JP5548143B2 - Ｌｅｄチップの製造方法 - Google Patents

Ｌｅｄチップの製造方法 Download PDF

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Publication number
JP5548143B2
JP5548143B2 JP2011012547A JP2011012547A JP5548143B2 JP 5548143 B2 JP5548143 B2 JP 5548143B2 JP 2011012547 A JP2011012547 A JP 2011012547A JP 2011012547 A JP2011012547 A JP 2011012547A JP 5548143 B2 JP5548143 B2 JP 5548143B2
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JP
Japan
Prior art keywords
laser
substrate
led chip
film
light
Prior art date
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Expired - Fee Related
Application number
JP2011012547A
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English (en)
Japanese (ja)
Other versions
JP2012156217A (ja
Inventor
直哉 木山
郁祥 中谷
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsuboshi Diamond Industrial Co Ltd
Original Assignee
Mitsuboshi Diamond Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsuboshi Diamond Industrial Co Ltd filed Critical Mitsuboshi Diamond Industrial Co Ltd
Priority to JP2011012547A priority Critical patent/JP5548143B2/ja
Priority to TW100132143A priority patent/TWI447964B/zh
Priority to CN201110329555.7A priority patent/CN102610711B/zh
Priority to KR1020110139660A priority patent/KR101390115B1/ko
Publication of JP2012156217A publication Critical patent/JP2012156217A/ja
Application granted granted Critical
Publication of JP5548143B2 publication Critical patent/JP5548143B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/50—Wavelength conversion elements
    • H01L33/501—Wavelength conversion elements characterised by the materials, e.g. binder
    • H01L33/502—Wavelength conversion materials
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/50—Wavelength conversion elements
    • H01L33/505—Wavelength conversion elements characterised by the shape, e.g. plate or foil
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
    • H01L2933/0008—Processes
    • H01L2933/0033—Processes relating to semiconductor body packages
    • H01L2933/0041—Processes relating to semiconductor body packages relating to wavelength conversion elements

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Dicing (AREA)
  • Laser Beam Processing (AREA)
  • Led Devices (AREA)
JP2011012547A 2011-01-25 2011-01-25 Ｌｅｄチップの製造方法 Expired - Fee Related JP5548143B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2011012547A JP5548143B2 (ja) 2011-01-25 2011-01-25 Ｌｅｄチップの製造方法
TW100132143A TWI447964B (zh) 2011-01-25 2011-09-06 LED wafer manufacturing method
CN201110329555.7A CN102610711B (zh) 2011-01-25 2011-10-24 Led芯片的制造方法
KR1020110139660A KR101390115B1 (ko) 2011-01-25 2011-12-22 Ｌｅｄ 칩의 제조 방법

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2011012547A JP5548143B2 (ja) 2011-01-25 2011-01-25 Ｌｅｄチップの製造方法

Publications (2)

Publication Number Publication Date
JP2012156217A JP2012156217A (ja) 2012-08-16
JP5548143B2 true JP5548143B2 (ja) 2014-07-16

Family

ID=46527963

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2011012547A Expired - Fee Related JP5548143B2 (ja) 2011-01-25 2011-01-25 Ｌｅｄチップの製造方法

Country Status (4)

Country Link
JP (1) JP5548143B2 (zh)
KR (1) KR101390115B1 (zh)
CN (1) CN102610711B (zh)
TW (1) TWI447964B (zh)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5658043B2 (ja) * 2011-01-07 2015-01-21 株式会社ディスコ 分割方法
JP2012238746A (ja) * 2011-05-12 2012-12-06 Disco Abrasive Syst Ltd 光デバイスウエーハの分割方法
JP6423135B2 (ja) * 2012-11-29 2018-11-14 三星ダイヤモンド工業株式会社 パターン付き基板の分割方法
TWI483802B (zh) * 2012-12-14 2015-05-11 Ind Tech Res Inst 雷射加工裝置及其方法
CN103934567A (zh) * 2013-01-21 2014-07-23 均豪精密工业股份有限公司 激光加工***及其方法
JP6405556B2 (ja) * 2013-07-31 2018-10-17 リンテック株式会社 保護膜形成フィルム、保護膜形成用シートおよび検査方法
JP6241174B2 (ja) * 2013-09-25 2017-12-06 三星ダイヤモンド工業株式会社 レーザー加工装置、および、パターン付き基板の加工条件設定方法
US9953856B2 (en) 2014-01-22 2018-04-24 Lintec Corporation Protective film-forming film, sheet for forming protective film, complex sheet for forming protective film, and method of producing manufactured product
WO2015111632A1 (ja) * 2014-01-22 2015-07-30 リンテック株式会社 保護膜形成フィルム、保護膜形成用シート、保護膜形成用複合シートおよび検査方法
JP6562014B2 (ja) * 2017-02-20 2019-08-21 日亜化学工業株式会社 発光素子の製造方法
JP6228343B1 (ja) * 2017-06-20 2017-11-08 リンテック株式会社 保護膜形成フィルム、保護膜形成用シートおよび検査方法
JP6401364B2 (ja) * 2017-10-12 2018-10-10 リンテック株式会社 保護膜形成用複合シートおよびレーザー印字方法
JP2018026597A (ja) * 2017-11-16 2018-02-15 ローム株式会社 発光素子および発光素子パッケージ
KR102152007B1 (ko) * 2020-03-18 2020-09-04 주식회사 탑 엔지니어링 기판 절단 방법 및 기판 절단 장치
CN113695748B (zh) * 2021-08-23 2022-10-25 西安交通大学 一种基于空间光调制器的鲨鱼皮表面结构快速制备方法

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB9511841D0 (en) * 1995-06-10 1995-08-09 Pilkington Glass Ltd Mirrors and their production
JP3439063B2 (ja) * 1997-03-24 2003-08-25 三洋電機株式会社 半導体発光素子および発光ランプ
JP3769872B2 (ja) * 1997-05-06 2006-04-26 ソニー株式会社 半導体発光素子
JP3604550B2 (ja) * 1997-12-16 2004-12-22 日亜化学工業株式会社 窒化物半導体素子の製造方法
JP4659300B2 (ja) * 2000-09-13 2011-03-30 浜松ホトニクス株式会社 レーザ加工方法及び半導体チップの製造方法
JP3895287B2 (ja) * 2003-03-06 2007-03-22 弘明 三澤 サファイア基板の分割方法及び分割装置
JP4279631B2 (ja) * 2003-08-20 2009-06-17 三菱化学株式会社 窒化物系半導体素子の製造方法
JP2005271563A (ja) * 2004-03-26 2005-10-06 Daitron Technology Co Ltd 硬脆材料板体の分割加工方法及び装置

Also Published As

Publication number Publication date
TW201232836A (en) 2012-08-01
KR20120086241A (ko) 2012-08-02
CN102610711B (zh) 2015-04-08
JP2012156217A (ja) 2012-08-16
TWI447964B (zh) 2014-08-01
CN102610711A (zh) 2012-07-25
KR101390115B1 (ko) 2014-04-28

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