JP5750327B2 - めっき装置、めっき処理方法及びめっき装置用基板ホルダの姿勢変換方法 - Google Patents

めっき装置、めっき処理方法及びめっき装置用基板ホルダの姿勢変換方法 Download PDF

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Publication number
JP5750327B2
JP5750327B2 JP2011158484A JP2011158484A JP5750327B2 JP 5750327 B2 JP5750327 B2 JP 5750327B2 JP 2011158484 A JP2011158484 A JP 2011158484A JP 2011158484 A JP2011158484 A JP 2011158484A JP 5750327 B2 JP5750327 B2 JP 5750327B2
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JP
Japan
Prior art keywords
substrate holder
substrate
plating
holding member
holding
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Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
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JP2011158484A
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English (en)
Japanese (ja)
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JP2012107311A (ja
Inventor
吉夫 南
吉夫 南
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ebara Corp
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Ebara Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ebara Corp filed Critical Ebara Corp
Priority to JP2011158484A priority Critical patent/JP5750327B2/ja
Priority to US13/277,466 priority patent/US9728435B2/en
Priority to TW100138033A priority patent/TWI580814B/zh
Priority to SG2012016358A priority patent/SG187305A1/en
Priority to SG10201605875SA priority patent/SG10201605875SA/en
Priority to SG10201605873QA priority patent/SG10201605873QA/en
Priority to KR1020120025532A priority patent/KR101826928B1/ko
Priority to CN201610452990.1A priority patent/CN106149031B/zh
Priority to CN201610453013.3A priority patent/CN106119919B/zh
Priority to CN201210069120.8A priority patent/CN102888647B/zh
Publication of JP2012107311A publication Critical patent/JP2012107311A/ja
Priority to JP2015100985A priority patent/JP6001134B2/ja
Application granted granted Critical
Publication of JP5750327B2 publication Critical patent/JP5750327B2/ja
Priority to US15/630,119 priority patent/US9991145B2/en
Priority to US15/630,130 priority patent/US9984910B2/en
Priority to KR1020180012713A priority patent/KR101853801B1/ko
Priority to KR1020180012715A priority patent/KR101918653B1/ko
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/12—Semiconductors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67775—Docking arrangements

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
JP2011158484A 2010-10-21 2011-07-19 めっき装置、めっき処理方法及びめっき装置用基板ホルダの姿勢変換方法 Expired - Fee Related JP5750327B2 (ja)

Priority Applications (15)

Application Number Priority Date Filing Date Title
JP2011158484A JP5750327B2 (ja) 2010-10-21 2011-07-19 めっき装置、めっき処理方法及びめっき装置用基板ホルダの姿勢変換方法
US13/277,466 US9728435B2 (en) 2010-10-21 2011-10-20 Plating apparatus and plating method
TW100138033A TWI580814B (zh) 2010-10-21 2011-10-20 基板處理裝置，以及鍍覆裝置及鍍覆方法
SG2012016358A SG187305A1 (en) 2011-07-19 2012-03-07 Plating apparatus and plating method
SG10201605875SA SG10201605875SA (en) 2011-07-19 2012-03-07 Plating apparatus and plating method
SG10201605873QA SG10201605873QA (en) 2011-07-19 2012-03-07 Plating apparatus and plating method
KR1020120025532A KR101826928B1 (ko) 2011-07-19 2012-03-13 도금장치, 도금방법, 스토커 및 기판홀더의 애티튜드를 변환하는 방법
CN201610453013.3A CN106119919B (zh) 2010-10-21 2012-03-15 镀敷设备、镀敷方法和转换用于可拆卸地保持基板的基板保持器的姿势的方法
CN201610452990.1A CN106149031B (zh) 2011-07-19 2012-03-15 镀敷设备
CN201210069120.8A CN102888647B (zh) 2010-10-21 2012-03-15 镀敷设备和镀敷方法
JP2015100985A JP6001134B2 (ja) 2010-10-21 2015-05-18 めっき装置
US15/630,119 US9991145B2 (en) 2010-10-21 2017-06-22 Plating apparatus and plating method
US15/630,130 US9984910B2 (en) 2010-10-21 2017-06-22 Plating apparatus and plating method
KR1020180012713A KR101853801B1 (ko) 2011-07-19 2018-02-01 도금장치, 도금방법, 스토커 및 기판홀더의 애티튜드를 변환하는 방법
KR1020180012715A KR101918653B1 (ko) 2011-07-19 2018-02-01 도금장치, 도금방법, 스토커 및 기판홀더의 애티튜드를 변환하는 방법

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2010236524 2010-10-21
JP2010236524 2010-10-21
JP2011158484A JP5750327B2 (ja) 2010-10-21 2011-07-19 めっき装置、めっき処理方法及びめっき装置用基板ホルダの姿勢変換方法

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2015100985A Division JP6001134B2 (ja) 2010-10-21 2015-05-18 めっき装置

Publications (2)

Publication Number Publication Date
JP2012107311A JP2012107311A (ja) 2012-06-07
JP5750327B2 true JP5750327B2 (ja) 2015-07-22

Family

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Family Applications (2)

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JP2011158484A Expired - Fee Related JP5750327B2 (ja) 2010-10-21 2011-07-19 めっき装置、めっき処理方法及びめっき装置用基板ホルダの姿勢変換方法
JP2015100985A Active JP6001134B2 (ja) 2010-10-21 2015-05-18 めっき装置

Family Applications After (1)

Application Number Title Priority Date Filing Date
JP2015100985A Active JP6001134B2 (ja) 2010-10-21 2015-05-18 めっき装置

Country Status (2)

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JP (2) JP5750327B2 (zh)
CN (2) CN102888647B (zh)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6276449B1 (ja) * 2017-03-30 2018-02-07 株式会社荏原製作所 基板処理装置、基板処理装置の制御方法、プログラムを格納した記憶媒体
US10991605B2 (en) 2017-12-13 2021-04-27 Ebara Corporation Substrate processing device, method for controlling substrate processing device, and storage medium storing a program

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US9859141B2 (en) * 2010-04-15 2018-01-02 Suss Microtec Lithography Gmbh Apparatus and method for aligning and centering wafers
JP6077886B2 (ja) * 2013-03-04 2017-02-08 株式会社荏原製作所 めっき装置
JP6247557B2 (ja) * 2014-02-14 2017-12-13 株式会社Ｊｃｕ 基板めっき治具
JP6251124B2 (ja) * 2014-06-09 2017-12-20 株式会社荏原製作所 基板ホルダ用の基板着脱部及びこれを備えた湿式基板処理装置
CN106471162B (zh) * 2014-06-26 2018-09-25 株式会社村田制作所 电镀用夹具
JP6607517B2 (ja) * 2015-07-15 2019-11-20 日新イオン機器株式会社 イオンビーム照射装置
JP6675257B2 (ja) * 2016-04-14 2020-04-01 株式会社荏原製作所 めっき装置及びめっき方法
JP6659467B2 (ja) * 2016-06-03 2020-03-04 株式会社荏原製作所 めっき装置、基板ホルダ、めっき装置の制御方法、及び、めっき装置の制御方法をコンピュータに実行させるためのプログラムを格納した記憶媒体
JP6695750B2 (ja) * 2016-07-04 2020-05-20 株式会社荏原製作所 基板ホルダの検査装置、これを備えためっき装置、及び外観検査装置
JP6723889B2 (ja) * 2016-09-28 2020-07-15 株式会社荏原製作所 めっき装置
JP6727117B2 (ja) * 2016-12-22 2020-07-22 株式会社荏原製作所 基板着脱装置、めっき装置、基板着脱装置の制御装置、基板着脱装置の制御方法をコンピュータに実行させるためのプログラムを格納した記憶媒体
CN108657818B (zh) * 2017-03-31 2024-04-26 可能可特科技（深圳）有限公司 一种基于fpc电镀的搬运装置
JP6971922B2 (ja) * 2018-06-27 2021-11-24 株式会社荏原製作所 基板ホルダ
JP7234345B2 (ja) * 2018-08-23 2023-03-07 エーエスエムエル ネザーランズ ビー．ブイ． ステージ装置および物体搭載プロセスの較正方法
JP7100556B2 (ja) 2018-10-05 2022-07-13 株式会社荏原製作所 基板ホルダに基板を保持させるためおよび／又は基板ホルダによる基板の保持を解除するための装置、および同装置を有するめっき装置
CN111074230A (zh) * 2018-10-19 2020-04-28 东泰高科装备科技有限公司 镀膜均匀性在线检测装置、检测方法及镀膜设备
JP7058209B2 (ja) 2018-11-21 2022-04-21 株式会社荏原製作所 基板ホルダに基板を保持させる方法
JP7421340B2 (ja) * 2020-01-06 2024-01-24 株式会社荏原製作所 基板処理装置、および基板処理方法
CN111074211A (zh) * 2020-01-15 2020-04-28 苏州东福来机电科技有限公司 一种电镀银设备
CN112259493A (zh) * 2020-10-19 2021-01-22 绍兴同芯成集成电路有限公司 一种超薄晶圆电镀、化镀整合工艺
CN115365083B (zh) * 2021-05-17 2024-06-11 亨泰光学股份有限公司 双向阳极电浆化学气相沉积镀膜设备
CN115094503B (zh) * 2022-07-21 2023-10-03 北京浦丹光电股份有限公司 一种带动芯片电镀的自动移动装置

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JPH0723556B2 (ja) * 1988-04-23 1995-03-15 富士通株式会社 基板の枠付めっき治具へのローディング装置
JPH0723557B2 (ja) * 1988-04-25 1995-03-15 富士通株式会社 基板の自動ローディング装置
JPH07245332A (ja) * 1994-03-04 1995-09-19 Hitachi Ltd 半導体製造装置および半導体装置の製造方法ならびに半導体装置
JPH11255321A (ja) * 1998-03-11 1999-09-21 Shinko Electric Co Ltd 手押し台車
JP2002363794A (ja) * 2001-06-01 2002-12-18 Ebara Corp 基板ホルダ及びめっき装置
US6558750B2 (en) * 2001-07-16 2003-05-06 Technic Inc. Method of processing and plating planar articles
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JP4124327B2 (ja) * 2002-06-21 2008-07-23 株式会社荏原製作所 基板ホルダ及びめっき装置
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JP3778282B2 (ja) * 2002-07-15 2006-05-24 株式会社荏原製作所 基板ホルダ及びめっき装置
JP2004353004A (ja) * 2003-05-27 2004-12-16 Ebara Corp めっき装置
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WO2010054677A1 (en) * 2008-11-14 2010-05-20 Replisaurus Technologies Inc. A system for plating a conductive substrate, and a substrate holder for holding a conductive substrate during plating thereof

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6276449B1 (ja) * 2017-03-30 2018-02-07 株式会社荏原製作所 基板処理装置、基板処理装置の制御方法、プログラムを格納した記憶媒体
JP2018168432A (ja) * 2017-03-30 2018-11-01 株式会社荏原製作所 基板処理装置、基板処理装置の制御方法、プログラムを格納した記憶媒体
US10163672B2 (en) 2017-03-30 2018-12-25 Ebara Corporation Substrate processing device, method for controlling substrate processing device, and storage medium storing programs
US10991605B2 (en) 2017-12-13 2021-04-27 Ebara Corporation Substrate processing device, method for controlling substrate processing device, and storage medium storing a program

Also Published As

Publication number Publication date
CN106119919B (zh) 2017-06-27
CN102888647B (zh) 2016-08-03
CN102888647A (zh) 2013-01-23
CN106119919A (zh) 2016-11-16
JP2015187306A (ja) 2015-10-29
JP2012107311A (ja) 2012-06-07
JP6001134B2 (ja) 2016-10-05

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