TW592867B

TW592867B - An apparatus and a method for scribing brittle substrates

Info

Publication number: TW592867B
Application number: TW091112647A
Authority: TW
Inventors: Haruo Wakayama
Original assignee: Mitsuboshi Diamond Ind Co Ltd
Priority date: 2001-06-11
Filing date: 2002-06-11
Publication date: 2004-06-21
Also published as: WO2002100620B1; WO2002100620A1

Abstract

A region on a surface of the glass substrate 50 in which a scribing line is to be formed is continuously irradiated and heated with a laser spot at a temperature lower than the softening point of the glass substrate 50. At the same time, a region in the vicinity of the laser spot is continuously cooled with cooling water sprayed from a cooling nozzle 37. Thereby, a blind crack is formed along an intended scribing line. An image pickup mechanism 40 picks up an image of a region in which the blind crack is formed and which is close to the region on the surface of the glass substrate to which the cooling water is sprayed, and based on obtained image data, observes that the blind crack is formed.

Description

592867 A7 _ B7 五、發明説明（彳）技術領域本發明關於應用在畫線脆性基板之畫線裝置及畫線方法，例如使用在平板顯示器（以下稱之FPD)及半導體晶圓的一種破璃基板。背景技藝一種FPD，其中將一對玻璃基板結合在一起，其係由結合一對母玻璃所製造，其每個對於另一個而言具有一較大的尺寸，然後分割該對母玻璃成為具有一預定尺寸之片段。刻畫線係在分割該母玻璃之前由一畫線器在該母玻璃上形成。近年來，使用雷射光束來形成刻畫線的方法已經實際在應用。對於使用雷射光束來在一玻璃基板上形成刻畫線的方法中，如圖6所示，一雷射基板50係由來自一雷射振盪裝置61的雷射光束來照射《由該雷射振盪裝置61所放射的雷射光束沿者该玻璃基板50上所要的刻畫線來形成一擴圓形雷射光點LS。該玻璃基板50及由該雷射振盪裝置61所放射的^射光束係在該雷射光點的縱向方向上彼此相對而移動。再者’ 一種冷卻媒體，例如冷卻水，其由冷卻喷嘴62來噴灑在該玻璃基板50的表面上照射該雷射光束的區域附近 ’藉以形成一刻畫線。在照射該雷射光束的該玻璃基板的表面上，由於該雷射光束的加熱而產生壓縮應力，而在該下游區域，由喷灑該冷卻媒體會產生拉伸應力^因此，由於在接近產生壓縮應力的其它區域的區域中產生拉伸應力 -4- 本紙張尺度適用中國國家標準(CNS) A4規格(210X 297公釐）592867 A7 _ B7 V. Description of the invention (ii) TECHNICAL FIELD The present invention relates to a line drawing device and a line drawing method for drawing a fragile substrate, for example, a broken glass used in a flat panel display (hereinafter referred to as FPD) and a semiconductor wafer. Substrate. BACKGROUND ART An FPD in which a pair of glass substrates are bonded together is manufactured by bonding a pair of mother glass, each of which has a larger size for the other, and then the pair of mother glass is divided into a glass having a Fragments of a predetermined size. The scribed lines are formed on the mother glass by a line drawing device before the mother glass is divided. In recent years, the method of using laser beams to form scribed lines has been practically applied. In the method of using a laser beam to form a scribe line on a glass substrate, as shown in FIG. 6, a laser substrate 50 is irradiated with a laser beam from a laser oscillation device 61. The laser beam emitted by the device 61 follows a desired scribe line on the glass substrate 50 to form an expanded circular laser light spot LS. The glass substrate 50 and the laser beam emitted from the laser oscillation device 61 are moved relative to each other in the longitudinal direction of the laser light spot. Furthermore, a cooling medium, such as cooling water, is sprayed by a cooling nozzle 62 on the surface of the glass substrate 50 near the area where the laser beam is irradiated, thereby forming a scribed line. On the surface of the glass substrate radiating the laser beam, compressive stress is generated due to the heating of the laser beam, and in the downstream region, tensile stress is generated by spraying the cooling medium ^. Tensile stress is generated in the area of other areas of compressive stress -4- This paper size applies to China National Standard (CNS) A4 specification (210X 297 mm)

裝訂Binding

線 592867 A7 B7 五、發明説明（2 ) ，基於每個應力的一應力梯度即產生在這些區域之間，所以在該玻璃基板50上，由該玻璃基板50的末端部份所形成的切口沿著所想要的刻畫線即產生一裂縫。因為藉此形成在該玻璃基板50的表面中的裂缝很微小，該裂缝通常肉眼無法觀察到，其稱之為盲裂缝BC。當該盲裂缝BC做為一刻畫線而形成在該玻璃基板50中，該玻璃基板50係送入到下一個分割步驟，並施加一力量在該玻璃基板上，所以一彎曲力矩即作用在該盲裂缝BC的寬度方向上。藉此，該玻璃基板50即沿著做為一刻畫線的該盲裂缝BC而分離。在這種畫線裝置中，當設定條件時，例如每單位面積之雷射光束的照射能量所加熱，並由一冷卻媒禮所冷卻，及該雷射光束及該玻璃基板之間的相對運動速率等，並不適當時，該盲裂缝BC將無法正常地形成。如果該玻璃基板50 送入到下一個分割步驟，而未正常地形成該盲裂缝在該玻璃基板50上，該玻璃基板50即不會沿著該盲裂缝BC分離，所以會損壞該玻璃基板50。因此，當該玻璃基板50在該分割步驟中受損，該玻璃基板50即不能做為FPD的組件，所以即影響了成本效率，並降低了 FPD的生產效率。再者，該玻璃基板50的損壞亦會損壞到用以分割該玻璃基板5〇的裝置本身。因此’其有需要一種畫線裝置來確認該盲裂缝BC係確定地形成在該破璃基板50中。但是，形成在玻璃基板5〇中的盲裂縫BC通常肉眼無法觀察到，因為該玻璃基板5〇的形狀 * S - 本紙張尺度適用中國國家標準(CNS) A4規格(210 X 297公釐)- 裝Line 592867 A7 B7 V. Description of the invention (2), a stress gradient based on each stress is generated between these regions, so on the glass substrate 50, a cut edge formed by the end portion of the glass substrate 50 A crack is created by the desired characterization line. Since the crack formed in the surface of the glass substrate 50 is thus minute, the crack is usually invisible to the naked eye, and is called a blind crack BC. When the blind crack BC is formed in the glass substrate 50 as a scribed line, the glass substrate 50 is sent to the next division step and a force is applied to the glass substrate, so a bending moment acts on the The width of the blind crack BC. Thereby, the glass substrate 50 is separated along the blind crack BC as a scribed line. In such a line drawing device, when conditions are set, for example, the irradiation energy of a laser beam per unit area is heated and cooled by a cooling medium, and the relative movement between the laser beam and the glass substrate If the velocity or the like is not appropriate, the blind crack BC will not form normally. If the glass substrate 50 is sent to the next division step, and the blind crack is not formed on the glass substrate 50 normally, the glass substrate 50 will not be separated along the blind crack BC, so the glass substrate 50 will be damaged. . Therefore, when the glass substrate 50 is damaged in the dividing step, the glass substrate 50 cannot be used as a component of the FPD, which affects cost efficiency and reduces FPD production efficiency. Furthermore, the damage of the glass substrate 50 will also damage the device itself for dividing the glass substrate 50. Therefore, there is a need for a line drawing device to confirm that the blind crack BC system is definitely formed in the broken glass substrate 50. However, the blind cracks BC formed in the glass substrate 50 are usually not visible to the naked eye, because the shape of the glass substrate 50 * S-This paper size applies the Chinese National Standard (CNS) A4 specification (210 X 297 mm)- Hold

訂Order

線 592867 A7 B7 五'發明説明（3 變化非常微小。因此，其問題在於，在該畫線裝置中不容易觀察到該盲裂縫BC的形成。再者，因為由雷射所放出的紅外光或類似者會傷害眼晴，由安全性的觀點，在畫線中的雷射照射期間，利用肉眼來觀察盲裂缝的形成會有問題。本發明即可解決上述的問題。本發明的目的在於提供可以可靠地分割一脆性基板之畫線裝置及畫線方法，其中在該脆性基板的表面上形成一盲裂縫的狀態，例如一玻璃基板’其可在一監視螢幕上可靠地觀察到，而該形成的程度即由影像處理技術來轉換成數值，或與正常形成的一盲裂縫的影像資料相比較，以自動地決定是否正常地形成一盲裂縫，藉此使其可能來在一分離步驟中可靠地分割該脆性基板。發明揭示根據本發明所揭示的一種畫線一脆性基板的裝置，其中藉由在低於該脆性基板的軟化點之下的溫度，沿著所要的刻畫線來連續地加熱該脆性基板，以沿著該脆性基板的表面上所想要的刻畫線來形成一盲裂缝，並在該加熱的區域附近的區域中連續地冷卻，其包含影像拾取裝置，用以在形成有盲裂縫的區域中來拾取一影像，該區域係接近於該脆性基板的表面上的冷卻的區域，並基於由該影像拾取裝置所得到的影像資料來觀察該盲裂缝的形成之影像處理裝置。Line 592867 A7 B7 5 'invention description (3 change is very small. Therefore, the problem is that the formation of the blind crack BC is not easy to observe in the line drawing device. Furthermore, because the infrared light emitted by the laser or The similar can hurt the eyes. From the viewpoint of safety, it is problematic to observe the formation of blind cracks with the naked eye during the laser irradiation in the line drawing. The present invention can solve the above problems. The object of the present invention is to provide A line drawing device and a line drawing method capable of reliably dividing a brittle substrate, in which a state of a blind crack is formed on the surface of the brittle substrate, such as a glass substrate which can be reliably observed on a monitoring screen, and the The degree of formation is converted into a value by image processing technology or compared with the image data of a blind crack that is normally formed to automatically determine whether a blind crack is normally formed, thereby making it possible to use it in a separation step The fragile substrate is reliably divided. The invention discloses a device for drawing a line and a fragile substrate according to the present invention, wherein The temperature below the softening point of the continuous heating of the brittle substrate along the desired scribe line to form a blind crack along the desired scribe line on the surface of the brittle substrate, and near the heated area The area is continuously cooled and includes an image pickup device for picking up an image in an area where a blind crack is formed. The area is close to the cooled area on the surface of the fragile substrate and is based on the image pickup by the image. An image processing device for observing the formation of the blind crack by image data obtained by the device.

該影像拾取裝置的影像拾取區域係由考慮所使用的CCD -6- 本纸張尺度適用中國國家標準(CNS) A4規格(210X297公釐）装The image pickup area of this image pickup device is based on the CCD -6- size of this paper. This paper size is applicable to China National Standard (CNS) A4 (210X297 mm).

訂Order

線 592867 A7 __ B7 五、發明説明（4~"~ 裝置（解析度、所要偵測的物件大小，及由光線照射之偵測條件來決定。因此，當為了改進偵測靈敏度所需要在一寬廣範圍中拾取較高解析度的影像，即需要包含一高解析度影像拾取裝置的一影像處理裝置，及具有對於所得到之資料的大容量之記憶體區域。當其有需要一想要的影像拾取範圍，及關於圖樣匹配的匹配程度所需要的臨界值，即可由使用者在一監視器的蝥幕上肉眼觀視的操作條件來決定，並需要根據該操作條件來改變，並加入可以改變這些設定資料（該補捉範圍、該臨界值及類似者）的用於操作影像處理之軟體。在該影像處理裝置中，用於正常形成有一盲裂缝的狀態之影像資料即可事先儲存。該影像處理裝置可比較該儲存的影像資料及由該影像拾取裝置所得到的影像資料，例如使用一圖樣匹配方法。正常形成一盲裂缝係自動辨識，其係由決定該儲存的與量測的資料之間的比較之匹配程度是否超過某個設定值（臨界值）。在該影像處理裝置中的硬體及軟體配置係設計成使得這種臨界值可根據所要測試的物體之狀況而改變（例如干擾光線及照射一測試區域的照明強度）。根據本發明的一種畫線一脆性基板的裝置，其中藉由在低於該脆性基板的軟化點之下的溫度，沿著所要的刻畫線來連續地加熱該脆性基板，以沿著該脆性基板的表面上所想要的刻畫線來形成一盲裂缝，並在該加熱的區域附近的區域中連績地冷卻，及其中形成有該盲裂縫之區域的影像本紙張尺度適用中國國家標準(CNS) A4規格(210 X 297公釐)Line 592867 A7 __ B7 V. Description of the invention (4 ~ " ~ The device (resolution, the size of the object to be detected, and the detection conditions of light exposure are determined. Therefore, in order to improve the detection sensitivity, it is necessary to To pick up a high-resolution image in a wide range, an image processing device including a high-resolution image pickup device, and a memory area having a large capacity for the obtained data are needed. The range of image pickup, and the critical values required for the degree of pattern matching, can be determined by the user's operating conditions of naked eyes on the screen of a monitor, and need to be changed according to the operating conditions, and can be added Software for operating image processing that changes these setting data (the catching range, the critical value, and the like). In the image processing device, image data used to form a state with a blind crack can be stored in advance. The image processing device can compare the stored image data with the image data obtained by the image pickup device, for example, using a pattern Matching method. Normally, a blind fracture system is automatically identified, which determines whether the degree of matching between the stored and measured data exceeds a certain set value (critical value). The hardening in the image processing device The body and software configuration is designed so that this critical value can be changed according to the condition of the object to be tested (such as disturbing light and the intensity of the illumination illuminating a test area). A device for drawing a line and a fragile substrate according to the present invention, wherein By continuously heating the brittle substrate along a desired scribe line at a temperature below the softening point of the brittle substrate, a blind crack is formed along the desired scribe line on the surface of the brittle substrate And continuously cool in the area near the heated area, and the image of the area where the blind crack is formed. This paper size applies the Chinese National Standard (CNS) A4 specification (210 X 297 mm)

59286V A7 --- -—— B7__ 彡、發明説明（5 ) ’該區域係接近於該脆性基板的表面上之冷卻的區域，其係由影像拾取裝置所拾取，並基於由該影像拾取裝置所得到的影像資料來觀察該盲裂缝的形成。在本發明的方法中，其較佳地是在其中有形成該盲裂缝之區域係立即位在該冷卻的區域之下游處。在本發明的方法中，其較佳地是在一水平方向上該影像拾取裝置的角度係設定成相對於該盲裂縫的30。到90。的範圍内。在本發明的方法中，其為該冷卻的區域係位在該加熱的區域之内的畫線條件之一種有效的選擇方案。根據本發明之分割一脆性基板的自動生產線係包含至少一個上述畫線一脆性基板的裝置，及至少一個折斷裝置。圖式簡單說明圖1所示為根據本發明之具體實施例來畫線一脆性基板的裝置之正視圖。圖2所示為由圖1之畫線裝置來形成一刻畫線的工作期間，照射在一玻璃基板上的光束之狀態的透視圖。圖3所示為在圖1之玻璃基板上物理狀態變化之平面圖。圖4所示為在圖1之畫線裝置中所提供的影像拾取機構之組態的架構圖。圖5(a)所示為當由該影像拾取機構的影像處理裝置所得到的影像資料顯示在一監視器上的範例性影像。圖5(1))所示為如果由該影像拾取機構所得到的影像資料有異常顯示在該監視器上時的範例性影像。本紙張尺度適用中國國家標準(CNS> A4規格(210X 297公釐） 592867 A7 B7 五、發明説明（6 圖6所示為解釋一種使用雷射光束形成一刻畫線的方法之架構圖。圖7所示為當在一雷射光點LS之内形成一冷卻點CP時，照射在一玻璃基板上的光束狀態之架構性透視圖。圖8所示為當該冷卻點CP形成在該雷射光點LS之内時，在該玻璃基板上有物理性改變狀態的架構性平面圖。圖9(a)及（b)所示分別為照明一盲裂縫BC及用以拾取該盲裂縫BC之影像的CCD攝影機之光源的較佳角度範圍之架構圖。圖10所示為一自動玻離基板分割生產線做為一範例性自動化生產線來分離一玻璃基板之架構圖，其中在一畫線裝置之後加入一折斷裝置。執行本發明之最佳模式然後，本發明的具體實施例將基於該圖面來說明。圖1所示為根據本發明來畫線一脆性基板的裝置之具體實施例的組態之架構圖。此畫線裝置係做為畫線一玻璃基板之用，例如用於FPD。如圖1所述，該畫線裝置在一水平基座11上具有一滑動台12。該滑動台12係在一預定的水平方向（Y方向）上往復地運動。該滑動台12係由一對導引軌道14及15所支撐，其係在該基座11的上表面之上放置成平行於Y方向，在此方式中，該滑動台12可沿著每個導引軌道14及15來滑動，而可保持在水平狀態。一球螺桿13係提供在該導引軌道14及15之間的一中間部份，並平行於每個導引軌道14及1 5，所以該球 -9- 本紙張尺度適用中國國家標準(CNS) A4規格(210X 297公釐) 592867 A7 _____B7 1、發明説明（7~) _ ! ~' 螺桿13即由一馬達旋轉（未示出）。該球螺桿13可前後地旋轉。一球螺帽16附著於該球螺桿13，其狀態為該球螺帽16 嚙合於該球螺桿13。該球螺帽16係一體地附著於該滑動台 12，其狀態為該球螺帽16並不會旋轉。藉由該球螺桿13的前後旋轉，該球螺帽16係沿著該球螺桿13的相反方向而滑動。藉此，一體地附著有該球螺帽16之滑動台12係沿著每個導引軌道14及15來在該Y方向上滑動。在該滑動台12上，一臺座19係置於水平狀態。該臺座19 係支撐在一對導引軌道21上，其放置成平行於該滑動台12 ’其方式使得該臺座19可以滑動。每個導引軌道21係置於垂直於Y方向之X方向上，其中可滑動該滑動台12。再者，一球螺桿22置於該導引軌跡2 1之間的一中間部份處，並平行於每個導引軌道2卜該球螺桿22係由馬達23來前後旋轉。一球螺帽24附著於該球螺桿22，其狀態為該球螺帽24嚙合於該球螺桿22。該球螺帽24係一體地附著於該臺座19，其狀態為該球螺帽24並不會旋轉。藉由該球螺桿22之前後旋轉，該球螺帽24係在沿著該球螺帽22之相反方向上移動。藉此，該臺座19即沿著該導引軌道21之X方向上滑動。一種旋轉機構25提供在該臺座19上。在此旋轉機制25中，一旋轉台26係提供成水平狀態，其上放置要被畫線的玻璃基板50。該旋轉機構25繞著一垂直方向的中心軸旋轉該旋轉台26,並可旋轉該旋轉台26使得該旋轉台相對於一參考位置可有任何的旋轉角度。在該旋轉台26上，該玻璃基板50藉由例如一吸力夾頭來固定。 -10 - 本紙張尺度適用中國國家標準(CNS) A4規格(210 X 297公釐）裝59286V A7 --- ----- B7__ 发明, description of the invention (5) 'This area is close to the cooled area on the surface of the fragile substrate, which is picked up by the image pickup device and based on the image pickup device Obtain the image data to observe the formation of the blind crack. In the method of the present invention, it is preferable that the area in which the blind crack is formed is immediately downstream of the cooled area. In the method of the present invention, it is preferable that the angle of the image pickup device in a horizontal direction is set to 30 relative to the blind crack. To 90. In the range. In the method of the present invention, it is an effective option for the condition that the cooled area is located within the heated area. The automatic production line for dividing a brittle substrate according to the present invention includes at least one device for drawing a brittle substrate as described above, and at least one breaking device. Brief Description of the Drawings Fig. 1 is a front view of an apparatus for drawing a fragile substrate according to an embodiment of the present invention. FIG. 2 is a perspective view showing a state of a light beam irradiated on a glass substrate during the operation of forming a scribed line by the line drawing device of FIG. 1. FIG. FIG. 3 is a plan view showing a change in physical state on the glass substrate of FIG. 1. FIG. FIG. 4 is a structural diagram showing the configuration of an image pickup mechanism provided in the line drawing device of FIG. 1. FIG. Fig. 5 (a) shows an exemplary image when image data obtained by the image processing device of the image pickup mechanism is displayed on a monitor. Fig. 5 (1)) shows an exemplary image when the image data obtained by the image pickup mechanism is abnormally displayed on the monitor. This paper size applies the Chinese national standard (CNS > A4 size (210X 297 mm) 592867 A7 B7 V. Description of the invention (6) Figure 6 shows the architecture diagram explaining a method of forming a scribed line using a laser beam. Figure 7 A structural perspective view showing the state of a light beam irradiated on a glass substrate when a cooling point CP is formed within a laser light point LS. FIG. 8 shows when the cooling point CP is formed at the laser light point Within LS, there are architectural plan views of the state of physical change on the glass substrate. Figures 9 (a) and (b) show the CCD that illuminates a blind crack BC and the CCD used to pick up the image of the blind crack BC, respectively. The structure diagram of the preferred angle range of the camera's light source. Figure 10 shows the structure diagram of an automatic glass separation substrate production line as an exemplary automated production line to separate a glass substrate, in which a break is added after a line drawing device. Device. Best Mode for Implementing the Present Invention Then, a specific embodiment of the present invention will be described based on the drawing. FIG. 1 shows a configuration frame of a specific embodiment of a device for drawing a brittle substrate according to the present invention. Figure. This line drawing device is used for drawing a glass substrate, such as for FPD. As shown in Figure 1, the line drawing device has a sliding table 12 on a horizontal base 11. The sliding table 12 is The slide table 12 is reciprocated in a predetermined horizontal direction (Y direction). The slide table 12 is supported by a pair of guide rails 14 and 15 and is placed on the upper surface of the base 11 so as to be parallel to the Y direction. In this way, the slide table 12 can slide along each guide track 14 and 15, and can be maintained in a horizontal state. A ball screw 13 is provided in the middle between the guide tracks 14 and 15. Part, and parallel to each guide track 14 and 15, so the ball -9- This paper size applies Chinese National Standard (CNS) A4 specification (210X 297 mm) 592867 A7 _____B7 1. Description of the invention (7 ~ ) _! ~ 'The screw 13 is rotated by a motor (not shown). The ball screw 13 can be rotated back and forth. A ball nut 16 is attached to the ball screw 13 in a state where the ball nut 16 is engaged with the ball screw 13. Ball screw 13. The ball nut 16 is integrally attached to the sliding table 12, and the state is that the ball nut 16 does not rotate. By rotating the ball screw 13 back and forth, the ball nut 16 slides in the opposite direction of the ball screw 13. Thereby, the slide table 12 with the ball nut 16 integrally attached is guided along each guide. The rails 14 and 15 slide in the Y direction. On the sliding table 12, a pedestal 19 is placed in a horizontal state. The pedestal 19 is supported on a pair of guide rails 21, which are placed parallel to the The slide table 12 ′ allows the pedestal 19 to slide. Each guide track 21 is placed in the X direction perpendicular to the Y direction, in which the slide table 12 can be slid. Furthermore, a ball screw 22 is placed in the The ball screw 22 is rotated back and forth by a motor 23 at a middle portion between the guide tracks 21 and parallel to each guide track 2. A ball nut 24 is attached to the ball screw 22 in a state where the ball nut 24 is engaged with the ball screw 22. The ball nut 24 is integrally attached to the pedestal 19, and the state is that the ball nut 24 does not rotate. By rotating the ball screw 22 back and forth, the ball nut 24 moves in the opposite direction along the ball nut 22. As a result, the base 19 slides along the X direction of the guide rail 21. A rotating mechanism 25 is provided on the pedestal 19. In this rotation mechanism 25, a rotation stage 26 is provided in a horizontal state, on which a glass substrate 50 to be drawn is placed. The rotating mechanism 25 rotates the rotating table 26 about a vertical central axis, and the rotating table 26 can be rotated so that the rotating table can have any rotation angle with respect to a reference position. On the rotating table 26, the glass substrate 50 is fixed by, for example, a suction chuck. -10-This paper size is applicable to China National Standard (CNS) A4 (210 X 297 mm)

訂Order

線 592867 A7 B7 五、發明説明（8 ) 一支撐3 1置於該旋轉台26之上，在其與該旋轉台26之間具有一適當的間隔。此支撐31係以水平狀態支撐於放置成垂直狀態的光學爽持器33的下端部份。該光學夾持器33的上端部份係附著於在該基座11上提供的一附著基座32的下表面。一雷射振邊器34用以振盡一雷射光束，其提供在該附著基座32之上。由該雷射振盪器34所振盪的雷射光束即故射到固定於該光學夾持器33内的一光學系統中。放射到該光學夾持器33的雷射光束即經由該光學夾持器 33的下端表面而引入到置於該旋轉台26上的該玻璃基板50 之上。該玻璃基板50係由夾持在該光學爽持器33内的光學系統所照射，其具有一橢圓形雷射光點，其在一預定方向上加長。附著於該光學夾持器33的下端部份之支撐31即具有一切刻輪晶片3 5，用以在該玻璃基板50的表面上形成一切口。此切刻輪晶片3 5係用來形成一裂隙，其觸發產生一盲裂缝 ’其位在要放射的雷射光束之縱向方向上的該玻璃基板50 之末端部份。同時’該切刻輪晶片35由一晶片爽持器36所失持’其方式為可使該切刻輪晶片35上下移動。再者，該支撐31在靠近該光學夹持器33處具有一冷卻喷嘴37，其方式為可改變該冷卻喷嘴37的附著位置。此冷卻噴嘴37噴灑一冷卻媒體，例如冷卻水、氦氣、氮氣及二氧化碳氣體到該玻璃基板50上。由該冷卻喷嘴37所放射的冷卻媒體即喷灑到靠近於一雷射光點的縱向方向上的一末端部份之位置，其係由該光學夾持器33放射到該玻璃基板50 -11 · 本紙張尺度適用中國國家標準(CNS) A4規格(210 X 297公釐）Line 592867 A7 B7 V. Description of the invention (8) A support 3 1 is placed on the rotary table 26 with an appropriate interval between it and the rotary table 26. This support 31 is supported in a horizontal state on a lower end portion of the optical holder 33 placed in a vertical state. An upper end portion of the optical holder 33 is attached to a lower surface of an attachment base 32 provided on the base 11. A laser beam exciter 34 is used to exhaust a laser beam, and is provided on the attachment base 32. The laser beam oscillated by the laser oscillator 34 is thus incident on an optical system fixed in the optical holder 33. The laser beam radiated to the optical holder 33 is introduced onto the glass substrate 50 placed on the rotary table 26 via the lower end surface of the optical holder 33. The glass substrate 50 is irradiated by an optical system held in the optical holder 33, and has an elliptical laser light spot that is elongated in a predetermined direction. The support 31 attached to the lower end portion of the optical holder 33 has all the caster wafers 35 for forming all the openings on the surface of the glass substrate 50. The cutting wheel wafer 35 is used to form a crack, which triggers to generate a blind crack, which is located at the end portion of the glass substrate 50 in the longitudinal direction of the laser beam to be emitted. At the same time, "the scoring wheel wafer 35 is lost by a wafer holder 36" in such a manner that the scoring wheel wafer 35 can be moved up and down. Furthermore, the support 31 has a cooling nozzle 37 near the optical holder 33 in such a manner that the attachment position of the cooling nozzle 37 can be changed. The cooling nozzle 37 sprays a cooling medium, such as cooling water, helium, nitrogen, and carbon dioxide gas, onto the glass substrate 50. The cooling medium radiated from the cooling nozzle 37 is sprayed to a position close to an end portion in a longitudinal direction of a laser light spot, and is radiated from the optical holder 33 to the glass substrate 50 -11 · This paper size applies to China National Standard (CNS) A4 (210 X 297 mm)

裝訂Binding

線 592867 A7 B7 五、發明説明（9 ) 之上。該支撐31在靠近該冷卻喷嘴37處具有一影像拾取機構4〇，其拾取該玻璃基板50的表面影像。此影像拾取機構40具有一 CCD(電荷耦合裝置）攝影機41，其方式為該CCD攝影機 4 1透過一光學系統42面對靠近由該冷卻噴嘴3 7所喷灌到玻璃基板50上的冷卻媒體之預定區域。由該CCD攝影機41所拾取的影像之區域係為照射在該玻璃基板50上的雷射光束之縱向方向上延伸的區域，及靠近於由該冷卻嘴嘴37所噴灑的冷卻媒體之位置的區域。再者，該畫線裝置具有一對CCD攝影機38及39，其拾取先前在該玻璃基板50上圖樣化的對準標記之影像。監視器 28及29即提供在該附著基座32上，其顯示了由個別的CCD 攝影機38及39所拾取的影像❶ 當使用這種畫線裝置來畫線該玻璃基板50時，要分割成一預定尺寸之玻璃基板50在開始時係置於該畫線裝置的旋轉台26上，並由一吸引裝置所固定。然後，在該玻璃基板 50上所提供的對準標記之影像即由CCD攝影機38及39所拾取。已經拾取影像的對準標記即顯示在監視器28及29上。關於該對準標記的位置資訊即由定位一工作台（未示出）的影像處理裝置來處理。接下來，在放置有該玻璃基板5〇的旋轉台26即定位在相對於該支撐31的預定位置，而該玻璃基板50即進行雷射畫線❶當該玻璃基板5〇在畫線時，由該光學夾持器33所放射到該玻璃基板5〇的表面上之橢圓形雷射光點的縱向方向即為沿著要形成在該玻璃基板5〇上的一 -12- 本紙張尺度適財S g家標準(CNS) A4規格(21Gχ 297公爱)--—Line 592867 A7 B7 V. Invention description (9). The support 31 has an image pickup mechanism 40 near the cooling nozzle 37, which picks up a surface image of the glass substrate 50. This image pickup mechanism 40 has a CCD (Charge Coupled Device) camera 41 in such a manner that the CCD camera 41 faces through a optical system 42 to face a predetermined cooling medium sprayed onto the glass substrate 50 by the cooling nozzle 37 region. The area of the image picked up by the CCD camera 41 is an area extending in the longitudinal direction of the laser beam irradiated on the glass substrate 50 and an area close to the position of the cooling medium sprayed by the cooling nozzle 37 . Furthermore, the line drawing device has a pair of CCD cameras 38 and 39, which pick up images of alignment marks previously patterned on the glass substrate 50. The monitors 28 and 29 are provided on the attachment base 32 and display the images picked up by the individual CCD cameras 38 and 39. When using this line drawing device to draw the glass substrate 50, it is divided into one The glass substrate 50 of a predetermined size is initially placed on the rotary table 26 of the line drawing device, and is fixed by a suction device. Then, the images of the alignment marks provided on the glass substrate 50 are picked up by the CCD cameras 38 and 39. The alignment marks of the picked-up images are displayed on the monitors 28 and 29. Information about the position of the alignment mark is processed by an image processing device that positions a table (not shown). Next, the turntable 26 on which the glass substrate 50 is placed is positioned at a predetermined position relative to the support 31, and the glass substrate 50 is laser-drawn. When the glass substrate 50 is drawn, The longitudinal direction of the elliptical laser light spot radiated by the optical holder 33 on the surface of the glass substrate 50 is along a length of -12 to be formed on the glass substrate 50. Sg Home Standard (CNS) A4 Specification (21Gχ 297 Public Love) ---

裝訂Binding

線 592867 A7 B7 五、發明説明（10 ) 刻畫線之X方向。該旋轉台26的定位即由滑動該滑動台12 、滑動該臺座19，及由該旋轉機構25旋轉該旋轉台26來進行。當該旋轉台26已經相對於該支撐31所定位時，該旋轉台 26即在X方向上滑動，所以該玻璃基板50的末端部份即面對該切刻輪晶片35。然後，該切刻輪晶片35即降低，所以在該玻璃基板50的末端部份處即形成一切口（圖2中的TR)。然後，該旋轉台26即在沿著一所要的刻畫線之X方向上滑動，而由該雷射振盪器34放射一雷射光束，且由該冷卻嘴嘴37喷灑一冷卻媒體（如冷卻水）以及壓縮空氣。圖2所示為光束照射在由該畫線裝置所要畫線的該玻璃基板50上的狀態之架構透視圖。圖3所示為在這種狀況下該玻璃基板50上的物理狀態改變之架構性平面圖。對於雷射畫線方法，較佳地是在日本專利編號3027768 中所揭示的一種方法。由該雷射振堡器34所振盪的雷射光束在該玻璃基板50的表面上形成一橢圓形雷射光點LS。舉例而言，該雷射光點 LS係呈橢圓形狀，其中長軸直徑b為30.0mm，而短軸直徑a 為1.0mm，其放射的方式為該長軸對應於要形成的刻畫線之方向。在此例中，由該雷射光點LS所加熱的溫度係低於該玻璃基板50熔解的溫度，即一玻璃基板的軟化點。因此，以該雷射光點LS所照射的玻璃基板50之表面即被加熱而不會熔解。該冷卻噴嘴37噴灑冷卻水到所要的刻畫線上的一冷卻點 -13- 本纸張尺度適用中國國家標準(CNS) A4規格(210X297公釐) ~ 裝Line 592867 A7 B7 V. Description of the invention (10) The X direction of the line is described. The positioning of the rotating table 26 is performed by sliding the sliding table 12, sliding the pedestal 19, and rotating the rotating table 26 by the rotating mechanism 25. When the rotary table 26 has been positioned relative to the support 31, the rotary table 26 slides in the X direction, so the end portion of the glass substrate 50 faces the cutting wheel wafer 35. Then, the cutting wheel wafer 35 is lowered, so that a cutout is formed at an end portion of the glass substrate 50 (TR in FIG. 2). Then, the rotating table 26 slides in the X direction along a desired scribed line, and a laser beam is emitted from the laser oscillator 34, and a cooling medium (such as cooling) is sprayed from the cooling nozzle 37 Water) and compressed air. Fig. 2 is a perspective view showing the structure of a state in which a light beam is irradiated on the glass substrate 50 to be drawn by the drawing device. FIG. 3 is a schematic plan view showing the physical state change on the glass substrate 50 in this state. As for the laser line drawing method, a method disclosed in Japanese Patent No. 3027768 is preferable. The laser beam oscillated by the laser oscillator 34 forms an elliptical laser light spot LS on the surface of the glass substrate 50. For example, the laser light point LS has an elliptical shape, in which the major axis diameter b is 30.0 mm and the minor axis diameter a is 1.0 mm, and the radiation mode is such that the major axis corresponds to the direction of the scribed line to be formed. In this example, the temperature heated by the laser light point LS is lower than the melting temperature of the glass substrate 50, that is, the softening point of a glass substrate. Therefore, the surface of the glass substrate 50 irradiated with the laser light spot LS is heated without melting. The cooling nozzle 37 sprays cooling water to a cooling point on a desired line. -13- This paper size is applicable to China National Standard (CNS) A4 (210X297 mm) ~

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線 592867 A7 B7 五、發明説明（n CP ’其位在一溝槽L ’例如距離該雷射光點ls之長軸方向上由該雷射光點L S所照射的區域有2 · 5 mm。藉此，在該玻璃基板50的表面上的冷卻點CP即被冷卻。因此，在該雷射光點L S及该冷卻點C P之間的區域中即產生一溫度梯度。壓縮應力係在由該雷射光點LS所加熱的該玻璃基板50之表面上的區域中會產生，而拉伸應力係在由該冷卻水喷灑的冷卻點CP處產生。依此方式，當壓縮應力由該雷射光點 LS加熱的區域中產生，而拉伸應力由於該冷卻水在該冷卻點CP處產生，在該雷射光點LS及該冷卻點CP之間的熱擴散區域HD中即產生壓縮應力，造成一較大的拉伸應力會產生在相對於關於該冷卻點CP之雷射光點LS之區域中。然後，此拉伸應力即用來自該切口產生一盲裂缝BC，其係由該切刻輪晶片3 5沿著一所要的刻畫線在該玻璃基板5〇的末端部份處形成。該盲裂缝BC的深度δ係根據該雷射光點LS的大小、該熱擴散區域HD的大小，及該雷射光點ls、該冷卻點CP及該玻璃基板50之間的移動速率V，其可由下式（1)來表示。請注意到，如上所述，a代表該雷射光點LS的短軸直徑，b代表該雷射光點L· S的長軸直徑，l代表沿著該刻畫線之熱擴散區域HD之長度（在該雷射光點LS及該冷卻點CP之間），而k 代表根據要畫線的材料（玻璃基板）之熱物理性質，一加熱光束的照射密度等等。 V = k a (b+L) / δ …（1) 如上所述，例如當該雷射光點LS的短軸直徑為i.o ， -14- 本紙張尺度適用中國國家標準(CNS) A4規格(210X297公釐）；· 裝訂Line 592867 A7 B7 V. Description of the invention (n CP 'It is located in a groove L', for example, the area illuminated by the laser light point LS in the direction of the long axis of the laser light point ls is 2.5 mm. The cooling point CP on the surface of the glass substrate 50 is cooled. Therefore, a temperature gradient is generated in a region between the laser light point LS and the cooling point CP. The compressive stress is caused by the laser light point The area on the surface of the glass substrate 50 heated by LS is generated, and the tensile stress is generated at the cooling point CP sprayed by the cooling water. In this way, when the compressive stress is heated by the laser light point LS Compressive stress is generated in the heat diffusion region HD between the laser light point LS and the cooling point CP due to the cooling water generated at the cooling point CP, resulting in a large A tensile stress is generated in a region relative to the laser light point LS with respect to the cooling point CP. Then, the tensile stress generates a blind crack BC from the notch, which is formed by the cutting wheel wafer 35 A desired engraved line on the glass substrate 50 The depth δ of the blind crack BC is based on the size of the laser light point LS, the size of the heat diffusion area HD, and the distance between the laser light point ls, the cooling point CP, and the glass substrate 50. The moving speed V can be expressed by the following formula (1). Please note that, as mentioned above, a represents the short-axis diameter of the laser light point LS, b represents the long-axis diameter of the laser light point L · S, and l represents The length of the heat diffusion area HD along the scribed line (between the laser light point LS and the cooling point CP), and k represents the heat physical property of the material (glass substrate) on which the line is to be drawn. Irradiation density, etc. V = ka (b + L) / δ… (1) As mentioned above, for example, when the short axis diameter of the laser light spot LS is io, -14- This paper size applies the Chinese National Standard (CNS) A4 specification (210X297 mm); · binding

線 592867 A7 ___B7 五、發明説明（12~) 一該雷射光點的長軸直徑b為30.0 mm，沿著該刻畫線之熱擴散區域HD的長度L為2.5 mm,該玻璃基板50的移動速率為 300 mm/sec ,且該雷射光束的功率為8〇 w，該盲裂缝Bc 的深度為120 μιη。這些數值的選擇方式係要成為對於每種製程的條件為最佳化的數值組合，並可運用到該製程中。再者’當在其上要形成刻畫線之玻璃基板較薄，使得畫線速率較低，例如該玻璃基板的厚度為〇 5到〇·7 mm，其對於一 FPD較佳，而該畫線速率低到3〇 mm/s，如果該冷卻點 CP形成在該雷射光點LS之外，構成一刻畫線的盲裂缝即穿透最多到一玻璃基板的下表面（即完整本體切割），所以該玻璃基板在一折斷步驟之前已經分離。在沿著玻璃分割的線配置之某些狀況下，要分割的物體之完整本體切割並不方便。特別是在當畫線之後，要被分割的物體需要運送到一折斷步驟，其中該物體需要被分割。當存在這種需求時，即會造成問題，例如像是該玻璃基板會在運送到該折斷步驟期間掉落或摔落，所以即會停止一自動分割生產線。在該畫線步驟中所形成的刻畫線，其不具有完整本體切割者，即需要具有一適當的深度，使得當在該折斷步驟中來折斷該玻璃基板時，該玻璃基板即可沿著該刻畫線來正確地折斷。為此目的，由喷灑一冷卻媒體所形成的該冷卻點 CP即形成在該雷射光點LS之内。圖7所示為在此狀況中，照射在該玻璃基板上的光束狀態之架構性透視圖。圖8所示為在這種狀況下該玻璃基板 50上的物理狀態改變之架構性平面圖。 •15- 本紙張尺度適用中國國家標準(CNS) Α4規格(210X 297公釐）裝Line 592867 A7 ___B7 V. Description of the invention (12 ~)-The long axis diameter b of the laser light spot is 30.0 mm, the length L of the heat diffusion area HD along the scribed line is 2.5 mm, and the moving speed of the glass substrate 50 It is 300 mm / sec, and the power of the laser beam is 80w, and the depth of the blind crack Bc is 120 μm. These values are selected in such a way as to be a combination of values optimized for the conditions of each process and can be applied to that process. Furthermore, when the glass substrate on which the engraved lines are to be formed is thin, the line drawing rate is low, for example, the thickness of the glass substrate is 0.05 to 0.7 mm, which is better for an FPD, and the line drawing The velocity is as low as 30 mm / s. If the cooling point CP is formed outside the laser light point LS, a blind crack forming a engraved line penetrates up to the lower surface of a glass substrate (ie, the entire body is cut), so The glass substrate has been separated before a breaking step. Under certain conditions, which are arranged along the glass dividing line, it is not convenient to cut the complete body of the object to be divided. Especially after drawing a line, the object to be divided needs to be transported to a breaking step, where the object needs to be divided. When such a demand exists, it can cause problems, such as if the glass substrate is dropped or dropped during the transport to the breaking step, so an automatic dividing line is stopped. The engraving line formed in the line drawing step does not have a complete body cutter, that is, it needs to have an appropriate depth, so that when the glass substrate is broken in the breaking step, the glass substrate can be along the Draw lines to break properly. For this purpose, the cooling point CP formed by spraying a cooling medium is formed within the laser light point LS. Fig. 7 is a structural perspective view showing a state of a light beam irradiated on the glass substrate in this state. FIG. 8 is a schematic plan view showing the physical state change on the glass substrate 50 in this state. • 15- This paper size applies to China National Standard (CNS) Α4 size (210X 297mm)

訂Order

592867 A7 B7 五、發明説明（13 ) 装在此狀況中，於一玻璃板之表面層的溫度分布下，在該玻璃被強迫冷卻的冷卻點即形成在接近最高溫度點處，或在一些低於該最高點的地方。因此，該玻璃板的冷卻即在一雷射光束到達該玻璃板的下表面之加熱區域之前即開始，藉此使其有可能避免一盲裂缝成為一完整本體切割。再者，即使當一雷射光束的輸出變動到某個程度，例如藉由約10W，·或該雷射光點LS及該冷卻點CP相對於該玻璃基板的移動速率變動到某個程度，其有可能形成具有一適當深度的盲裂縫。因此，其有可能加大用於畫線的雷射光輸出之容許變動，或該雷射光點LS及該冷卻點CP相對於該玻璃基板的移動速率之可容許的變動寬度，藉此使其有可能來執行穩定的畫線。線因為如此形成的盲裂縫BC很微小，且如果由於冷卻媒體造成的拉伸應力不再作用，該盲裂缝BC實質上肉眼無法觀察到。但是，因為一較大的拉伸應力會產生在靠近於喷灑冷卻水之區域的部份中，形成在該玻璃基板50的表面上之盲裂縫BC即在使用肉眼觀察時，即成為具有一較大寬度的開口。在本發明的畫線裝置中，該影像拾取機構40拾取該區域的影像，其接近於喷灑冷卻水之冷卻點CP處，因此其上會作用一較大的拉伸力量。該影像拾取機構40之影像拾取區域CF之長度係由考慮該CCD裝置之解析度、要偵測的物體，及由光線照射所偵測的不同條件來決定。因此，當在如果使用高速率下，為了改進偵測靈敏度而 -16- 本紙張尺度適用中國國家標準(CNS) A4規格(210X 297公釐〉 592867 A7 B7 五、發明説明（14 ) 需要在一寬廣範圍内有較高的解析度影像拾取，即需要包含一高解析度影像拾取裝置之影像處理裝置，及對於所得到的資料具有一大容量之記憶體區域。該硬體及軟體的配置係設計成使得該使用者可決定所需要的影像拾取範圍，及關於該匹配程度的臨界值，其係由眼睛觀視一監視器的螢幕之圖樣匹配，並根據該操作條件，並且當根據該操作條件而需要改變時，此設定資料即可改變。圖4所示為一影像拾取機構40之組態的架構圖。在該影像拾取機構40中，一 CCD攝影機41拾取一玻璃基板50的表面之影像拾取區域CF的影像，其係由放置成面對該玻璃基板 50之表面上的影像拾取區域CF的一光學系統42所放大。請注意到該玻璃基板50之表面的影像拾取區域CF，其中影像由該CCD攝影機41所拾取，其為接近於噴灑冷卻水之區域的部份。如前所述，如果一旦形成該盲裂缝BC而無拉伸應力作用時，該裂缝的開口狀態即在短時間内改變成封閉狀態。因此，在該冷卻點CP之下游旁的區域即為最容易光學地觀察該盲裂縫BC之點。因此，其較佳地是該CCD攝影機41之放置方式使其能夠拾取在該冷卻點CP之下游旁的該部份之影像。再者，即使當式（1)中的L為負值時，即該冷卻點CP位在該雷射光點LS之内，其有可能光學地觀察到位在該冷卻點CP下游旁的該盲裂縫。該光學系統42具有由一光源43所放射的光線。在該玻璃基板50的表面上之影像拾取區域即照射此光線。該盲裂縫BC形成在垂直方向，而相對於由該光源43所照 -17- 本紙張尺度適用中國國家標準(CNS) A4規格(210X 297公釐) 裝訂線 592867 A7 B7 五、發明説明（15 ) 射之玻璃基板50的表面。為了接收由該ccD攝影機41所反射的光線，該光源43及該CCD攝影機41在該水平方向上相對於該盲裂縫之角度係設定在3〇。到90。的範圍，因為當角度小於3 0時’其不可能充份地補捉到來自該盲裂縫所反射的光線。再者，其較佳地是該光源43及該CCD攝影機41之角度係相對於該玻璃基板50之表面的水平平面來調整到 10。到80°。圖9(a)及9(b)分別顯示出對於拾取該盲裂縫bc 之影像來照射該盲裂縫BC及該CCD攝影機41之光源43的較佳角度範圍。由該CCD攝影機4 1所得到的影像資料係經由一攝影機控制單元（CCU) 44傳送到一影像處理裝置45。該影像處理裝置45的輸出即輸入到一控制電路46，其控制了整個畫線裝置。該影像處理裝置45在預定的時段讀取由該CCD攝影機41 所得到的影像資料，並將該資料相較於先前所儲存的一正常盲裂縫BC之影像資料。圖5(a)所示為當先前儲存的一正常盲裂縫BC之影像資料顯示在一監視器上時的範例性影像。當觀察形成在該玻璃基板50之表面上的該盲裂缝BC時，如上所述，在畫線（形成一盲裂缝）期間可在預定時段讀取複數個片段的影像資料，而實質上可即時地進行觀察來配合於一系列關於自動畫線操作的移動。再者，其憑經驗足以僅觀察一盲裂縫形成的線之終端處附近，即該玻璃基板50之末端部份附近。當該盲裂縫BC穩 -18 - 本紙張尺度適用中國國家標準(CNS) A4規格(210X297公釐）裝592867 A7 B7 V. Description of the invention (13) In this condition, under the temperature distribution of the surface layer of a glass plate, the cooling point where the glass is forcibly cooled is formed near the highest temperature point, or at some low temperature At the highest point. Therefore, the cooling of the glass plate is started before a laser beam reaches the heating area of the lower surface of the glass plate, thereby making it possible to prevent a blind crack from becoming a complete body cut. Furthermore, even when the output of a laser beam changes to a certain degree, for example, by about 10W, or the moving rate of the laser light point LS and the cooling point CP relative to the glass substrate changes to a certain degree, it It is possible to form a blind crack with an appropriate depth. Therefore, it is possible to increase the allowable variation of the laser light output for line drawing, or the allowable variation width of the movement rate of the laser light point LS and the cooling point CP with respect to the glass substrate, thereby making it have May come to perform stable line drawing. Because the blind crack BC formed in this way is very small, and if the tensile stress caused by the cooling medium no longer acts, the blind crack BC is virtually invisible to the naked eye. However, since a large tensile stress is generated in a portion close to the area where the cooling water is sprayed, the blind crack BC formed on the surface of the glass substrate 50 becomes a component having a Larger openings. In the line drawing device of the present invention, the image pickup mechanism 40 picks up an image of the area, which is close to the cooling point CP where the cooling water is sprayed, so a large tensile force acts on it. The length of the image pickup area CF of the image pickup mechanism 40 is determined by considering the resolution of the CCD device, the object to be detected, and different conditions detected by light irradiation. Therefore, when using high speed, in order to improve the detection sensitivity, -16- this paper size applies the Chinese National Standard (CNS) A4 specification (210X 297 mm> 592867 A7 B7 V. Description of the invention (14) There is a high-resolution image pickup in a wide range, that is, an image processing device including a high-resolution image pickup device and a memory area with a large capacity for the obtained data. The configuration of the hardware and software is It is designed so that the user can determine the required image pickup range and the critical value regarding the degree of matching, which is matched by the pattern of the screen of a monitor viewed by the eyes, and according to the operating conditions, and according to the operation When the conditions need to be changed, this setting data can be changed. Fig. 4 is a structural diagram of the configuration of an image pickup mechanism 40. In the image pickup mechanism 40, a CCD camera 41 picks up the surface of a glass substrate 50 The image of the image pickup area CF is enlarged by an optical system 42 placed so as to face the image pickup area CF on the surface of the glass substrate 50. Please note The image pickup area CF to the surface of the glass substrate 50, wherein the image is picked up by the CCD camera 41, which is a portion close to the area where the cooling water is sprayed. As described above, if the blind crack BC is formed without When tensile stress is applied, the open state of the crack changes to a closed state in a short time. Therefore, the area near the downstream of the cooling point CP is the point where the blind crack BC is most easily observed optically. Therefore, its It is preferable that the CCD camera 41 is placed in such a manner that it can pick up the image of the part downstream of the cooling point CP. Furthermore, even when L in the formula (1) is negative, the cooling The point CP is located within the laser light point LS, and it is possible to optically observe the blind crack located downstream of the cooling point CP. The optical system 42 has light emitted by a light source 43. On the glass substrate 50 The image pickup area on the surface of the light illuminates this light. The blind crack BC is formed in a vertical direction, and is relative to that illuminated by the light source 43- This paper size applies the Chinese National Standard (CNS) A4 specification (210X 297 mm) ) Gutter 592 867 A7 B7 5. Description of the invention (15) Surface of the glass substrate 50. In order to receive the light reflected by the ccD camera 41, the angle of the light source 43 and the CCD camera 41 with respect to the blind crack in the horizontal direction It is set in the range of 30 ° to 90 °, because when the angle is less than 30, it is impossible to fully capture the light reflected from the blind crack. Furthermore, it is preferably the light source 43 and The angle of the CCD camera 41 is adjusted to 10 ° to 80 ° with respect to the horizontal plane of the surface of the glass substrate 50. Figs. 9 (a) and 9 (b) respectively show the irradiation for picking up the image of the blind crack bc. A preferred angle range of the blind crack BC and the light source 43 of the CCD camera 41. The image data obtained by the CCD camera 41 is transmitted to an image processing device 45 via a camera control unit (CCU) 44. The output of the image processing device 45 is input to a control circuit 46, which controls the entire line drawing device. The image processing device 45 reads the image data obtained by the CCD camera 41 in a predetermined period, and compares the data with the image data of a normal blind crack BC previously stored. Fig. 5 (a) shows an exemplary image when previously stored image data of a normal blind crack BC is displayed on a monitor. When observing the blind crack BC formed on the surface of the glass substrate 50, as described above, during the line drawing (the formation of a blind crack), the image data of a plurality of segments can be read in a predetermined period of time, and substantially in real time Ground observations are made to match a series of movements related to automatic line drawing operations. Furthermore, it is sufficient to observe only the vicinity of the terminal end of a line formed by a blind crack, that is, the vicinity of the end portion of the glass substrate 50 by experience. When the blind crack BC is stable -18-This paper size applies to China National Standard (CNS) A4 (210X297 mm).

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592867592867

疋地形成在該玻璃基板5 0之開頭及末端部份附近時，該盲裂縫BC即連續地形成直到該終端。因此，如果在所想要的刻畫線之終端附近可觀察到盲裂缝BC時，其大致上可確定此即實質上等於觀察到在所要的刻畫線上的線性盲裂縫 BC 〇當由該CCD攝影機41所得到的影像資料實質上可吻合所緒存的一盲裂缝BC之影像資料時（在兩個影像資料之間的圖樣匹配之匹配程度）’該影像處理裝置4 5即輸出給該控制電路46 — ΟΚ信號，以代表該盲裂縫bc已經符合要求地形成。另一方面，則當由該CCD攝影機41所得到的影像資料實質上並不吻合所儲存的一盲裂缝BC之影像資料時（該匹配程度係在預定的容許範圍之外），該影像處理裝置45即輸出給該控制電路46 — NG信號，以代表該盲裂缝Bc並未符合要求地形成。圖5(b)所示為顯示在監視器上一並未符合要求地形成之異常盲裂缝BC之範例性影像。當一盲裂缝可充份符合要求地來沿著一所要的刻畫線來分割一脆性基板並未形成時，如圖5(a)所示的直線即不會顯示在該監視器上。當由該影像處理裝置45輸出該ΟΚ信號時，該控制電路46 控制該畫線裝置，所以即可繼續在該玻璃基板5〇上形成該刻畫線的工作。另一方面，當由該影像處理裝置45輸出該々G信號時，即發出一警告來通知操作者發生異常，所以在該玻璃基板50上形成刻畫線之工作即中斷，並中止傳送該玻璃基板50到一後續步驟。因此，當在畫線形成處理期間在該玻璃基板5〇上並未符本紙張尺度適用中國國家標準(CNS) Α4規格(210X 297公釐) 裝When the ground is formed near the beginning and end portions of the glass substrate 50, the blind crack BC is continuously formed until the end. Therefore, if a blind crack BC can be observed near the end of the desired characterization line, it can be roughly determined that this is substantially equivalent to observing a linear blind crack BC on the desired characterization line. When the CCD camera 41 When the obtained image data substantially matches the image data of a blind crack BC (the degree of pattern matching between the two image data), the image processing device 45 is output to the control circuit 46. — ΟΚ signal to represent that the blind crack bc has been satisfactorily formed. On the other hand, when the image data obtained by the CCD camera 41 does not substantially match the stored image data of a blind crack BC (the matching degree is outside a predetermined allowable range), the image processing device 45 is output to the control circuit 46—NG signal to represent that the blind crack Bc has not been formed as required. Fig. 5 (b) shows an exemplary image showing an abnormal blind crack BC formed on the monitor that does not meet the requirements. When a blind crack can fully meet the requirements to divide a brittle substrate along a desired scribe line and is not formed, the straight line shown in Fig. 5 (a) will not be displayed on the monitor. When the OK signal is output by the image processing device 45, the control circuit 46 controls the line drawing device, so the work of forming the line drawing on the glass substrate 50 can be continued. On the other hand, when the 々G signal is output by the image processing device 45, a warning is issued to notify the operator that an abnormality has occurred, so the work of forming a scribed line on the glass substrate 50 is interrupted, and the transmission of the glass substrate is suspended 50 to a next step. Therefore, when the glass substrate 50 is not conformed to the paper size during the line drawing process, the Chinese National Standard (CNS) A4 specification (210X 297 mm) is used.

訂Order

線 592867 A7 __ B7 五、發明説明（17 ) 合要求地形成一盲裂缝BC時，該畫線形成工作即中斷，並發出一警告。因此，該操作者可認知到於該畫線形成處理期間於該玻璃基板50上並未形成盲裂缝BC。藉此，該操作者可在該畫線裝置中由該旋轉台26移除該玻璃基板50做為一不良品，所以並未形成盲裂缝BC之做為不良品之玻璃基板50即不可能送入到下一個折斷步驟。再者，如果使用影像處理之此控制系統加入到一自動生產線裝置，其有可能自動地移除具有缺陷之裂縫形成的NG產品。圖10所示為一自動玻璃基板分割生產線100之架構圖，其係為用以分割該玻璃基板50之範例性自動化生產線，其中加入一折斷裝置在該畫線裝置之後。此自動玻璃基板分割生產線100具有用以分割一單一板材玻璃基板之裝置組態，其包含一匣承載器101，其中承載包覆一玻璃基板50的卡匣，一輸送帶102,由該卡匣承載器 101拉出的玻璃基板50即放置其上，然後定位該玻璃基板50 ，本發明的一畫線裝置103用以畫線該玻璃基板50，一輸送帶104，其上放置有形成一刻畫線之玻璃基板50，然後被定位，一折斷裝置105，其包含區分成兩半部的一工作台，其中該兩個工作台中至少一個被旋轉，並向下移動來折彎該玻璃基板50，所以該玻璃基板50即沿著一刻畫線分離，及一運送輸送帶106，其運送該分離的玻璃基板50B到該自動玻璃基板分割生產線100之外。再者，該自動玻璃基板分割線100之部份具有個別的機械手臂R 1到R5，例如用來在個別的狀態中運送該玻璃基板50 ^ -20- 本紙張尺度適用中國國家標準(CNS) A4規格(210X 297公釐) 592867 A7 B7 五、發明説明（18 ) 接著，將說明該自動玻璃基板分割生產線100之操作。包覆在該卡匣承載器101中的玻璃基板50由機械手臂（送入機械手臂）R1取出，而所取出的玻璃基板50即放置在該輸送帶102上。接下來，該玻璃基板50即定位在該輸送帶1〇2 的前送側。然後，該玻璃基板50即由機械手臂（輸送機械手臂）R2所夾持，並運送到該畫線裝置103。該運送的玻璃基板50即置於該畫線裝置50内的一工作台上。在該畫線裝置103中，如上所述，一盲裂縫BC相對於該玻璃基板50沿著一先前設計的線來形成。在此畫線裝置 103中，當該預定的盲裂缝BC並未依需求地形成在該玻璃基板50的表面上時，該影像處理裝置45即輸出一NG信號，該畫線裝置103的操作即中止，並發出一警告來通知該異常的發生。另一方面，在該畫線裝置103中，當一盲裂缝BC可依需求地形成在該玻璃基板50之表面上時，該玻璃基板50即由該機械手臂（運送機械手臂）R3所夾持，並置於該輸送帶104 上。置於該輸送帶104上的玻璃基板50係定位在該輸送帶104 的前送側，並由機械手臂（運送機械手臂）R4運送到該折斷裝置105，所以在該玻璃基板50上的盲裂缝BC即定位在該兩個半部的工作台之間的中段。該玻璃基板50由該折斷裝置105分離成複數個片段（以下每個該複數個片段的玻璃基板即表示成一玻璃基板50B)，並由該機械手臂（運送機械手臂）R5來放置在該運送輸送帶 •21· 本纸張尺度適用中國國家標準(CNS) A4規格(210X 297公釐）裝訂線 592867Line 592867 A7 __ B7 V. Description of the invention (17) When a blind crack BC is formed as required, the line drawing work is interrupted and a warning is issued. Therefore, the operator can recognize that no blind crack BC was formed on the glass substrate 50 during the line drawing forming process. Thereby, the operator can remove the glass substrate 50 as a defective product from the rotary table 26 in the line drawing device, so it is impossible to send the glass substrate 50 as a defective product without forming a blind crack BC. Proceed to the next breaking step. Furthermore, if this control system using image processing is added to an automatic production line device, it is possible to automatically remove NG products with flawed crack formation. FIG. 10 is a structural diagram of an automatic glass substrate dividing production line 100, which is an exemplary automatic production line for dividing the glass substrate 50, and a breaking device is added after the line drawing device. The automatic glass substrate dividing production line 100 has a device configuration for dividing a single sheet glass substrate, which includes a cassette carrier 101, which carries a cassette covering a glass substrate 50, a conveyor belt 102, and the cassette The glass substrate 50 pulled out by the carrier 101 is placed thereon, and then the glass substrate 50 is positioned. A line drawing device 103 of the present invention is used to draw the glass substrate 50, and a conveyor belt 104 is formed thereon to form a characterization. The glass substrate 50 of the wire is then positioned, and a breaking device 105 includes a table divided into two halves, wherein at least one of the two tables is rotated and moved downward to bend the glass substrate 50, Therefore, the glass substrate 50 is separated along a engraved line, and a transport conveyor 106 is used to transport the separated glass substrate 50B outside the automatic glass substrate dividing production line 100. Furthermore, a part of the automatic glass substrate dividing line 100 has individual robot arms R 1 to R5, for example, for transporting the glass substrate in individual states 50 ^ -20- This paper standard applies to Chinese National Standards (CNS) A4 specification (210X 297 mm) 592867 A7 B7 V. Description of the invention (18) Next, the operation of the automatic glass substrate dividing production line 100 will be explained. The glass substrate 50 wrapped in the cassette carrier 101 is taken out by a robot arm (feed robot arm) R1, and the taken-out glass substrate 50 is placed on the conveyor belt 102. Next, the glass substrate 50 is positioned on the feed side of the conveyor belt 102. Then, the glass substrate 50 is held by a robot arm (conveying robot arm) R2, and is conveyed to the line drawing device 103. The transported glass substrate 50 is placed on a workbench in the line drawing device 50. In the line drawing device 103, as described above, a blind crack BC is formed with respect to the glass substrate 50 along a previously designed line. In this line drawing device 103, when the predetermined blind crack BC is not formed on the surface of the glass substrate 50 as required, the image processing device 45 outputs a NG signal, and the operation of the line drawing device 103 is Abort and issue a warning to notify the occurrence of the exception. On the other hand, in the line drawing device 103, when a blind crack BC can be formed on the surface of the glass substrate 50 as required, the glass substrate 50 is held by the robot arm (transport robot arm) R3. And placed on the conveyor belt 104. The glass substrate 50 placed on the conveyor belt 104 is positioned on the forward side of the conveyor belt 104 and is conveyed to the breaking device 105 by a robot arm (conveying robot arm) R4, so the blind crack on the glass substrate 50 BC is positioned in the middle between the two half-tables. The glass substrate 50 is separated into a plurality of fragments by the breaking device 105 (hereinafter, each of the plurality of fragments of the glass substrate is referred to as a glass substrate 50B), and the robot arm (transport robot arm) R5 is placed on the transport conveyor Belt • 21 · This paper size applies to China National Standard (CNS) A4 (210X 297mm) gutter 592867

106 上。請注意到，其有可能接受—種裝置組態作為另—個生產線配置’其中當該影像處理裝置45產生- NG信號時，在其上並未形成一預定的盲裂縫Bc之玻璃基板5〇即自動地送離該生產線1〇〇 ^藉此，即可達到一完全自動化的操作。產業應用如上所述’本發明之脆性基板的畫線裝置及畫線方法能夠可靠地偵測到何時一盲裂缝並未形成在一玻璃基板上，藉此使其可能來防止不具有一盲裂缝形成在其上的玻璃基板來送入到一後續的分割步驟。因此，其有可能防止分割脆性基板的良率降低，以及分割效率的降低❶ -22 - 本紙張尺度適用中國國家標準(CNS) A4規格(210X 297公釐）106 on. Please note that it is possible to accept one device configuration as another production line configuration, wherein when the image processing device 45 generates a -NG signal, a predetermined blind crack Bc glass substrate 5 is not formed thereon. That is to say, it is automatically sent away from the production line 100 ^, so that a fully automated operation can be achieved. Industrial Application As described above, the line drawing device and line drawing method of the brittle substrate of the present invention can reliably detect when a blind crack is not formed on a glass substrate, thereby making it possible to prevent a blind crack The glass substrate formed thereon is fed into a subsequent dividing step. Therefore, it is possible to prevent the reduction of the yield of the fragile substrate and the reduction of the division efficiency. -22-This paper size applies the Chinese National Standard (CNS) A4 specification (210X 297 mm)

Claims

592867 A BCD 月 o 1X 年案(92 請本申換利替專圍號範 647相 112請 1申 09文第中月 ^ Ar/v idflsuvi..ig'i vh * i-L 六、申請專利範圍 1 · 一種脆性基板之畫線裝置，其特徵在於藉由在低於該脆性基板的軟化點之溫度下，沿著該脆性基板的表面上形成有刻畫線之區域連續地加熱，並連續地冷卻在該加熱區域附近的區域’以沿著刻畫線形成一盲裂缝，該裝置包含：影像拾取手段，用以拾取其中形成有該盲裂縫之區域的影像’該區域係靠近於該脆性基板表面上之冷卻區域 :及一影像處理裝置，用以預先儲存形成一盲裂縫狀態的〜像貝料，並比較該影像資料與前述影像拾取手段所得到的影像資料，以確認盲裂缝之形成。 2· —種畫線一脆性基板的方法，其特徵在於藉由在低於該脆性基板的軟化點之溫度下，沿著該脆性基板的表面上形成有刻畫線之區域連續地加熱，並連續地冷卻在該加熱區域附近的區域，以沿著刻畫線形成一盲裂縫，由該影像拾取手段拾取其中形成有該盲裂縫之區域的一影像，該區域係靠近於該脆性基板表面上的該冷卻區域，並比較所得影像資料與影像拾取手段中預先儲存之形成一ΐ裂縫狀態的影像資料，以確認盲裂縫之形成。 3. 如申請專利範圍第2項之方法，、，、甲形成有琢百裂縫之區域係位在該冷卻區域的正下處。 4. 如申請專利範圍第2或3項之方法，其中該影像拾取手段在-水平方向上的角度係設定成相對於該盲裂縫的3。。 O.\78\78927-921015.doc _ 1 _ 本：張尺度適用中ϋ國家標準(CNS) Μ規格(21GX297公董) ---一 A B c D 592867 六、申請專利範圍到9 0 °的範圍内。 5. 如申請專利範圍第3項之方法，其中該冷卻區域係位在該加熱的區域之内。 6. —種分割一脆性基板的自動生產線，其包含至少一如申請專利範圍第1項之脆性基板劃線裝置及至少一折斷裝置。 O:\78\78927-921015.doc - 2 - 本紙張尺度適用中國國家標準(CNS) A4規格(210 X 297公釐)592867 A BCD month o 1X case (92, please apply for the replacement of the special perimeter number 647 phase 112, please apply for the 1st and 09th article ^ Ar / v idflsuvi..ig'i vh * iL Six, the scope of patent application 1 A line drawing device for a fragile substrate, characterized by continuously heating and continuously cooling the area along the surface of the fragile substrate where a scribe line is formed at a temperature lower than the softening point of the fragile substrate. A region near the heating region 'forms a blind crack along the scribed line. The device includes: an image pickup means for picking up an image of the region where the blind crack is formed. The region is close to the surface of the brittle substrate. Cooling area: and an image processing device for pre-storing ~~ shell material that forms a blind crack, and comparing the image data with the image data obtained by the aforementioned image pickup means to confirm the formation of blind cracks. 2 · — A method for drawing a line with a brittle substrate is characterized in that a region with a line for engraving is formed along the surface of the brittle substrate at a temperature lower than the softening point of the brittle substrate. The area near the heating area is continuously heated and continuously cooled to form a blind crack along the engraved line. An image of the area in which the blind crack is formed is picked up by the image pickup means, and the area is close to the area. The cooling area on the surface of the fragile substrate is compared with the obtained image data and the image data in the state of forming a crack in the image pickup means to confirm the formation of blind cracks. 3. If the method of the second item of the scope of patent application, The area where a hundred cracks are formed is located directly below the cooling area. 4. For the method of item 2 or 3 of the patent application scope, wherein the angle of the image pickup means in the horizontal direction is set Relative to the blind crack of 3. O. \ 78 \ 78927-921015.doc _ 1 _ This: The Zhang scale is applicable to the China National Standard (CNS) M specification (21GX297 public director) --- AB c D 592867 6. The scope of patent application is within the range of 90 °. 5. The method according to item 3 of the scope of patent application, wherein the cooling area is located within the heated area. 6.-A method of dividing a brittle substrate Mobile production line, which includes at least one brittle substrate scribing device and at least one breaking device as in the scope of application for patent 1. O: \ 78 \ 78927-921015.doc-2-This paper size applies to China National Standard (CNS) A4 Specifications (210 X 297 mm)