JP5576514B2 - 表面処理銅箔、積層板、プリント配線板及びプリント回路板 - Google Patents
表面処理銅箔、積層板、プリント配線板及びプリント回路板 Download PDFInfo
- Publication number
- JP5576514B2 JP5576514B2 JP2013003859A JP2013003859A JP5576514B2 JP 5576514 B2 JP5576514 B2 JP 5576514B2 JP 2013003859 A JP2013003859 A JP 2013003859A JP 2013003859 A JP2013003859 A JP 2013003859A JP 5576514 B2 JP5576514 B2 JP 5576514B2
- Authority
- JP
- Japan
- Prior art keywords
- copper foil
- treated
- treated copper
- treatment
- roughness
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 title claims description 116
- 239000011889 copper foil Substances 0.000 title claims description 104
- 238000011282 treatment Methods 0.000 claims description 42
- 230000003746 surface roughness Effects 0.000 claims description 34
- 229910052759 nickel Inorganic materials 0.000 claims description 28
- 229910052742 iron Inorganic materials 0.000 claims description 25
- 229910052750 molybdenum Inorganic materials 0.000 claims description 24
- 238000004381 surface treatment Methods 0.000 claims description 23
- 238000007788 roughening Methods 0.000 claims description 20
- 239000002335 surface treatment layer Substances 0.000 claims description 17
- 229910052802 copper Inorganic materials 0.000 claims description 16
- 239000010949 copper Substances 0.000 claims description 16
- 239000011347 resin Substances 0.000 claims description 16
- 229920005989 resin Polymers 0.000 claims description 16
- 239000010410 layer Substances 0.000 claims description 14
- 239000000758 substrate Substances 0.000 claims description 9
- 238000009713 electroplating Methods 0.000 claims description 2
- 238000010030 laminating Methods 0.000 claims description 2
- 229910020637 Co-Cu Inorganic materials 0.000 claims 2
- 230000005540 biological transmission Effects 0.000 description 31
- 229910052751 metal Inorganic materials 0.000 description 17
- 239000002184 metal Substances 0.000 description 17
- 239000002585 base Substances 0.000 description 15
- 238000007747 plating Methods 0.000 description 14
- 229920000106 Liquid crystal polymer Polymers 0.000 description 12
- 239000004977 Liquid-crystal polymers (LCPs) Substances 0.000 description 12
- 239000000463 material Substances 0.000 description 12
- 238000000034 method Methods 0.000 description 11
- 239000000126 substance Substances 0.000 description 11
- 239000004020 conductor Substances 0.000 description 10
- 238000005530 etching Methods 0.000 description 10
- 239000003513 alkali Substances 0.000 description 9
- 230000007423 decrease Effects 0.000 description 8
- 230000000694 effects Effects 0.000 description 8
- 238000005259 measurement Methods 0.000 description 8
- 230000000052 comparative effect Effects 0.000 description 7
- 229910052709 silver Inorganic materials 0.000 description 7
- 239000004744 fabric Substances 0.000 description 6
- 238000004519 manufacturing process Methods 0.000 description 6
- 230000008569 process Effects 0.000 description 6
- 229910000077 silane Inorganic materials 0.000 description 6
- 229910000881 Cu alloy Inorganic materials 0.000 description 5
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 description 5
- 229910045601 alloy Inorganic materials 0.000 description 5
- 239000000956 alloy Substances 0.000 description 5
- 239000003822 epoxy resin Substances 0.000 description 5
- 238000011156 evaluation Methods 0.000 description 5
- 239000011521 glass Substances 0.000 description 5
- 229920000647 polyepoxide Polymers 0.000 description 5
- 238000005096 rolling process Methods 0.000 description 5
- 229910052725 zinc Inorganic materials 0.000 description 5
- 229910001316 Ag alloy Inorganic materials 0.000 description 4
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 4
- -1 amine compound Chemical class 0.000 description 4
- 229910052804 chromium Inorganic materials 0.000 description 4
- 230000002500 effect on skin Effects 0.000 description 4
- 239000011888 foil Substances 0.000 description 4
- 238000010438 heat treatment Methods 0.000 description 4
- 239000007788 liquid Substances 0.000 description 4
- 239000000203 mixture Substances 0.000 description 4
- 239000003921 oil Substances 0.000 description 4
- 229920001721 polyimide Polymers 0.000 description 4
- 239000010731 rolling oil Substances 0.000 description 4
- 239000004332 silver Substances 0.000 description 4
- 239000004642 Polyimide Substances 0.000 description 3
- 239000002253 acid Substances 0.000 description 3
- 239000000853 adhesive Substances 0.000 description 3
- 230000001070 adhesive effect Effects 0.000 description 3
- 229910052785 arsenic Inorganic materials 0.000 description 3
- 230000008901 benefit Effects 0.000 description 3
- 239000011247 coating layer Substances 0.000 description 3
- 239000002131 composite material Substances 0.000 description 3
- 239000003792 electrolyte Substances 0.000 description 3
- 229910052732 germanium Inorganic materials 0.000 description 3
- 230000001965 increasing effect Effects 0.000 description 3
- 229910052698 phosphorus Inorganic materials 0.000 description 3
- 229910052718 tin Inorganic materials 0.000 description 3
- 229910052721 tungsten Inorganic materials 0.000 description 3
- NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical compound OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 description 2
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 2
- 238000002441 X-ray diffraction Methods 0.000 description 2
- 230000002411 adverse Effects 0.000 description 2
- 125000003118 aryl group Chemical group 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 2
- ZCDOYSPFYFSLEW-UHFFFAOYSA-N chromate(2-) Chemical compound [O-][Cr]([O-])(=O)=O ZCDOYSPFYFSLEW-UHFFFAOYSA-N 0.000 description 2
- 238000000151 deposition Methods 0.000 description 2
- 230000008021 deposition Effects 0.000 description 2
- JEIPFZHSYJVQDO-UHFFFAOYSA-N iron(III) oxide Inorganic materials O=[Fe]O[Fe]=O JEIPFZHSYJVQDO-UHFFFAOYSA-N 0.000 description 2
- 150000002739 metals Chemical class 0.000 description 2
- 238000005498 polishing Methods 0.000 description 2
- 230000002265 prevention Effects 0.000 description 2
- 230000009467 reduction Effects 0.000 description 2
- FZHAPNGMFPVSLP-UHFFFAOYSA-N silanamine Chemical compound [SiH3]N FZHAPNGMFPVSLP-UHFFFAOYSA-N 0.000 description 2
- LMPMFQXUJXPWSL-UHFFFAOYSA-N 3-(3-sulfopropyldisulfanyl)propane-1-sulfonic acid Chemical compound OS(=O)(=O)CCCSSCCCS(O)(=O)=O LMPMFQXUJXPWSL-UHFFFAOYSA-N 0.000 description 1
- ZAMOUSCENKQFHK-UHFFFAOYSA-N Chlorine atom Chemical compound [Cl] ZAMOUSCENKQFHK-UHFFFAOYSA-N 0.000 description 1
- 229910001200 Ferrotitanium Inorganic materials 0.000 description 1
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- 238000013019 agitation Methods 0.000 description 1
- 125000000217 alkyl group Chemical group 0.000 description 1
- 229910000147 aluminium phosphate Inorganic materials 0.000 description 1
- 238000004458 analytical method Methods 0.000 description 1
- 238000000137 annealing Methods 0.000 description 1
- 238000003486 chemical etching Methods 0.000 description 1
- 229910052801 chlorine Inorganic materials 0.000 description 1
- 239000000460 chlorine Substances 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 229910000365 copper sulfate Inorganic materials 0.000 description 1
- ARUVKPQLZAKDPS-UHFFFAOYSA-L copper(II) sulfate Chemical compound [Cu+2].[O-][S+2]([O-])([O-])[O-] ARUVKPQLZAKDPS-UHFFFAOYSA-L 0.000 description 1
- UREBDLICKHMUKA-CXSFZGCWSA-N dexamethasone Chemical compound C1CC2=CC(=O)C=C[C@]2(C)[C@]2(F)[C@@H]1[C@@H]1C[C@@H](C)[C@@](C(=O)CO)(O)[C@@]1(C)C[C@@H]2O UREBDLICKHMUKA-CXSFZGCWSA-N 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 238000004070 electrodeposition Methods 0.000 description 1
- 238000005868 electrolysis reaction Methods 0.000 description 1
- 230000002708 enhancing effect Effects 0.000 description 1
- 125000001033 ether group Chemical group 0.000 description 1
- 229910052731 fluorine Inorganic materials 0.000 description 1
- 239000011737 fluorine Substances 0.000 description 1
- 125000001183 hydrocarbyl group Chemical group 0.000 description 1
- 125000002768 hydroxyalkyl group Chemical group 0.000 description 1
- 238000007654 immersion Methods 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 229910052749 magnesium Inorganic materials 0.000 description 1
- 230000000873 masking effect Effects 0.000 description 1
- 238000005065 mining Methods 0.000 description 1
- 239000011259 mixed solution Substances 0.000 description 1
- PHQOGHDTIVQXHL-UHFFFAOYSA-N n'-(3-trimethoxysilylpropyl)ethane-1,2-diamine Chemical compound CO[Si](OC)(OC)CCCNCCN PHQOGHDTIVQXHL-UHFFFAOYSA-N 0.000 description 1
- 239000004745 nonwoven fabric Substances 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 230000035699 permeability Effects 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920006267 polyester film Polymers 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 239000002243 precursor Substances 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 125000002924 primary amino group Chemical group [H]N([H])* 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 238000001953 recrystallisation Methods 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 125000000547 substituted alkyl group Chemical group 0.000 description 1
- 239000012209 synthetic fiber Substances 0.000 description 1
- 229920002994 synthetic fiber Polymers 0.000 description 1
- 239000010936 titanium Substances 0.000 description 1
- 229930195735 unsaturated hydrocarbon Natural products 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- 229910052726 zirconium Inorganic materials 0.000 description 1
Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D7/00—Electroplating characterised by the article coated
- C25D7/06—Wires; Strips; Foils
- C25D7/0614—Strips or foils
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D1/00—Electroforming
- C25D1/04—Wires; Strips; Foils
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/12—Electroplating: Baths therefor from solutions of nickel or cobalt
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/38—Electroplating: Baths therefor from solutions of copper
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D9/00—Electrolytic coating other than with metals
- C25D9/04—Electrolytic coating other than with metals with inorganic materials
- C25D9/08—Electrolytic coating other than with metals with inorganic materials by cathodic processes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0237—High frequency adaptations
- H05K1/0242—Structural details of individual signal conductors, e.g. related to the skin effect
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Electroplating Methods And Accessories (AREA)
- Parts Printed On Printed Circuit Boards (AREA)
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2013003859A JP5576514B2 (ja) | 2013-01-11 | 2013-01-11 | 表面処理銅箔、積層板、プリント配線板及びプリント回路板 |
TW103101084A TWI526303B (zh) | 2013-01-11 | 2014-01-10 | Surface-treated copper foil, laminated board, carrier copper foil, printed wiring board, printed circuit board, electronic machine and printed wiring board manufacturing method |
PCT/JP2014/050355 WO2014109396A1 (ja) | 2013-01-11 | 2014-01-10 | 表面処理銅箔、積層板、キャリア付銅箔、プリント配線板、プリント回路板、電子機器、及びプリント配線板の製造方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2013003859A JP5576514B2 (ja) | 2013-01-11 | 2013-01-11 | 表面処理銅箔、積層板、プリント配線板及びプリント回路板 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2014133936A JP2014133936A (ja) | 2014-07-24 |
JP5576514B2 true JP5576514B2 (ja) | 2014-08-20 |
Family
ID=51167040
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2013003859A Active JP5576514B2 (ja) | 2013-01-11 | 2013-01-11 | 表面処理銅箔、積層板、プリント配線板及びプリント回路板 |
Country Status (3)
Country | Link |
---|---|
JP (1) | JP5576514B2 (zh) |
TW (1) | TWI526303B (zh) |
WO (1) | WO2014109396A1 (zh) |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2016178121A (ja) * | 2015-03-18 | 2016-10-06 | タツタ電線株式会社 | ストレッチャブルケーブルおよびストレッチャブル回路基板 |
JP6023367B1 (ja) * | 2015-06-17 | 2016-11-09 | Jx金属株式会社 | キャリア付銅箔、積層体、プリント配線板の製造方法及び電子機器の製造方法 |
JP6687409B2 (ja) * | 2016-02-09 | 2020-04-22 | 福田金属箔粉工業株式会社 | 高彩度処理銅箔及び該処理銅箔を用いた銅張積層板並びに該処理銅箔の製造方法 |
JP7055049B2 (ja) * | 2017-03-31 | 2022-04-15 | Jx金属株式会社 | 表面処理銅箔及びそれを用いた積層板、キャリア付銅箔、プリント配線板、電子機器、並びに、プリント配線板の製造方法 |
JP7421208B2 (ja) | 2019-12-24 | 2024-01-24 | 日本電解株式会社 | 表面処理銅箔及びその製造方法 |
EP4391734A1 (en) * | 2022-12-21 | 2024-06-26 | JX Metals Corporation | Copper foil, laminate, and flexible printed wiring board |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4295800B2 (ja) * | 2002-05-13 | 2009-07-15 | 三井金属鉱業株式会社 | 電解銅箔 |
JP2004238647A (ja) * | 2003-02-04 | 2004-08-26 | Furukawa Techno Research Kk | 平滑化銅箔とその製造方法 |
JP4161304B2 (ja) * | 2003-02-04 | 2008-10-08 | 古河サーキットフォイル株式会社 | 高周波回路用金属箔 |
US7341796B2 (en) * | 2004-02-17 | 2008-03-11 | Nippon Mining & Metals Co., Ltd | Copper foil having blackened surface or layer |
JP2006222185A (ja) * | 2005-02-09 | 2006-08-24 | Furukawa Circuit Foil Kk | ポリイミド系フレキシブル銅張積層板用銅箔、ポリイミド系フレキシブル銅張積層板、及びポリイミド系フレキシブルプリント配線板 |
-
2013
- 2013-01-11 JP JP2013003859A patent/JP5576514B2/ja active Active
-
2014
- 2014-01-10 WO PCT/JP2014/050355 patent/WO2014109396A1/ja active Application Filing
- 2014-01-10 TW TW103101084A patent/TWI526303B/zh active
Also Published As
Publication number | Publication date |
---|---|
TW201438890A (zh) | 2014-10-16 |
JP2014133936A (ja) | 2014-07-24 |
WO2014109396A1 (ja) | 2014-07-17 |
TWI526303B (zh) | 2016-03-21 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP5710737B1 (ja) | 表面処理銅箔、積層板、プリント配線板、プリント回路板及び電子機器 | |
JP5576514B2 (ja) | 表面処理銅箔、積層板、プリント配線板及びプリント回路板 | |
JP4682271B2 (ja) | プリント配線板用銅箔 | |
JP2023133413A (ja) | 表面処理銅箔、銅張積層板及びプリント配線板 | |
KR101607381B1 (ko) | 고주파 회로용 동박, 고주파 회로용 구리 피복 적층판, 고주파 회로용 프린트 배선판, 고주파 회로용 캐리어가 부착된 동박, 전자 기기, 및 프린트 배선판의 제조 방법 | |
KR101203439B1 (ko) | 프린트 배선판용 동박 | |
JP6111017B2 (ja) | プリント配線板用銅箔及びそれを用いた積層体、プリント配線板及び電子部品 | |
KR101736537B1 (ko) | 고주파 회로용 동박, 고주파 회로용 구리 피복 적층판, 고주파 회로용 프린트 배선판, 고주파 회로용 캐리어가 부착된 동박, 전자 기기, 및 프린트 배선판의 제조 방법 | |
WO2015033917A1 (ja) | 表面処理銅箔、その表面処理銅箔を用いて得られる銅張積層板及びプリント配線板 | |
JP4659140B2 (ja) | プリント配線板用銅箔 | |
JP2015105440A (ja) | 表面処理銅箔、積層板、プリント配線板、プリント回路板及び電子機器 | |
JP2011210994A (ja) | プリント配線板用銅箔及びそれを用いた積層体 | |
JP2011014647A (ja) | プリント配線板用銅箔 | |
JP5506368B2 (ja) | 環境配慮型プリント配線板用銅箔 | |
JP2014224318A (ja) | 高周波回路用銅箔、高周波回路用銅張積層板、高周波回路用プリント配線板、高周波回路用キャリア付銅箔、電子機器、及びプリント配線板の製造方法 | |
JP2010258398A (ja) | プリント配線板用銅箔 | |
JP2011014651A (ja) | プリント配線板用銅箔 | |
JP2012064769A (ja) | プリント配線板用銅箔 | |
JP5373453B2 (ja) | プリント配線板用銅箔 | |
JP2011114204A (ja) | プリント配線板用銅箔 | |
JP2011009453A (ja) | プリント配線板用銅箔 | |
JP2011012297A (ja) | プリント配線板用銅箔 | |
WO2022255422A1 (ja) | 粗化処理銅箔、銅張積層板及びプリント配線板 | |
JP2010258399A (ja) | プリント配線板用銅箔 | |
JP2023040316A (ja) | 表面処理金属箔及び金属張積層板 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20140507 |
|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20140603 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20140703 |
|
R150 | Certificate of patent or registration of utility model |
Ref document number: 5576514 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
S531 | Written request for registration of change of domicile |
Free format text: JAPANESE INTERMEDIATE CODE: R313531 |
|
S533 | Written request for registration of change of name |
Free format text: JAPANESE INTERMEDIATE CODE: R313533 |
|
R350 | Written notification of registration of transfer |
Free format text: JAPANESE INTERMEDIATE CODE: R350 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
S531 | Written request for registration of change of domicile |
Free format text: JAPANESE INTERMEDIATE CODE: R313531 |
|
R350 | Written notification of registration of transfer |
Free format text: JAPANESE INTERMEDIATE CODE: R350 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |