JP5562676B2 - 炭化珪素ハニカム構造体の製造方法、坏土、及びハニカム成形体 - Google Patents
炭化珪素ハニカム構造体の製造方法、坏土、及びハニカム成形体 Download PDFInfo
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- JP5562676B2 JP5562676B2 JP2010033346A JP2010033346A JP5562676B2 JP 5562676 B2 JP5562676 B2 JP 5562676B2 JP 2010033346 A JP2010033346 A JP 2010033346A JP 2010033346 A JP2010033346 A JP 2010033346A JP 5562676 B2 JP5562676 B2 JP 5562676B2
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- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 title claims description 36
- 238000004519 manufacturing process Methods 0.000 title claims description 32
- 229910010271 silicon carbide Inorganic materials 0.000 title claims description 31
- 238000000034 method Methods 0.000 title claims description 29
- 239000004927 clay Substances 0.000 title claims description 10
- 239000000463 material Substances 0.000 claims description 96
- 239000002994 raw material Substances 0.000 claims description 55
- 239000002245 particle Substances 0.000 claims description 29
- 239000007858 starting material Substances 0.000 claims description 25
- 238000010304 firing Methods 0.000 claims description 24
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 7
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 claims description 7
- 239000001301 oxygen Substances 0.000 claims description 7
- 229910052760 oxygen Inorganic materials 0.000 claims description 7
- 230000008569 process Effects 0.000 claims description 5
- HMDDXIMCDZRSNE-UHFFFAOYSA-N [C].[Si] Chemical compound [C].[Si] HMDDXIMCDZRSNE-UHFFFAOYSA-N 0.000 claims description 4
- 229910052751 metal Inorganic materials 0.000 claims description 4
- 239000002184 metal Substances 0.000 claims description 4
- 229910052710 silicon Inorganic materials 0.000 claims description 3
- 239000010703 silicon Substances 0.000 claims description 3
- 229910021426 porous silicon Inorganic materials 0.000 claims 1
- 239000000047 product Substances 0.000 description 26
- 239000011248 coating agent Substances 0.000 description 16
- 238000000576 coating method Methods 0.000 description 16
- 230000002950 deficient Effects 0.000 description 12
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- 239000003054 catalyst Substances 0.000 description 10
- 238000001035 drying Methods 0.000 description 10
- 238000000227 grinding Methods 0.000 description 9
- 238000013001 point bending Methods 0.000 description 9
- 239000011230 binding agent Substances 0.000 description 8
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 7
- 230000000052 comparative effect Effects 0.000 description 7
- 230000000694 effects Effects 0.000 description 7
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 7
- 239000000919 ceramic Substances 0.000 description 6
- 238000011156 evaluation Methods 0.000 description 6
- 239000007789 gas Substances 0.000 description 6
- 230000014759 maintenance of location Effects 0.000 description 6
- 238000010298 pulverizing process Methods 0.000 description 6
- 230000008929 regeneration Effects 0.000 description 6
- 238000011069 regeneration method Methods 0.000 description 6
- 229910052878 cordierite Inorganic materials 0.000 description 5
- JSKIRARMQDRGJZ-UHFFFAOYSA-N dimagnesium dioxido-bis[(1-oxido-3-oxo-2,4,6,8,9-pentaoxa-1,3-disila-5,7-dialuminabicyclo[3.3.1]nonan-7-yl)oxy]silane Chemical compound [Mg++].[Mg++].[O-][Si]([O-])(O[Al]1O[Al]2O[Si](=O)O[Si]([O-])(O1)O2)O[Al]1O[Al]2O[Si](=O)O[Si]([O-])(O1)O2 JSKIRARMQDRGJZ-UHFFFAOYSA-N 0.000 description 5
- 229920000609 methyl cellulose Polymers 0.000 description 5
- 239000001923 methylcellulose Substances 0.000 description 5
- 235000010981 methylcellulose Nutrition 0.000 description 5
- 238000005192 partition Methods 0.000 description 5
- 239000000843 powder Substances 0.000 description 5
- 239000004094 surface-active agent Substances 0.000 description 5
- 239000002699 waste material Substances 0.000 description 5
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 4
- 238000002845 discoloration Methods 0.000 description 4
- 239000000203 mixture Substances 0.000 description 4
- 230000002093 peripheral effect Effects 0.000 description 4
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 3
- 239000002131 composite material Substances 0.000 description 3
- 239000012530 fluid Substances 0.000 description 3
- 238000004898 kneading Methods 0.000 description 3
- 238000000465 moulding Methods 0.000 description 3
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 3
- 238000000746 purification Methods 0.000 description 3
- 239000000377 silicon dioxide Substances 0.000 description 3
- 239000002689 soil Substances 0.000 description 3
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- 239000000853 adhesive Substances 0.000 description 2
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- 239000004568 cement Substances 0.000 description 2
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- 229930195733 hydrocarbon Natural products 0.000 description 2
- 150000002430 hydrocarbons Chemical class 0.000 description 2
- -1 hydroxypropoxyl methyl Chemical group 0.000 description 2
- 229910052500 inorganic mineral Inorganic materials 0.000 description 2
- 239000010954 inorganic particle Substances 0.000 description 2
- 238000007689 inspection Methods 0.000 description 2
- 239000011707 mineral Substances 0.000 description 2
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- 229910000510 noble metal Inorganic materials 0.000 description 2
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- 239000010948 rhodium Substances 0.000 description 2
- 239000011863 silicon-based powder Substances 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 239000000454 talc Substances 0.000 description 2
- 229910052623 talc Inorganic materials 0.000 description 2
- 239000005995 Aluminium silicate Substances 0.000 description 1
- 229910052582 BN Inorganic materials 0.000 description 1
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 description 1
- 229910052684 Cerium Inorganic materials 0.000 description 1
- 229920002472 Starch Polymers 0.000 description 1
- BOTDANWDWHJENH-UHFFFAOYSA-N Tetraethyl orthosilicate Chemical compound CCO[Si](OCC)(OCC)OCC BOTDANWDWHJENH-UHFFFAOYSA-N 0.000 description 1
- OLBVUFHMDRJKTK-UHFFFAOYSA-N [N].[O] Chemical compound [N].[O] OLBVUFHMDRJKTK-UHFFFAOYSA-N 0.000 description 1
- 238000005299 abrasion Methods 0.000 description 1
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- 230000002411 adverse Effects 0.000 description 1
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- 238000004220 aggregation Methods 0.000 description 1
- 229910052783 alkali metal Inorganic materials 0.000 description 1
- 150000001340 alkali metals Chemical class 0.000 description 1
- 229910052784 alkaline earth metal Inorganic materials 0.000 description 1
- 150000001342 alkaline earth metals Chemical class 0.000 description 1
- ILRRQNADMUWWFW-UHFFFAOYSA-K aluminium phosphate Chemical compound O1[Al]2OP1(=O)O2 ILRRQNADMUWWFW-UHFFFAOYSA-K 0.000 description 1
- 235000012211 aluminium silicate Nutrition 0.000 description 1
- 229910052788 barium Inorganic materials 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 229910052792 caesium Inorganic materials 0.000 description 1
- 229910052791 calcium Inorganic materials 0.000 description 1
- GWXLDORMOJMVQZ-UHFFFAOYSA-N cerium Chemical compound [Ce] GWXLDORMOJMVQZ-UHFFFAOYSA-N 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 239000003426 co-catalyst Substances 0.000 description 1
- 239000003245 coal Substances 0.000 description 1
- 239000011362 coarse particle Substances 0.000 description 1
- 239000008119 colloidal silica Substances 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 239000002612 dispersion medium Substances 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 238000001125 extrusion Methods 0.000 description 1
- 239000000835 fiber Substances 0.000 description 1
- 230000009970 fire resistant effect Effects 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 230000005802 health problem Effects 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- NLYAJNPCOHFWQQ-UHFFFAOYSA-N kaolin Chemical compound O.O.O=[Al]O[Si](=O)O[Si](=O)O[Al]=O NLYAJNPCOHFWQQ-UHFFFAOYSA-N 0.000 description 1
- 229910052744 lithium Inorganic materials 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- QSHDDOUJBYECFT-UHFFFAOYSA-N mercury Chemical compound [Hg] QSHDDOUJBYECFT-UHFFFAOYSA-N 0.000 description 1
- 229910052753 mercury Inorganic materials 0.000 description 1
- 239000010445 mica Substances 0.000 description 1
- 229910052618 mica group Inorganic materials 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229910052763 palladium Inorganic materials 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 229910052700 potassium Inorganic materials 0.000 description 1
- 235000019353 potassium silicate Nutrition 0.000 description 1
- 239000002244 precipitate Substances 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 230000001105 regulatory effect Effects 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 229910052703 rhodium Inorganic materials 0.000 description 1
- MHOVAHRLVXNVSD-UHFFFAOYSA-N rhodium atom Chemical compound [Rh] MHOVAHRLVXNVSD-UHFFFAOYSA-N 0.000 description 1
- VSZWPYCFIRKVQL-UHFFFAOYSA-N selanylidenegallium;selenium Chemical compound [Se].[Se]=[Ga].[Se]=[Ga] VSZWPYCFIRKVQL-UHFFFAOYSA-N 0.000 description 1
- 238000004904 shortening Methods 0.000 description 1
- 238000007873 sieving Methods 0.000 description 1
- RMAQACBXLXPBSY-UHFFFAOYSA-N silicic acid Chemical compound O[Si](O)(O)O RMAQACBXLXPBSY-UHFFFAOYSA-N 0.000 description 1
- 238000005245 sintering Methods 0.000 description 1
- 229910052708 sodium Inorganic materials 0.000 description 1
- NTHWMYGWWRZVTN-UHFFFAOYSA-N sodium silicate Chemical compound [Na+].[Na+].[O-][Si]([O-])=O NTHWMYGWWRZVTN-UHFFFAOYSA-N 0.000 description 1
- 239000012798 spherical particle Substances 0.000 description 1
- 239000008107 starch Substances 0.000 description 1
- 235000019698 starch Nutrition 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 229910052712 strontium Inorganic materials 0.000 description 1
- 230000007847 structural defect Effects 0.000 description 1
- 238000010998 test method Methods 0.000 description 1
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Description
平均粒径48μmの炭化珪素粉末と金属珪素粉末とを80:20の比率(質量比)で混合し、更にメチルセルロース(バインダー)、界面活性剤、助剤及び水を添加し、ニーダーを用いて混練した。得られた混練土から押出成形機にてハニカムセグメント(ハニカム成形体)を押出成形し、目封止を施した後、これをマイクロ波乾燥した後、更に120℃で30分間熱風乾燥した。この乾燥後、得られたハニカムセグメント(乾燥体)を1450℃で2時間焼成し、端面35mm×35mm、長さ254mm、隔壁厚さ300μm、セル密度47個/cm2の炭化珪素質ハニカムセグメント(ハニカム構造体)を得た。焼成後のセグメント不良品、接合不良品、接合体研削切れ端、接合体研削屑、完成体不良品をローラーミルによって粉砕し、平均粒子径を20μmとしこれを再生原料とした。
(割掛)=(乾燥前寸法)/(乾燥後寸法)
Claims (4)
- 炭化珪素ハニカム構造体の製造過程で発生した炭化珪素ハニカム構造体の出発原料に由来する回収物から再生された再生原料を、出発原料の一部として用いた炭化珪素ハニカム構造体の製造方法であって、
前記再生原料が、炭化珪素と金属珪素とを含む前記出発原料を焼成した後の工程における前記炭素珪素ハニカム構造体を構成する材料から回収されるものであり、
前記再生原料を、平均粒子径を5〜100μmとした後に、前記出発原料の一部として前記出発原料全体に占める割合が50質量%以下となるように添加し、または、前記再生原料を前記出発原料の一部として前記出発原料全体に占める割合が50質量%以下となるように添加した後、平均粒子径を5〜100μmとし、
これを用いて気孔率が50%以上の多孔質の炭化珪素ハニカム構造体を製造する炭化珪素ハニカム構造体の製造方法。 - 前記再生原料中に含まれる酸素含有量が20質量%以下である請求項1に記載の炭化珪素ハニカム構造体の製造方法。
- 請求項1または2に記載の炭化珪素ハニカム構造体の製造方法の工程中における、前記再生原料を前記出発原料の一部として含む坏土。
- 請求項3に記載の坏土を押出成形して形成された、未焼成のハニカム成形体。
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