JP5483658B2 - 配線基板の製造方法 - Google Patents
配線基板の製造方法 Download PDFInfo
- Publication number
- JP5483658B2 JP5483658B2 JP2010171017A JP2010171017A JP5483658B2 JP 5483658 B2 JP5483658 B2 JP 5483658B2 JP 2010171017 A JP2010171017 A JP 2010171017A JP 2010171017 A JP2010171017 A JP 2010171017A JP 5483658 B2 JP5483658 B2 JP 5483658B2
- Authority
- JP
- Japan
- Prior art keywords
- copper plating
- plating layer
- layer
- electroless copper
- wiring conductor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000004519 manufacturing process Methods 0.000 title claims description 30
- 238000007747 plating Methods 0.000 claims description 119
- 229910052802 copper Inorganic materials 0.000 claims description 104
- 239000010949 copper Substances 0.000 claims description 104
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 103
- 239000004020 conductor Substances 0.000 claims description 54
- 238000000034 method Methods 0.000 claims description 27
- 239000000758 substrate Substances 0.000 claims description 10
- 238000005530 etching Methods 0.000 claims description 9
- 238000000151 deposition Methods 0.000 claims 2
- 238000007796 conventional method Methods 0.000 description 13
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 12
- 230000002093 peripheral effect Effects 0.000 description 11
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 8
- 239000012190 activator Substances 0.000 description 6
- 238000007788 roughening Methods 0.000 description 6
- 238000005259 measurement Methods 0.000 description 5
- 229910052763 palladium Inorganic materials 0.000 description 4
- 229920005989 resin Polymers 0.000 description 4
- 239000011347 resin Substances 0.000 description 4
- 239000003054 catalyst Substances 0.000 description 3
- 239000011888 foil Substances 0.000 description 3
- 239000007788 liquid Substances 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 230000003746 surface roughness Effects 0.000 description 3
- 206010034972 Photosensitivity reaction Diseases 0.000 description 2
- 239000000654 additive Substances 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 2
- 230000036211 photosensitivity Effects 0.000 description 2
- 229920003217 poly(methylsilsesquioxane) Polymers 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- JYEUMXHLPRZUAT-UHFFFAOYSA-N 1,2,3-triazine Chemical compound C1=CN=NN=C1 JYEUMXHLPRZUAT-UHFFFAOYSA-N 0.000 description 1
- XQUPVDVFXZDTLT-UHFFFAOYSA-N 1-[4-[[4-(2,5-dioxopyrrol-1-yl)phenyl]methyl]phenyl]pyrrole-2,5-dione Chemical compound O=C1C=CC(=O)N1C(C=C1)=CC=C1CC1=CC=C(N2C(C=CC2=O)=O)C=C1 XQUPVDVFXZDTLT-UHFFFAOYSA-N 0.000 description 1
- LCPVQAHEFVXVKT-UHFFFAOYSA-N 2-(2,4-difluorophenoxy)pyridin-3-amine Chemical compound NC1=CC=CN=C1OC1=CC=C(F)C=C1F LCPVQAHEFVXVKT-UHFFFAOYSA-N 0.000 description 1
- 229920000298 Cellophane Polymers 0.000 description 1
- 229920000106 Liquid crystal polymer Polymers 0.000 description 1
- 239000004977 Liquid-crystal polymers (LCPs) Substances 0.000 description 1
- 229920000265 Polyparaphenylene Polymers 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 229910000365 copper sulfate Inorganic materials 0.000 description 1
- ARUVKPQLZAKDPS-UHFFFAOYSA-L copper(II) sulfate Chemical compound [Cu+2].[O-][S+2]([O-])([O-])[O-] ARUVKPQLZAKDPS-UHFFFAOYSA-L 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 239000007800 oxidant agent Substances 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 229920003192 poly(bis maleimide) Polymers 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 239000009719 polyimide resin Substances 0.000 description 1
- -1 polyphenylene Polymers 0.000 description 1
- 239000012286 potassium permanganate Substances 0.000 description 1
- 239000011734 sodium Substances 0.000 description 1
- SUKJFIGYRHOWBL-UHFFFAOYSA-N sodium hypochlorite Chemical compound [Na+].Cl[O-] SUKJFIGYRHOWBL-UHFFFAOYSA-N 0.000 description 1
- CHQMHPLRPQMAMX-UHFFFAOYSA-L sodium persulfate Substances [Na+].[Na+].[O-]S(=O)(=O)OOS([O-])(=O)=O CHQMHPLRPQMAMX-UHFFFAOYSA-L 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
Images
Landscapes
- Manufacturing Of Printed Circuit Boards (AREA)
- Manufacturing Of Printed Wiring (AREA)
Description
1a 粗化面
2 無電解銅めっき層
2a 黒化膜
3 ドライフィルムレジスト
3A めっきレジスト層
5 電解銅めっき層
6 配線導体
Claims (1)
- 配線導体が形成される絶縁層の表面に算術平均粗さRaが300nm以下の粗化面を形成する工程と、前記粗化面に無電解銅めっき層を被着させる工程と、前記の無電解銅めっき層の表面を黒化処理して厚みが0.05〜0.3μmの黒化膜を形成する工程と、前記黒化膜の表面にドライフィルムレジストを貼着するとともに配線導体のパターンに対応する開口を有するように露光および現像してめっきレジスト層を形成する工程と、前記めっきレジスト層の開口内の前記黒化膜上に電解銅めっき層を被着させる工程と、前記前記黒化膜上からめっきレジスト層を剥離する工程と、前記電解銅めっき層および黒化膜および無電解銅めっき層を、配線導体のパターン間の前記黒化膜を含む無電解銅めっき層が消失するまでエッチング処理することにより電解銅めっき層およびその下の黒化処理された無電解銅めっき層から成る配線導体を形成する工程とを行なうことを特徴とする配線基板の製造方法。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2010171017A JP5483658B2 (ja) | 2010-07-29 | 2010-07-29 | 配線基板の製造方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2010171017A JP5483658B2 (ja) | 2010-07-29 | 2010-07-29 | 配線基板の製造方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2012033642A JP2012033642A (ja) | 2012-02-16 |
JP5483658B2 true JP5483658B2 (ja) | 2014-05-07 |
Family
ID=45846727
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2010171017A Expired - Fee Related JP5483658B2 (ja) | 2010-07-29 | 2010-07-29 | 配線基板の製造方法 |
Country Status (1)
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JP (1) | JP5483658B2 (ja) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6464578B2 (ja) * | 2013-08-01 | 2019-02-06 | 三菱瓦斯化学株式会社 | プリント配線板の製造方法 |
JP7135503B2 (ja) * | 2018-07-02 | 2022-09-13 | 昭和電工マテリアルズ株式会社 | 積層体、プリント配線板及び半導体パッケージ、並びに積層体の製造方法 |
US20220183158A1 (en) * | 2019-03-26 | 2022-06-09 | Mitsui Mining & Smelting Co., Ltd. | Method of manufacturing printed wiring board |
CN113574977A (zh) * | 2019-03-26 | 2021-10-29 | 三井金属矿业株式会社 | 印刷电路板的制造方法 |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2794865B2 (ja) * | 1989-12-29 | 1998-09-10 | ソニー株式会社 | プリント基板の製造方法 |
JPH10284822A (ja) * | 1997-04-01 | 1998-10-23 | Hitachi Chem Co Ltd | プリント配線板の製造法 |
JP5322531B2 (ja) * | 2008-05-27 | 2013-10-23 | 新光電気工業株式会社 | 配線基板の製造方法 |
-
2010
- 2010-07-29 JP JP2010171017A patent/JP5483658B2/ja not_active Expired - Fee Related
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Publication number | Publication date |
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JP2012033642A (ja) | 2012-02-16 |
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