JP5684244B2 - ジャイロスコープパッケージングアセンブリ - Google Patents
ジャイロスコープパッケージングアセンブリ Download PDFInfo
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- JP5684244B2 JP5684244B2 JP2012513095A JP2012513095A JP5684244B2 JP 5684244 B2 JP5684244 B2 JP 5684244B2 JP 2012513095 A JP2012513095 A JP 2012513095A JP 2012513095 A JP2012513095 A JP 2012513095A JP 5684244 B2 JP5684244 B2 JP 5684244B2
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- 238000004806 packaging method and process Methods 0.000 title claims description 21
- 239000000758 substrate Substances 0.000 claims description 51
- 238000000034 method Methods 0.000 claims description 34
- 229910000679 solder Inorganic materials 0.000 claims description 13
- 230000008569 process Effects 0.000 claims description 7
- 238000009429 electrical wiring Methods 0.000 claims description 6
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 claims description 4
- 238000001816 cooling Methods 0.000 claims description 2
- 238000007789 sealing Methods 0.000 claims 1
- 239000000463 material Substances 0.000 description 14
- 238000001514 detection method Methods 0.000 description 13
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 9
- 229910052710 silicon Inorganic materials 0.000 description 9
- 239000010703 silicon Substances 0.000 description 9
- 230000033001 locomotion Effects 0.000 description 8
- 238000005530 etching Methods 0.000 description 6
- 230000005284 excitation Effects 0.000 description 6
- 238000005516 engineering process Methods 0.000 description 5
- 239000002131 composite material Substances 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 4
- 230000002093 peripheral effect Effects 0.000 description 4
- 239000000853 adhesive Substances 0.000 description 3
- 230000001070 adhesive effect Effects 0.000 description 3
- 230000008901 benefit Effects 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 3
- 229910052737 gold Inorganic materials 0.000 description 3
- 239000010931 gold Substances 0.000 description 3
- 230000004044 response Effects 0.000 description 3
- 235000012431 wafers Nutrition 0.000 description 3
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 2
- 230000000712 assembly Effects 0.000 description 2
- 238000000429 assembly Methods 0.000 description 2
- 230000008859 change Effects 0.000 description 2
- 239000004020 conductor Substances 0.000 description 2
- 238000013016 damping Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 230000006870 function Effects 0.000 description 2
- 238000002955 isolation Methods 0.000 description 2
- 230000007246 mechanism Effects 0.000 description 2
- 238000005459 micromachining Methods 0.000 description 2
- 238000000206 photolithography Methods 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- 230000035882 stress Effects 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 235000015842 Hesperis Nutrition 0.000 description 1
- 235000012633 Iberis amara Nutrition 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- 230000001133 acceleration Effects 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 230000002939 deleterious effect Effects 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 239000000835 fiber Substances 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 238000004377 microelectronic Methods 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 238000005457 optimization Methods 0.000 description 1
- 238000012536 packaging technology Methods 0.000 description 1
- 230000003071 parasitic effect Effects 0.000 description 1
- 239000010453 quartz Substances 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 230000008646 thermal stress Effects 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- 239000010936 titanium Substances 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- 238000009461 vacuum packaging Methods 0.000 description 1
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Classifications
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01C—MEASURING DISTANCES, LEVELS OR BEARINGS; SURVEYING; NAVIGATION; GYROSCOPIC INSTRUMENTS; PHOTOGRAMMETRY OR VIDEOGRAMMETRY
- G01C19/00—Gyroscopes; Turn-sensitive devices using vibrating masses; Turn-sensitive devices without moving masses; Measuring angular rate using gyroscopic effects
- G01C19/56—Turn-sensitive devices using vibrating masses, e.g. vibratory angular rate sensors based on Coriolis forces
- G01C19/5642—Turn-sensitive devices using vibrating masses, e.g. vibratory angular rate sensors based on Coriolis forces using vibrating bars or beams
- G01C19/5663—Manufacturing; Trimming; Mounting; Housings
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01C—MEASURING DISTANCES, LEVELS OR BEARINGS; SURVEYING; NAVIGATION; GYROSCOPIC INSTRUMENTS; PHOTOGRAMMETRY OR VIDEOGRAMMETRY
- G01C19/00—Gyroscopes; Turn-sensitive devices using vibrating masses; Turn-sensitive devices without moving masses; Measuring angular rate using gyroscopic effects
- G01C19/56—Turn-sensitive devices using vibrating masses, e.g. vibratory angular rate sensors based on Coriolis forces
- G01C19/567—Turn-sensitive devices using vibrating masses, e.g. vibratory angular rate sensors based on Coriolis forces using the phase shift of a vibration node or antinode
- G01C19/5677—Turn-sensitive devices using vibrating masses, e.g. vibratory angular rate sensors based on Coriolis forces using the phase shift of a vibration node or antinode of essentially two-dimensional vibrators, e.g. ring-shaped vibrators
- G01C19/5684—Turn-sensitive devices using vibrating masses, e.g. vibratory angular rate sensors based on Coriolis forces using the phase shift of a vibration node or antinode of essentially two-dimensional vibrators, e.g. ring-shaped vibrators the devices involving a micromechanical structure
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Radar, Positioning & Navigation (AREA)
- Remote Sensing (AREA)
- Manufacturing & Machinery (AREA)
- Gyroscopes (AREA)
Description
Howard H.Ge及びA. Dorian Challonerによる「Environmentally Robust Disc Resonator Gyroscope」と題する同時係属中の2009年4月1日出願の米国特許出願第12/416911号(米国特許出願公開第US2010/0251818A1号)。
Howard H.Ge及びA. Dorian Challonerによる「Isolated Active Temperature Regulator for Vacuum Packaging of a Disk Resonator Gyroscope」と題する同時係属中の2009年5月27日出願の米国特許出願第12/473084号(米国特許出願公開第US2010/0300201A1号)。
Kirill V. Shcheglovらによる「Method of Producing an Inertial Sensor」と題する2006年3月9日出願の米国特許第7401397号。
Kirill V. Shcheglovらによる「Integral Resonator Gyroscope」と題する2005年8月8日出願の米国特許第7347095号。
「Disk Resonator Gyroscope」と題する2006年7月20日出願の米国特許出願第11/458911号(米国特許出願公開第US2007/0017287A1号)。
「Planar Resonator Gyroscope with Central Die Attachment」と題する2007年6月4日出願の米国特許出願第11/757395号(米国特許出願公開第US2008/0295622A1号)。
「Vibratory Gyroscope with Parasitic Mode Dampening」と題する2006年12月22日出願の米国特許出願第11/615872号(米国特許出願公開第US2008/0148846A1号)。
「Disk Resonator Integral Inertial Measurement Unit」と題する2006年12月22日出願の米国特許出願第11/831822号(米国特許出願公開第US2010/0024546A1号)。
Claims (17)
- 支持材(140)と、
支持材に取り付けられた基板(130)と、
基板に接続されて基板との間に空洞(125)を画定するベースプレート(110)と、
ベースプレートに取り付けられており、かつ空洞内に吊り下げられている共振器(120、200)と
を備え、
基板の少なくとも一部が除去されることにより複数の片持ち梁状部分が画定されており、
ベースプレートが複数の片持ち梁状部分のうちの少なくとも1つに載せて基板に接続されている、パッケージングされた共振器ジャイロスコープ(100)。 - 基板が支持材に剛性支持マウント(135)により取り付けられている、請求項1に記載のパッケージングされた共振器ジャイロスコープ。
- 基板が少なくとも1つの半田ボール(134)を介して支持材に取り付けられている、請求項1に記載のパッケージングされた共振器ジャイロスコープ。
- 少なくとも1つの半田ボールがサーマルピラーバンプを含んでいる、請求項3に記載のパッケージングされた共振器ジャイロスコープ。
- 基板が少なくとも1つのピラーを介して支持材に取り付けられている、請求項1に記載のパッケージングされた共振器ジャイロスコープ。
- ベースプレートが少なくとも1つの第1電気配線を含み、
基板が少なくとも1つの第2電気配線を含み、
第1電気配線が第2電気配線に接続されている、
請求項1に記載のパッケージングされた共振器ジャイロスコープ。 - 少なくとも1つの第2電気配線が少なくとも1つのリードワイヤに接続されている、請求項6に記載のパッケージングされた共振器ジャイロスコープ。
- 更に、共振器パッケージを封止するキャップを備えている、請求項1に記載のパッケージングされた共振器ジャイロスコープ。
- 更に、キャップに接続されるゲッター層を備えている、請求項8に記載のパッケージングされた共振器ジャイロスコープ。
- 更に、熱電冷却モジュールを備えている、請求項1に記載のパッケージングされた共振器ジャイロスコープ。
- プレーナ共振器ジャイロスコープ(100)をパッケージングする方法であって、
プレーナ共振器及びベースプレートを含むプレーナ共振器チップを基板に取り付けて、基板とベースプレートとの間に空洞を画定し、空洞内に共振器を吊り下げる工程(410)と、
基板を支持材に取り付ける工程(415)と、
キャップを支持材に堅く固定する工程(425)と
を含み、
基板の少なくとも一部を除去することにより複数の片持ち梁状部分を画定し、
複数の片持ち梁状部分のうちの少なくとも1つに載せて、ベースプレートを基板に接続する、方法。 - プレーナ共振器及びベースプレートを含むプレーナ共振器チップを基板に取り付ける工程が、ベースプレートと基板との間に電気接続線を設ける工程(420)を含む、請求項11に記載の方法。
- 基板を支持材に取り付ける工程が、剛性支持マウントを設ける工程を含む、請求項11に記載の方法。
- 基板を支持材に取り付ける工程が、少なくとも1つの半田ボールを使用して基板を支持材に堅く固定する工程を含む、請求項11に記載の方法。
- 基板を支持材に取り付ける工程が、少なくとも1つのピラーを使用して基板を支持材に堅く固定する工程を含む、請求項11に記載の方法。
- 更に、基板と少なくとも1つのリードワイヤとの間に電気接続線を設ける工程を含む、請求項15に記載の方法。
- 更に、ゲッター層をキャップに堅く固定する工程を含む、請求項11に記載の方法。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US12/475,963 US8418554B2 (en) | 2009-06-01 | 2009-06-01 | Gyroscope packaging assembly |
US12/475,963 | 2009-06-01 | ||
PCT/US2010/034669 WO2010141194A1 (en) | 2009-06-01 | 2010-05-13 | Gyroscope packaging assembly |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2012529011A JP2012529011A (ja) | 2012-11-15 |
JP5684244B2 true JP5684244B2 (ja) | 2015-03-11 |
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JP2012513095A Active JP5684244B2 (ja) | 2009-06-01 | 2010-05-13 | ジャイロスコープパッケージングアセンブリ |
Country Status (6)
Country | Link |
---|---|
US (1) | US8418554B2 (ja) |
EP (1) | EP2438399B1 (ja) |
JP (1) | JP5684244B2 (ja) |
CN (1) | CN102449434B (ja) |
CA (1) | CA2760961C (ja) |
WO (1) | WO2010141194A1 (ja) |
Families Citing this family (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2010119573A1 (ja) * | 2009-04-17 | 2010-10-21 | 株式会社日立製作所 | 慣性センサおよびその製造方法 |
CN103780221B (zh) * | 2014-01-02 | 2017-03-22 | 东南大学 | 一种具有低热弹性阻尼结构的扭转式微机电谐振器件 |
CN104976995B (zh) * | 2015-08-07 | 2018-05-25 | 中国人民解放军国防科学技术大学 | 变谐振环壁厚的嵌套环式mems振动陀螺 |
US10352960B1 (en) * | 2015-10-30 | 2019-07-16 | Garmin International, Inc. | Free mass MEMS accelerometer |
US10794700B1 (en) * | 2015-10-30 | 2020-10-06 | Garmin International, Inc. | Stress isolation of resonating gyroscopes |
CN105628013B (zh) * | 2016-01-07 | 2018-06-19 | 东南大学 | 一种组装式半球谐振微陀螺仪及其加工工艺 |
CN105466405B (zh) * | 2016-01-07 | 2018-02-02 | 东南大学 | 一种混合式半球谐振微陀螺仪及其加工工艺 |
CN106556386B (zh) * | 2016-11-15 | 2019-11-08 | 东南大学 | 硅基微壳体谐振器及其制备方法 |
EP4006503A1 (en) * | 2019-07-30 | 2022-06-01 | Kyocera Corporation | Vibrometer and vibration detection method |
US11981560B2 (en) | 2020-06-09 | 2024-05-14 | Analog Devices, Inc. | Stress-isolated MEMS device comprising substrate having cavity and method of manufacture |
US20230245950A1 (en) * | 2022-01-31 | 2023-08-03 | Adeia Semiconductor Bonding Technologies Inc. | Heat dissipating system for electronic devices |
JP2023128270A (ja) * | 2022-03-03 | 2023-09-14 | 株式会社東芝 | センサ |
Family Cites Families (26)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB2208318B (en) | 1987-07-24 | 1991-11-06 | Yazaki Corp | Vibrational angular velocity sensor |
US5894090A (en) * | 1996-05-31 | 1999-04-13 | California Institute Of Technology | Silicon bulk micromachined, symmetric, degenerate vibratorygyroscope, accelerometer and sensor and method for using the same |
US6032531A (en) * | 1997-08-04 | 2000-03-07 | Kearfott Guidance & Navigation Corporation | Micromachined acceleration and coriolis sensor |
GB9817347D0 (en) | 1998-08-11 | 1998-10-07 | British Aerospace | An angular rate sensor |
EP1076430A1 (en) * | 1999-07-23 | 2001-02-14 | BRITISH TELECOMMUNICATIONS public limited company | Optical regenerator for high-bitrate OTDM signals |
GB0001775D0 (en) * | 2000-01-27 | 2000-03-22 | British Aerospace | Improvements relating to angular rate sensor devices |
JP2002181550A (ja) * | 2000-10-02 | 2002-06-26 | Ngk Insulators Ltd | 角速度測定装置 |
FR2824636B1 (fr) * | 2001-05-10 | 2003-09-05 | Schlumberger Services Petrol | Capteur de pression microelectronique a resonateur supportant des pressions elevees |
US6487864B1 (en) * | 2002-04-23 | 2002-12-03 | Honeywell International Inc. | Cyrogenic inertial micro-electro-mechanical system (MEMS) device |
US7312674B2 (en) * | 2002-08-06 | 2007-12-25 | The Charles Stark Draper Laboratory, Inc. | Resonator system with a plurality of individual mechanically coupled resonators and method of making same |
US6944931B2 (en) | 2002-08-12 | 2005-09-20 | The Boeing Company | Method of producing an integral resonator sensor and case |
US7040163B2 (en) | 2002-08-12 | 2006-05-09 | The Boeing Company | Isolated planar gyroscope with internal radial sensing and actuation |
US6806557B2 (en) * | 2002-09-30 | 2004-10-19 | Motorola, Inc. | Hermetically sealed microdevices having a single crystalline silicon getter for maintaining vacuum |
US7581443B2 (en) | 2005-07-20 | 2009-09-01 | The Boeing Company | Disc resonator gyroscopes |
US7068126B2 (en) * | 2004-03-04 | 2006-06-27 | Discera | Method and apparatus for frequency tuning of a micro-mechanical resonator |
JP5037819B2 (ja) | 2005-03-04 | 2012-10-03 | ソニー株式会社 | 電子機器 |
WO2008001908A1 (fr) | 2006-06-30 | 2008-01-03 | Sony Corporation | Gyro-capteur d'oscillations |
JP2008039576A (ja) * | 2006-08-07 | 2008-02-21 | Sony Corp | 振動型ジャイロセンサ |
US7493814B2 (en) | 2006-12-22 | 2009-02-24 | The Boeing Company | Vibratory gyroscope with parasitic mode damping |
US7793541B2 (en) | 2007-06-04 | 2010-09-14 | The Boeing Company | Planar resonator gyroscope central die attachment |
JP2009028891A (ja) * | 2007-06-27 | 2009-02-12 | Sumitomo Precision Prod Co Ltd | ゲッター膜を有する密閉空間内に形成されたmemsデバイス |
US7836765B2 (en) | 2007-07-31 | 2010-11-23 | The Boeing Company | Disc resonator integral inertial measurement unit |
WO2010077311A1 (en) * | 2008-12-17 | 2010-07-08 | Sand9, Inc. | Multi-port mechanical resonating devices and related methods |
US8393212B2 (en) | 2009-04-01 | 2013-03-12 | The Boeing Company | Environmentally robust disc resonator gyroscope |
US8327526B2 (en) | 2009-05-27 | 2012-12-11 | The Boeing Company | Isolated active temperature regulator for vacuum packaging of a disc resonator gyroscope |
US8106724B1 (en) * | 2009-07-23 | 2012-01-31 | Integrated Device Technologies, Inc. | Thin-film bulk acoustic resonators having perforated resonator body supports that enhance quality factor |
-
2009
- 2009-06-01 US US12/475,963 patent/US8418554B2/en active Active
-
2010
- 2010-05-13 CN CN201080024156.3A patent/CN102449434B/zh active Active
- 2010-05-13 WO PCT/US2010/034669 patent/WO2010141194A1/en active Application Filing
- 2010-05-13 EP EP10722229.1A patent/EP2438399B1/en active Active
- 2010-05-13 JP JP2012513095A patent/JP5684244B2/ja active Active
- 2010-05-13 CA CA2760961A patent/CA2760961C/en active Active
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Publication number | Publication date |
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CA2760961C (en) | 2014-10-21 |
US8418554B2 (en) | 2013-04-16 |
US20100300202A1 (en) | 2010-12-02 |
CN102449434A (zh) | 2012-05-09 |
CA2760961A1 (en) | 2010-12-09 |
JP2012529011A (ja) | 2012-11-15 |
EP2438399A1 (en) | 2012-04-11 |
EP2438399B1 (en) | 2015-07-08 |
CN102449434B (zh) | 2016-01-20 |
WO2010141194A1 (en) | 2010-12-09 |
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