JP5750327B2 - めっき装置、めっき処理方法及びめっき装置用基板ホルダの姿勢変換方法 - Google Patents
めっき装置、めっき処理方法及びめっき装置用基板ホルダの姿勢変換方法 Download PDFInfo
- Publication number
- JP5750327B2 JP5750327B2 JP2011158484A JP2011158484A JP5750327B2 JP 5750327 B2 JP5750327 B2 JP 5750327B2 JP 2011158484 A JP2011158484 A JP 2011158484A JP 2011158484 A JP2011158484 A JP 2011158484A JP 5750327 B2 JP5750327 B2 JP 5750327B2
- Authority
- JP
- Japan
- Prior art keywords
- substrate holder
- substrate
- plating
- holding member
- holding
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D7/00—Electroplating characterised by the article coated
- C25D7/12—Semiconductors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67775—Docking arrangements
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Manufacturing & Machinery (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electroplating Methods And Accessories (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Priority Applications (15)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2011158484A JP5750327B2 (ja) | 2010-10-21 | 2011-07-19 | めっき装置、めっき処理方法及びめっき装置用基板ホルダの姿勢変換方法 |
US13/277,466 US9728435B2 (en) | 2010-10-21 | 2011-10-20 | Plating apparatus and plating method |
TW100138033A TWI580814B (zh) | 2010-10-21 | 2011-10-20 | 基板處理裝置,以及鍍覆裝置及鍍覆方法 |
SG2012016358A SG187305A1 (en) | 2011-07-19 | 2012-03-07 | Plating apparatus and plating method |
SG10201605875SA SG10201605875SA (en) | 2011-07-19 | 2012-03-07 | Plating apparatus and plating method |
SG10201605873QA SG10201605873QA (en) | 2011-07-19 | 2012-03-07 | Plating apparatus and plating method |
KR1020120025532A KR101826928B1 (ko) | 2011-07-19 | 2012-03-13 | 도금장치, 도금방법, 스토커 및 기판홀더의 애티튜드를 변환하는 방법 |
CN201610453013.3A CN106119919B (zh) | 2010-10-21 | 2012-03-15 | 镀敷设备、镀敷方法和转换用于可拆卸地保持基板的基板保持器的姿势的方法 |
CN201610452990.1A CN106149031B (zh) | 2011-07-19 | 2012-03-15 | 镀敷设备 |
CN201210069120.8A CN102888647B (zh) | 2010-10-21 | 2012-03-15 | 镀敷设备和镀敷方法 |
JP2015100985A JP6001134B2 (ja) | 2010-10-21 | 2015-05-18 | めっき装置 |
US15/630,119 US9991145B2 (en) | 2010-10-21 | 2017-06-22 | Plating apparatus and plating method |
US15/630,130 US9984910B2 (en) | 2010-10-21 | 2017-06-22 | Plating apparatus and plating method |
KR1020180012713A KR101853801B1 (ko) | 2011-07-19 | 2018-02-01 | 도금장치, 도금방법, 스토커 및 기판홀더의 애티튜드를 변환하는 방법 |
KR1020180012715A KR101918653B1 (ko) | 2011-07-19 | 2018-02-01 | 도금장치, 도금방법, 스토커 및 기판홀더의 애티튜드를 변환하는 방법 |
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2010236524 | 2010-10-21 | ||
JP2010236524 | 2010-10-21 | ||
JP2011158484A JP5750327B2 (ja) | 2010-10-21 | 2011-07-19 | めっき装置、めっき処理方法及びめっき装置用基板ホルダの姿勢変換方法 |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2015100985A Division JP6001134B2 (ja) | 2010-10-21 | 2015-05-18 | めっき装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2012107311A JP2012107311A (ja) | 2012-06-07 |
JP5750327B2 true JP5750327B2 (ja) | 2015-07-22 |
Family
ID=57528775
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2011158484A Expired - Fee Related JP5750327B2 (ja) | 2010-10-21 | 2011-07-19 | めっき装置、めっき処理方法及びめっき装置用基板ホルダの姿勢変換方法 |
JP2015100985A Active JP6001134B2 (ja) | 2010-10-21 | 2015-05-18 | めっき装置 |
Family Applications After (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2015100985A Active JP6001134B2 (ja) | 2010-10-21 | 2015-05-18 | めっき装置 |
Country Status (2)
Country | Link |
---|---|
JP (2) | JP5750327B2 (zh) |
CN (2) | CN102888647B (zh) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6276449B1 (ja) * | 2017-03-30 | 2018-02-07 | 株式会社荏原製作所 | 基板処理装置、基板処理装置の制御方法、プログラムを格納した記憶媒体 |
US10991605B2 (en) | 2017-12-13 | 2021-04-27 | Ebara Corporation | Substrate processing device, method for controlling substrate processing device, and storage medium storing a program |
Families Citing this family (22)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US9859141B2 (en) * | 2010-04-15 | 2018-01-02 | Suss Microtec Lithography Gmbh | Apparatus and method for aligning and centering wafers |
JP6077886B2 (ja) * | 2013-03-04 | 2017-02-08 | 株式会社荏原製作所 | めっき装置 |
JP6247557B2 (ja) * | 2014-02-14 | 2017-12-13 | 株式会社Jcu | 基板めっき治具 |
JP6251124B2 (ja) * | 2014-06-09 | 2017-12-20 | 株式会社荏原製作所 | 基板ホルダ用の基板着脱部及びこれを備えた湿式基板処理装置 |
CN106471162B (zh) * | 2014-06-26 | 2018-09-25 | 株式会社村田制作所 | 电镀用夹具 |
JP6607517B2 (ja) * | 2015-07-15 | 2019-11-20 | 日新イオン機器株式会社 | イオンビーム照射装置 |
JP6675257B2 (ja) * | 2016-04-14 | 2020-04-01 | 株式会社荏原製作所 | めっき装置及びめっき方法 |
JP6659467B2 (ja) * | 2016-06-03 | 2020-03-04 | 株式会社荏原製作所 | めっき装置、基板ホルダ、めっき装置の制御方法、及び、めっき装置の制御方法をコンピュータに実行させるためのプログラムを格納した記憶媒体 |
JP6695750B2 (ja) * | 2016-07-04 | 2020-05-20 | 株式会社荏原製作所 | 基板ホルダの検査装置、これを備えためっき装置、及び外観検査装置 |
JP6723889B2 (ja) * | 2016-09-28 | 2020-07-15 | 株式会社荏原製作所 | めっき装置 |
JP6727117B2 (ja) * | 2016-12-22 | 2020-07-22 | 株式会社荏原製作所 | 基板着脱装置、めっき装置、基板着脱装置の制御装置、基板着脱装置の制御方法をコンピュータに実行させるためのプログラムを格納した記憶媒体 |
CN108657818B (zh) * | 2017-03-31 | 2024-04-26 | 可能可特科技(深圳)有限公司 | 一种基于fpc电镀的搬运装置 |
JP6971922B2 (ja) * | 2018-06-27 | 2021-11-24 | 株式会社荏原製作所 | 基板ホルダ |
JP7234345B2 (ja) * | 2018-08-23 | 2023-03-07 | エーエスエムエル ネザーランズ ビー.ブイ. | ステージ装置および物体搭載プロセスの較正方法 |
JP7100556B2 (ja) | 2018-10-05 | 2022-07-13 | 株式会社荏原製作所 | 基板ホルダに基板を保持させるためおよび/又は基板ホルダによる基板の保持を解除するための装置、および同装置を有するめっき装置 |
CN111074230A (zh) * | 2018-10-19 | 2020-04-28 | 东泰高科装备科技有限公司 | 镀膜均匀性在线检测装置、检测方法及镀膜设备 |
JP7058209B2 (ja) | 2018-11-21 | 2022-04-21 | 株式会社荏原製作所 | 基板ホルダに基板を保持させる方法 |
JP7421340B2 (ja) * | 2020-01-06 | 2024-01-24 | 株式会社荏原製作所 | 基板処理装置、および基板処理方法 |
CN111074211A (zh) * | 2020-01-15 | 2020-04-28 | 苏州东福来机电科技有限公司 | 一种电镀银设备 |
CN112259493A (zh) * | 2020-10-19 | 2021-01-22 | 绍兴同芯成集成电路有限公司 | 一种超薄晶圆电镀、化镀整合工艺 |
CN115365083B (zh) * | 2021-05-17 | 2024-06-11 | 亨泰光学股份有限公司 | 双向阳极电浆化学气相沉积镀膜设备 |
CN115094503B (zh) * | 2022-07-21 | 2023-10-03 | 北京浦丹光电股份有限公司 | 一种带动芯片电镀的自动移动装置 |
Family Cites Families (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE2636413A1 (de) * | 1976-08-12 | 1978-02-16 | Schering Ag | Vorrichtung zum vollstaendigen und partiellen behandeln der oberflaechen von teilen |
JPH0723556B2 (ja) * | 1988-04-23 | 1995-03-15 | 富士通株式会社 | 基板の枠付めっき治具へのローディング装置 |
JPH0723557B2 (ja) * | 1988-04-25 | 1995-03-15 | 富士通株式会社 | 基板の自動ローディング装置 |
JPH07245332A (ja) * | 1994-03-04 | 1995-09-19 | Hitachi Ltd | 半導体製造装置および半導体装置の製造方法ならびに半導体装置 |
JPH11255321A (ja) * | 1998-03-11 | 1999-09-21 | Shinko Electric Co Ltd | 手押し台車 |
JP2002363794A (ja) * | 2001-06-01 | 2002-12-18 | Ebara Corp | 基板ホルダ及びめっき装置 |
US6558750B2 (en) * | 2001-07-16 | 2003-05-06 | Technic Inc. | Method of processing and plating planar articles |
JP2003243473A (ja) * | 2002-02-15 | 2003-08-29 | Nec Electronics Corp | 半導体基板用キャリアの搬送台車 |
JP4124327B2 (ja) * | 2002-06-21 | 2008-07-23 | 株式会社荏原製作所 | 基板ホルダ及びめっき装置 |
JP4162440B2 (ja) * | 2002-07-22 | 2008-10-08 | 株式会社荏原製作所 | 基板ホルダ及びめっき装置 |
JP3778282B2 (ja) * | 2002-07-15 | 2006-05-24 | 株式会社荏原製作所 | 基板ホルダ及びめっき装置 |
JP2004353004A (ja) * | 2003-05-27 | 2004-12-16 | Ebara Corp | めっき装置 |
JP2006117966A (ja) * | 2004-10-19 | 2006-05-11 | Ebara Corp | めっき装置及びめっき方法 |
WO2010054677A1 (en) * | 2008-11-14 | 2010-05-20 | Replisaurus Technologies Inc. | A system for plating a conductive substrate, and a substrate holder for holding a conductive substrate during plating thereof |
-
2011
- 2011-07-19 JP JP2011158484A patent/JP5750327B2/ja not_active Expired - Fee Related
-
2012
- 2012-03-15 CN CN201210069120.8A patent/CN102888647B/zh not_active Expired - Fee Related
- 2012-03-15 CN CN201610453013.3A patent/CN106119919B/zh not_active Expired - Fee Related
-
2015
- 2015-05-18 JP JP2015100985A patent/JP6001134B2/ja active Active
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6276449B1 (ja) * | 2017-03-30 | 2018-02-07 | 株式会社荏原製作所 | 基板処理装置、基板処理装置の制御方法、プログラムを格納した記憶媒体 |
JP2018168432A (ja) * | 2017-03-30 | 2018-11-01 | 株式会社荏原製作所 | 基板処理装置、基板処理装置の制御方法、プログラムを格納した記憶媒体 |
US10163672B2 (en) | 2017-03-30 | 2018-12-25 | Ebara Corporation | Substrate processing device, method for controlling substrate processing device, and storage medium storing programs |
US10991605B2 (en) | 2017-12-13 | 2021-04-27 | Ebara Corporation | Substrate processing device, method for controlling substrate processing device, and storage medium storing a program |
Also Published As
Publication number | Publication date |
---|---|
CN106119919B (zh) | 2017-06-27 |
CN102888647B (zh) | 2016-08-03 |
CN102888647A (zh) | 2013-01-23 |
CN106119919A (zh) | 2016-11-16 |
JP2015187306A (ja) | 2015-10-29 |
JP2012107311A (ja) | 2012-06-07 |
JP6001134B2 (ja) | 2016-10-05 |
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