JP5501759B2 - 接着剤組成物及びこれを用いた接着フィルム - Google Patents
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Description
まず、還流冷却器を連結したコック付き25mlの水分定量受器、温度計、撹拌器を備えた1リットルのセパラブルフラスコを用意した。そこに、上記一般式(3a)で表されるジアミンとしてBAPP(2,2−ビス[4−(4−アミノフェノキシ)フェニル]プロパン)、上記一般式(27’)で表されるジアミンとしてポリオキシプロピレンジアミンであるジェファーミンD−2000(サンテクノケミカル(株)社製、商品名、アミン当量1000、n3が平均して33.1)、上記一般式(3c)で表されるジアミンとして反応性シリコーンオイルX−22−161A(信越化学工業(株)社製、商品名、アミン当量840、n1が10〜60)、非プロトン性極性溶媒としてNMP(N−メチル−2−ピロリドン)及びγ−BL(γ−ブチロラクトン)、トリメリット酸無水物(TMA)をそれぞれ表1に示した配合比で仕込んで反応混合液とし、これを80℃に加熱しながら30分間撹拌した。そして、水と共沸可能な芳香族炭化水素としてトルエンを100ml投入してから温度を約160℃として2時間還流させた。水分定量受器に水が約3.6ml以上溜まっていること、水の流出が見られなくなっていることを確認後、水分定量受器に溜まっている流出水を除去しながら、約190℃まで温度を上げて反応混合液からトルエンを除去した。配合量の単位は重量部である。
得られた接着剤組成物溶液(実施例1〜3、比較例1〜2)を厚さ50μmのテフロン(登録商標)フィルム(ニチアス(株)製、商品名:ナフロンテープ)上に塗布し、乾燥機にて140℃で10分間加熱して溶媒を除去することにより、膜厚が25μmの接着剤組成物からなる接着層を形成させた。更に、乾燥機にて200℃で60分間加熱硬化させた後、テフロン(登録商標)フィルムを剥がして試料Aとした。
得られた接着剤組成物溶液(実施例1〜3、比較例1〜2)を厚さ50μmのテフロン(登録商標)フィルム(ニチアス(株)製、商品名:ナフロンテープ)上に塗布し、乾燥機にて140℃で10分間加熱して溶媒を除去することにより、膜厚が60μmの接着剤組成物からなる接着層を形成させた。更に200℃で60分間加熱硬化させた後、テフロン(登録商標)フィルムを剥がして試料Bとした。
得られた接着剤組成物溶液(実施例1〜3、比較例1〜2)を厚さ25μmのポリイミドフィルム(東レ・デュポン(株)社製、商品名:カプトン100V)上に塗布し、乾燥機にて140℃で10分間加熱して溶媒を除去することにより、膜厚が25μmの接着剤組成物からなる接着層を形成させた。続いて、35μmの圧延銅箔(株式会社日鉱マテリアルズ製、商品名:BHY−22B−T)の粗化面側と上記接着層とが対向しながら接するように貼り合わせて、温度200℃/圧力4MPaで熱プレスを行って仮接着させた。更に、乾燥機にて200℃で60分間加熱硬化させ、ポリイミドフィルム/接着層/圧延銅箔の順で積層された積層体を得、これを試料Cとした。
得られた接着剤組成物溶液(実施例1〜3、比較例1〜2)を厚さ25μmのポリイミドフィルム(東レ・デュポン(株)社製、商品名:カプトン100V)上に塗布し、乾燥機にて140℃で10分間加熱して溶媒を除去することにより、膜厚が25μmの接着剤組成物からなる接着層を形成させた。続いて、35μmの圧延銅箔(株式会社日鉱マテリアルズ製、商品名:BHY−22B−T)の光沢面側と上記接着層とが対向しながら接するように貼り合わせて、温度200℃/圧力4MPaで熱プレスを行って仮接着させた。更に、乾燥機にて200℃で60分間加熱硬化させ、ポリイミドフィルム/接着層/圧延銅箔の順で積層された積層体を得、これを試料Cとした。
試料(A)のガラス転移温度(Tg)は動的粘弾性測定装置DVE(レオメトリック(株)製、商品名)を用いて、引張りモード、チャック間距離:22.5mm、測定温度:−50〜300℃、昇温速度:5℃/分、及び測定周波数:10Hzの条件下で測定され、tanδピークの最大値を採用した。その結果は表3に示す。
貯蔵弾性率の測定は、Tgの測定と同様にして行い、25℃における値を用いた。
試料B(フィルム状硬化物のみ)について、分析装置TG−DTA(セイコー電子工業社製、商品名)を用いて、試料の質量が5%減少するときの温度を熱分解温度とした。
試料B(フィルム状硬化物のみ)について、熱機械的分析装置TMA(セイコー電子工業社製、商品名)を用いて、25℃からガラス転移温度までの温度範囲における熱膨張率を測定した。
試料B(フィルム状硬化物のみ)について、インピ−ダンス/マテリアルアナライザ−(HP社製)を用いて、周波数1GHz及び5GHzの条件下で測定した。
試料C及び試料Dは接着層を10mmの短冊状に切れ目を入れて用いた。試料の接着性は、常態、150で240時間加熱放置した後、及び121℃、2気圧、蒸気が飽和した状態で30時間放置した後に、それぞれ評価した。その評価方法としては、上記環境下に置いた後の試料を用いて、測定温度:25℃、剥離速度:10mm/minの条件下で90°方向の引き剥がし試験を行い、圧延銅箔引きの剥離強度(kN/m)を測定して試料の接着性とした。
試料Cは20×20mm四角状に切断して用いた。試料のはんだ耐熱性は、常態、及び40℃、湿度90%の状態で8時間放置後、それぞれ評価した。その評価方法としては、上記環境下に置いた後の試料を用いて、280℃又は300℃に加温したはんだ浴に1分間、銅箔側を下にして試料を浮かべた後の、ふくれ、はがれ等の外観異常の有無から評価した。評価は、○:ふくれ、はがれ等の外観異常無し、×:ふくれ、はがれ等の外観異常有りとした。
Claims (4)
- (A)有機溶剤に溶解する変性ポリアミドイミド樹脂、
(B)ジシクロペンタジエン型エポキシ樹脂、及び
(C)硬化剤又は硬化促進剤
を含有し、
前記変性ポリアミドイミド樹脂が、下記一般式(1a)で表されるジイミドジカルボン酸、下記一般式(1b)で表されるジイミドジカルボン酸及び下記一般式(1c)で表されるジイミドジカルボン酸を含むジイミドジカルボン酸混合物と、下記化学式(2a)、(2b)、(2c)、(2d)又は(2e)で表される芳香族ジイソシアネートとを反応させて得られる樹脂であり、
前記変性ポリアミドイミド樹脂100重量部に対して、前記ジシクロペンタジエン型エポキシ樹脂を5〜100重量部含有する、熱硬化性接着剤組成物。
式(1b)中、Z2は下記一般式(21)、(22)、(23)、(24)、(25)、(26)又は(27)で表される2価の有機基を示し、
式(1c)中、R1及びR2はそれぞれ独立に2価の有機基を示し、R3、R4、R5及びR6はそれぞれ独立に炭素数1〜20のアルキル基又は炭素数6〜18のアリール基を示し、n1は1〜50の整数を示し、
式(24)中、X2は炭素数1〜3の脂肪族炭化水素基、炭素数1〜3のハロゲン化脂肪族炭化水素基、スルホニル基、オキシ基又はカルボニル基を示し、
式(25)中、X3は炭素数1〜3の脂肪族炭化水素基、炭素数1〜3のハロゲン化脂肪族炭化水素基、スルホニル基、オキシ基、カルボニル基又は単結合を示し、
式(27)中、R10はアルキレン基を示し、n2は1〜70の整数を示す。] - 加熱により硬化してガラス転移温度が100〜260℃である硬化物を形成する、請求項1記載の接着剤組成物。
- 前記変性ポリアミドイミド樹脂がポリシロキサン鎖を有する、請求項1記載の接着剤組成物。
- 支持体フィルムと、前記支持体フィルム上に形成された請求項1〜3のいずれか一項に記載の接着剤組成物からなる接着層とを備える、接着フィルム。
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JP2009515244A JP5501759B2 (ja) | 2007-05-21 | 2008-05-20 | 接着剤組成物及びこれを用いた接着フィルム |
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JP2007134415 | 2007-05-21 | ||
JP2007134415 | 2007-05-21 | ||
PCT/JP2008/059234 WO2008143253A1 (ja) | 2007-05-21 | 2008-05-20 | 接着剤組成物及びこれを用いた接着フィルム |
JP2009515244A JP5501759B2 (ja) | 2007-05-21 | 2008-05-20 | 接着剤組成物及びこれを用いた接着フィルム |
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JPWO2008143253A1 JPWO2008143253A1 (ja) | 2010-08-12 |
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KR (1) | KR101148853B1 (ja) |
CN (2) | CN101679832A (ja) |
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WO2010141066A2 (en) * | 2009-06-04 | 2010-12-09 | Office Of Technology Transfer | Fabrication of high-temperature thermoelectric couple |
US20110090259A1 (en) * | 2009-10-16 | 2011-04-21 | Samsung Electronics Co., Ltd. | Light emitting module, backlight unit and display apparatus |
JP5890253B2 (ja) * | 2012-05-31 | 2016-03-22 | 株式会社巴川製紙所 | 熱伝導性熱硬化型接着剤組成物及び熱伝導性熱硬化型接着剤シート |
CN108137931B (zh) * | 2015-10-16 | 2021-06-08 | 住友化学株式会社 | 树脂溶液组合物 |
KR101700161B1 (ko) * | 2016-05-17 | 2017-01-26 | 이오에스(주) | 리지드-플렉서블 기판 제조방법 및 이에 사용되는 동박판-테이프 |
TWI614285B (zh) * | 2016-11-11 | 2018-02-11 | 財團法人工業技術研究院 | 聚合物及包含該聚合物之樹脂組成物 |
CN110050033A (zh) * | 2016-12-09 | 2019-07-23 | 日立化成株式会社 | 组合物、粘接剂、烧结体、接合体和接合体的制造方法 |
CN110050036A (zh) * | 2016-12-09 | 2019-07-23 | 日立化成株式会社 | 组合物、粘接剂、烧结体、接合体和接合体的制造方法 |
WO2019230944A1 (ja) * | 2018-06-01 | 2019-12-05 | 三菱瓦斯化学株式会社 | 樹脂組成物、プリプレグ、金属箔張積層板、樹脂シート及びプリント配線板 |
KR102257926B1 (ko) * | 2018-09-20 | 2021-05-28 | 주식회사 엘지화학 | 다층인쇄회로기판, 이의 제조방법 및 이를 이용한 반도체 장치 |
JP7444048B2 (ja) | 2020-12-22 | 2024-03-06 | 株式会社村田製作所 | 積層セラミックコンデンサ及び積層セラミックコンデンサの製造方法 |
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WO2003022929A1 (fr) * | 2001-09-05 | 2003-03-20 | Hitachi Chemical Co., Ltd. | Composition de resine ignifuge et thermoresistante et film adhesif en etant fait |
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JP2001152015A (ja) * | 1999-11-29 | 2001-06-05 | Hitachi Chem Co Ltd | 耐熱性樹脂組成物及びそれを用いた接着フィルム |
JP2002161205A (ja) * | 2000-11-24 | 2002-06-04 | Hitachi Chem Co Ltd | 難燃性耐熱性樹脂組成物、これを用いた接着剤フィルム及び接着剤付きポリイミドフィルム |
WO2003022929A1 (fr) * | 2001-09-05 | 2003-03-20 | Hitachi Chemical Co., Ltd. | Composition de resine ignifuge et thermoresistante et film adhesif en etant fait |
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CN105295824B (zh) | 2019-06-18 |
US8697244B2 (en) | 2014-04-15 |
CN101679832A (zh) | 2010-03-24 |
JPWO2008143253A1 (ja) | 2010-08-12 |
WO2008143253A1 (ja) | 2008-11-27 |
US20100240821A1 (en) | 2010-09-23 |
TWI370164B (ja) | 2012-08-11 |
TW200911948A (en) | 2009-03-16 |
KR20100009575A (ko) | 2010-01-27 |
CN105295824A (zh) | 2016-02-03 |
KR101148853B1 (ko) | 2012-05-29 |
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