JP5438127B2 - マルチチャンネル現像システム - Google Patents
マルチチャンネル現像システム Download PDFInfo
- Publication number
- JP5438127B2 JP5438127B2 JP2011539781A JP2011539781A JP5438127B2 JP 5438127 B2 JP5438127 B2 JP 5438127B2 JP 2011539781 A JP2011539781 A JP 2011539781A JP 2011539781 A JP2011539781 A JP 2011539781A JP 5438127 B2 JP5438127 B2 JP 5438127B2
- Authority
- JP
- Japan
- Prior art keywords
- processing station
- substrate
- processing
- discharge arm
- fluid
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 238000011161 development Methods 0.000 title description 31
- 238000012545 processing Methods 0.000 claims description 263
- 239000000758 substrate Substances 0.000 claims description 251
- 239000012530 fluid Substances 0.000 claims description 59
- 238000012546 transfer Methods 0.000 claims description 40
- 238000001459 lithography Methods 0.000 claims description 28
- 239000004065 semiconductor Substances 0.000 claims description 13
- 230000000694 effects Effects 0.000 claims description 2
- 238000000576 coating method Methods 0.000 description 53
- 239000011248 coating agent Substances 0.000 description 51
- 238000000034 method Methods 0.000 description 34
- 238000010438 heat treatment Methods 0.000 description 22
- 230000008569 process Effects 0.000 description 20
- 229920002120 photoresistant polymer Polymers 0.000 description 15
- 230000007246 mechanism Effects 0.000 description 11
- 239000006117 anti-reflective coating Substances 0.000 description 8
- 230000008901 benefit Effects 0.000 description 8
- 238000005192 partition Methods 0.000 description 8
- 239000000463 material Substances 0.000 description 7
- 235000012431 wafers Nutrition 0.000 description 7
- 230000015654 memory Effects 0.000 description 6
- 238000007599 discharging Methods 0.000 description 5
- 239000007788 liquid Substances 0.000 description 5
- 238000013461 design Methods 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 4
- 239000002245 particle Substances 0.000 description 4
- 230000007547 defect Effects 0.000 description 3
- 239000003595 mist Substances 0.000 description 3
- 238000012986 modification Methods 0.000 description 3
- 230000004048 modification Effects 0.000 description 3
- 238000003860 storage Methods 0.000 description 3
- 230000007723 transport mechanism Effects 0.000 description 3
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 238000011109 contamination Methods 0.000 description 2
- 238000001514 detection method Methods 0.000 description 2
- 230000003287 optical effect Effects 0.000 description 2
- 238000003672 processing method Methods 0.000 description 2
- 235000001674 Agaricus brunnescens Nutrition 0.000 description 1
- 239000000969 carrier Substances 0.000 description 1
- 230000001276 controlling effect Effects 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- FFUAGWLWBBFQJT-UHFFFAOYSA-N hexamethyldisilazane Chemical compound C[Si](C)(C)N[Si](C)(C)C FFUAGWLWBBFQJT-UHFFFAOYSA-N 0.000 description 1
- 238000007654 immersion Methods 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000012544 monitoring process Methods 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 238000000206 photolithography Methods 0.000 description 1
- 230000001737 promoting effect Effects 0.000 description 1
- 230000001105 regulatory effect Effects 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 238000004528 spin coating Methods 0.000 description 1
- 238000005728 strengthening Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 230000007704 transition Effects 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
- H01L21/6719—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the construction of the processing chambers, e.g. modular processing chambers
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/16—Coating processes; Apparatus therefor
- G03F7/162—Coating on a rotating support, e.g. using a whirler or a spinner
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
- H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68771—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by supporting more than one semiconductor substrate
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
Description
Claims (14)
- 第1側部および第2側部を有し、前記第1側部に近接して基板を保持するように構成された第1処理ステーションおよび前記第2側部に近接して基板を保持するように構成された第2処理ステーションを備える筐体と、
前記第1側部と前記第1処理ステーションとの間に配置され、前記第1処理ステーションに第1の流体を供給するように構成された第1吐出アームと、
前記第2側部と前記第2処理ステーションとの間に配置され、前記第2処理ステーションに前記第1の流体を供給するように構成された第2吐出アームと、
前記第1処理ステーションにリンス流体を供給するように構成された第1リンスアームと、
前記第2処理ステーションに前記リンス流体を供給するように構成された第2リンスアームと、
を備え、
前記第2処理ステーションが前記第1処理ステーションと隣り合って配置され、
前記第1吐出アームおよび前記第2吐出アームは前記筐体の長手方向に移動するように構成され、
前記第1処理ステーションおよび前記第2処理ステーションによって共有されるドレインポートを含み、
前記第1処理ステーションと前記第2処理ステーションとを分離するように構成された複数のシャッターをさらに備える半導体基板処理装置。 - 前記第1処理ステーションの動作は前記第2処理ステーションの動作から独立している、請求項1記載の装置。
- 前記基板処理装置は、前記筐体の外部に配置された基板搬送エリアをさらに備え、
前記複数のシャッターは、
前記第1処理ステーションを前記基板搬送エリアから分離するように構成された第1シャッターと、
前記第2処理ステーションを前記基板搬送エリアから分離するように構成された第2シャッターと、
前記第1処理ステーションを前記第2処理ステーションから分離するように構成された第3シャッターと、
を備える、請求項1記載の装置。 - 前記第3シャッターの上方に設置されたパネルをさらに備え、
少なくとも前記パネルの一部は少なくとも前記第3シャッターの一部と重なる、請求項3記載の装置。 - 前記第1処理ステーションに連結された第1排気開口および前記第2処理ステーションに連結された第2排気開口をさらに含み、
前記第1排気開口は第1排気流路に連結され、前記第2排気開口は第2排気流路に連結される、請求項1記載の装置。 - 前記第1排気流路および前記第2排気流路のそれぞれは第1排気区画および第2排気区画を含む、請求項5記載の装置。
- 前記ドレインポートは現像流体の排出経路を形成するように構成され、
前記排出経路はサイフォン効果を有することを特徴とする請求項1記載の装置。 - 5mmから約25mmの範囲の高さを有する支柱を備える、請求項1記載の装置。
- 前記第1処理ステーションに前記第1の流体を供給するように構成された第3吐出アームおよび前記第2処理ステーションに前記第1の流体を供給するように構成された第4吐出アームをさらに備える、請求項1記載の装置。
- 前記第3吐出アームおよび前記第4吐出アームは円弧状に移動するように構成される、請求項9記載の装置。
- 前記第3吐出アームは前記第1吐出アームに対して垂直に配置され、
前記第4吐出アームは前記第2吐出アームに対して垂直に配置される、請求項9記載の装置。 - 複数の基板処理装置を含むトラックリソグラフィーツールであって、
それぞれの基板処理装置は、
第1側部および第2側部を有し、前記第1側部に近接して基板を保持するように構成された第1処理ステーションおよび前記第2側部に近接して基板を保持するように構成された第2処理ステーションを備える筐体と、
前記第1側部と前記第1処理ステーションとの間に配置され、前記第1処理ステーションに現像流体を供給するように構成された第1吐出アームと、
前記第2側部と前記第2処理ステーションとの間に配置され、前記第2処理ステーションに前記現像流体を供給するように構成された第2吐出アームと、
前記第1処理ステーションにリンス流体を供給するように構成された第1リンスアームと、
前記第2処理ステーションに前記リンス流体を供給するように構成された第2リンスアームと、
を備え、
前記第2処理ステーションが前記第1処理ステーションと隣り合って配置され、
前記第1吐出アームおよび前記第2吐出アームは前記筐体の長手方向に移動するように構成され、
前記第1処理ステーションおよび前記第2処理ステーションによって共有されるドレインポートを含み、
前記第1処理ステーションと前記第2処理ステーションとを分離するように構成された複数のシャッターをさらに備えるトラックリソグラフィーツール。 - 複数の前記基板処理装置が上下に積層配置されている、請求項12記載のトラックリソグラフィーツール。
- 上下の積層は4つの基板処理装置を備える、請求項13記載のトラックリソグラフィーツール。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US12/334,156 US8127713B2 (en) | 2008-12-12 | 2008-12-12 | Multi-channel developer system |
US12/334,156 | 2008-12-12 | ||
PCT/US2009/067038 WO2010068597A1 (en) | 2008-12-12 | 2009-12-07 | Multi-channel developer system |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2012510732A JP2012510732A (ja) | 2012-05-10 |
JP5438127B2 true JP5438127B2 (ja) | 2014-03-12 |
Family
ID=42241048
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2011539781A Active JP5438127B2 (ja) | 2008-12-12 | 2009-12-07 | マルチチャンネル現像システム |
Country Status (3)
Country | Link |
---|---|
US (1) | US8127713B2 (ja) |
JP (1) | JP5438127B2 (ja) |
WO (1) | WO2010068597A1 (ja) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6371253B2 (ja) * | 2014-07-31 | 2018-08-08 | 東京エレクトロン株式会社 | 基板洗浄システム、基板洗浄方法および記憶媒体 |
KR20200028169A (ko) * | 2018-09-06 | 2020-03-16 | 삼성전자주식회사 | Opc 방법, 및 그 opc 방법을 이용한 마스크 제조방법 |
KR102594076B1 (ko) * | 2021-07-08 | 2023-10-25 | 세메스 주식회사 | 기판 처리 장치 및 기판 처리 방법 |
JP2024035711A (ja) * | 2022-09-02 | 2024-03-14 | 株式会社Screenホールディングス | 基板処理装置 |
Family Cites Families (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4361163A (en) * | 1981-01-02 | 1982-11-30 | Seiichiro Aigo | Apparatus for washing semiconductor materials |
JPH07282476A (ja) * | 1994-04-12 | 1995-10-27 | Sony Corp | 現像液塗布方法及び装置 |
JPH0831732A (ja) * | 1994-07-18 | 1996-02-02 | Dainippon Screen Mfg Co Ltd | 回転式基板処理装置 |
DE69910106T2 (de) * | 1998-04-15 | 2004-06-17 | Mitsubishi Heavy Industries, Ltd. | Brennkammer |
JPH11294770A (ja) * | 1998-04-15 | 1999-10-29 | Mitsubishi Heavy Ind Ltd | 燃焼器 |
US6267853B1 (en) * | 1999-07-09 | 2001-07-31 | Applied Materials, Inc. | Electro-chemical deposition system |
JP2002100556A (ja) * | 2000-09-25 | 2002-04-05 | Dainippon Screen Mfg Co Ltd | 基板現像装置 |
US6770424B2 (en) * | 2002-12-16 | 2004-08-03 | Asml Holding N.V. | Wafer track apparatus and methods for dispensing fluids with rotatable dispense arms |
US20070111519A1 (en) * | 2003-10-15 | 2007-05-17 | Applied Materials, Inc. | Integrated electroless deposition system |
JP4931605B2 (ja) * | 2004-01-26 | 2012-05-16 | アプライド マテリアルズ インコーポレイテッド | 半導体基板上へ金属を無電解堆積するための装置 |
JP2008526030A (ja) * | 2004-12-22 | 2008-07-17 | 株式会社Sokudo | 集積熱ユニット |
US20060130767A1 (en) * | 2004-12-22 | 2006-06-22 | Applied Materials, Inc. | Purged vacuum chuck with proximity pins |
US7282675B2 (en) | 2004-12-22 | 2007-10-16 | Sokudo Co., Ltd. | Integrated thermal unit having a shuttle with a temperature controlled surface |
JP4444154B2 (ja) | 2005-05-02 | 2010-03-31 | 大日本スクリーン製造株式会社 | 基板処理装置 |
JP4845668B2 (ja) * | 2006-10-17 | 2011-12-28 | 東京エレクトロン株式会社 | 複合配管及び複合配管を備える塗布・現像処理装置 |
US7608484B2 (en) * | 2006-10-31 | 2009-10-27 | Texas Instruments Incorporated | Non-pull back pad package with an additional solder standoff |
JP4428717B2 (ja) * | 2006-11-14 | 2010-03-10 | 東京エレクトロン株式会社 | 基板処理方法及び基板処理システム |
JP2009135169A (ja) * | 2007-11-29 | 2009-06-18 | Tokyo Electron Ltd | 基板処理システムおよび基板処理方法 |
-
2008
- 2008-12-12 US US12/334,156 patent/US8127713B2/en active Active
-
2009
- 2009-12-07 JP JP2011539781A patent/JP5438127B2/ja active Active
- 2009-12-07 WO PCT/US2009/067038 patent/WO2010068597A1/en active Application Filing
Also Published As
Publication number | Publication date |
---|---|
JP2012510732A (ja) | 2012-05-10 |
US20100151690A1 (en) | 2010-06-17 |
US8127713B2 (en) | 2012-03-06 |
WO2010068597A1 (en) | 2010-06-17 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US7396412B2 (en) | Coat/develop module with shared dispense | |
US7641404B2 (en) | Substrate processing apparatus | |
US8540824B2 (en) | Substrate processing method | |
JP4845463B2 (ja) | 基板処理装置 | |
US20070172234A1 (en) | Apparatus for and method of processing substrate | |
US7722267B2 (en) | Substrate processing apparatus | |
US11031261B2 (en) | Liquid processing apparatus | |
US20070274711A1 (en) | Substrate processing apparatus and substrate processing method | |
JP5008268B2 (ja) | 基板処理装置および基板処理方法 | |
US20060024446A1 (en) | Substrate processing apparatus and substrate processing method | |
US7766565B2 (en) | Substrate drying apparatus, substrate cleaning apparatus and substrate processing system | |
US20080212049A1 (en) | Substrate processing apparatus with high throughput development units | |
US20100081097A1 (en) | Substrate processing apparatus | |
JP2009135293A (ja) | 基板処理装置 | |
US20100129526A1 (en) | Substrate processing apparatus | |
TW200919574A (en) | Substrate processing apparatus and substrate processing method | |
US9566598B2 (en) | Substrate processing apparatus and substrate processing method | |
US7690853B2 (en) | Substrate processing apparatus | |
JP5438127B2 (ja) | マルチチャンネル現像システム | |
US8031324B2 (en) | Substrate processing apparatus with integrated cleaning unit | |
JP2012015385A (ja) | 基板処理装置、基板処理方法、プログラム及びコンピュータ記憶媒体 | |
JP4842280B2 (ja) | 共有分配を伴うコート/現像モジュール | |
US20080196658A1 (en) | Substrate processing apparatus including a substrate reversing region | |
JP2001118782A (ja) | 基板処理装置 | |
US20240162056A1 (en) | Apparatus for processing substrate |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20130514 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20130708 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20130903 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20131030 |
|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20131126 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20131212 |
|
R150 | Certificate of patent or registration of utility model |
Ref document number: 5438127 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
S533 | Written request for registration of change of name |
Free format text: JAPANESE INTERMEDIATE CODE: R313533 |
|
R350 | Written notification of registration of transfer |
Free format text: JAPANESE INTERMEDIATE CODE: R350 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |