JP5906550B2 - ハイバリア性を有する封止材 - Google Patents

ハイバリア性を有する封止材 Download PDF

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Publication number
JP5906550B2
JP5906550B2 JP2011165809A JP2011165809A JP5906550B2 JP 5906550 B2 JP5906550 B2 JP 5906550B2 JP 2011165809 A JP2011165809 A JP 2011165809A JP 2011165809 A JP2011165809 A JP 2011165809A JP 5906550 B2 JP5906550 B2 JP 5906550B2
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Japan
Prior art keywords
plate
sealing material
weight
parts
inorganic compound
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JP2011165809A
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English (en)
Japanese (ja)
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JP2013028722A (ja
Inventor
敏之 管野
敏之 管野
小冬 王
小冬 王
明伸 若林
明伸 若林
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Moresco Corp
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Moresco Corp
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Publication date
Application filed by Moresco Corp filed Critical Moresco Corp
Priority to JP2011165809A priority Critical patent/JP5906550B2/ja
Priority to KR1020120080355A priority patent/KR101668140B1/ko
Priority to TW101127164A priority patent/TWI496826B/zh
Priority to CN201210264188.1A priority patent/CN102898782B/zh
Publication of JP2013028722A publication Critical patent/JP2013028722A/ja
Application granted granted Critical
Publication of JP5906550B2 publication Critical patent/JP5906550B2/ja
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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J3/00—Processes of treating or compounding macromolecular substances
    • C08J3/24—Crosslinking, e.g. vulcanising, of macromolecules
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J3/00—Processes of treating or compounding macromolecular substances
    • C08J3/20—Compounding polymers with additives, e.g. colouring
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
    • C08K3/013—Fillers, pigments or reinforcing additives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K7/00—Use of ingredients characterised by shape
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L101/00—Compositions of unspecified macromolecular compounds
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/842—Containers
    • H10K50/8426—Peripheral sealing arrangements, e.g. adhesives, sealants
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00—Energy generation through renewable energy sources
    • Y02E10/50—Photovoltaic [PV] energy
    • Y02E10/549—Organic PV cells

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  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Sealing Material Composition (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
JP2011165809A 2011-07-28 2011-07-28 ハイバリア性を有する封止材 Active JP5906550B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2011165809A JP5906550B2 (ja) 2011-07-28 2011-07-28 ハイバリア性を有する封止材
KR1020120080355A KR101668140B1 (ko) 2011-07-28 2012-07-24 하이배리어성을 갖는 봉지재
TW101127164A TWI496826B (zh) 2011-07-28 2012-07-27 具有高阻隔性的封裝材料
CN201210264188.1A CN102898782B (zh) 2011-07-28 2012-07-27 具有高阻隔性的封装材料

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2011165809A JP5906550B2 (ja) 2011-07-28 2011-07-28 ハイバリア性を有する封止材

Publications (2)

Publication Number Publication Date
JP2013028722A JP2013028722A (ja) 2013-02-07
JP5906550B2 true JP5906550B2 (ja) 2016-04-20

Family

ID=47571287

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2011165809A Active JP5906550B2 (ja) 2011-07-28 2011-07-28 ハイバリア性を有する封止材

Country Status (4)

Country Link
JP (1) JP5906550B2 (zh)
KR (1) KR101668140B1 (zh)
CN (1) CN102898782B (zh)
TW (1) TWI496826B (zh)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104051357B (zh) * 2013-03-15 2017-04-12 财团法人工业技术研究院 环境敏感电子装置以及其封装方法
JP6699171B2 (ja) * 2013-10-02 2020-05-27 株式会社村田製作所 電池、電解質、電池パック、電子機器、電動車両、蓄電装置および電力システム
CN104637886B (zh) 2013-11-12 2017-09-22 财团法人工业技术研究院 折叠式封装结构
CN105754273B (zh) * 2016-03-11 2018-04-20 安徽金兑新材料科技有限公司 一种阻隔水汽的聚合纳米薄膜及其制备方法
CN105802179B (zh) * 2016-05-06 2017-04-05 辽宁大禹防水科技发展有限公司 一种用于防水卷材的高强树脂胎基及其制备方法
KR102497953B1 (ko) * 2016-12-09 2023-02-09 미쯔비시 가스 케미칼 컴파니, 인코포레이티드 가스배리어성 필름
CN109988413A (zh) * 2017-12-29 2019-07-09 深圳光启尖端技术有限责任公司 一种气体阻隔材料及其制备方法
CN114990753A (zh) * 2022-06-17 2022-09-02 烟台经纬智能科技有限公司 一种发光变色纤维及其一步成型制备方法

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6916527B2 (en) * 2001-01-18 2005-07-12 Matsushita Electric Works, Ltd. Resin moldings
JP4906195B2 (ja) * 2001-04-13 2012-03-28 白石工業株式会社 板状炭酸カルシウムを含む含塩素高分子化合物組成物
JP2003041019A (ja) * 2001-07-26 2003-02-13 Toray Ind Inc 熱可塑性樹脂フィルム
JP2004179275A (ja) * 2002-11-26 2004-06-24 Sumitomo Bakelite Co Ltd 半導体装置
JP4526776B2 (ja) * 2003-04-02 2010-08-18 株式会社半導体エネルギー研究所 発光装置及び電子機器
JP2006056969A (ja) * 2004-08-19 2006-03-02 Nippon Steel Chem Co Ltd エポキシ樹脂組成物およびその硬化物
JP2006249343A (ja) * 2005-03-14 2006-09-21 Mitsui Chemicals Inc エポキシ樹脂組成物および半導体素子収納用パッケージ
JP2006291072A (ja) * 2005-04-12 2006-10-26 Sekisui Chem Co Ltd 光硬化型樹脂組成物、有機エレクトロルミネッセンス素子用接着剤、有機エレクトロルミネッセンス表示素子、及び、有機エレクトロルミネッセンス表示素子の製造方法
JP2008095001A (ja) * 2006-10-13 2008-04-24 Nippon Electric Glass Co Ltd 封止用組成物
JP4780041B2 (ja) * 2007-06-07 2011-09-28 住友ベークライト株式会社 半導体用樹脂ペースト及び半導体装置
JP5258723B2 (ja) * 2008-09-24 2013-08-07 積水化学工業株式会社 電子部品用接着剤及び電子部品積層体
JP5332464B2 (ja) * 2008-09-30 2013-11-06 住友ベークライト株式会社 樹脂組成物および樹脂組成物を使用して作製した半導体装置
WO2010067546A1 (ja) * 2008-12-10 2010-06-17 住友ベークライト株式会社 半導体封止用樹脂組成物、半導体装置の製造方法及び半導体装置
US9136195B2 (en) * 2009-07-17 2015-09-15 Tyco Electronics Corporation Oxygen barrier compositions and related methods

Also Published As

Publication number Publication date
TW201313805A (zh) 2013-04-01
CN102898782A (zh) 2013-01-30
CN102898782B (zh) 2016-07-13
KR101668140B1 (ko) 2016-10-20
KR20130014375A (ko) 2013-02-07
TWI496826B (zh) 2015-08-21
JP2013028722A (ja) 2013-02-07

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