JP5509295B2 - 半導体装置 - Google Patents
半導体装置 Download PDFInfo
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- JP5509295B2 JP5509295B2 JP2012242398A JP2012242398A JP5509295B2 JP 5509295 B2 JP5509295 B2 JP 5509295B2 JP 2012242398 A JP2012242398 A JP 2012242398A JP 2012242398 A JP2012242398 A JP 2012242398A JP 5509295 B2 JP5509295 B2 JP 5509295B2
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- semiconductor chip
- connection
- solder
- semiconductor device
- solder bumps
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- 239000004065 semiconductor Substances 0.000 title claims description 196
- 229910000679 solder Inorganic materials 0.000 claims description 173
- 230000004888 barrier function Effects 0.000 claims description 72
- 238000000034 method Methods 0.000 claims description 57
- 239000000203 mixture Substances 0.000 claims description 26
- 239000010949 copper Substances 0.000 claims description 17
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 16
- 229910052802 copper Inorganic materials 0.000 claims description 15
- 230000015572 biosynthetic process Effects 0.000 claims description 14
- 238000007772 electroless plating Methods 0.000 claims description 12
- 238000009713 electroplating Methods 0.000 claims description 7
- 150000002816 nickel compounds Chemical class 0.000 claims description 4
- 239000010410 layer Substances 0.000 description 128
- 229910052751 metal Inorganic materials 0.000 description 57
- 239000002184 metal Substances 0.000 description 57
- 239000000758 substrate Substances 0.000 description 56
- 238000007747 plating Methods 0.000 description 43
- 229920005989 resin Polymers 0.000 description 42
- 239000011347 resin Substances 0.000 description 42
- 230000035882 stress Effects 0.000 description 39
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 32
- 230000004907 flux Effects 0.000 description 23
- 238000004519 manufacturing process Methods 0.000 description 23
- 238000012986 modification Methods 0.000 description 18
- 230000004048 modification Effects 0.000 description 18
- 238000012360 testing method Methods 0.000 description 18
- 230000008859 change Effects 0.000 description 17
- 229910052759 nickel Inorganic materials 0.000 description 14
- 239000011229 interlayer Substances 0.000 description 13
- 238000004140 cleaning Methods 0.000 description 12
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 10
- CURLTUGMZLYLDI-UHFFFAOYSA-N Carbon dioxide Chemical compound O=C=O CURLTUGMZLYLDI-UHFFFAOYSA-N 0.000 description 8
- 230000000052 comparative effect Effects 0.000 description 8
- 238000011156 evaluation Methods 0.000 description 8
- CLDVQCMGOSGNIW-UHFFFAOYSA-N nickel tin Chemical compound [Ni].[Sn] CLDVQCMGOSGNIW-UHFFFAOYSA-N 0.000 description 8
- 229920001187 thermosetting polymer Polymers 0.000 description 8
- 229910001128 Sn alloy Inorganic materials 0.000 description 7
- 229910045601 alloy Inorganic materials 0.000 description 7
- 239000000956 alloy Substances 0.000 description 7
- 230000008569 process Effects 0.000 description 7
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 6
- 239000003822 epoxy resin Substances 0.000 description 6
- 239000011521 glass Substances 0.000 description 6
- 239000000463 material Substances 0.000 description 6
- 229910052698 phosphorus Inorganic materials 0.000 description 6
- 239000011574 phosphorus Substances 0.000 description 6
- 229920000647 polyepoxide Polymers 0.000 description 6
- QDWJUBJKEHXSMT-UHFFFAOYSA-N boranylidynenickel Chemical compound [Ni]#B QDWJUBJKEHXSMT-UHFFFAOYSA-N 0.000 description 5
- KUNSUQLRTQLHQQ-UHFFFAOYSA-N copper tin Chemical class [Cu].[Sn] KUNSUQLRTQLHQQ-UHFFFAOYSA-N 0.000 description 5
- 238000005530 etching Methods 0.000 description 5
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 5
- 229910052737 gold Inorganic materials 0.000 description 5
- 239000010931 gold Substances 0.000 description 5
- 239000007788 liquid Substances 0.000 description 5
- 238000007639 printing Methods 0.000 description 5
- 230000008646 thermal stress Effects 0.000 description 5
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 4
- 229910002092 carbon dioxide Inorganic materials 0.000 description 4
- 239000001569 carbon dioxide Substances 0.000 description 4
- 239000004744 fabric Substances 0.000 description 4
- 239000011888 foil Substances 0.000 description 4
- OFNHPGDEEMZPFG-UHFFFAOYSA-N phosphanylidynenickel Chemical compound [P].[Ni] OFNHPGDEEMZPFG-UHFFFAOYSA-N 0.000 description 4
- 239000010936 titanium Substances 0.000 description 4
- 229910052782 aluminium Inorganic materials 0.000 description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 3
- 238000004458 analytical method Methods 0.000 description 3
- 238000011161 development Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 239000011256 inorganic filler Substances 0.000 description 3
- 229910003475 inorganic filler Inorganic materials 0.000 description 3
- 239000012299 nitrogen atmosphere Substances 0.000 description 3
- 229920002120 photoresistant polymer Polymers 0.000 description 3
- 230000003405 preventing effect Effects 0.000 description 3
- 230000001681 protective effect Effects 0.000 description 3
- 238000007789 sealing Methods 0.000 description 3
- JYEUMXHLPRZUAT-UHFFFAOYSA-N 1,2,3-triazine Chemical compound C1=CN=NN=C1 JYEUMXHLPRZUAT-UHFFFAOYSA-N 0.000 description 2
- XQUPVDVFXZDTLT-UHFFFAOYSA-N 1-[4-[[4-(2,5-dioxopyrrol-1-yl)phenyl]methyl]phenyl]pyrrole-2,5-dione Chemical compound O=C1C=CC(=O)N1C(C=C1)=CC=C1CC1=CC=C(N2C(C=CC2=O)=O)C=C1 XQUPVDVFXZDTLT-UHFFFAOYSA-N 0.000 description 2
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 2
- 239000003638 chemical reducing agent Substances 0.000 description 2
- 239000011651 chromium Substances 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 150000001875 compounds Chemical class 0.000 description 2
- 230000007547 defect Effects 0.000 description 2
- 238000009792 diffusion process Methods 0.000 description 2
- 239000000945 filler Substances 0.000 description 2
- 239000007789 gas Substances 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 238000009413 insulation Methods 0.000 description 2
- 239000010955 niobium Substances 0.000 description 2
- 230000002093 peripheral effect Effects 0.000 description 2
- 229920003192 poly(bis maleimide) Polymers 0.000 description 2
- 229920001955 polyphenylene ether Polymers 0.000 description 2
- 239000000377 silicon dioxide Substances 0.000 description 2
- 238000005476 soldering Methods 0.000 description 2
- 238000009210 therapy by ultrasound Methods 0.000 description 2
- 229910052719 titanium Inorganic materials 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- KWSLGOVYXMQPPX-UHFFFAOYSA-N 5-[3-(trifluoromethyl)phenyl]-2h-tetrazole Chemical compound FC(F)(F)C1=CC=CC(C2=NNN=N2)=C1 KWSLGOVYXMQPPX-UHFFFAOYSA-N 0.000 description 1
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 1
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 1
- 229910000881 Cu alloy Inorganic materials 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- WNROFYMDJYEPJX-UHFFFAOYSA-K aluminium hydroxide Chemical compound [OH-].[OH-].[OH-].[Al+3] WNROFYMDJYEPJX-UHFFFAOYSA-K 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 239000012298 atmosphere Substances 0.000 description 1
- JRPBQTZRNDNNOP-UHFFFAOYSA-N barium titanate Chemical compound [Ba+2].[Ba+2].[O-][Ti]([O-])([O-])[O-] JRPBQTZRNDNNOP-UHFFFAOYSA-N 0.000 description 1
- 229910002113 barium titanate Inorganic materials 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- 239000012141 concentrate Substances 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 230000032798 delamination Effects 0.000 description 1
- YPTUAQWMBNZZRN-UHFFFAOYSA-N dimethylaminoboron Chemical compound [B]N(C)C YPTUAQWMBNZZRN-UHFFFAOYSA-N 0.000 description 1
- 238000010292 electrical insulation Methods 0.000 description 1
- 230000006355 external stress Effects 0.000 description 1
- 238000007429 general method Methods 0.000 description 1
- BHEPBYXIRTUNPN-UHFFFAOYSA-N hydridophosphorus(.) (triplet) Chemical compound [PH] BHEPBYXIRTUNPN-UHFFFAOYSA-N 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- -1 neodymium-yttrium aluminum Chemical compound 0.000 description 1
- 229910052758 niobium Inorganic materials 0.000 description 1
- GUCVJGMIXFAOAE-UHFFFAOYSA-N niobium atom Chemical compound [Nb] GUCVJGMIXFAOAE-UHFFFAOYSA-N 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 238000000059 patterning Methods 0.000 description 1
- 230000035699 permeability Effects 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 239000009719 polyimide resin Substances 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 229910001379 sodium hypophosphite Inorganic materials 0.000 description 1
- 238000004528 spin coating Methods 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 238000007655 standard test method Methods 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 230000008961 swelling Effects 0.000 description 1
- 229910052715 tantalum Inorganic materials 0.000 description 1
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 description 1
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
- 239000010937 tungsten Substances 0.000 description 1
- 238000001771 vacuum deposition Methods 0.000 description 1
- 239000002966 varnish Substances 0.000 description 1
- 229910019901 yttrium aluminum garnet Inorganic materials 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
- H01L2224/321—Disposition
- H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/32225—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73201—Location after the connecting process on the same surface
- H01L2224/73203—Bump and layer connectors
- H01L2224/73204—Bump and layer connectors the bump connector being embedded into the layer connector
Landscapes
- Wire Bonding (AREA)
Description
本発明の第1の実施形態について図面を参照しながら説明する。
なお、第1の実施形態の一変形例として、半導体チップ1の電極パッド2の上に形成されるUBM層3と、配線基板10の接続パッド15の上に形成されるバリアメタル層17とを、いずれもリンの濃度が5wt%で、厚さが5μmの電解ニッケル−リンめっきによって形成してもよい。このようにすると、UBM層3及びバリアメタル層17はいずれも電解めっき法により結晶質となるため、はんだバンプ4における半導体チップ1及び配線基板10から受ける熱ストレスによる応力が均等となる。従って、はんだバンプ4に発生するクラックを抑制することができる。
第2変形例として、半導体チップ1の電極パッド2の上に形成されるUBM層3を構成する無電解ニッケル−リンめっきの厚さと、配線基板10の接続パッド15の上に形成されるバリアメタル層17を構成する無電解ニッケル−リンめっきの厚さとを、いずれも5μmに代えて10μmとする。
以下、本発明の第2の実施形態について図面を参照しながら説明する。
第1変形例として、半導体チップ1の電極パッド2の上に形成されるUBM層3を構成する無電解ニッケル−リンめっきの厚さと、配線基板10の接続パッド15の上に形成されるバリアメタル層17を構成する無電解ニッケル−リンめっきの厚さとを、いずれも5μmに代えて10μmとする。
第2変形例として、半導体チップ1の電極パッド2の上に形成されるUBM層3を構成する無電解ニッケル−リンめっきと、配線基板10の接続パッド15の上に形成されるバリアメタル層17を構成する無電解ニッケル−リンめっきに代えて、いずれも無電解ニッケル−ボロンめっきとしている。無電解ニッケル−ボロンめっきの厚さは共に5μmである。
第3変形例として、配線基板10の接続パッド15の上に形成されるバリアメタル層17を構成する無電解ニッケル−リンめっきの厚さを5μmに代えて10μmとする。一方、半導体チップ1の電極パッド2の上に形成されるUBM層3の厚さは、5μmのままとしている。
以下、本発明の比較例について図面を参照しながら説明する。
本比較例においては、半導体チップ1と配線基板10Aがはんだバンプ4を介して接続される場合に、全てのはんだバンプ4における半導体チップ1側に形成される接合界面が、水平方向からの擦り応力に対して脆弱なニッケル−スズ(Ni6Sn5)合金となる。
2 電極パッド
3 アンダーバンプメタル(UBM)層
4 はんだバンプ
5 絶縁保護膜
6 アンダーフィル樹脂
7 フラックス
10 配線基板
10A 配線基板
11 コア基板
12 回路パターン
13 ビア
14 層間絶縁樹脂層
15 接続パッド
16 ソルダレジスト層
17 バリアメタル層
18 コンタクトプラグ
Claims (6)
- 少なくとも1つの素子が形成された素子形成面と該素子形成面に形成された銅から構成される複数の電極パッドとを有する半導体チップと、
主面が前記半導体チップの素子形成面と対向し、且つそれぞれが前記主面の前記各電極パッドと対向する位置に形成された複数の接続パッドを有する配線基板と、
前記各電極パッドと前記各接続パッドとの間にそれぞれ設けられ、前記各電極パッドと前記各接続パッドとを電気的に接続する複数のはんだバンプとを備え、
前記はんだバンプにおける、前記電極パッド側の組成と前記接続パッド側の組成とは同一であり、
前記半導体チップにおける隅部を除く領域であって、前記電極パッドと前記はんだバンプとの間及び前記接続パッドと前記はんだバンプとの間には、それぞれバリア層が形成されており、
前記半導体チップにおける隅部の領域であって、前記電極パッドと前記はんだバンプとの間及び前記接続パッドと前記はんだバンプとの間には、共にバリア層が形成されていないことを特徴とする半導体装置。 - 前記はんだバンプにおける前記電極パッド側部分と前記接続パッド側部分とは、共に非晶質であることを特徴とする請求項1に記載の半導体装置。
- 前記バリア層は、無電解めっき法により形成されたニッケル化合物からなることを特徴とする請求項2に記載の半導体装置。
- 前記はんだバンプにおける前記電極パッド側部分と前記接続パッド側部分とは、共に結晶質であることを特徴とする請求項1に記載の半導体装置。
- 前記バリア層は、電解めっき法により形成されたニッケル化合物からなることを特徴とする請求項4に記載の半導体装置。
- 前記複数のはんだバンプは、その体積が互いに等しいことを特徴とする請求項1〜5のいずれか1項に記載の半導体装置。
Priority Applications (1)
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JP2012242398A JP5509295B2 (ja) | 2012-11-02 | 2012-11-02 | 半導体装置 |
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JP2009001444A Division JP2010161136A (ja) | 2009-01-07 | 2009-01-07 | 半導体装置及びその製造方法 |
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JP4034107B2 (ja) * | 2002-04-17 | 2008-01-16 | 株式会社ルネサステクノロジ | 半導体装置 |
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