JP5702785B2 - ガラス基板のレーザ切断方法 - Google Patents
ガラス基板のレーザ切断方法 Download PDFInfo
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- JP5702785B2 JP5702785B2 JP2012527001A JP2012527001A JP5702785B2 JP 5702785 B2 JP5702785 B2 JP 5702785B2 JP 2012527001 A JP2012527001 A JP 2012527001A JP 2012527001 A JP2012527001 A JP 2012527001A JP 5702785 B2 JP5702785 B2 JP 5702785B2
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- laser beam
- glass substrate
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-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/07—Cutting armoured, multi-layered, coated or laminated, glass products
- C03B33/072—Armoured glass, i.e. comprising reinforcement
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/40—Removing material taking account of the properties of the material involved
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
- C03B33/0222—Scoring using a focussed radiation beam, e.g. laser
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
- C03B33/023—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/09—Severing cooled glass by thermal shock
- C03B33/091—Severing cooled glass by thermal shock using at least one focussed radiation beam, e.g. laser beam
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/09—Severing cooled glass by thermal shock
- C03B33/091—Severing cooled glass by thermal shock using at least one focussed radiation beam, e.g. laser beam
- C03B33/093—Severing cooled glass by thermal shock using at least one focussed radiation beam, e.g. laser beam using two or more focussed radiation beams
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C23/00—Other surface treatment of glass not in the form of fibres or filaments
- C03C23/0005—Other surface treatment of glass not in the form of fibres or filaments by irradiation
- C03C23/0025—Other surface treatment of glass not in the form of fibres or filaments by irradiation by a laser beam
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P40/00—Technologies relating to the processing of minerals
- Y02P40/50—Glass production, e.g. reusing waste heat during processing or shaping
- Y02P40/57—Improving the yield, e-g- reduction of reject rates
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Toxicology (AREA)
- Thermal Sciences (AREA)
- Mechanical Engineering (AREA)
- Plasma & Fusion (AREA)
- Life Sciences & Earth Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Geochemistry & Mineralogy (AREA)
- Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
- Laser Beam Processing (AREA)
- Processing Of Stones Or Stones Resemblance Materials (AREA)
Description
106 レーザ走査器
108 レーザビーム
109b〜109d ビームスポット
110 ガラス基板
111、113 エッジ
112 エッジ傷
116 切断ライン
117 第1表面
140 貫通割れ目
150 ガラス物品
Claims (8)
- 表面圧縮層と引張層とを含む強化ガラス基板からガラス物品を切断する方法であって、
前記ガラス物品と前記強化ガラス基板との間の切断ラインの全長に沿って前記表面圧縮層上に入射するレーザビームを、前記切断ラインの全長に沿って存在する引張応力場を生成し、貫通割れ目が該切断ラインに沿って伝播するように、走査させるステップを含み、
前記レーザビームを、前記強化ガラス基板に対する該レーザビームの入射角が垂直であるときに、基準走査速度で走査させ、かつ、
前記レーザビームを前記切断ラインに沿って走査させるにつれ、該走査レーザビームの入射角が増加するのにしたがって、前記レーザビームを前記基準走査速度から低下させた減速する走査速度で走査させることを特徴とする方法。 - 前記強化ガラス基板の第1エッジにエッジ傷を形成するステップをさらに含み、前記貫通割れ目が該エッジ傷の位置で開始したものであり、かつ前記貫通割れ目が、前記ガラス物品と前記強化ガラス基板との間の前記切断ラインに沿って、分離部を先導することを特徴とする請求項1記載の方法。
- 表面圧縮層と引張層とを含む強化ガラス基板を切断する方法において、
エッジ傷を、前記強化ガラス基板の前記表面圧縮層上に、前記強化ガラス基板の第1エッジから前記強化ガラス基板の第2エッジに延びる切断ライン上に位置付けて、形成するステップ、
レーザビームを前記切断ラインの全長に沿って前後に走査させるステップ、および
前記レーザビームを前記切断ラインの全長に沿って一定時間前後に走査させた後、前記レーザビームを前記エッジ傷上で短縮走査ラインに沿って走査させるステップ、
を含むことを特徴とする方法。 - 前記レーザビームを、前記強化ガラス基板に対する該レーザビームの入射角が垂直であるときに、基準走査速度で走査させ、かつ、
前記レーザビームを前記切断ラインに沿って走査させるにつれ、該走査レーザビームの入射角が増加するのにしたがって、前記レーザビームを前記基準走査速度から低下させた減速する走査速度で走査させることを特徴とする請求項3記載の方法。 - 前記レーザビームを走査させるステップが、前記切断ラインに沿って走査レーザラインを生成するものであり、該走査レーザラインの長さが、おおよそ前記切断ラインの長さ以上であることを特徴とする請求項1または3記載の方法。
- 前記レーザビームを前記切断ラインの全長に沿って一定時間前後に走査させた後に前記レーザビームを前記エッジ傷上に短縮走査ラインに沿って前後に走査させるステップをさらに含むことを特徴とする請求項2記載の方法。
- 前記レーザビームが、前記切断ラインと位置合わせされる主軸を有する楕円ビームスポットを前記強化ガラス基板上に照射するように、前記レーザビームを成形するステップをさらに含むことを特徴とする請求項1または3記載の方法。
- 一定時間後に前記走査レーザビームを停止させるステップ、および、
前記走査レーザビームを停止させた後に前記エッジ傷にウォータージェットを適用して、前記切断ラインに沿って貫通割れ目を生じさせるステップ、
をさらに含むことを特徴とする請求項2または3記載の方法。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US23772809P | 2009-08-28 | 2009-08-28 | |
US61/237,728 | 2009-08-28 | ||
PCT/US2010/046885 WO2011025903A1 (en) | 2009-08-28 | 2010-08-27 | Methods for laser cutting glass substrates |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2013503104A JP2013503104A (ja) | 2013-01-31 |
JP5702785B2 true JP5702785B2 (ja) | 2015-04-15 |
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Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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JP2012527001A Expired - Fee Related JP5702785B2 (ja) | 2009-08-28 | 2010-08-27 | ガラス基板のレーザ切断方法 |
Country Status (7)
Country | Link |
---|---|
US (2) | US8932510B2 (ja) |
EP (1) | EP2470326B1 (ja) |
JP (1) | JP5702785B2 (ja) |
KR (1) | KR101718569B1 (ja) |
CN (1) | CN102574246B (ja) |
TW (1) | TWI490179B (ja) |
WO (1) | WO2011025903A1 (ja) |
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US20110049765A1 (en) | 2011-03-03 |
TW201129514A (en) | 2011-09-01 |
KR101718569B1 (ko) | 2017-03-21 |
KR20120064091A (ko) | 2012-06-18 |
CN102574246B (zh) | 2015-04-01 |
TWI490179B (zh) | 2015-07-01 |
EP2470326B1 (en) | 2016-12-28 |
CN102574246A (zh) | 2012-07-11 |
US20150096329A1 (en) | 2015-04-09 |
EP2470326A1 (en) | 2012-07-04 |
US8932510B2 (en) | 2015-01-13 |
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