするものである。この電子部品実装パッケージは、電子部品１０の搭載面１を有する板状の基板底部３と、基板底部３上で搭載面１を囲むように配置された枠状の基板堤部５と、基板堤部５の表面に周状に配置された金属層９と、を備えており、金属層９が基板堤部５の上面５ａから側面５ｂに及ぶように設けられていることから、基板堤部５の側面５ｂ間の厚みｔが薄くなっても金属層９の幅を大きく取ることができ、これにより、気密性の高い電子部品実装パッケージを得ることができる。 In the electronic component mounting package of the present embodiment, an electronic component 10 such as a crystal resonator is mounted on the mounting surface 1 of the above-described ceramic substrate for storing electronic components, and a lid body 7 is provided above the substrate bank portion 5. It is characterized by this. This electronic component mounting package includes a plate-like substrate bottom 3 having a mounting surface 1 for an electronic component 10, a frame-like substrate bank 5 arranged on the substrate bottom 3 so as to surround the mounting surface 1, and a substrate bank Since the metal layer 9 is provided so as to extend from the upper surface 5a to the side surface 5b of the substrate bank portion 5, the substrate bank portion 5 is provided. Even if the thickness t between the side surfaces 5b is reduced, the width of the metal layer 9 can be increased, whereby a highly airtight electronic component mounting package can be obtained.
なお、本実施形態の電子部品収納用セラミック基板には、必要に応じて、その表面や内部に、電子部品１０や外部電源と接続するための導体層を設けてもよい。 The ceramic substrate for storing electronic components according to the present embodiment may be provided with a conductor layer for connecting to the electronic component 10 or an external power source on the surface or inside thereof as necessary.
次に、本実施形態の電子部品収納用セラミック基板および電子部品実装パッケージの製造方法について説明する。 Next, a manufacturing method of the electronic component housing ceramic substrate and the electronic component mounting package of the present embodiment will be described.
図５は、本実施形態の電子部品収納用セラミック基板の製造工程を示す模式図である。まず、図５（ａ）に示すように、基板底部３および基板堤部５を形成するためのシート状
成形体２１を作製する。その組成は、例えば、Ａｌ２Ｏ３粉末を主成分とし、これにＳｉＯ２粉末およびＭｇＯ粉末を所定量添加した混合粉末を用いる。
FIG. 5 is a schematic view showing a manufacturing process of the electronic component housing ceramic substrate of the present embodiment. First, as shown in FIG. 5A, a sheet-like molded body 21 for forming the substrate bottom portion 3 and the substrate bank portion 5 is produced. The composition is, for example, a mixed powder in which Al 2 O 3 powder is a main component and a predetermined amount of SiO 2 powder and MgO powder is added thereto.
次に、この混合粉末に対して、有機バインダーを溶媒とともに添加してスラリーや混練物を調製した後、これをプレス法、ドクターブレード法、圧延法、射出法などの成形方法を用いてシート状成形体２１を形成する。 Next, an organic binder is added to the mixed powder together with a solvent to prepare a slurry or a kneaded product, which is then formed into a sheet using a molding method such as a press method, a doctor blade method, a rolling method, or an injection method. Formed body 21 is formed.
次に、シート状成形体２１の表面に、電子部品や外部電源と接続するための導体層あるいは蓋体７との接合に供する金属層９となる金属粉末ペーストの印刷パターン２２を形成する。印刷パターン２２はその一部が金型の凸部２３に加圧されるように形成する。 Next, the printed pattern 22 of the metal powder paste used as the metal layer 9 used for joining with the conductor layer or the cover body 7 for connecting with an electronic component or an external power supply is formed on the surface of the sheet-like molded body 21. The print pattern 22 is formed so that a part thereof is pressed against the convex portion 23 of the mold.
次に、図５（ｂ）に示すように、一方の面に凸部２３を有する金型を用意し、この金型を用いて、金属粉末ペーストの印刷パターン２２を形成したシート状成形体をプレス成形し、凸部２３に対応する部分が凹部となる凹状成形体２５を形成する。この場合、金型の凸部２３が金属粉末ペーストの印刷パターン２２の一部に重なるように加圧する。このプレス成形の工程において、シート状成形体２１の表面に形成された金属粉末ペーストの印刷パターン２２のうち、凸部２３の周囲２３ａに対応する位置に形成された金属粉末ペーストの印刷パターン２２は、加圧時に変形し、凹部の側面２４にまで伸びてくる。こうして金属粉末ペーストの印刷パターン２２を凹状成形体２５の凹部からそれに連なる凹部の側面２４に及ぶように形成することが可能となる。 Next, as shown in FIG.5 (b), the metal mold | die which has the convex part 23 on one side is prepared, and the sheet-like molded object which formed the printing pattern 22 of the metal powder paste using this metal mold | die was used. Press molding is performed to form a concave shaped body 25 in which a portion corresponding to the convex portion 23 becomes a concave portion. In this case, pressurization is performed so that the convex portion 23 of the mold overlaps a part of the printed pattern 22 of the metal powder paste. In the press molding process, among the metal powder paste print patterns 22 formed on the surface of the sheet-like molded body 21, the metal powder paste print pattern 22 formed at a position corresponding to the periphery 23a of the convex portion 23 is It is deformed when pressurized and extends to the side surface 24 of the recess. In this way, the printed pattern 22 of the metal powder paste can be formed so as to extend from the concave portion of the concave shaped body 25 to the side surface 24 of the concave portion continuous therewith.
ここで、本実施形態の電子部品収納用セラミック基板を作製する方法によれば、シート成形体２１の金型の凸部２３によって加圧された部分（凹部の中央部２１ｂ）と、その周囲２１ａとは一体的に成形される。 Here, according to the method for producing the ceramic substrate for housing an electronic component of the present embodiment, the portion of the sheet molded body 21 pressed by the convex portion 23 of the mold (the central portion 21b of the concave portion) and the periphery 21a thereof. And are integrally molded.
次に、この成形体２５を所定の温度条件で焼成することにより、電子部品収納用セラミック基板を得ることができる。 Next, by firing this molded body 25 under a predetermined temperature condition, a ceramic substrate for storing electronic components can be obtained.
図６は、本実施形態の他の電子部品収納用セラミック基板の製造工程を示すものであり、図３に示した構造の金属層を有する電子部品収納用セラミック基板の製造工程を示す模式図である。図３に示した構造の金属層を有する電子部品収納用セラミック基板を得る場合には、凸部２３の周囲２３ａとなる位置に形成する金属粉末ペーストの印刷パターン２２として、図６に示すように厚みを変化させたものを形成する。 FIG. 6 is a schematic diagram illustrating a manufacturing process of a ceramic substrate for storing electronic components having a metal layer having the structure shown in FIG. is there. When obtaining a ceramic substrate for storing an electronic component having the metal layer having the structure shown in FIG. 3, as a printed pattern 22 of the metal powder paste formed at a position that becomes the periphery 23a of the convex portion 23, as shown in FIG. Forms with varying thickness.
図７は、本実施形態の他の電子部品収納用セラミック基板の製造工程を示すものであり、図４に示した構造の金属層を有する電子部品収納用セラミック基板の製造工程を示す模式図である。図７に示した構造の成形体を得る場合には、金属粉末ペースト中に含ませるバインダとして、ガラス転移温度が金型で加圧するときの温度以下のものを用いて、金属粉末ペーストの印刷パターン２２がシート状成形体２１の表面上で伸びるようにするとよい。この場合には、シート状成形体を金型を用いて加圧したときに、印刷パターン２２が伸びると同時にシート状成形体中に埋まる。こうして図４に示すような形状の金属層９を有する電子部品収納用セラミック基板を得ることができる。 FIG. 7 shows a manufacturing process of another electronic component housing ceramic substrate of the present embodiment, and is a schematic diagram showing a manufacturing process of an electronic component housing ceramic substrate having the metal layer having the structure shown in FIG. is there. In the case of obtaining a molded body having the structure shown in FIG. 7, the binder contained in the metal powder paste is one having a glass transition temperature equal to or lower than the temperature at which the metal mold is pressed. It is preferable that 22 extends on the surface of the sheet-like molded body 21. In this case, when the sheet-like molded body is pressurized using a mold, the printing pattern 22 is stretched and simultaneously buried in the sheet-like molded body. Thus, an electronic component housing ceramic substrate having the metal layer 9 having a shape as shown in FIG. 4 can be obtained.
Ａｌ２Ｏ３粉末９３質量％に対して、ＳｉＯ２粉末を５質量％、ＭｇＯ粉末を２質量％の割合で混合した後、さらに、有機バインダーとしてアクリル系バインダーを１９質量％、有機溶媒としてトルエンを混合してスラリーを調製した後、ドクターブレード法にて平均厚みが４００μｍのシート状成形体を作製した。次に、この成形体の基板堤部となる部分の上面付近にタングステンと銅との混合粉末を主成分とする金属粉末ペーストを用いて所定の形状の印刷パターンを形成した。印刷パターン（金属層）の形状については前述の
図面に基づき表１に示した。
After mixing SiO 2 powder at 5% by mass and MgO powder at 2% by mass with respect to 93% by mass of Al 2 O 3 powder, 19% by mass of acrylic binder as organic binder and toluene as organic solvent. Were mixed to prepare a slurry, and then a sheet-like molded article having an average thickness of 400 μm was prepared by a doctor blade method. Next, a printed pattern having a predetermined shape was formed in the vicinity of the upper surface of the portion to be the substrate bank portion of this formed body using a metal powder paste mainly composed of a mixed powder of tungsten and copper. The shape of the printing pattern (metal layer) is shown in Table 1 based on the above-mentioned drawing.
次に、金属粉末ペーストの印刷パターンを形成したシート状成形体に対し、金型を用いて、８０℃の温度で加熱プレスを行い、切断して、図２、図３、図４および図９にそれぞれ示すような構造の成形体を形成した。次いで、還元雰囲気中、１４００℃、１時間の条件にて焼成を行った。焼成後の電子部品収納用セラミック基板の金属層（メタライズ層）にはニッケル、金めっきを順に施した。 Next, the sheet-like molded body on which the printed pattern of the metal powder paste is formed is heated and pressed at a temperature of 80 ° C. using a mold, and cut to obtain FIGS. 2, 3, 4 and 9. Molded bodies having structures as shown in FIG. Next, firing was performed in a reducing atmosphere at 1400 ° C. for 1 hour. Nickel and gold plating were sequentially applied to the metal layer (metallized layer) of the ceramic substrate for storing electronic components after firing.
得られた電子部品収納用セラミック基板は、平面の面積が２ｍｍ×２ｍｍ、基板底部の厚みが０．１ｍｍ、基板堤部の平均厚みが０．１５ｍｍ、基板堤部の搭載面からの高さが０．２ｍｍであった。 The obtained ceramic substrate for storing electronic components has a plane area of 2 mm × 2 mm, a thickness of the bottom of the substrate of 0.1 mm, an average thickness of the substrate bank portion of 0.15 mm, and a height from the mounting surface of the substrate bank portion. It was 0.2 mm.
作製した基板のうち、図４に示す構造の電子部品収納用セラミック基板の基板堤部の側面を覆う金属層は、基板堤部の上面付近の厚みｔ３が平均で２０μｍ、これよりも下方であって搭載面側の位置（先端より５０μｍ上部）における厚みｔ４は平均で１２μｍであった。 Of the substrate prepared, the metal layer covering the side surface of the substrate bank portion of the electronic component storing ceramic substrate having the structure shown in Figure 4, the thickness t 3 is the average of the vicinity of the upper surface of the substrate bank portion 20 [mu] m, below than this The thickness t 4 at the position on the mounting surface side (50 μm above the tip) was 12 μm on average.
次に、めっきを施した電子部品収納用セラミック基板の基板堤部の金属層の表面に接合部材として銀ロウ（共晶Ａｇ−Ｃｕロウ）を用い、この上に厚みが０．２ｍｍのコバール（Ｆｅ−Ｎｉ−Ｃｏ合金）製の蓋体をシーム溶接によって接合した。 Next, silver brazing (eutectic Ag-Cu brazing) is used as a bonding member on the surface of the metal layer of the substrate bank portion of the plated ceramic substrate for storing electronic components, and a 0.2 mm thick kovar (on top) A lid body made of (Fe—Ni—Co alloy) was joined by seam welding.
蓋体を形成した電子部品収納用セラミック基板（電子部品実装パッケージ）について、Ｈｅリーク法により気密封止性を評価した。Ｈｅリーク法は、０．４１ＭＰａのＨｅ加圧雰囲気中に２時間保持した後取り出し、真空雰囲気中にて検出されるＨｅガス量を測定した。試料数は５個とし、表１にはＨｅガス量が最大であった値を記した。 The hermetic sealing performance of the ceramic substrate for storing electronic components (electronic component mounting package) on which the lid was formed was evaluated by the He leak method. In the He leak method, the gas was held in a 0.41 MPa He pressurized atmosphere for 2 hours and then taken out, and the amount of He gas detected in a vacuum atmosphere was measured. The number of samples was five, and Table 1 shows the value at which the amount of He gas was maximum.
比較例（試料Ｎｏ．５）として、成形体の基板堤部となる部分の上面だけに金属粉末ペーストの印刷パターンを形成した試料を同様の方法にて電子部品実装パッケージとして作製し、気密封止性を同様に評価した。 As a comparative example (sample No. 5), a sample in which a printed pattern of a metal powder paste is formed only on the upper surface of the portion that becomes the substrate bank portion of the molded body is produced as an electronic component mounting package by the same method, and hermetically sealed Sex was similarly evaluated.
表１から明らかなように、作製した試料のうち基板堤部の表面の金属層を基板堤部の上面から側面にも及ぶ形状とした試料Ｎｏ．１〜３では、Ｈｅリーク法による気密封止性がいずれも４×１０−１０ＭＰａ・ｃｍ３／ｓｅｃ以下であった。この中で、電子部品収納用セラミック基板の搭載面を含むようにして縦断面視したときに、基板堤部の上面が凸凹（デコボコ）している構造（図３）の試料では、Ｈｅリーク法による気密封止性が１×１０−１０ＭＰａ・ｃｍ３／ｓｅｃであった。 As is clear from Table 1, among the prepared samples, the sample no. 1 to 3, all of the hermetic sealing properties by the He leak method were 4 × 10 −10 MPa · cm 3 / sec or less. Among these, a sample having a structure (FIG. 3) in which the upper surface of the substrate bank portion is uneven when viewed in a vertical cross-section so as to include the mounting surface of the ceramic substrate for housing electronic components is used. The hermetic sealing property was 1 × 10 −10 MPa · cm 3 / sec.
これに対し、基板堤部の上面だけに金属層を形成した試料（試料Ｎｏ．４）では、Ｈｅ
リーク法による気密封止性が７×１０−１０ＭＰａ・ｃｍ３／ｓｅｃであった。
On the other hand, in the sample (sample No. 4) in which the metal layer is formed only on the upper surface of the substrate bank portion, He
The hermetic sealing property by the leak method was 7 × 10 −10 MPa · cm 3 / sec.
１０１・・・・・電子部品収納用セラミック基板
１・・・・・・・搭載面
３、１０５・・・基板底部
５、１０６・・・基板堤部
５ａ・・・・・・基板堤部の上面
５ｂ・・・・・・基板堤部の側面
７、１０３・・・蓋体
９・・・・・・・金属層
１０・・・・・・電子部品
２１・・・・・・シート状成形体
２１ａ・・・・・凹状成形体の周囲
２３・・・・・・凸部
２３ａ・・・・・凸部の周囲
２４・・・・・・凹部の側面
２５・・・・・・凹状成形体
ｔ・・・・・・・基板堤部の厚み
ｔ１・・・・・・基板堤部の上面の位置における厚み
ｔ２・・・・・・基板底部の搭載面側の位置における厚み
ｔ３・・・・・・基板堤部の上面付近における金属層の厚み
ｔ４・・・・・・基板底部の搭載面側の位置における金属層の厚み
ｗ・・・・・・・金属層の幅（基板堤部の厚みｔに対応する幅）
101... Ceramic substrate for storing electronic components 1... Mounting surface 3, 105... Substrate bottom 5, 106. Upper surface 5b... Side surface 7 of substrate bank portion 103 103 Lid 9 Metal layer 10 Electronic component 21 Sheet molding Body 21a: Peripheral molded body periphery 23: Convex part 23a: Convex part periphery 24: Concave side 25: Concave molding body t · · · · · · · thickness at the mounting surface side of the position of the thickness t 2 · · · · · · substrate bottom at the position of the upper surface of the thickness t 1 · · · · · · substrate bank portion of the substrate bank portion t 3 ... Metal layer thickness t near the top surface of the substrate bank 4 ... Metal layer thickness w at the mounting surface side position of the substrate bottom. Layer width (width corresponding to substrate bank thickness t)
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