JP5612574B2 - ワークピース上に反応ガス混合物から層を析出するためのcvd反応器 - Google Patents
ワークピース上に反応ガス混合物から層を析出するためのcvd反応器 Download PDFInfo
- Publication number
- JP5612574B2 JP5612574B2 JP2011519149A JP2011519149A JP5612574B2 JP 5612574 B2 JP5612574 B2 JP 5612574B2 JP 2011519149 A JP2011519149 A JP 2011519149A JP 2011519149 A JP2011519149 A JP 2011519149A JP 5612574 B2 JP5612574 B2 JP 5612574B2
- Authority
- JP
- Japan
- Prior art keywords
- reactor
- workpiece
- conduit
- cvd
- inflow
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/4412—Details relating to the exhausts, e.g. pumps, filters, scrubbers, particle traps
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/22—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the deposition of inorganic material, other than metallic material
- C23C16/30—Deposition of compounds, mixtures or solid solutions, e.g. borides, carbides, nitrides
- C23C16/34—Nitrides
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/22—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the deposition of inorganic material, other than metallic material
- C23C16/30—Deposition of compounds, mixtures or solid solutions, e.g. borides, carbides, nitrides
- C23C16/36—Carbonitrides
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/448—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for generating reactive gas streams, e.g. by evaporation or sublimation of precursor materials
- C23C16/4488—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for generating reactive gas streams, e.g. by evaporation or sublimation of precursor materials by in situ generation of reactive gas by chemical or electrochemical reaction
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/455—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for introducing gases into reaction chamber or for modifying gas flows in reaction chamber
- C23C16/45563—Gas nozzles
- C23C16/45578—Elongated nozzles, tubes with holes
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/458—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for supporting substrates in the reaction chamber
- C23C16/4582—Rigid and flat substrates, e.g. plates or discs
- C23C16/4583—Rigid and flat substrates, e.g. plates or discs the substrate being supported substantially horizontally
- C23C16/4584—Rigid and flat substrates, e.g. plates or discs the substrate being supported substantially horizontally the substrate being rotated
Landscapes
- Chemical & Material Sciences (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Inorganic Chemistry (AREA)
- Electrochemistry (AREA)
- Chemical Vapour Deposition (AREA)
Description
水素、窒素、炭化水素、(飽和、不飽和、芳香族)アミン、アンモニア、ヒドラジン、二酸化炭素、一酸化炭素、一酸化窒素、シラン、ボラン、ハロゲン化物、BCl3、SiCl4、SiCl3CH3、WF6。
TiCl4、BBr3、CH3CN、CH3OH、金属有機化合物、例えばトリメチルアルミニウム、白金アセトニルアセトネート、VCl4。
CrCl2、MoCl5、TiJ4、AlCl3、HfCl4、NbCl5。
単層、多層、勾配混合物、挿入体、マルチレイヤーとしての遷移金属、IVB−VIIBの炭化物、窒化物、酸化物、ホウ化物、ケイ化物、リン化物、並びにSi、N、Al、C...の共有結合化合物。
純金属、合金、鋼、硬質金属、超合金、セラミック、グラファイトなど。
Claims (15)
- ワークピース上に反応ガスから層を析出するためのCVD反応器であって:
反応器壁(11)と反応器床(12)とによって仕切られた、細長い、鉛直方向に延びる反応器室(10)と、
前記反応器床(12)の領域内で前記反応器室(10)内に入る、反応ガスを前記反応器室(10)内に流入させるための流入導管(34)と、
前記反応器床の領域内で前記反応器室(10)から出る、前記反応器室(10)から使用済反応ガスを流出させるための流出導管(31)と、
前記反応器室(10)内に配置されて中心軸線を中心として回転可能な多階層状のワークピース収容体(21)であって、前記ワークピース収容体の中心軸線と、前記流出導管の中心軸線とが合致している、多階層状のワークピース収容体(21)と、を具備しており、
前記流出導管が固定されたものとして構築されていて、前記流入導管が前記ワークピース収容体と前記反応器壁との間に配設されていることを特徴とする、CVD反応器。 - 前記反応器壁(11)が少なくとも部分的に加熱可能であり、そして前記流入導管(34)が、前記反応器壁(11)の加熱可能な部分に対して平行に延びる管である、請求項1に記載のCVD反応器。
- 前記流入導管(34)の長さは、これが前記ワークピース収容体のほぼ最上階層まで延びるように設定されている、請求項2に記載のCVD反応器。
- 前記ワークピース収容体の1階層当たり、それぞれの階層に対応して、前記流入導管内に少なくとも1つの開口(36)が設けられており、
反応ガスが前記流入導管の前記開口(36)から半径方向に前記階層に沿って中心の前記流出導管(31)まで流動し得るように、前記階層が半径方向にアクセス可能(26)である、請求項3に記載のCVD反応器。 - 前記流出導管(31)が、前記反応器床(12)の中心から最上階層まで延びる管であり、そして前記管は、1階層当たり、それぞれの階層の高さに、使用済反応ガスを前記流出導管(31)内に流入させるための少なくとも1つの開口(36)を有している、請求項1から4までのいずれか1項に記載のCVD反応器。
- 前記流入導管(34)が、前記反応器床(12)とは反対側の端部(35)で開放しており、そして前記ワークピース収容体(21)が、前記反応器床(12)とは反対側の端部に、開口(40)を備えた閉鎖板(22)を有していることにより、反応ガスが、前記流入導管(34)の開口(35)から、前記閉鎖板(22)の前記開口(40)を通って前記反応器床(12)の方向に流れることができ、そして中心の前記流出導管(31)を介して前記反応器室(10)から流出することができる、請求項2から5までのいずれか1項に記載のCVD反応器。
- 前記閉鎖板(22)の上方の領域に、前記反応器室(10)内の混合空間(42)が形成されており、前記混合空間内には反応ガスが流入することができる、請求項6に記載のCVD反応器。
- 複数の流入導管(34)が設けられており、前記複数の流入導管(34)を介して、複数の異なる反応ガスが、前記反応器室(10)内で混合することによって所定の反応ガスを形成するために、別々に前記反応器室(10)内に流入することができる、請求項1から7までのいずれか1項に記載のCVD反応器。
- 前記流入導管が、断熱材料から形成された複数の通路を有している、請求項8に記載のCVD反応器。
- 前記流入導管(34)内に形成された開口(36)が、流出する反応ガスが互いに衝突するように方向付けされている、請求項8に記載のCVD反応器。
- 前記ワークピース収容体(21)が前記反応器床(12)の領域内に内側歯列(28)を有しており、前記内側歯列には、前記ワークピース収容体(21)を回転させるために、被駆動歯車(29)が噛み合っている、請求項1から10までのいずれか1項に記載のCVD反応器。
- 1つ又は2つ以上の反応ガス発生器が前記反応器床の領域で、前記流入導管内に組み込まれており、そして前記反応器室内に配置されている、請求項1から11までのいずれか1項に記載のCVD反応器。
- 前記反応器室(10)内のガスを***させ、分解し、及び/又は活性化するためのモジュールが前記流入導管(34)内に組み込まれている、請求項1から12までのいずれか1項に記載のCVD反応器。
- 前記流出導管(31)及び/又は前記ワークピース収容体(21)が中心に配置されている、請求項1から13までのいずれか1項に記載のCVD反応器。
- 前記ワークピース収容体がその中心軸線だけにたいして回転可能である、請求項1〜14のいずれか1項に記載のCVD反応器。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE102008034330A DE102008034330A1 (de) | 2008-07-23 | 2008-07-23 | CVD-Reaktor zur Abscheidung von Schichten aus einem Reaktionsgasgemisch auf Werkstücken |
DE102008034330.7 | 2008-07-23 | ||
PCT/EP2009/059360 WO2010010088A1 (de) | 2008-07-23 | 2009-07-21 | Cvd-reaktor zur abscheidung von schichten aus einem reaktionsgasgemisch auf werkstücken |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2011528753A JP2011528753A (ja) | 2011-11-24 |
JP5612574B2 true JP5612574B2 (ja) | 2014-10-22 |
Family
ID=41171067
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2011519149A Active JP5612574B2 (ja) | 2008-07-23 | 2009-07-21 | ワークピース上に反応ガス混合物から層を析出するためのcvd反応器 |
Country Status (11)
Country | Link |
---|---|
US (1) | US9297070B2 (ja) |
EP (1) | EP2304075B1 (ja) |
JP (1) | JP5612574B2 (ja) |
CN (1) | CN102165099B (ja) |
DE (1) | DE102008034330A1 (ja) |
DK (1) | DK2304075T3 (ja) |
ES (1) | ES2543732T3 (ja) |
PL (1) | PL2304075T3 (ja) |
PT (1) | PT2304075E (ja) |
SI (1) | SI2304075T1 (ja) |
WO (1) | WO2010010088A1 (ja) |
Families Citing this family (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102008034330A1 (de) * | 2008-07-23 | 2010-01-28 | Ionbond Ag Olten | CVD-Reaktor zur Abscheidung von Schichten aus einem Reaktionsgasgemisch auf Werkstücken |
DE102010000479A1 (de) * | 2010-02-19 | 2011-08-25 | Aixtron Ag, 52134 | Vorrichtung zur Homogenisierung eines verdampften Aerosols sowie Vorrichtung zum Abscheiden einer organischen Schicht auf einem Substrat mit einer derartigen Homogenisierungseinrichtung |
TWI475129B (zh) * | 2010-12-15 | 2015-03-01 | Ncd Co Ltd | 薄膜沉積方法及其系統 |
CN102191484A (zh) * | 2011-06-28 | 2011-09-21 | 上海宏力半导体制造有限公司 | 反应气体源喷射管、炉管以及半导体制造装置 |
CN103160799A (zh) * | 2011-12-19 | 2013-06-19 | 同方威视技术股份有限公司 | 中子敏感镀膜及其形成方法 |
CN103361633B (zh) * | 2012-04-01 | 2015-07-01 | 北京北方微电子基地设备工艺研究中心有限责任公司 | 一种进气装置、反应腔室以及等离子体加工设备 |
JP6358420B2 (ja) * | 2014-01-10 | 2018-07-18 | 三菱マテリアル株式会社 | 減圧式縦型化学蒸着装置及び化学蒸着方法 |
JP6511798B2 (ja) * | 2014-12-22 | 2019-05-15 | 三菱マテリアル株式会社 | 化学蒸着装置、化学蒸着方法 |
US20160333478A1 (en) | 2014-01-10 | 2016-11-17 | Mitsubishi Materials Corporation | Chemical vapor deposition apparatus and chemical vapor deposition method |
DE102014205426A1 (de) * | 2014-03-24 | 2015-09-24 | Siemens Aktiengesellschaft | Gestell zur Halterung von Bauteilen |
DE112014006594B4 (de) * | 2014-04-16 | 2023-07-13 | Mitsubishi Electric Corporation | Anweisungswerterzeugungsvorrichtung |
CN106191808B (zh) * | 2016-09-05 | 2019-01-01 | 江苏协鑫特种材料科技有限公司 | 一种化学气相沉积反应器 |
CN109857171A (zh) * | 2017-11-30 | 2019-06-07 | 中国科学院大连化学物理研究所 | 一种应用于酯化反应的多区域自适应温控装置 |
CN108315689B (zh) * | 2018-01-10 | 2024-04-19 | 东莞市柯霖金属材料表面技术有限公司 | 一种td处理工艺 |
CN109554686B (zh) * | 2018-12-11 | 2023-09-22 | 广东双虹新材料科技有限公司 | 一种常压多层cvd反应器 |
TWI710674B (zh) * | 2019-04-10 | 2020-11-21 | 長生太陽能股份有限公司 | 爐管及多晶矽成長方法 |
CN111996512A (zh) * | 2020-09-30 | 2020-11-27 | 常州艾恩希纳米镀膜科技有限公司 | 一种用于cvd涂层设备的铝反应器 |
WO2023160793A1 (en) | 2022-02-24 | 2023-08-31 | Ihi Bernex Ag | Chemical vapor deposition apparatus |
Family Cites Families (24)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DD111935B3 (de) | 1974-06-17 | 1991-01-17 | Rainer Moeller | Vorrichtung zur erzeugung duenner, homogener schichten auf erhitzten unterlagen |
EP0164928A3 (en) | 1984-06-04 | 1987-07-29 | Texas Instruments Incorporated | Vertical hot wall cvd reactor |
JPS61191015A (ja) * | 1985-02-20 | 1986-08-25 | Hitachi Ltd | 半導体の気相成長方法及びその装置 |
US4926793A (en) * | 1986-12-15 | 1990-05-22 | Shin-Etsu Handotai Co., Ltd. | Method of forming thin film and apparatus therefor |
JPS63150912A (ja) * | 1986-12-15 | 1988-06-23 | Shin Etsu Handotai Co Ltd | 薄膜生成装置 |
EP0572150A3 (en) | 1992-05-26 | 1993-12-29 | General Electric Company | Chemical vapour-deposition of aluminide coatings |
US5324540A (en) * | 1992-08-17 | 1994-06-28 | Tokyo Electron Limited | System and method for supporting and rotating substrates in a process chamber |
US5441570A (en) * | 1993-06-22 | 1995-08-15 | Jein Technics Co., Ltd. | Apparatus for low pressure chemical vapor deposition |
US5782980A (en) * | 1996-05-14 | 1998-07-21 | Advanced Micro Devices, Inc. | Low pressure chemical vapor deposition apparatus including a process gas heating subsystem |
US5863843A (en) * | 1996-07-31 | 1999-01-26 | Lucent Technologies Inc. | Wafer holder for thermal processing apparatus |
DE19743922C1 (de) | 1997-10-04 | 1999-04-15 | Verschleis Schutz Technik Dr I | Verfahren zur CVD-Oberflächenbeschichtung und CVD-Reaktorsystem |
US6265026B1 (en) * | 1998-01-16 | 2001-07-24 | The Regents Of The University Of California | Vapor phase deposition |
US6179913B1 (en) * | 1999-04-16 | 2001-01-30 | Cbl Technologies, Inc. | Compound gas injection system and methods |
JP2002289536A (ja) | 2001-03-27 | 2002-10-04 | Sony Corp | 熱cvd装置および薄膜半導体素子の製造方法 |
US6793966B2 (en) | 2001-09-10 | 2004-09-21 | Howmet Research Corporation | Chemical vapor deposition apparatus and method |
US20030164143A1 (en) * | 2002-01-10 | 2003-09-04 | Hitachi Kokusai Electric Inc. | Batch-type remote plasma processing apparatus |
US7125812B2 (en) * | 2002-01-15 | 2006-10-24 | Tokyo Electron Limited | CVD method and device for forming silicon-containing insulation film |
KR100643493B1 (ko) * | 2004-09-23 | 2006-11-10 | 삼성전자주식회사 | 반도체 장치의 실리콘 산질화막을 형성하는 방법 및 장치 |
TW200619416A (en) * | 2004-09-30 | 2006-06-16 | Aviza Tech Inc | Method and apparatus for low temperature dielectric deposition using monomolecular precursors |
US20070010072A1 (en) * | 2005-07-09 | 2007-01-11 | Aviza Technology, Inc. | Uniform batch film deposition process and films so produced |
JP4434149B2 (ja) * | 2006-01-16 | 2010-03-17 | 東京エレクトロン株式会社 | 成膜方法、成膜装置及び記憶媒体 |
US7928019B2 (en) * | 2007-08-10 | 2011-04-19 | Micron Technology, Inc. | Semiconductor processing |
DE102008034330A1 (de) * | 2008-07-23 | 2010-01-28 | Ionbond Ag Olten | CVD-Reaktor zur Abscheidung von Schichten aus einem Reaktionsgasgemisch auf Werkstücken |
US20100326357A1 (en) * | 2009-06-30 | 2010-12-30 | Wei-Hung Huang | Nozzle and furnace having the same |
-
2008
- 2008-07-23 DE DE102008034330A patent/DE102008034330A1/de not_active Ceased
-
2009
- 2009-07-21 US US13/055,155 patent/US9297070B2/en active Active
- 2009-07-21 SI SI200931210T patent/SI2304075T1/sl unknown
- 2009-07-21 DK DK09780878.6T patent/DK2304075T3/en active
- 2009-07-21 WO PCT/EP2009/059360 patent/WO2010010088A1/de active Application Filing
- 2009-07-21 EP EP09780878.6A patent/EP2304075B1/de active Active
- 2009-07-21 PT PT97808786T patent/PT2304075E/pt unknown
- 2009-07-21 ES ES09780878.6T patent/ES2543732T3/es active Active
- 2009-07-21 JP JP2011519149A patent/JP5612574B2/ja active Active
- 2009-07-21 CN CN200980137451.7A patent/CN102165099B/zh active Active
- 2009-07-21 PL PL09780878T patent/PL2304075T3/pl unknown
Also Published As
Publication number | Publication date |
---|---|
CN102165099B (zh) | 2015-08-19 |
PT2304075E (pt) | 2015-07-28 |
EP2304075B1 (de) | 2015-03-25 |
CN102165099A (zh) | 2011-08-24 |
EP2304075A1 (de) | 2011-04-06 |
DE102008034330A1 (de) | 2010-01-28 |
WO2010010088A1 (de) | 2010-01-28 |
JP2011528753A (ja) | 2011-11-24 |
PL2304075T3 (pl) | 2015-08-31 |
US20110185973A1 (en) | 2011-08-04 |
ES2543732T3 (es) | 2015-08-21 |
US9297070B2 (en) | 2016-03-29 |
DK2304075T3 (en) | 2015-06-29 |
SI2304075T1 (sl) | 2015-07-31 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP5612574B2 (ja) | ワークピース上に反応ガス混合物から層を析出するためのcvd反応器 | |
JP5566100B2 (ja) | 成膜システム内の粒子コンタミネーションを抑制する方法および機器 | |
TWI364785B (en) | System and method for depositing a gaseous mixture onto a substrate surface using a showerhead apparatus | |
JP5728341B2 (ja) | 排気トラップ | |
JP5619164B2 (ja) | Cvd方法およびcvd反応炉 | |
WO2007114427A1 (ja) | 成膜装置の排気系構造、成膜装置、および排ガスの処理方法 | |
CN103361632B (zh) | 半导体装置的制造方法、基板处理方法、基板处理装置、气化***和喷雾过滤器 | |
JP7402041B2 (ja) | Cvdリアクタおよびcvdリアクタの洗浄方法 | |
JP4303966B2 (ja) | 特に結晶質皮膜を沈積する方法ならびにその方法を実施する装置 | |
CN100367459C (zh) | 衬底处理装置及半导体装置的制造方法 | |
KR20160106598A (ko) | 화학 증착 장치, 및 화학 증착 방법 | |
JP2008137831A (ja) | カーボンナノチューブ製造装置及びそれを用いたカーボンナノチューブの製造方法。 | |
JP2014504329A (ja) | 金属物の表面処理 | |
CN109804110B (zh) | 用于敷设碳层的设备和方法 | |
JP4535620B2 (ja) | 過剰cvd反応物の制御方法及びその装置 | |
JPWO2019124098A1 (ja) | 成膜装置 | |
DE102005056536A1 (de) | CVD-Reaktor mit widerstandsbeheiztem Suszeptor | |
JPH0382765A (ja) | 微粒および/または等軸粒組織のコーティングを有する物品 | |
US20080107808A1 (en) | Method and an apparatus for the coating of a base body | |
JP6358420B2 (ja) | 減圧式縦型化学蒸着装置及び化学蒸着方法 | |
JP6511798B2 (ja) | 化学蒸着装置、化学蒸着方法 | |
US20200385858A1 (en) | Coating of fluid-permeable materials | |
JP2023506372A (ja) | 2次元の層のためのcvdリアクタの使用 | |
JP5524758B2 (ja) | 結晶成長装置 | |
JPH05125543A (ja) | 炭化珪素膜製造装置 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20120627 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20130903 |
|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20140805 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20140904 |
|
R150 | Certificate of patent or registration of utility model |
Ref document number: 5612574 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
S111 | Request for change of ownership or part of ownership |
Free format text: JAPANESE INTERMEDIATE CODE: R313113 |
|
S531 | Written request for registration of change of domicile |
Free format text: JAPANESE INTERMEDIATE CODE: R313531 |
|
R350 | Written notification of registration of transfer |
Free format text: JAPANESE INTERMEDIATE CODE: R350 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |