JP5832740B2 - 硬化性エポキシ樹脂組成物 - Google Patents

硬化性エポキシ樹脂組成物 Download PDF

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Publication number
JP5832740B2
JP5832740B2 JP2010267355A JP2010267355A JP5832740B2 JP 5832740 B2 JP5832740 B2 JP 5832740B2 JP 2010267355 A JP2010267355 A JP 2010267355A JP 2010267355 A JP2010267355 A JP 2010267355A JP 5832740 B2 JP5832740 B2 JP 5832740B2
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Japan
Prior art keywords
resin composition
epoxy resin
acid
weight
liquid curable
Prior art date
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JP2010267355A
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English (en)
Japanese (ja)
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JP2012116935A (ja
Inventor
正憲 坂根
正憲 坂根
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Daicel Corp
Original Assignee
Daicel Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority to JP2010267355A priority Critical patent/JP5832740B2/ja
Application filed by Daicel Corp filed Critical Daicel Corp
Priority to ES11844984T priority patent/ES2750565T3/es
Priority to MYPI2013001730A priority patent/MY161591A/en
Priority to PCT/JP2011/075816 priority patent/WO2012073666A1/ja
Priority to US13/883,297 priority patent/US9200133B2/en
Priority to CN201180050239.4A priority patent/CN103168074B/zh
Priority to KR1020137016598A priority patent/KR101829948B1/ko
Priority to EP11844984.2A priority patent/EP2647667B1/en
Priority to TW100143643A priority patent/TWI511995B/zh
Publication of JP2012116935A publication Critical patent/JP2012116935A/ja
Application granted granted Critical
Publication of JP5832740B2 publication Critical patent/JP5832740B2/ja
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Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/34—Silicon-containing compounds
    • C08K3/36—Silica
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/22—Di-epoxy compounds
    • C08G59/24—Di-epoxy compounds carbocyclic
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/49—Phosphorus-containing compounds
    • C08K5/51—Phosphorus bound to oxygen
    • C08K5/52—Phosphorus bound to oxygen only
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H01L23/293—Organic, e.g. plastic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Medicinal Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Power Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Engineering & Computer Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Physics & Mathematics (AREA)
  • Epoxy Resins (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
JP2010267355A 2010-11-30 2010-11-30 硬化性エポキシ樹脂組成物 Active JP5832740B2 (ja)

Priority Applications (9)

Application Number Priority Date Filing Date Title
JP2010267355A JP5832740B2 (ja) 2010-11-30 2010-11-30 硬化性エポキシ樹脂組成物
MYPI2013001730A MY161591A (en) 2010-11-30 2011-11-09 Curable epoxy resin composition
PCT/JP2011/075816 WO2012073666A1 (ja) 2010-11-30 2011-11-09 硬化性エポキシ樹脂組成物
US13/883,297 US9200133B2 (en) 2010-11-30 2011-11-09 Curable epoxy resin composition
ES11844984T ES2750565T3 (es) 2010-11-30 2011-11-09 Composición de resina epoxi curable
CN201180050239.4A CN103168074B (zh) 2010-11-30 2011-11-09 固化性环氧树脂组合物
KR1020137016598A KR101829948B1 (ko) 2010-11-30 2011-11-09 경화성 에폭시 수지 조성물
EP11844984.2A EP2647667B1 (en) 2010-11-30 2011-11-09 Curable epoxy resin composition
TW100143643A TWI511995B (zh) 2010-11-30 2011-11-29 硬化性環氧樹脂組成物

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2010267355A JP5832740B2 (ja) 2010-11-30 2010-11-30 硬化性エポキシ樹脂組成物

Publications (2)

Publication Number Publication Date
JP2012116935A JP2012116935A (ja) 2012-06-21
JP5832740B2 true JP5832740B2 (ja) 2015-12-16

Family

ID=46171614

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2010267355A Active JP5832740B2 (ja) 2010-11-30 2010-11-30 硬化性エポキシ樹脂組成物

Country Status (9)

Country Link
US (1) US9200133B2 (zh)
EP (1) EP2647667B1 (zh)
JP (1) JP5832740B2 (zh)
KR (1) KR101829948B1 (zh)
CN (1) CN103168074B (zh)
ES (1) ES2750565T3 (zh)
MY (1) MY161591A (zh)
TW (1) TWI511995B (zh)
WO (1) WO2012073666A1 (zh)

Families Citing this family (16)

* Cited by examiner, † Cited by third party
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EP2931822B1 (en) * 2012-12-14 2021-06-23 Blue Cube IP LLC High solids epoxy coatings
US9382472B2 (en) 2013-12-18 2016-07-05 Rohm And Haas Electronic Materials Llc Transformative wavelength conversion medium
US9464224B2 (en) 2013-12-18 2016-10-11 Rohm And Haas Electronic Materials Llc Transformative wavelength conversion medium
EP3112389B1 (en) * 2014-02-28 2019-06-05 Daicel Corporation Curable composition, cured product thereof, and wafer level lens
US10703856B2 (en) * 2014-05-20 2020-07-07 Daicel Corporation Epoxy resin composition and cured product of same
US10737786B2 (en) 2016-05-13 2020-08-11 Bell Helicopter Textron Inc. Distributed propulsion system for vertical take off and landing closed wing aircraft
KR102224073B1 (ko) * 2016-06-28 2021-03-08 도레이 카부시키가이샤 에폭시 수지 조성물, 프리프레그 및 섬유 강화 복합 재료
US11101052B2 (en) * 2016-10-06 2021-08-24 Sekisui Chemical Co., Ltd. Conductive material, connection structure and method for producing connection structure
CN110999537B (zh) * 2017-08-24 2022-08-26 电化株式会社 有机电致发光元件用密封剂
JP6505913B1 (ja) * 2018-05-17 2019-04-24 株式会社Ｔ＆Ｋ Ｔｏｋａ 硬化性エポキシド組成物
JP7220277B2 (ja) 2019-02-21 2023-02-09 デンカ株式会社 組成物
CN113451227B (zh) * 2019-03-06 2022-07-19 西安航思半导体有限公司 高可靠性qfn封装器件结构
WO2021235480A1 (ja) * 2020-05-21 2021-11-25 株式会社ダイセル 回転電機用硬化性エポキシ組成物
JP7068431B2 (ja) * 2020-05-21 2022-05-16 株式会社ダイセル 回転電機用硬化性エポキシ組成物
TWI724932B (zh) * 2020-06-24 2021-04-11 朱宥豪 Led模壓封裝膠及其使用方法(一)
CN115637013B (zh) * 2022-10-31 2024-04-30 深圳伊帕思新材料科技有限公司 双马来酰亚胺组合物、半固化胶片以及铜箔基板

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* Cited by examiner, † Cited by third party
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JPS6126619A (ja) * 1984-07-17 1986-02-05 Daicel Chem Ind Ltd 脂環式エポキシ樹脂配合物
JPH07116284B2 (ja) 1986-02-04 1995-12-13 ダイセル化学工業株式会社 ポリカ−ボネ−トジオ−ルの製造方法
JPH0249025A (ja) 1988-05-26 1990-02-19 Daicel Chem Ind Ltd ポリカーボネートジオール
JP2879685B2 (ja) 1988-09-06 1999-04-05 ダイセル化学工業株式会社 ポリカーボネートジオール
JP3033778B2 (ja) 1989-10-11 2000-04-17 ダイセル化学工業株式会社 ポリカーボネートポリオール
JPH03252420A (ja) 1990-03-01 1991-11-11 Daicel Chem Ind Ltd 共重合ポリカーボネートジオールの製造方法
JP3760391B2 (ja) * 1995-09-01 2006-03-29 ダイセル化学工業株式会社 エポキシ化反応粗液の精製方法
US5756780A (en) 1995-09-01 1998-05-26 Daicel Chemical Industries, Ltd. Process for the preparation of a purified 3,4-epoxycyclohexyl methyl(meth)acrylate and, a stabilized 3,4-epoxycyclohexyl methyl acrylated
JPH09278869A (ja) * 1996-04-17 1997-10-28 Daicel Chem Ind Ltd 硬化性樹脂組成物
JPH1192549A (ja) 1997-09-18 1999-04-06 Sumitomo Durez Kk 液状エポキシ樹脂組成物
JP4663893B2 (ja) 2001-03-23 2011-04-06 ダイセル化学工業株式会社 エポキシ化合物の製造方法
JP3802373B2 (ja) * 2001-06-06 2006-07-26 ソニーケミカル株式会社 潜在性硬化剤、潜在性硬化剤の製造方法及び接着剤
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JP2005330335A (ja) * 2004-05-18 2005-12-02 Nitto Denko Corp 光半導体素子封止用エポキシ樹脂組成物およびそれを用いた光半導体装置
JP5073226B2 (ja) * 2006-05-11 2012-11-14 出光興産株式会社 光拡散性樹脂組成物及びそれを用いた光拡散板
JP2008038017A (ja) * 2006-08-07 2008-02-21 Kyocera Chemical Corp 注形用可撓性エポキシ樹脂組成物および電気・電子部品装置
KR101435410B1 (ko) 2006-10-24 2014-08-29 시바 홀딩 인크 열 안정성 양이온 광경화성 조성물
CN101641616B (zh) * 2007-03-28 2012-04-25 柯尼卡美能达精密光学株式会社 光学用有机无机复合材料及光学元件
CN100547029C (zh) * 2007-04-20 2009-10-07 常熟佳发化学有限责任公司 一种不饱和树脂组合物,及其制备方法和其使用方法
TW200913181A (en) * 2007-07-10 2009-03-16 Arakawa Chem Ind Optical semiconductor-sealing composition
JP5179839B2 (ja) * 2007-11-08 2013-04-10 株式会社ダイセル エポキシ樹脂組成物、及びその硬化物
JP5675230B2 (ja) * 2010-09-03 2015-02-25 株式会社ダイセル 熱硬化性エポキシ樹脂組成物及びその用途

Also Published As

Publication number Publication date
KR101829948B1 (ko) 2018-02-19
EP2647667A1 (en) 2013-10-09
WO2012073666A1 (ja) 2012-06-07
MY161591A (en) 2017-04-28
US20130241086A1 (en) 2013-09-19
EP2647667B1 (en) 2019-09-25
EP2647667A4 (en) 2016-12-28
CN103168074A (zh) 2013-06-19
CN103168074B (zh) 2016-02-10
JP2012116935A (ja) 2012-06-21
US9200133B2 (en) 2015-12-01
KR20130121135A (ko) 2013-11-05
TWI511995B (zh) 2015-12-11
ES2750565T3 (es) 2020-03-26
TW201226429A (en) 2012-07-01

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