JP5906550B2 - ハイバリア性を有する封止材 - Google Patents
ハイバリア性を有する封止材 Download PDFInfo
- Publication number
- JP5906550B2 JP5906550B2 JP2011165809A JP2011165809A JP5906550B2 JP 5906550 B2 JP5906550 B2 JP 5906550B2 JP 2011165809 A JP2011165809 A JP 2011165809A JP 2011165809 A JP2011165809 A JP 2011165809A JP 5906550 B2 JP5906550 B2 JP 5906550B2
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- JP
- Japan
- Prior art keywords
- plate
- sealing material
- weight
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- inorganic compound
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J3/00—Processes of treating or compounding macromolecular substances
- C08J3/24—Crosslinking, e.g. vulcanising, of macromolecules
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J3/00—Processes of treating or compounding macromolecular substances
- C08J3/20—Compounding polymers with additives, e.g. colouring
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
- C08K3/013—Fillers, pigments or reinforcing additives
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K7/00—Use of ingredients characterised by shape
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L101/00—Compositions of unspecified macromolecular compounds
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/842—Containers
- H10K50/8426—Peripheral sealing arrangements, e.g. adhesives, sealants
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
- Y02E10/549—Organic PV cells
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- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Sealing Material Composition (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2011165809A JP5906550B2 (ja) | 2011-07-28 | 2011-07-28 | ハイバリア性を有する封止材 |
KR1020120080355A KR101668140B1 (ko) | 2011-07-28 | 2012-07-24 | 하이배리어성을 갖는 봉지재 |
TW101127164A TWI496826B (zh) | 2011-07-28 | 2012-07-27 | 具有高阻隔性的封裝材料 |
CN201210264188.1A CN102898782B (zh) | 2011-07-28 | 2012-07-27 | 具有高阻隔性的封装材料 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2011165809A JP5906550B2 (ja) | 2011-07-28 | 2011-07-28 | ハイバリア性を有する封止材 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2013028722A JP2013028722A (ja) | 2013-02-07 |
JP5906550B2 true JP5906550B2 (ja) | 2016-04-20 |
Family
ID=47571287
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2011165809A Active JP5906550B2 (ja) | 2011-07-28 | 2011-07-28 | ハイバリア性を有する封止材 |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP5906550B2 (zh) |
KR (1) | KR101668140B1 (zh) |
CN (1) | CN102898782B (zh) |
TW (1) | TWI496826B (zh) |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN104051357B (zh) * | 2013-03-15 | 2017-04-12 | 财团法人工业技术研究院 | 环境敏感电子装置以及其封装方法 |
JP6699171B2 (ja) * | 2013-10-02 | 2020-05-27 | 株式会社村田製作所 | 電池、電解質、電池パック、電子機器、電動車両、蓄電装置および電力システム |
CN104637886B (zh) | 2013-11-12 | 2017-09-22 | 财团法人工业技术研究院 | 折叠式封装结构 |
CN105754273B (zh) * | 2016-03-11 | 2018-04-20 | 安徽金兑新材料科技有限公司 | 一种阻隔水汽的聚合纳米薄膜及其制备方法 |
CN105802179B (zh) * | 2016-05-06 | 2017-04-05 | 辽宁大禹防水科技发展有限公司 | 一种用于防水卷材的高强树脂胎基及其制备方法 |
KR102497953B1 (ko) * | 2016-12-09 | 2023-02-09 | 미쯔비시 가스 케미칼 컴파니, 인코포레이티드 | 가스배리어성 필름 |
CN109988413A (zh) * | 2017-12-29 | 2019-07-09 | 深圳光启尖端技术有限责任公司 | 一种气体阻隔材料及其制备方法 |
CN114990753A (zh) * | 2022-06-17 | 2022-09-02 | 烟台经纬智能科技有限公司 | 一种发光变色纤维及其一步成型制备方法 |
Family Cites Families (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6916527B2 (en) * | 2001-01-18 | 2005-07-12 | Matsushita Electric Works, Ltd. | Resin moldings |
JP4906195B2 (ja) * | 2001-04-13 | 2012-03-28 | 白石工業株式会社 | 板状炭酸カルシウムを含む含塩素高分子化合物組成物 |
JP2003041019A (ja) * | 2001-07-26 | 2003-02-13 | Toray Ind Inc | 熱可塑性樹脂フィルム |
JP2004179275A (ja) * | 2002-11-26 | 2004-06-24 | Sumitomo Bakelite Co Ltd | 半導体装置 |
JP4526776B2 (ja) * | 2003-04-02 | 2010-08-18 | 株式会社半導体エネルギー研究所 | 発光装置及び電子機器 |
JP2006056969A (ja) * | 2004-08-19 | 2006-03-02 | Nippon Steel Chem Co Ltd | エポキシ樹脂組成物およびその硬化物 |
JP2006249343A (ja) * | 2005-03-14 | 2006-09-21 | Mitsui Chemicals Inc | エポキシ樹脂組成物および半導体素子収納用パッケージ |
JP2006291072A (ja) * | 2005-04-12 | 2006-10-26 | Sekisui Chem Co Ltd | 光硬化型樹脂組成物、有機エレクトロルミネッセンス素子用接着剤、有機エレクトロルミネッセンス表示素子、及び、有機エレクトロルミネッセンス表示素子の製造方法 |
JP2008095001A (ja) * | 2006-10-13 | 2008-04-24 | Nippon Electric Glass Co Ltd | 封止用組成物 |
JP4780041B2 (ja) * | 2007-06-07 | 2011-09-28 | 住友ベークライト株式会社 | 半導体用樹脂ペースト及び半導体装置 |
JP5258723B2 (ja) * | 2008-09-24 | 2013-08-07 | 積水化学工業株式会社 | 電子部品用接着剤及び電子部品積層体 |
JP5332464B2 (ja) * | 2008-09-30 | 2013-11-06 | 住友ベークライト株式会社 | 樹脂組成物および樹脂組成物を使用して作製した半導体装置 |
WO2010067546A1 (ja) * | 2008-12-10 | 2010-06-17 | 住友ベークライト株式会社 | 半導体封止用樹脂組成物、半導体装置の製造方法及び半導体装置 |
US9136195B2 (en) * | 2009-07-17 | 2015-09-15 | Tyco Electronics Corporation | Oxygen barrier compositions and related methods |
-
2011
- 2011-07-28 JP JP2011165809A patent/JP5906550B2/ja active Active
-
2012
- 2012-07-24 KR KR1020120080355A patent/KR101668140B1/ko active IP Right Grant
- 2012-07-27 CN CN201210264188.1A patent/CN102898782B/zh active Active
- 2012-07-27 TW TW101127164A patent/TWI496826B/zh active
Also Published As
Publication number | Publication date |
---|---|
TW201313805A (zh) | 2013-04-01 |
CN102898782A (zh) | 2013-01-30 |
CN102898782B (zh) | 2016-07-13 |
KR101668140B1 (ko) | 2016-10-20 |
KR20130014375A (ko) | 2013-02-07 |
TWI496826B (zh) | 2015-08-21 |
JP2013028722A (ja) | 2013-02-07 |
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