JP5575882B2 - 気密式電気パッケージ - Google Patents

気密式電気パッケージ Download PDF

Info

Publication number: JP5575882B2
Authority: JP; Japan
Prior art keywords: barrier layer; layer; conductive; electrical package; anode
Prior art date: 2009-05-21
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.): Active

Application number

JP2012511841A

Other languages

English (en)

Japanese (ja)

Other versions

JP2012527728A (ja

Inventor

ファークハール，ドナルド・セトン

ハーゾグ，マイケル・スコット

ラクフ，ステファン

Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)

General Electric Co

Original Assignee

General Electric Co

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

2009-05-21

Filing date

2010-04-21

Publication date

2014-08-20

2010-04-21 Application filed by General Electric Co filed Critical General Electric Co

2012-11-08 Publication of JP2012527728A publication Critical patent/JP2012527728A/ja

2014-08-20 Application granted granted Critical

2014-08-20 Publication of JP5575882B2 publication Critical patent/JP5575882B2/ja

Status Active legal-status Critical Current

2030-04-21 Anticipated expiration legal-status Critical

Links

239000010410 layer Substances 0.000 claims description 238
230000004888 barrier function Effects 0.000 claims description 146
230000005693 optoelectronics Effects 0.000 claims description 55
238000000034 method Methods 0.000 claims description 22
238000004519 manufacturing process Methods 0.000 claims description 15
229910052751 metal Inorganic materials 0.000 claims description 13
239000002184 metal Substances 0.000 claims description 13
239000012790 adhesive layer Substances 0.000 claims description 8
229910052782 aluminium Inorganic materials 0.000 claims description 7
XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 7
230000009471 action Effects 0.000 claims description 4
230000008878 coupling Effects 0.000 claims description 3
238000010168 coupling process Methods 0.000 claims description 3
238000005859 coupling reaction Methods 0.000 claims description 3
229910001220 stainless steel Inorganic materials 0.000 claims description 3
239000010935 stainless steel Substances 0.000 claims description 3
229910001369 Brass Inorganic materials 0.000 claims description 2
239000010951 brass Substances 0.000 claims description 2
239000000463 material Substances 0.000 description 30
239000000758 substrate Substances 0.000 description 23
239000011888 foil Substances 0.000 description 20
238000003475 lamination Methods 0.000 description 18
239000000853 adhesive Substances 0.000 description 14
230000001070 adhesive effect Effects 0.000 description 14
238000013461 design Methods 0.000 description 9
230000008569 process Effects 0.000 description 9
QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 8
229910052760 oxygen Inorganic materials 0.000 description 8
239000001301 oxygen Substances 0.000 description 8
238000004806 packaging method and process Methods 0.000 description 6
238000000576 coating method Methods 0.000 description 5
239000011521 glass Substances 0.000 description 5
229920003023 plastic Polymers 0.000 description 5
238000007789 sealing Methods 0.000 description 5
239000011248 coating agent Substances 0.000 description 4
239000004020 conductor Substances 0.000 description 4
239000004033 plastic Substances 0.000 description 4
238000010030 laminating Methods 0.000 description 3
230000035699 permeability Effects 0.000 description 3
229920000642 polymer Polymers 0.000 description 3
238000012545 processing Methods 0.000 description 3
RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
238000013459 approach Methods 0.000 description 2
230000006835 compression Effects 0.000 description 2
238000007906 compression Methods 0.000 description 2
238000001035 drying Methods 0.000 description 2
230000000694 effects Effects 0.000 description 2
238000002347 injection Methods 0.000 description 2
239000007924 injection Substances 0.000 description 2
239000012528 membrane Substances 0.000 description 2
238000012986 modification Methods 0.000 description 2
230000004048 modification Effects 0.000 description 2
230000003287 optical effect Effects 0.000 description 2
230000035515 penetration Effects 0.000 description 2
239000002985 plastic film Substances 0.000 description 2
239000004065 semiconductor Substances 0.000 description 2
229920001169 thermoplastic Polymers 0.000 description 2
239000004416 thermosoftening plastic Substances 0.000 description 2
239000004820 Pressure-sensitive adhesive Substances 0.000 description 1
241000350158 Prioria balsamifera Species 0.000 description 1
238000010521 absorption reaction Methods 0.000 description 1
230000002411 adverse Effects 0.000 description 1
238000004458 analytical method Methods 0.000 description 1
238000010923 batch production Methods 0.000 description 1
230000005540 biological transmission Effects 0.000 description 1
230000015572 biosynthetic process Effects 0.000 description 1
230000015556 catabolic process Effects 0.000 description 1
239000000919 ceramic Substances 0.000 description 1
238000010276 construction Methods 0.000 description 1
229910052802 copper Inorganic materials 0.000 description 1
239000010949 copper Substances 0.000 description 1
238000005520 cutting process Methods 0.000 description 1
238000006731 degradation reaction Methods 0.000 description 1
238000000151 deposition Methods 0.000 description 1
238000011161 development Methods 0.000 description 1
238000010586 diagram Methods 0.000 description 1
238000005553 drilling Methods 0.000 description 1
230000005611 electricity Effects 0.000 description 1
229920002457 flexible plastic Polymers 0.000 description 1
230000005525 hole transport Effects 0.000 description 1
238000009413 insulation Methods 0.000 description 1
238000003754 machining Methods 0.000 description 1
150000002739 metals Chemical class 0.000 description 1
PZRHRDRVRGEVNW-UHFFFAOYSA-N milrinone Chemical compound N1C(=O)C(C#N)=CC(C=2C=CN=CC=2)=C1C PZRHRDRVRGEVNW-UHFFFAOYSA-N 0.000 description 1
229960003574 milrinone Drugs 0.000 description 1
229910052759 nickel Inorganic materials 0.000 description 1
239000005022 packaging material Substances 0.000 description 1
238000012536 packaging technology Methods 0.000 description 1
229920006255 plastic film Polymers 0.000 description 1
229920000515 polycarbonate Polymers 0.000 description 1
239000004417 polycarbonate Substances 0.000 description 1
229920000728 polyester Polymers 0.000 description 1
229920001721 polyimide Polymers 0.000 description 1
229920001296 polysiloxane Polymers 0.000 description 1
238000002360 preparation method Methods 0.000 description 1
238000009824 pressure lamination Methods 0.000 description 1
230000009467 reduction Effects 0.000 description 1
230000004044 response Effects 0.000 description 1
238000004528 spin coating Methods 0.000 description 1
239000000126 substance Substances 0.000 description 1
229920001187 thermosetting polymer Polymers 0.000 description 1
238000001771 vacuum deposition Methods 0.000 description 1
238000004804 winding Methods 0.000 description 1

Classifications

- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/805—Electrodes
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B33/00—Electroluminescent light sources
- H05B33/02—Details
- H05B33/04—Sealing arrangements, e.g. against humidity
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/842—Containers
- H10K50/8423—Metallic sealing arrangements
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/844—Encapsulations
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/844—Encapsulations
- H10K50/8445—Encapsulations multilayered coatings having a repetitive structure, e.g. having multiple organic-inorganic bilayers
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K2102/00—Constructional details relating to the organic devices covered by this subclass
- H10K2102/301—Details of OLEDs
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/88—Terminals, e.g. bond pads
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
- Y10T428/24273—Structurally defined web or sheet [e.g., overall dimension, etc.] including aperture
- Y10T428/24322—Composite web or sheet
- Y10T428/24331—Composite web or sheet including nonapertured component

Landscapes

Physics & Mathematics (AREA)
Optics & Photonics (AREA)
Chemical & Material Sciences (AREA)
Inorganic Chemistry (AREA)
Electroluminescent Light Sources (AREA)

JP2012511841A 2009-05-21 2010-04-21 気密式電気パッケージ Active JP5575882B2 (ja)

Applications Claiming Priority (3)

Application Number	Priority Date	Filing Date	Title
US12/470,033		2009-05-21
US12/470,033 US20100294526A1 (en)	2009-05-21	2009-05-21	Hermetic electrical package
PCT/US2010/031854 WO2010135050A1 (en)	2009-05-21	2010-04-21	Hermetic electrical package

Publications (2)

Publication Number	Publication Date
JP2012527728A JP2012527728A (ja)	2012-11-08
JP5575882B2 true JP5575882B2 (ja)	2014-08-20

Family

ID=42320737

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
JP2012511841A Active JP5575882B2 (ja)	2009-05-21	2010-04-21	気密式電気パッケージ

Country Status (7)

Country	Link
US (1)	US20100294526A1 (ko)
EP (1)	EP2433319B1 (ko)
JP (1)	JP5575882B2 (ko)
KR (1)	KR101702683B1 (ko)
CN (1)	CN102439752B (ko)
TW (1)	TWI527281B (ko)
WO (1)	WO2010135050A1 (ko)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
US8154183B2 (en) *	2010-03-04	2012-04-10	General Electric Company	Mitigating shorting risks in encapsulated organic light emitting devices (OLEDs)
US8692457B2 (en) *	2010-12-20	2014-04-08	General Electric Company	Large area light emitting electrical package with current spreading bus
FR2976730B1 (fr) *	2011-06-17	2013-12-06	Astron Fiamm Safety	Delo encapsulee en colle pleine plaque avec un capot troue
US8358066B1 (en) *	2011-08-10	2013-01-22	General Electric Company	Organic light emitting diode package with energy blocking layer
US8829556B2 (en)	2011-09-01	2014-09-09	General Electric Company	Thermal management in large area flexible OLED assembly
DE102011121165A1 (de) *	2011-12-16	2013-06-20	Thyssenkrupp Steel Europe Ag	Metallisches Bauelement oder Flacherzeugnis mit photovoltaisch wirksamer Beschichtung, Verfahren zu dessen Herstellung und aus solchen, miteinander elektrisch verschalteten Bauelementen gebildete Verkleidung
US20130248914A1 (en) *	2012-03-20	2013-09-26	General Electric Company	Packaged optoelectronic device and process for manufacturing
EP3011612B1 (en) *	2013-05-23	2020-02-19	OLEDWorks GmbH	Light-emitting device with alternating arrangement of anode pads and cathode pads
US9876190B2 (en)	2013-08-21	2018-01-23	Lg Display Co., Ltd.	Organic light-emitting diode and method for manufacturing same
DE102013112270B4 (de) *	2013-11-07	2024-02-22	Pictiva Displays International Limited	Bauelementanordnung
DE102015223053B4 (de) *	2015-11-23	2020-03-12	Thyssenkrupp Ag	Verfahren zur Herstellung eines Funktionsmoduls
TWI638473B (zh) *	2016-12-07	2018-10-11	財團法人工業技術研究院	發光元件與發光元件的製造方法

Family Cites Families (38)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
US3660593A (en) *	1970-12-22	1972-05-02	Nat Forge Co	Pressure vessel power lead-through
US4458101A (en) *	1982-04-08	1984-07-03	Westinghouse Electric Corp.	Gas-insulated epoxy bushing having an internal throat shield and an embedded ground shield
CH680013A5 (ko) *	1988-09-19	1992-05-29	Mathias Och
JP3676074B2 (ja) *	1997-03-14	2005-07-27	Ｔｄｋ株式会社	ホットメルト材およびラミネート体とその製造方法
JPH11195492A (ja) *	1997-12-27	1999-07-21	Hokuriku Electric Ind Co Ltd	有機ｅｌ素子とその製造方法
US6140766A (en) *	1997-12-27	2000-10-31	Hokuriku Electric Industry Co., Ltd.	Organic EL device
US6134300A (en) *	1998-11-05	2000-10-17	The Regents Of The University Of California	Miniature x-ray source
US6251471B1 (en) *	1999-05-12	2001-06-26	University Of New Hampshire	Surface trace electrical feedthru
US6353658B1 (en) *	1999-09-08	2002-03-05	The Regents Of The University Of California	Miniature x-ray source
US6413645B1 (en) *	2000-04-20	2002-07-02	Battelle Memorial Institute	Ultrabarrier substrates
US6566808B1 (en) *	1999-12-22	2003-05-20	General Electric Company	Luminescent display and method of making
US6700322B1 (en) *	2000-01-27	2004-03-02	General Electric Company	Light source with organic layer and photoluminescent layer
US6777871B2 (en) *	2000-03-31	2004-08-17	General Electric Company	Organic electroluminescent devices with enhanced light extraction
US6661029B1 (en) *	2000-03-31	2003-12-09	General Electric Company	Color tunable organic electroluminescent light source
US6492026B1 (en) *	2000-04-20	2002-12-10	Battelle Memorial Institute	Smoothing and barrier layers on high Tg substrates
JP4423767B2 (ja) *	2000-08-22	2010-03-03	ソニー株式会社	有機電界発光素子及びその製造方法
US6305975B1 (en) *	2000-10-12	2001-10-23	Bear Instruments, Inc.	Electrical connector feedthrough to low pressure chamber
US6537688B2 (en) *	2000-12-01	2003-03-25	Universal Display Corporation	Adhesive sealed organic optoelectronic structures
US6624568B2 (en) *	2001-03-28	2003-09-23	Universal Display Corporation	Multilayer barrier region containing moisture- and oxygen-absorbing material for optoelectronic devices
JP2002373779A (ja) *	2001-06-13	2002-12-26	Sony Corp	電気的接続装置および電気的接続装置を有する電子機器
JP2003084684A (ja) *	2001-09-13	2003-03-19	Sony Corp	ディスプレイ装置及びディスプレイ装置の製造方法、並びに電子機器
TW519853B (en) *	2001-10-17	2003-02-01	Chi Mei Electronic Corp	Organic electro-luminescent display and its packaging method
DE10222609B4 (de) *	2002-04-15	2008-07-10	Schott Ag	Verfahren zur Herstellung strukturierter Schichten auf Substraten und verfahrensgemäß beschichtetes Substrat
US7015640B2 (en) *	2002-09-11	2006-03-21	General Electric Company	Diffusion barrier coatings having graded compositions and devices incorporating the same
US6975067B2 (en) *	2002-12-19	2005-12-13	3M Innovative Properties Company	Organic electroluminescent device and encapsulation method
US7052355B2 (en) *	2003-10-30	2006-05-30	General Electric Company	Organic electro-optic device and method for making the same
US7097501B2 (en) *	2003-11-25	2006-08-29	Schlumberger Technology Corporation	Micro coated electrical feedthru
JP4027914B2 (ja) *	2004-05-21	2007-12-26	株式会社半導体エネルギー研究所	照明装置及びそれを用いた機器
US7033850B2 (en) *	2004-06-30	2006-04-25	Eastman Kodak Company	Roll-to-sheet manufacture of OLED materials
US20060093795A1 (en) *	2004-11-04	2006-05-04	Eastman Kodak Company	Polymeric substrate having a desiccant layer
CN100550467C (zh) *	2005-02-16	2009-10-14	皇家飞利浦电子股份有限公司	有机电致发光二极管设备
JP5596250B2 (ja) *	2005-03-02	2014-09-24	スリーエムイノベイティブプロパティズカンパニー	湿気反応性組成物及び有機ｅｌ素子
WO2007023789A1 (ja) *	2005-08-25	2007-03-01	Tokki Corporation	有機ｅｌ素子
EP1932194A2 (en) *	2005-09-28	2008-06-18	Koninklijke Philips Electronics N.V.	A large area organic diode device and a method of manufacturing it
FR2904508B1 (fr) *	2006-07-28	2014-08-22	Saint Gobain	Dispositif electroluminescent encapsule
US7766502B2 (en) *	2007-05-07	2010-08-03	Tresco International Ltd. Co.	Self-illuminated structural panel units and systems including the same
US20090168391A1 (en) *	2007-12-27	2009-07-02	Kouichi Saitou	Substrate for mounting device and method for producing the same, semiconductor module and method for producing the same, and portable apparatus provided with the same
EP2144290A1 (en) *	2008-07-08	2010-01-13	Nederlandse Organisatie voor toegepast- natuurwetenschappelijk onderzoek TNO	Electronic device and method of manufacturing the same

2009
- 2009-05-21 US US12/470,033 patent/US20100294526A1/en not_active Abandoned
2010
- 2010-04-21 JP JP2012511841A patent/JP5575882B2/ja active Active
- 2010-04-21 KR KR1020117027633A patent/KR101702683B1/ko active IP Right Grant
- 2010-04-21 WO PCT/US2010/031854 patent/WO2010135050A1/en active Application Filing
- 2010-04-21 CN CN201080023152.3A patent/CN102439752B/zh active Active
- 2010-04-21 EP EP10719465.6A patent/EP2433319B1/en active Active
- 2010-05-12 TW TW099115142A patent/TWI527281B/zh active

Also Published As

Publication number	Publication date
TW201104941A (en)	2011-02-01
TWI527281B (zh)	2016-03-21
US20100294526A1 (en)	2010-11-25
EP2433319B1 (en)	2019-06-05
WO2010135050A1 (en)	2010-11-25
CN102439752B (zh)	2015-11-25
KR101702683B1 (ko)	2017-02-06
KR20120029396A (ko)	2012-03-26
EP2433319A1 (en)	2012-03-28
CN102439752A (zh)	2012-05-02
JP2012527728A (ja)	2012-11-08

Legal Events

Date	Code	Title	Description
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JP5575882B2 (ja)	2014-08-20	気密式電気パッケージ
KR101755606B1 (ko)	2017-07-07	광전자 컴포넌트 및 광전자 컴포넌트를 제조하기 위한 방법
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US20130248914A1 (en)	2013-09-26	Packaged optoelectronic device and process for manufacturing
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