JP6477486B2 - ダイボンドシート及び半導体装置の製造方法 - Google Patents
ダイボンドシート及び半導体装置の製造方法 Download PDFInfo
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- JP6477486B2 JP6477486B2 JP2015543884A JP2015543884A JP6477486B2 JP 6477486 B2 JP6477486 B2 JP 6477486B2 JP 2015543884 A JP2015543884 A JP 2015543884A JP 2015543884 A JP2015543884 A JP 2015543884A JP 6477486 B2 JP6477486 B2 JP 6477486B2
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- silver
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
- B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
- B23K35/0244—Powders, particles or spheres; Preforms made therefrom
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L24/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
- H01L24/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L24/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L24/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/52—Mounting semiconductor bodies in containers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
- H01L2224/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
- H01L2224/29001—Core members of the layer connector
- H01L2224/29099—Material
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- H01L2224/29339—Silver [Ag] as principal constituent
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
- H01L2224/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
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Description
空孔率(体積%)=[1−(M1)/(M2)]×100 …(1)
M2(g/cm3)=1/[{(A/100)/8.96}+{(1−A/100)/10.5}] …(2)
M2(g/cm3)=1/[{(B/100)/M3}+{(1−B/100)/M4}] …(3)
[B:低融点ガラスの含有量(質量%)、M3:低融点ガラスの密度(例えば、5.5g/cm3)、M4:銀の密度(例えば、10.5g/cm3)、銅の密度(例えば、8.96g/cm3)、銀と銅との混合物の密度(例えば、前記式(2)で算出した密度M2(g/cm3)]
また、熱圧着後の接合体のダイシェア強度は20MPa以上であることが好ましい。特に、半導体素子及び銀めっきが設けられた基板とのダイシェア強度は20MPa以上であることが好ましい。
ペースト状組成物1〜10は、下記の調製例1〜10に従い調製した。なお、表1〜3には、各成分の配合量を質量部で示す。
AgC239:銀粒子(福田金属箔粉工業社製、製品名「AgC239」、体積平均粒径3.0μm)。
K−0082P:銀粒子(METALOR社製、製品名「K−0082P」、体積平均粒径1.6μm)。
Silver Foil:銀箔(Alfa Aesar社製、製品名「Silver Foil 0.1 mm thick hard Premion 99.998%、厚み100μm)
Cu−HWQ:銅粒子(福田金属箔粉工業社製、製品名「Cu−HWQ」、体積平均粒径1.5μm)。
ナノテックCUO:酸化銅粒子(CIKナノテック社製、製品名「ナノテックCUO」、体積平均粒径70μm)。
CH−002:球状銅粒子(三井金属社製、製品名「CH−002」、体積平均粒径0.3μm)
酸化第二銅:(和光純薬工業社製、製品名「酸化銅(II)」)。
3L3:(福田金属箔粉工業社製、製品名「3L3」、体積平均粒径10μmフレーク状)
ステアリン酸:(新日本理化社製、製品名「ステアリン酸」)。
VP−1300:低融点ガラス粒子(日立化成社製、製品名「バニーテクトIII VP−1300」、体積平均粒径1μm)。
MTPH:(日本テルペン工業社製、製品名「ボルニルシクロヘキサノール」)。
DPMA:(ダイセル化学社製、製品名「ジプロピレングリコールメチルエーテルアセテート」)。
炭酸ポリプロピレン:(和光純薬工業社製、製品名「4−メチル−1,3−ジオキソラン−2−オン)。
テルピネオール:(和光純薬工業社製、製品名「α−テルピネオール」)。
ポリアミック酸:(Aldrich社製、製品名「Poly(pyromellitic dianhydride−co−oxydianiline)NMP solution」)。
分散媒としてボルニルシクロヘキサノール(MTPH、日本テルペン社製)6.83g及びジプロピレングリコールメチルエーテルアセテート(DPMA、ダイセル化学社製)6.83gと、添加剤としてステアリン酸(新日本理化社製)1.35gとをポリ瓶に混合し、密栓し、50℃の水浴で暖め、時々振り混ぜながら透明均一な溶液とした。この溶液に銀粒子としてAgC239を135g添加し、スパチュラで乾燥粉がなくなるまでかき混ぜた。さらに、密栓をして自転公転型攪拌装置(Planetry Vacuum Mixer ARV−310、シンキー社製)を用いて、2000rpmで1分間撹拌してペースト状組成物1を得た。
分散媒として炭酸プロピレン3.2gと、銅粒子としてCu−HWQ(福田金属箔粉工業社製))14.28g及び酸化銅粒子としてナノテックCUO(CIKナノテック社製)2.52gをポリ瓶に加え、スパチュラで乾燥粉がなくなるまでかき混ぜた。その後は、調製例1と同様の方法でペースト状組成物2を得た。
分散媒としてテルピネオール(和光純薬工業製)1.37gと、添加剤としてステアリン酸(新日本理化社製)0.14gとをポリ瓶に混合、密栓し50℃の水浴で暖め、時々振り混ぜながら透明均一な溶液とした。この溶液に低融点ガラス粒子であるバニーテクトIII VP−1300(日立化成社製)及び2種類の銀粒子(AgC239(福田金属箔工業社製)、K−0082P(METALOR社製))を表2に示す割合で添加し、スパチュラで乾燥粉がなくなるまでかき混ぜた。その後は、調製例1と同様の方法でペースト状組成物3〜7を得た。
分散媒としてテルピネオール10gと、銅粒子として球状銅粒子(CH−002、三井金属社製)90gとをポリ瓶に混合し、自動公転型攪拌装置を用いて、2000rpmで2分間攪拌して、ペースト状組成物8を得た。
二つのジルコニアポットにジルコニアボール(直径10mm)10個と酸化第二銅(和光純薬工業社製)10gをともにいれ、遊星ボールミル(P7、フリッチュ社製)のアーム両側にジルコニアポットを取り付け450rpmで2時間粉砕した。粉砕した酸化第二銅18gとジプロピレングリコールモノブチルエーテル2gとをポリ瓶に混合し、スパチュラでかき混ぜた。この混合物を、自動公転型攪拌装置を用いて、2000rpmで1分間攪拌して、ペースト状組成物9を得た。
分散媒としてテルピネオール4gと、フレーク状銅粉(3L3、福田金属箔粉工業社製)18gとをポリ瓶に混合し、自動公転型攪拌装置を用いて、減圧2kPa、2000rpmで2分間攪拌して、ペースト状組成物10を得た。
(実施例1)
ペースト状組成物1をガラス板上に、ギャップを100μmにセットしたベーカーアプリケータ(YBA5型、ヨシミツ精機社製)を用いて膜状に塗布した。このガラス板をホットプレート上で室温から200℃まで10℃/minで昇温後、200℃で1時間放置した。このガラス基板を室温(25℃)に戻した後、ペースト状組成物1の硬化膜を、カッターナイフの刃をガラスと硬化膜との間に差し込み剥離することで、自立膜として得た。この硬化膜を14×14mm2の正方形に切断して、ダイボンドシートとした。デジタルリニアゲージ(DG−525H、小野測器社製)を用いて、ガラス基板厚みと、ガラス基板及びダイボンドシートの合計の厚みとの差を、ダイボンドシートの膜厚として測定した結果、60μmであった。
ダイボンドシート中に含まれる有機物量を評価するために炭素分を誘導加熱燃焼赤外線吸収法にて測定した。炭素分が検出限界(10ppm)以下のときには、表中「−」で示す。
ダイボンドシートに含まれる元素比率を以下の発光分析により定量した。まず、ふた付きのポリ容器にダイボンドシート約0.1gを小数点以下4桁まで秤量した。ここに、硝酸(AA−100、多摩化学社製)4mL、過酸化水素(原子吸光測定用、和光純薬製)3mLを添加し、30分間超音波処理をしてダイボンドシートを溶解した。残渣や浮遊物が無いことを確認した後、100mLのメスフラスコに移し、ふた付きのポリ容器を共洗いしながら純水を添加し、100mLに希釈した。必要に応じてさらに適宜希釈し、測定溶液とした。測定溶液を誘導結合プラズマ発光分光分析装置(SPS5100、日立ハイテクサイエンス社製)により測定することで、含有元素とその割合を得た。測定は以下の条件で行った。プラズマ出力:1.2kW、測定波長:V:292.401nm、Te:214.282nm、W:207.912nm、Ag:328.068nm。
銀めっきアルミナDCB基板上に14×14mm2のダイボンドシートを設置し、その上にチタン、ニッケル及び金がこの順でめっきされ、2×2mm2の被着面が金めっきであるシリコンチップを16枚並べて置き、その上に膨張黒鉛シートを置いた状態で加熱圧着装置(テスター産業社製)を用いて空気中で10MPa、300℃の条件で10分間処理して接合した。ダイボンドシートの接着強度は、ダイシェア強度により評価した。DS−100ロードセルを装着した万能型ボンドテスタ(4000シリーズ、DAGE社製)を用い、測定スピード5mm/min、測定高さ50μmで被着面が金めっきであるシリコンチップを水平方向に押し、ダイボンドシートのダイシェア強度を測定した。15枚のシリコンチップを測定した値の平均値をダイシェア強度とした。
実施例1のダイボンドシートを、加熱圧着装置による圧着条件を表1に示す条件に変更した以外は、[ダイシェア強度の測定]に記載の方法に従ってダイシェア強度を測定した。その結果、加熱圧着条件として、温度が250℃以上、圧力が1MPa以上、時間が90秒以上であればダイシェア強度が10MPa以上になり、十分な接着強度が得られることが確認された。
ペースト状組成物2をガラス板上に、ギャップを100μmにセットしたベーカーアプリケータ(YBA5型、ヨシミツ精機社製)を用いて膜状に塗布した。このガラス板をギ酸リフロー装置「SR−300−2」(アユミ工業社製)にて、ギ酸を含む窒素中(ギ酸含有量は30℃時における飽和量で10質量%)で300℃1時間加熱することにより焼結を行った後、窒素中で300℃10分間静置し、その後窒素中で50℃以下に冷却してから空気中に取り出した。ペースト状組成物2の硬化膜を、カッターナイフの刃をガラスと硬化膜の間に差し込み剥離することで、自立膜として得た。この硬化膜を14×14mm2の正方形に切断して、ダイボンドシートとした。デジタルリニアゲージ(DG−525H、小野測器社製)を用いて、ガラス基板厚みと、ガラス基板及びダイボンドシートの合計の厚みとの差を、ダイボンドシートの膜厚として測定した結果、70μmであった。このダイボンドシートを用いて、実施例1と同様に各種測定及び分析を行った。
ペースト状組成物3〜7をガラス基板上にポリイミドテープで固定したPTFE(四フッ化エチレン)含浸ガラスクロスの上に塗布した以外は実施例1と同様にして、ダイボンドシートを作製した。このダイボンドシートを用いて、実施例1と同様に各種測定及び分析を行った。
アルミニウム板上にポリイミドテープでテフロン(登録商標)含浸ガラスクロスシートを固定し、その上にギャップを150μmにしたベーカーアプリケータを用いてペースト状組成物8を膜状に塗布した。このアルミニウム板をギ酸リフロー装置に導入し、減圧して10分間放置した。その後、アルミニウム板を、ギ酸含有窒素雰囲気下で、圧力0.09MPaで加熱し、385℃に達した状態で1時間処理した。その後、これを385℃で減圧し10分間放置した後、窒素で常圧に戻し、キャリヤトレイごと前室の冷却板上に移して30℃まで冷却して、空気中に取り出した。ペースト状組成物8の硬化膜を、カッターナイフの刃をガラスと硬化膜との間に差し込み剥離することで、自立膜として得た。この自立膜を14×14mm2の正方形に切断して、ダイボンドシートとした。
厚さ300μmのテフロン(登録商標)シートに20×20mm2の開口を設けてマスクとした。このマスクを石英ガラス板上に重ねてペースト状組成物9をマスク開口部に塗布し、メタルスキージで均し、マスクを取り除いた。このガラス板を110℃のホットプレート上で10分乾燥後、チューブヒーター(ALL VACUUM CREATE社製)にセットした。その後、ガラス板を水素雰囲気下で350℃、1時間処理した後、窒素を流し放冷して室温付近で空気中に取り出した。ペースト状組成物9の硬化膜を、カッターナイフの刃をガラスと硬化膜との間に差し込み剥離することで、自立膜として得た。この自立膜を14×14mm2の正方形に切断して、ダイボンドシートとした。
厚さ300μmのテフロン(登録商標)シートに20×20mm2の開口を儲けてマスクとし、このマスクを石英ガラス板上(27×35mm2)に重ね、ペースト状組成物10を塗布し、メタルスキージで均し、マスクを取り除いた。この石英ガラス板をギ酸リフロー装置に導入して減圧し10分間放置した。その後、石英ガラス板を、ギ酸含有窒素雰囲気下で、圧力0.09MPaで加熱し、385℃に達した状態で1時間処理した。その後、これを385℃で減圧し10分間放置した後、窒素で常圧に戻し、キャリヤトレイごと前室の冷却板上に移して30℃まで冷却して、空気中に取り出した。ペースト状組成物10の硬化膜を、カッターナイフの刃をガラスと硬化膜との間に差し込み剥離することで、自立膜として得た。この自立膜を14×14mm2の正方形に切断して、ダイボンドシートとした。
厚さ100μmの銀箔(Silver Foil、0.1mm thick、hard、99.998%、PREMION、Alfa Aesar社製)を14×14mm2の正方形に切断してダイボンドシートとして用いた。このダイボンドシートを用いて、実施例1と同様に各種測定及び分析を行った。その結果、比較例1のダイボンドシートのダイシェア強度は8MPaと低く、接着不良であった。
実施例1のダイボンドシートに、N−メチルピロリドンで5質量%に希釈したポリアミック酸(製品番号575801、Aldrich社製)溶液を表面からあふれない程度に含浸した。その後、余分なポリアミック酸溶液をベンコット(登録商標、旭化成せんい株式会社)でふき取った後、ポリテトラフルオロエチレンのシートをひいた100℃に加熱したホットプレート上で乾燥した。ポリアミック酸溶液の含浸及び乾燥を繰り返し、ダイボンドシートの乾燥状態での重量増加が1.03質量%(ポリアミック酸含量2.8質量%)となったダイボンドシートを調製した。このダイボンドシートを用いて、実施例1と同様に各種測定及び分析を行った。その結果、比較例2のダイボンドシートのダイシェア強度は2MPaと低く、接着不良であった。
シリコンチップ及び基板をダイボンドシートで接合したサンプルをカップ内にサンプルクリップ(Samplklip I、Buehler社製)で固定し、周囲にエポキシ注形樹脂(エポマウント、リファインテック社製)をサンプル全体が埋まるまで流し込み、真空デシケータ内に静置し、1分間減圧して脱泡した。その後、室温下(25℃)10時間放置後、60℃の恒温機で2時間エポキシ注形樹脂を硬化した。ダイヤモンド切断ホイール(11−304、リファインテック社製)をつけたリファインソー・ロー(リファインテック製)を用い、注形したサンプルの観察したい断面付近で切断した。耐水研磨紙(カーボマックペーパー、リファインテック社製)をつけた研磨装置(Refine Polisher HV、リファインテック社製)で断面を削り、シリコンチップにクラックの無い断面を出した。その後、バフ研磨剤を染ませたバフ研磨布をセットした研磨装置で断面を平滑に仕上げた。断面をイオンミリング装置(IM4000、日立製作所社製)でイオンビーム照射角度30°、偏心率2mm、加速電圧6kV、アルゴンガス流量0.07〜0.1cm3/min、処理時間5分の条件でフラットミリングを行い、断面にスパッタ装置(ION SPUTTER、日立ハイテク社製)を用いて白金を10nmの厚みでスパッタしてSEM用のサンプルとした。このSEM用サンプルをSEM装置(ESEM XL30、Philips社製)により、ダイボンドシートの断面を印加電圧10kV、各種倍率で観察した。
(ダイボンドシートの作製)
ペースト状組成物1を、厚さ50μmのポリイミドシート上に、20×20mm2の正方形に開口させた厚さ125μmのPETフィルムをマスクとして、メタルスキージを用いて塗布した。このペースト状組成物1を塗布したポリイミドシートをホットプレート上に設置し、110℃で10分間及び180℃で10分間乾燥後、もう一枚のポリイミドシートを乾燥したペースト状組成物上に被せ、加熱圧着装置を用いて、表4に記載の圧力条件で、300℃、10分間硬化した。硬化したペースト状組成物をポリイミドシートから剥離し、10×10mm2の正方形に切断して、実施例18、19及び比較例3のダイボンドシートとした。
空孔率の測定は、以下の方法で行った。ダイボンドシートを長方形に切り出し、ダイボンドシートの縦、横の長さを定規で、厚みを膜厚計(ID−C112C、グラナイトコンパレータスタンド、レリーズ、ミツトヨ社製)で測定してシートの体積を計算した。切り出したダイボンドシートの体積と、精密天秤で測定したダイボンドシートの重量とからダイボンドシートの見かけの密度M1(g/cm3)を求めた。求めたM1と、ダイボンドシートを構成する材料の密度M2(g/cm3)とを用いて、下記式(4)から空孔率を求めた。
空孔率(体積%)=[1−(M1)/(M2)]×100 …(4)
M2(g/cm3)=1/[{(B/100)/5.5}+{(1−B/100)/10.5}] …(5)
[B:低融点ガラスの含有量(質量%)]
熱圧着後の空孔率(体積%)={(A2)/(A1)}×100 …(6)
(Agペーストを用いた接続信頼性試験サンプルの作製)
イソボルニルシクロヘキサノール(テルソルブMTPH、日本テルペン製)5.5質量部とステアリン酸ブチル(和光純薬工業製)5.5質量部をポリ瓶に混合、密栓し50℃の水浴で暖め、時々振り混ぜながら透明均一な溶液とした。この溶液に鱗片状銀粒子(AgC239、福田金属箔粉工業製)89質量部を添加し、スパチュラで乾燥粉がなくなるまでかき混ぜた。さらに、ポリ瓶に密栓をして自転公転型攪拌装置(Planetary Vacuum Mixer ARV−310、シンキー社製)を用いて、2000rpmで1分間撹拌してAgペーストを得た。
Agダイボンドシートは、実施例1で調製したものを5×9mm2に切断して用いた。基板(銀めっき銅板19×25mm、厚み3mm)上に、Agダイボンドシート、チタン、ニッケル及び金がこの順でめっきされ、4×8mm2の被着面が金めっきであるシリコンチップ、アルミナ板、膨張黒鉛シートをこの順で重ね、加熱圧着装置を用いて空気中で10MPa、300℃の条件で10分間処理して接合した。この接合体にプライマーをコートし、これを封止材で封止して、Agダイボンドシートを用いた接続信頼性試験サンプル2を作製した。
Cuダイボンドシートは、実施例9で調製したものを5×9mm2に切断して用いた。基板(銅板19×25mm、厚み3mm)上に、Cuダイボンドシート、チタン、ニッケル及び金がこの順でめっきされ、4×8mm2の被着面が金めっきであるシリコンチップ、アルミナ板、膨張黒鉛シートをこの順で重ね、雰囲気制御加熱圧着装置(RF−100B、アユミ工業社製)によってギ酸含有窒素雰囲気で10MPa、300℃の条件で10分間処理し、その後窒素中、無加圧300℃10分処理して接合した。この接合体にプライマーをコートし、これを封止材で封止して、Cuダイボンドシートを用いた接続信頼性試験サンプル3を作製した。
接続信頼性試験は、冷熱衝撃試験装置(TSA−72ES−W、タバイエスペック社製)を用い、低温側−40℃、高温側200℃、1サイクル30分で行った。試験サンプルの接続信頼性は、超音波トモグラフィー(InSight−300、インサイト社製)を用いて、接続信頼性試験を200サイクル行った後のダイボンド層が剥離した面積割合で評価した。その結果、試験サンプル1(Agペースト)を用いた場合では20面積%、試験サンプル2(Agダイボンドシート)を用いた場合では20面積%、試験サンプル3(Cuダイボンドシート)を用いた場合では0面積%の剥離が見られた。以上の結果から、AgダイボンドシートはAgペーストと同等の接続信頼性を有しており、CuダイボンドシートはAgダイボンドシート及びAgダイボンドシートより接続信頼性に優れていた。
Claims (4)
- 空孔率が15〜50体積%であり、銀及び/又は銅を含み、炭素分が1.5質量%以下であり、バナジウムを原子換算で0.06〜13.6原子%及びテルルを原子換算で0.12〜7.8原子%含む多孔質シートを、半導体素子と半導体素子搭載用支持部材との間に介在させ、これらを加熱加圧することにより前記半導体素子と前記半導体素子搭載用支持部材とを接合することを特徴とする半導体装置の製造方法。
- 空孔率が15〜50体積%であり、銀及び/又は銅を含み、炭素分が1.5質量%以下であり、バナジウムを原子換算で0.06〜13.6原子%及びテルルを原子換算で0.12〜7.8原子%含む多孔質シートからなることを特徴とするダイボンドシート。
- 前記多孔質シートが、銀粒子及び/又は銅粒子と分散媒とが含まれる組成物をシート状に形成し、加熱して得られるものであることを特徴とする請求項2に記載のダイボンドシート。
- 請求項2又は3に記載のダイボンドシートを介して、半導体素子と半導体素子搭載用支持部材とが接合された構造を有することを特徴とする半導体装置。
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WO2015060346A1 (ja) | 2015-04-30 |
JPWO2015060346A1 (ja) | 2017-03-09 |
TW201535536A (zh) | 2015-09-16 |
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