JP5692241B2 - 逆阻止型半導体素子の製造方法 - Google Patents
逆阻止型半導体素子の製造方法 Download PDFInfo
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- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
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Description
裏面からのボロンのイオン注入により分離層4を形成する際に、イオン注入時の基板温度を室温とし、イオン注入を、ボロンのドーズ量を1×1015cm-2,加速電圧を150keVとして行なう。続くアニール処理は、レーザーアニール処理のみとする。レーザーアニール処理条件は、YAG2ωレーザー(波長532nm;パルス幅100ns)の照射エネルギー密度、3J/cm2の条件で行なう。
比較例1では、前述の従来例と異なり、基板の裏面側プロセスでpコレクタ層を形成する際に、FZ−n基板を400℃〜500℃に加熱した状態で、その裏面にボロンを注入し、アニール処理は炉アニール処理を行うプロセスである。たとえば、ヒータ等の基板加熱機構を備えた試料台の上にFZ−n基板をその表面側(表面電極が形成されている側)を下にして載置し、これを所定温度(400℃〜500℃)で加熱するとともに、半導体基板(FZ−n半導体基板)1の裏面側(pコレクタ層を形成する側)から、ボロンのイオン注入を行うプロセスとする。炉アニール処理の条件は、400℃で、5時間とした。
比較例2は前記比較例1のプロセスのうち、アニール処理を炉アニール処理からレーザーアニール処理に変更したことが異なり、その他のプロセスは同じである。レーザーアニール処理の条件は、前述の従来例のレーザーアニール処理条件と同じ、YAG2ωレーザー(波長532nm;パルス幅100ns)の照射エネルギー密度、3J/cm2の条件である。
本発明の逆阻止型IGBTにかかる実施の形態1について説明する。コレクタ層6および分離層4におけるイオン注入層を活性化するために、イオン注入時に半導体基板1を加熱しながらイオン注入をおこなう。そして、さらに、活性化のためにレーザーアニール処理と炉アニール処理との両方のアニール処理を、この順に、行うところが実施の形態1にかかる逆阻止型半導体素子の製造方法の特徴部分である。
つぎに、本発明の逆阻止型IGBTにかかる実施の形態2について説明する。コレクタ層6および分離層4のイオン注入層を活性化するためにイオン注入時に半導体基板1を400℃〜500℃に加熱しながらイオン注入をおこなう。そして、更に活性化のために先に炉アニール処理、その後、レーザーアニール処理を行う。
2 酸化膜マスク
3 開口部
4、4b 分離層
4a 拡散層
5 ボロンソース
6 pコレクタ層
7 コレクタ電極
8 スクライブライン
10 表面構造
11 トレンチ
12 薬液残渣
13 レジスト残渣
15 nエミッタ領域
16 pベース領域
20 結晶欠陥
21 ゲート絶縁膜
22 ゲート電極
23 層間絶縁膜
24 エミッタ電極
Claims (5)
- 第1導電型の半導体基板の一方の主面にMOSゲート構造を含む主要表面構造を形成する工程と、他方の主面に第2導電型コレクタ層を形成する工程と、前記主要表面構造を取り巻く外周にあって、いずれか一方の主面から他方の主面にかけてエッチング形成されるテーパー溝の側辺面に沿って、前記両主面間を連結するとともに前記他方の主面の第2導電型コレクタ層に接続される第2導電型分離層を形成する工程とを有する逆阻止型半導体素子の製造方法において、前記第2導電型コレクタ層と前記第2導電型分離層とを形成する工程がそれぞれ前記半導体基板を400℃乃至500℃のいずれかの温度に保持した状態で第2導電型不純物元素をイオン注入し、レーザーアニール処理と350℃乃至500℃のいずれかの温度による炉アニール処理との両方のアニール処理を行って前記第2導電型コレクタ層と前記第2導電型分離層とをそれぞれ形成する工程であることを特徴とする逆阻止型半導体素子の製造方法。
- 前記両方のアニール処理を、レーザーアニール処理を先にして、その後、350℃乃至500℃のいずれかの温度による炉アニール処理の順に行うことを特徴とする請求項1記載の逆阻止型半導体素子の製造方法。
- 前記両方のアニール処理を、350℃乃至500℃のいずれかの温度による炉アニール処理を先にして、その後、レーザーアニール処理の順に行うことを特徴とする請求項1記載の逆阻止型半導体素子の製造方法。
- 前記第2導電型コレクタ層と前記第2導電型分離層とを形成する工程が同時に行われることを特徴とする請求項1乃至3のいずれか一項に記載の逆阻止型半導体素子の製造方法。
- 前記350℃乃至500℃のいずれかの温度による炉アニール処理の保持時間を1時間乃至10時間とすることを特徴とする請求項1記載の逆阻止型半導体素子の製造方法。
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JP2012553716A JP5692241B2 (ja) | 2011-01-18 | 2012-01-16 | 逆阻止型半導体素子の製造方法 |
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US (1) | US8853009B2 (ja) |
JP (1) | JP5692241B2 (ja) |
CN (1) | CN103329255A (ja) |
DE (1) | DE112012000501T5 (ja) |
WO (1) | WO2012099080A1 (ja) |
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GB2532869A (en) * | 2013-08-28 | 2016-06-01 | Qubeicon Ltd | Semiconductor die and package jigsaw submount |
DE102015117821B4 (de) * | 2015-10-20 | 2021-09-09 | Infineon Technologies Ag | Verfahren zum Bilden eines Halbleiterbauelements |
JP7339819B2 (ja) * | 2019-09-04 | 2023-09-06 | 株式会社東芝 | 半導体装置の製造方法および半導体装置 |
Citations (3)
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JP2003059856A (ja) * | 2001-08-09 | 2003-02-28 | Fuji Electric Co Ltd | 半導体装置の製造方法 |
JP2005268487A (ja) * | 2004-03-18 | 2005-09-29 | Fuji Electric Device Technology Co Ltd | 半導体素子の製造方法および半導体素子の製造装置 |
JP2006303410A (ja) * | 2005-03-25 | 2006-11-02 | Fuji Electric Holdings Co Ltd | 半導体装置およびその製造方法 |
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US4904609A (en) | 1988-05-06 | 1990-02-27 | General Electric Company | Method of making symmetrical blocking high voltage breakdown semiconductor device |
JP4696337B2 (ja) | 1999-10-15 | 2011-06-08 | 富士電機システムズ株式会社 | 半導体装置 |
JP4788028B2 (ja) | 2000-08-28 | 2011-10-05 | 富士電機株式会社 | 逆阻止型igbtを逆並列に接続した双方向igbt |
JP4747260B2 (ja) | 2003-04-16 | 2011-08-17 | 富士電機株式会社 | 逆阻止型絶縁ゲート形バイポーラトランジスタの製造方法 |
US7776672B2 (en) * | 2004-08-19 | 2010-08-17 | Fuji Electric Systems Co., Ltd. | Semiconductor device and manufacturing method thereof |
JP4982948B2 (ja) | 2004-08-19 | 2012-07-25 | 富士電機株式会社 | 半導体装置の製造方法 |
DE102008003953A1 (de) | 2007-02-28 | 2008-09-04 | Fuji Electric Device Technology Co. Ltd. | Verfahren zur Herstellung eines Halbleiterelements |
JP5668270B2 (ja) | 2008-12-11 | 2015-02-12 | 富士電機株式会社 | 半導体素子の製造方法 |
JP2010212530A (ja) | 2009-03-12 | 2010-09-24 | Fuji Electric Systems Co Ltd | 半導体素子の製造方法 |
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JP2005268487A (ja) * | 2004-03-18 | 2005-09-29 | Fuji Electric Device Technology Co Ltd | 半導体素子の製造方法および半導体素子の製造装置 |
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